一种均压环端子用铜钨合金叠层接触组件

Abstract

本实用新型公开了一种均压环端子用铜钨合金叠层接触组件，本实用新型涉及高压电气设备技术领域，该实用新型，包括：绝缘橡胶层，所述绝缘橡胶层的内壁粘接有接触装置；通过设置接触装置和锁止装置的配合，通过低含铜钨铜、过渡层和高含铜钨铜的梯度叠层设计，实现了材料性能的优势互补，低含铜钨铜位于底层，凭借其高钨含量的特性，具备出色的耐电弧侵蚀能力和高硬度，能够承受高压电气设备运行时产生的强电弧冲击，高含铜钨铜处于顶层，充分发挥铜的高导电性与良好的导热性，降低接触电阻，减少电能损耗和发热现象，中间的过渡层则缓解了不同含铜量材料间因热膨胀系数差异产生的热应力，避免材料出现裂纹或脱落的目的。

Claims

1. A copper-tungsten alloy laminated contact assembly for a grading ring terminal, comprising: Insulating rubber layer (1), characterized in that: The inner wall of the insulating rubber layer (1) is bonded with a contact device (2), which is connected by sliding. The outer wall of the insulating rubber layer is symmetrically fixed with locking devices (3). The contact device (2) includes a low copper tungsten copper (20), a transition layer (21) is fixedly connected to the top end of the low copper tungsten copper (20), and a high copper tungsten copper (22) is fixedly connected to the top end of the transition layer (21).

2. The copper-tungsten alloy stack contact assembly for a grading ring terminal according to claim 1, wherein: The low-copper-content tungsten copper (20), the transition layer (21), and the high-copper-content tungsten copper (22) are in a stepped state from low to high, and the outer wall of the low-copper-content tungsten copper (20) is bonded to the inner wall of the insulating rubber layer (1).

3. The copper-tungsten alloy stack contact assembly for a grading ring terminal according to claim 2, wherein: The top ends of the low copper tungsten copper (20), the transition layer (21) and the high copper tungsten copper (22) are all fixedly connected to contact ends (23). The bottom ends of the contact ends (23) are arranged in a circular array along the central axis of the low copper tungsten copper (20). The outer wall of the contact ends (23) is slidably connected to a connecting groove (24), which is opened on the inner wall of the connecting end (25).

4. The copper-tungsten alloy stack contact assembly for a grading ring terminal according to claim 3, wherein: The top end of the low copper tungsten copper (20) contacts the bottom end of the connecting end (25), the outer walls of the transition layer (21) and the high copper tungsten copper (22) are slidably connected to the inner wall of the connecting end (25), and the outer wall of the connecting end (25) is bonded to the inner wall of the insulating rubber layer (1).

5. The copper-tungsten alloy stack contact assembly for a grading ring terminal according to claim 1, wherein: The locking device (3) includes a limiting frame (30), a slider (31) is symmetrically slidably connected to the inner wall of the limiting frame (30), an inclined area (32) is opened on the outer wall of the slider (31), a compression spring (33) is fixedly connected to the outer wall of the slider (31), and a locking frame (34) is slidably connected to the outer wall of the slider (31).

6. A copper-tungsten alloy stack contact assembly for a grading ring terminal according to claim 5, wherein: The side wall of the limiting frame (30) is fixedly connected to the outer wall of the insulating rubber layer (1), the outer wall of the inclined area (32) is slidably connected to the inner wall of the locking frame (34), and the side wall of the locking frame (34) is fixedly connected to the outer wall of the insulating rubber layer (1).

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