IGBT module heat dissipation packaging structure

Abstract

The utility model relates to IGBT module heat dissipation packaging structure, include: from top to bottom are sequentially laminated and set up upper heat dissipation board, heat conduction board and lower heat dissipation board, form the cavity between upper heat dissipation board and heat conduction board, and multiple chips are arranged in the cavity, the inside integrated first heat conduction subassembly of upper heat dissipation board, first heat conduction subassembly is located multiple chips's top surface, and the end of first heat conduction subassembly extends to the heat dissipation fin board of upper heat dissipation board outer periphery, constitutes the directional heat conduction path from chip top to peripheral heat dissipation structure, and lower heat dissipation board contains bottom plate, protection frame and multiple heat conduction support rods, and protection frame is perpendicularly set up in bottom plate surface, and multiple independent bellows are distributed in the inner wall of protection frame, and multiple heat conduction support rods are set in the surface of bottom plate with the dislocation, to fixedly support heat conduction board, and the upper end of multiple heat conduction support rods is connected with heat conduction board, and the lower end is connected with bottom plate, forms the three -dimensional heat dissipation channel that spreads outwards from chip bottom through heat conduction board, heat conduction support rod, bottom plate. The device can high -efficient heat dissipation.

Description

Technical Field

[0001] This utility model belongs to the field of IGBT module technology, and specifically relates to an IGBT module heat dissipation packaging structure. Background Technology

[0002] As a core component in the field of power electronics, IGBT (Insulated Gate Bipolar Transistor) modules are widely used in many fields such as new energy vehicles, industrial frequency conversion, and smart grids. With the continuous increase in the power density of IGBT modules, the heat generated during operation increases dramatically. If the heat cannot be dissipated in a timely and efficient manner, the module temperature will rise significantly, which will not only reduce the module's performance and reliability but also severely shorten its service life.

[0003] Existing heat dissipation packaging structures for IGBT modules suffer from low heat dissipation efficiency. Traditional heat dissipation methods mainly rely on a single heat dissipation path, such as heat dissipation through the bottom heat sink, which is difficult to meet the heat dissipation requirements of high-power IGBT modules. Moreover, the design of the packaging structure is not reasonable enough, causing heat to accumulate inside the module and not be able to be quickly and effectively conducted to the external heat dissipation device. Therefore, a heat dissipation packaging structure for IGBT modules is proposed. Utility Model Content

[0004] To address the aforementioned problems in the existing technology, this utility model provides a heat dissipation packaging structure for IGBT modules. The technical problem to be solved by this utility model is achieved through the following technical solution: This utility model provides a heat dissipation packaging structure for an IGBT module, including: A top heat sink, a heat conduction plate, and a bottom heat sink are stacked sequentially from top to bottom. A cavity is formed between the top heat sink and the heat conduction plate, and multiple chips are arranged in an array within the cavity. A first heat conduction component is integrated inside the top heat sink. The first heat conduction component is located on the top surface of the multiple chips, and its end extends to the heat dissipation fins on the outer periphery of the top heat sink, forming a directional heat conduction path from the top of the chips to the surrounding heat dissipation structure. The bottom heat sink includes a base plate, a protective frame, and multiple heat conduction support rods. The protective frame is vertically mounted on the surface of the base plate. Its sidewalls have multiple sets of through holes, and the inner wall of the protective frame is circumferentially distributed with multiple independent air boxes. The air outlet directions of the independent air boxes on opposite sides are the same. The multiple thermally conductive support rods are staggered on the surface of the base plate to fix and support the heat-conducting plate. The upper ends of the multiple thermally conductive support rods are thermally connected to the heat-conducting plate, and the lower ends are thermally connected to the base plate, forming a three-dimensional heat dissipation channel that diffuses outward from the bottom of the chip through the heat-conducting plate, the thermally conductive support rods to the base plate, and then through the base plate.

[0005] Preferably, the upper heat dissipation plate includes: a top plate and a side plate fixedly connected; wherein, the heat dissipation fins are fixedly connected to the outer periphery of the side plate; the top plate covers the top of the side plate and the heat dissipation fins, forming a rectangular frame.

[0006] Preferably, the first heat-conducting component is fixed inside the side plate; the first heat-conducting component includes: a plurality of metal sheets, a plurality of first heat-conducting rods, a plurality of second heat-conducting rods, and a plurality of third heat-conducting rods; wherein, the plurality of metal sheets and the plurality of first heat-conducting rods are alternately arranged along the length direction of the side plate, wherein three first heat-conducting rods are fixed on the first and second sides of each metal sheet, and each metal sheet is located on the top surface of a chip; the plurality of second heat-conducting rods are distributed in groups on the third side of each metal sheet and extend orthogonally to the plurality of first heat-conducting rods; the plurality of third heat-conducting rods are oriented parallel to the fourth side of the metal sheet and located between the plurality of chips which are symmetrically distributed in two rows, and the two ends of the plurality of third heat-conducting rods are fixed to the inner wall of the side plate.

[0007] Preferably, the upper surface of the top plate is uniformly provided with an array of multiple terminals, wherein the bottom of each terminal corresponds to a metal sheet; when external pressure is applied to a terminal, the metal sheet is driven by the pressure to generate directional elastic deformation, so that it forms a stable contact interface with the electrode of the chip, thereby forming a vertical conductive path from the terminal through the metal sheet to the chip.

[0008] Preferably, the upper heat sink further includes: a substrate and a packaging base plate stacked from top to bottom; the plurality of chips and the plurality of third heat-conducting rods are welded to the upper surface of the substrate, and the bottom of the packaging base plate is in direct contact with the heat-conducting plate, so that the heat of the plurality of chips is transferred to the heat-conducting plate through the substrate and the packaging base plate.

[0009] Preferably, the base plate is a rectangular plate structure, and a support column is provided at each of the four ends of the base plate. Each support column is provided with a threaded inner hole. A threaded hole is provided at each of the four ends of the heat-conducting plate. The base plate and the heat-conducting plate are fixedly connected by bolts.

[0010] Preferably, the first heat-conducting rod, the second heat-conducting rod, and the third heat-conducting rod are all made of ceramic.

[0011] Preferably, each metal sheet has three second heat-conducting rods on its third side.

[0012] Preferably, the number of the plurality of third heat-conducting rods is 2, and the plurality of third heat-conducting rods are spaced apart.

[0013] Preferably, one side of the protective frame is provided with a connector for establishing an electrical connection between the plurality of independent bellows and an external power source.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows: To address the issue of low heat dissipation efficiency in existing IGBT module heat dissipation packaging structures, this invention provides a new IGBT module heat dissipation packaging structure. This structure achieves efficient and simultaneous heat dissipation from the top and bottom of the chip through a multi-dimensional heat dissipation collaborative design of an upper and lower heat dissipation plate. The upper heat dissipation plate directionally conducts heat from the top of the chip to the heat dissipation fins on the outer periphery through a first thermal conductive component, forming a rapid dissipation path for the concentrated heat at the top. The lower heat dissipation plate, through the staggered layout of the thermally conductive support rods and the directional airflow driven by the independent airbox within the protective frame, constructs a three-dimensional heat dissipation channel from the bottom of the chip through the thermally conductive plate and thermally conductive support rods to the bottom plate, effectively preventing heat accumulation. The through holes in the protective frame, combined with the independent airbox, form a circulating airflow, enhancing heat dissipation efficiency, while the optimized layout of the bidirectional heat dissipation structure significantly improves the overall heat dissipation performance and module reliability. Attached Figure Description

[0015] Figure 1 This is a structural diagram of the heat dissipation packaging structure for the IGBT module provided by this utility model; Figure 2 This is an exploded view of the heat dissipation packaging structure of the IGBT module provided by this utility model; Figure 3 This is a schematic diagram of a half-section of the first heat-conducting component provided by this utility model; Figure 4 This is a half-sectional view of the heat dissipation packaging structure of the IGBT module provided by this utility model; Figure 5 This is a partially enlarged schematic diagram of point A of the heat dissipation packaging structure of the IGBT module provided by this utility model.

[0016] Figure label: 1-Upper heat sink; 2-Heat conduction plate; 3-Lower heat sink; 4-Chip; 11-First heat conduction component; 12-Heat dissipation fins; 13-Top plate; 14-Side plate; 15-Substrate; 16-Encapsulation base plate; 17-Solder layer; 111-Metal sheet; 112-First heat conduction rod; 113-Second heat conduction rod; 114-Third heat conduction rod; 131-Terminal; 31-Base plate; 32-Protective frame; 33-Heat conduction support rod; 311-Support column; 322-Independent air box; 323-Connector. Detailed Implementation

[0017] The present invention will be further described in detail below with reference to specific embodiments, but the implementation of the present invention is not limited thereto.

[0018] The present invention proposes a heat dissipation packaging structure for an IGBT module, with reference to the accompanying drawings.

[0019] Figure 1 This is a structural diagram of the heat dissipation packaging structure for the IGBT module provided by this utility model; Figure 2 This is an exploded view of the heat dissipation packaging structure of the IGBT module provided by this utility model.

[0020] Combination Figure 1 and Figure 2 As shown, the IGBT module heat dissipation packaging structure includes: an upper heat sink 1, a heat conduction plate 2, and a lower heat sink 3 stacked sequentially from top to bottom. A cavity is formed between the upper heat sink 1 and the heat conduction plate 2, and multiple chips 4 are arranged in an array within the cavity. A first heat conduction component 11 is integrated inside the upper heat sink 1. The first heat conduction component 11 is located on the top surface of the multiple chips 4, and its end extends to the heat dissipation fins 12 on the outer periphery of the upper heat sink 1, forming a directional heat conduction path from the top of the chips to the outer heat dissipation structure. The lower heat sink 3 includes a base plate 31, a protective frame 32, and multiple heat conduction fins 12. The heat-conducting support rod 33 is provided. The protective frame 32 is vertically set on the surface of the base plate 31. The side wall of the protective frame 32 is provided with multiple sets of through holes 321. The inner wall of the protective frame 32 is circumferentially distributed with multiple independent air boxes 322. The air outlet direction of the independent air boxes 322 on opposite sides is the same. Multiple heat-conducting support rods 33 are staggered on the surface of the base plate 31 to fix and support the heat-conducting plate 2. The upper end of the multiple heat-conducting support rods 33 is thermally connected to the heat-conducting plate 2, and the lower end is thermally connected to the base plate 31, forming a three-dimensional heat dissipation channel from the bottom of the chip through the heat-conducting plate 2, the heat-conducting support rods 33 to the base plate 31, and then diffuses outward through the base plate 31.

[0021] Here, the upper heat sink 1, through the first heat-conducting component 11 and the heat sink fins 12, forms a directional heat conduction path from the top of the chip to the outer heat dissipation structure. The lower heat sink 3, through the heat-conducting support rod 33, cooperates with the heat-conducting plate 2 to form a three-dimensional heat dissipation channel from the bottom of the chip through the heat-conducting plate 2, the heat-conducting support rod 33 to the bottom plate 31, and then diffuses outward through the bottom plate 31. In addition, multiple independent air boxes 322 are arranged circumferentially in the lower heat sink 3. By setting the air outlet direction of the air boxes in the same direction to form directional air, the air flow inside the protective frame is accelerated, thereby improving the heat dissipation efficiency of the three-dimensional heat dissipation channel.

[0022] For example, an independent bellows 322 is provided on one side wall of the protective frame 32, and the length of the independent bellows 322 is less than the length of the side wall of the protective frame 32.

[0023] Here, the protective frame 32 protects the internal components such as the heat-conducting support rod 33 and the independent air boxes 322, while the through holes on its surface facilitate airflow and promote heat dissipation. Multiple independent air boxes 322 are connected in series, and a connector 323 is provided on one side of the protective frame 32 for establishing an electrical connection between the multiple independent air boxes 322 and an external power source. The connector 323 allows for the simultaneous opening or closing of the multiple independent air boxes 322.

[0024] Please continue to refer to Figure 1 and Figure 2 The upper heat sink 1 includes a top plate 13 and a side plate 14 that are fixedly connected; wherein, a heat sink fin 12 is fixedly connected to the outer periphery of the side plate 14; the top plate 13 covers the top of the side plate 14 and the heat sink fin 12, forming a rectangular frame.

[0025] In one possible implementation, the side plate 14 is a rectangular frame, the top plate 13 is attached to the top of the side plate 14 with glue, and the side plate 14 is attached to the heat-conducting plate 2 with glue.

[0026] The first heat-conducting component 11 inside the upper heat sink 1 will now be described in detail. Figure 3 This is a half-sectional structural diagram of the first heat-conducting component provided by this utility model. Figure 3 As shown, the first heat-conducting component 11 is fixed inside the side plate 14; the first heat-conducting component 11 includes: multiple metal sheets 111, multiple first heat-conducting rods 112, multiple second heat-conducting rods 113, and multiple third heat-conducting rods 114; wherein, the multiple metal sheets 111 and the multiple first heat-conducting rods 112 are arranged alternately along the length direction of the side plate 14, wherein three first heat-conducting rods 112 are fixed on the first side and the second side of each metal sheet 111, and each metal sheet 111 is located on the top surface of a chip 4; multiple second heat-conducting rods 113 are distributed in groups on the third side of each metal sheet 111 and extend in an orthogonal direction to the multiple first heat-conducting rods 112; multiple third heat-conducting rods 114 are arranged parallel to the fourth side of the metal sheet 111 and are located between the multiple chips 4 which are symmetrically distributed in two rows, and the two ends of the multiple third heat-conducting rods 114 are fixed to the inner wall of the side plate 14.

[0027] It should be noted that chip 4 is not installed on the bottom surface of the third heat-conducting rod 114.

[0028] In one possible implementation, the first heat-conducting rod 112, the second heat-conducting rod 113, and the third heat-conducting rod 114 are all made of ceramic. Furthermore, each metal sheet 111 has three second heat-conducting rods 113 on its third side, and there are two third heat-conducting rods 114 spaced apart from each other.

[0029] Please continue to refer to Figure 2The top plate 13 has a plurality of terminals 131 evenly arranged in an array on its upper surface, wherein the bottom of each terminal 131 corresponds to a metal plate 111. When external pressure is applied to a terminal 131, the metal plate 111 is driven by the pressure to generate directional elastic deformation, so that it forms a stable contact interface with the electrode of the chip 4, thereby forming a vertical conductive path from the terminal 131 through the metal plate 111 to the chip 4. Through these multiple vertical conductive paths, signal transmission and power transmission between the chip and external circuits can be established.

[0030] Figure 4 This is a half-sectional view of the heat dissipation packaging structure of the IGBT module provided by this utility model. Figure 5 This is a partially enlarged schematic diagram of point A in the heat dissipation packaging structure of the IGBT module provided by this utility model. Combined with... Figures 4-5 It can be concluded that the upper heat sink 1 also includes: a substrate 15 and a packaging base plate 16 stacked from top to bottom; multiple chips 4 and multiple third heat conduction rods 114 are fixed to the upper surface of the substrate 15 through a solder layer 17, and the bottom of the packaging base plate 16 is in direct contact with the heat conduction plate 2. Through the substrate 15 and the packaging base plate 16, the heat of multiple chips 4 is transferred to the heat conduction plate 2.

[0031] Here, the IGBT module can be installed on other devices based on actual needs, using the packaging base plate 16.

[0032] Please continue to refer to Figure 2 The base plate 31 is a rectangular plate structure, and a support column 311 is provided at each of the four ends of the base plate 31. Each support column 311 is provided with a threaded inner hole. A threaded hole 211 is provided at each of the four ends of the heat-conducting plate 2. The base plate 31 and the heat-conducting plate 2 are fixedly connected by bolts.

[0033] In one embodiment, the number of chips 4 is 6, distributed in a 2*3 array; correspondingly, the number of terminals 131 and metal sheets is also 6, distributed in a 2*3 array. When the IGBT module is working, the chip 4 generates heat. Part of the heat is conducted to the side plate 14 through the third heat-conducting rod 114, and then dissipated into the surrounding environment through the heat dissipation fins 12 on the side plate 14. Part of the heat is conducted to the side plate 14 through the first heat-conducting rod 112 and the second heat-conducting rod 113, and then dissipated through the heat dissipation fins 12. Another part of the heat is conducted to the lower heat dissipation plate 3 through the substrate 15, the packaging base plate 16 and the heat-conducting plate 2 in sequence. With the directional airflow in the lower heat dissipation plate 3, the heat is accelerated for cooling, and the heat-conducting support rod 33 conducts the heat to the base plate 31, so as to dissipate it into the surrounding environment, thereby achieving efficient heat dissipation.

[0034] To address the issue of low heat dissipation efficiency in existing IGBT module heat dissipation packaging structures, this invention provides a new IGBT module heat dissipation packaging structure. This structure utilizes a bidirectional collaborative heat dissipation architecture with upper and lower heat sinks. It combines a multi-dimensional heat conduction path of the first heat-conducting component in the upper heat sink, passive heat dissipation enhancement of the heat sink fins, and directional airflow driven by an independent airbox in the lower heat sink to achieve simultaneous and efficient heat dissipation from the top and bottom of the chip. Specifically, the first heat-conducting component, through a three-dimensional staggered arrangement of metal sheets and multiple heat-conducting rods, evenly diffuses heat from the top of the chip to the heat sink fins. The heat-conducting support rods of the lower heat sink, in conjunction with the directional airflow within the protective frame, accelerate the dissipation of heat from the bottom through the base plate. Furthermore, the elastic deformation connection mechanism between the terminals and the metal sheets further optimizes the heat dissipation path while ensuring electrical path stability. This structure overcomes the technical bottlenecks of single heat flow paths and internal heat accumulation in traditional heat dissipation solutions, significantly improving the heat dissipation efficiency, operational reliability, and lifespan of high-power IGBT modules.

[0035] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0036] The foregoing description illustrates and describes several preferred embodiments of the present invention. However, as previously stated, it should be understood that the present invention is not limited to the forms disclosed herein and should not be construed as excluding other embodiments. It can be used in various other combinations, modifications, and environments, and can be altered within the scope of the present invention's conception through the foregoing teachings or related technical or knowledge. Any modifications and variations made by those skilled in the art that do not depart from the spirit and scope of the present invention should be within the protection scope of the appended claims.

Claims

1. A heat dissipation packaging structure for an IGBT module, characterized in that, include: The upper heat sink (1), the heat conduction plate (2) and the lower heat sink (3) are stacked sequentially from top to bottom. A cavity is formed between the upper heat sink (1) and the heat conduction plate (2), and multiple chips (4) are arranged in an array in the cavity. The upper heat sink (1) integrates a first heat conduction component (11), which is located on the top surface of the plurality of chips (4), and the end of the first heat conduction component (11) extends to the heat dissipation fins (12) on the outer periphery of the upper heat sink (1), forming a directional heat conduction path from the top of the chip to the outer heat dissipation structure. The lower heat dissipation plate (3) includes: a base plate (31), a protective frame (32) and multiple heat-conducting support rods (33). The protective frame (32) is vertically arranged on the surface of the base plate (31), and its side wall is provided with multiple sets of through holes (321). The inner wall of the protective frame (32) is circumferentially distributed with multiple independent air boxes (322). The air outlet direction of the independent air boxes (322) on opposite sides is the same. The plurality of thermally conductive support rods (33) are staggered on the surface of the base plate (31) to fix and support the thermally conductive plate (2). The upper ends of the plurality of thermally conductive support rods (33) are thermally connected to the thermally conductive plate (2), and the lower ends are thermally connected to the base plate (31), forming a three-dimensional heat dissipation channel from the bottom of the chip through the thermally conductive plate (2), the thermally conductive support rods (33) to the base plate (31), and then diffuse outward through the base plate (31).

2. The IGBT module heat dissipation packaging structure according to claim 1, characterized in that, The upper heat sink (1) includes a top plate (13) and a side plate (14) fixedly connected; wherein the heat sink fins (12) are fixedly connected to the outer periphery of the side plate (14); the top plate (13) covers the top of the side plate (14) and the heat sink fins (12), forming a rectangular frame.

3. The IGBT module heat dissipation packaging structure according to claim 2, characterized in that, The first heat-conducting component (11) is fixed inside the side plate (14); the first heat-conducting component (11) includes: a plurality of metal sheets (111), a plurality of first heat-conducting rods (112), a plurality of second heat-conducting rods (113) and a plurality of third heat-conducting rods (114); The plurality of metal sheets (111) and the plurality of first heat-conducting rods (112) are arranged alternately along the length of the side plate (14). Each metal sheet (111) has three first heat-conducting rods (112) fixed on its first and second sides. Each metal sheet (111) is located on the top surface of a chip (4). The plurality of second heat-conducting rods (113) are distributed in groups on the third side of each metal sheet (111) and extend in an orthogonal direction to the plurality of first heat-conducting rods (112); The plurality of third heat-conducting rods (114) are arranged parallel to the fourth side of the metal sheet (111) and located between the plurality of chips (4) which are symmetrically distributed in two rows. The two ends of the plurality of third heat-conducting rods (114) are fixed to the inner wall of the side plate (14).

4. The IGBT module heat dissipation packaging structure according to claim 3, characterized in that, The top plate (13) has a plurality of terminals (131) evenly arranged in an array on its upper surface, wherein the bottom of each terminal (131) corresponds to a metal sheet (111); When external pressure is applied to a terminal (131), the metal sheet (111) is driven by the pressure to generate directional elastic deformation, so that it forms a stable contact interface with the electrode of the chip (4), thereby forming a vertical conductive path from the terminal (131) through the metal sheet (111) to the chip (4).

5. The IGBT module heat dissipation packaging structure according to claim 3, characterized in that, The upper heat sink (1) further includes: a substrate (15) and a packaging base plate (16) stacked from top to bottom; The plurality of chips (4) and the plurality of third heat-conducting rods (114) are welded to the upper surface of the substrate (15). The bottom of the packaging base plate (16) is in direct contact with the heat-conducting plate (2). The heat of the plurality of chips (4) is transferred to the heat-conducting plate (2) through the substrate (15) and the packaging base plate (16).

6. The IGBT module heat dissipation packaging structure according to claim 2, characterized in that, The base plate (31) is a rectangular plate structure, and a support column (311) is provided at each of the four ends of the base plate (31). Each support column (311) is provided with a threaded inner hole. A threaded hole (211) is provided at each of the four ends of the heat-conducting plate (2). The base plate (31) and the heat-conducting plate (2) are fixedly connected by bolts.

7. The IGBT module heat dissipation packaging structure according to claim 3, characterized in that, The first heat-conducting rod (112), the second heat-conducting rod (113), and the third heat-conducting rod (114) are all made of ceramic.

8. The IGBT module heat dissipation packaging structure according to claim 3, characterized in that, Each metal sheet (111) has three second heat-conducting rods (113) on its third side.

9. The IGBT module heat dissipation packaging structure according to claim 3, characterized in that, The number of the plurality of third heat-conducting rods (114) is 2, and the plurality of third heat-conducting rods (114) are spaced apart.

10. The IGBT module heat dissipation packaging structure according to claim 1, characterized in that, One side of the protective frame (32) is provided with a connector (323) for establishing an electrical connection between the multiple independent bellows (322) and an external power source.

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