一种用于热泵的散热装置
By employing a three-dimensional ventilation structure and a dual cooling mechanism combining water and air cooling in the heat pump heat dissipation device, the problem of low heat dissipation efficiency of traditional heat pumps is solved, achieving efficient heat dissipation and making it suitable for heat pump equipment in high-temperature environments.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU XUNENGGU IND CO LTD
- Filing Date
- 2025-07-14
- Publication Date
- 2026-07-17
AI Technical Summary
Traditional heat pump cooling devices have low heat dissipation efficiency, especially in high-temperature environments where they are difficult to effectively reduce equipment temperature, leading to performance degradation and increased energy consumption. Furthermore, the lack of a three-dimensional ventilation layout in the structural design causes heat to accumulate.
It adopts a three-dimensional ventilation structure, including the base air inlet, the top fan and the side axial fan group, and combines water cooling and air cooling dual cooling mechanisms to achieve efficient heat dissipation through evaporation and conduction, forming an airflow path of bottom inlet and top outlet and side outlet.
It significantly improves airflow speed and heat exchange efficiency, ensuring that heat is quickly dissipated from the chassis, especially in high-temperature environments, effectively reducing equipment temperature and improving overall heat dissipation.
Smart Images
Figure CN224517129U_ABST
Abstract
Claims
1. A heat dissipation device for a heat pump, comprising a chassis (1), the chassis (1) being composed of a support frame (2), a base bracket (3), a protective plate (4), and a top cover (5), wherein a heat exchanger assembly (6) is provided inside the chassis (1), and a top fan (7) is installed on the top surface of the top cover (5), characterized in that: An axial fan assembly (8) is installed on the protective plate (4) located on the side of the chassis (1). A base (9) is provided at the bottom of the chassis support (3). A water-holding cavity (91) is opened in the base (9). An air inlet (92) is opened on the outer wall of the base (9). The airflow enters from the air inlet (92), flows through the water surface of the water-holding cavity (91), and is initially cooled by evaporation and conduction. Then it is blown out from the top fan (7) on the top and the axial fan assembly (8) on the side, forming a three-dimensional ventilation structure with bottom inlet and top outlet and side outlet.
2. The heat dissipating device for a heat pump according to claim 1, characterized by: The axial fan assembly (8) is installed on the protective plate (4) on both the front and rear sides of the chassis (1), and each axial fan assembly (8) includes two axial fans.
3. The heat dissipating device for a heat pump according to claim 2, characterized by: The base (9) is a rectangular base without a top cover. The base (9) is connected to the machine base support (3) for airflow. The air inlet (92) is provided on the four outer side walls of the base (9).
4. The heat dissipating device for a heat pump according to claim 3, characterized by: The water-filled cavity (91) is filled with cold water, and the air inlet (92) is higher than the surface of the cold water in the water-filled cavity (91).
5. The heat dissipation device for a heat pump according to claim 4, characterized in that: Multiple inclined guide plates (93) are installed side by side at the top opening of the base (9).
6. The heat radiating device for a heat pump according to claim 1, characterized by: Exhaust fan groups (10) are symmetrically installed on the crossbeam above the heat exchanger group (6), and each exhaust fan group (10) has multiple exhaust fans arranged in parallel.