Wafer carrier device
By covering the surface of the iron support frame with a layer of polytetrafluoroethylene and a layer of iron oxide, the corrosion problem of the support frame in the wafer dicing process is solved, the service life of the device is extended and the cost is reduced, and the adhesion reliability between the blue film and the support frame is improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUBEI XINGCHEN TECH CO LTD
- Filing Date
- 2025-07-21
- Publication Date
- 2026-07-17
AI Technical Summary
In the 3DIC manufacturing process, the annular support frame used in the wafer dicing process is easily corroded by acidic or alkaline solutions, resulting in a high scrap rate of the support frame and affecting its service life.
The iron support frame is covered with a polytetrafluoroethylene (PTFE) material layer, while the blue film and the support frame are not covered with a PTFE layer. The acid and alkali corrosion resistance and high adhesion of PTFE are utilized, combined with the iron oxide layer to improve corrosion resistance and bonding reliability.
It extends the lifespan of the wafer carrier, reduces consumable costs, and ensures a tight and reliable fit between the blue film and the support frame.
Smart Images
Figure CN224521617U_ABST
Abstract
Claims
1. A wafer carrier device, characterized in that, include: Iron support frame; The iron support frame is ring-shaped; First material layer; The first material layer covers the top surface, inner side surface, and outer side surface of the iron support frame; the bottom surface of the iron support frame includes a first part and a second part; the first part is connected to the inner side surface, and the second part is connected to the outer side surface; the first part is annular in shape. Second material layer; The second material layer covers the second portion; both the first material layer and the second material layer comprise polytetrafluoroethylene.
2. The wafer carrier apparatus of claim 1, wherein, The outer diameter of the first part is smaller than the outer diameter of the iron support frame, but larger than the inner diameter of the iron support frame.
3. The wafer carrier apparatus of claim 1, wherein, The wafer carrier device further includes: Blue film; the outer periphery of the front side of the blue film covers the first part and is attached to the first part.
4. The wafer carrier apparatus of claim 3, wherein, The remaining portion of the front side of the blue film is exposed by the space enclosed by the inner side of the iron support frame, forming a wafer carrier surface; the wafer carrier device is used to carry the wafer placed on the wafer carrier surface for dicing and wet processing.
5. The wafer carrier device according to claim 3, characterized in that, The surface of the first part includes a layer of iron oxide, and the outer periphery of the front side of the blue film is bonded to the iron oxide layer.
6. The wafer carrier apparatus of claim 3, wherein, The diameter of the blue membrane is less than or equal to the outer diameter of the first part.
7. The wafer carrier apparatus of claim 3, wherein, The blue film has a diameter of 370 mm; the outer diameter of the first portion ranges from 370 mm to 372 mm.
8. The wafer carrier apparatus of claim 1, wherein, The inner diameter of the first portion ranges from 345 mm to 355 mm; the outer diameter of the iron support frame covered by the first material layer ranges from 375 mm to 405 mm.