Carrier plate device for vertical hot filament CVD and carrier plate tray for carrier plate device
By using metal wires to press down on the silicon wafer and raise its ends, the problem of the cover plate blocking the coating area was solved, thus improving the coating effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHANGZHOU S C EXACT EQUIP
- Filing Date
- 2025-08-18
- Publication Date
- 2026-07-24
AI Technical Summary
In vertical hot-wire CVD equipment, the cover plate pressing down on the silicon wafer will block the coating area and affect the coating effect.
A metal wire is used to hold the silicon wafer in place. The end of the wire is tilted upwards to form an angle with the silicon wafer, avoiding direct contact and reducing the area of obstruction.
This reduces the direct contact between the metal wire and the silicon wafer, lowers the shading area, and improves the coating effect.
Smart Images
Figure CN224548541U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of coating technology, specifically relating to coating tooling, and more particularly to a vertical hot wire CVD carrier plate device and a carrier plate tray for the carrier plate device. Background Technology
[0002] The solar photovoltaic industry has developed rapidly; in the process of manufacturing solar cells, silicon wafers need to go through processes such as cleaning, diffusion, annealing, coating, and screen printing.
[0003] In vertical hot-wire CVD equipment, the carrier plate is placed vertically in the process chamber. During the movement of the carrier plate, in order to prevent the silicon wafer from falling off the carrier plate, a limiting device (such as a cover plate) is often used to press the silicon wafer down. However, the cover plate will come into direct contact with the silicon wafer, which will block the coating area of the silicon wafer and thus affect the coating effect.
[0004] Therefore, how to solve the technical problem that using a cover plate to press down the silicon wafer will affect the coating area is a problem that urgently needs to be solved by those skilled in the art.
[0005] It should be noted that the information disclosed in this background section is only for understanding the background technology of the present application concept, and therefore, the above description is not considered to constitute prior art information. Utility Model Content
[0006] This disclosure provides at least one carrier plate device for vertical hot-wire CVD and a carrier plate tray for the carrier plate device.
[0007] In a first aspect, embodiments of this disclosure provide a carrier plate device for vertical hot-wire CVD, comprising: a vertically arranged carrier plate frame with a recessed mounting position in the middle of one side wall; a carrier plate tray disposed within the mounting position; wherein the carrier plate tray has a plurality of positioning plate placement slots arranged in a matrix; in each row of positioning plate placement slots, a silicon wafer placement slot is formed between adjacent positioning plate placement slots; at least one metal wire is disposed in the positioning plate placement slot, the end of the metal wire resting on the silicon wafer in the silicon wafer placement slot; a positioning plate is disposed in the positioning plate placement slot, the positioning plate being connected to the positioning plate placement slot to clamp the metal wire and causing the end of the metal wire to be raised.
[0008] In one alternative embodiment, a plurality of first magnets are provided at the bottom of the mounting position; wherein the carrier tray is disposed within the mounting position and is attracted to the first magnets for positioning.
[0009] In one alternative embodiment, inclined mounting steps are provided at both ends of the mounting position.
[0010] In one alternative embodiment, a passage is provided between the limiting plate placement slot and the adjacent silicon wafer placement slot; wherein the metal wire is adapted to pass through the passage and extend into the silicon wafer placement slot.
[0011] In one optional embodiment, at least one second magnet is provided in the positioning plate placement groove; wherein the positioning plate is disposed in the positioning plate placement groove and is attracted to the second magnet for positioning.
[0012] In one alternative embodiment, the bottom of the carrier frame is provided with a plurality of fixing blocks; wherein the carrier frame is adapted to be connected to the drive shaft via the fixing blocks.
[0013] In one optional embodiment, the bottom of the mounting position is provided with a plurality of first fixing holes; wherein after the carrier tray is positioned, the carrier frame fixes the carrier tray by providing connectors in each of the first fixing holes.
[0014] In one optional embodiment, a plurality of second fixing holes are provided at the bottom of the positioning plate placement groove; wherein after the positioning plate is positioned, the carrier plate tray fixes the positioning plate by providing connectors in each of the second fixing holes.
[0015] Secondly, embodiments of this disclosure also provide a carrier tray for a carrier device, comprising: a plurality of positioning plate placement slots arranged in a matrix on the carrier tray; a silicon wafer placement slot being provided between adjacent positioning plate placement slots in each row of positioning plate placement slots; at least one metal wire being disposed in the positioning plate placement slot, the end of the metal wire resting on the silicon wafer in the silicon wafer placement slot; a positioning plate being disposed in the positioning plate placement slot, the positioning plate being connected to the positioning plate placement slot to clamp the metal wire so that the end of the metal wire is raised.
[0016] In one optional embodiment, a passage is provided between the limiting piece placement slot and the adjacent silicon wafer placement slot; wherein, the metal wire is adapted to pass through the passage and extend into the silicon wafer placement slot; at least one second magnet is provided in the limiting piece placement slot; wherein, the limiting piece is disposed in the limiting piece placement slot and is attracted to the second magnet for positioning; a plurality of second fixing holes are provided at the bottom of the limiting piece placement slot; wherein, after the limiting piece is positioned, the carrier tray fixes the limiting piece by providing connectors in each of the second fixing holes.
[0017] The beneficial effect of this utility model is that the vertical hot wire CVD carrier plate device and the carrier plate tray of the carrier plate device use metal wire to press the silicon wafer. Since the shielding area of the metal wire is small, and the end of the metal wire will bend up after contacting the silicon wafer, forming an inclined angle with the silicon wafer, direct contact with the silicon wafer is avoided, and the shielding area is further reduced.
[0018] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention are realized and obtained through the structures particularly pointed out in the description and the accompanying drawings.
[0019] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described in detail below with reference to the accompanying drawings. Attached Figure Description
[0020] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0021] Figure 1 This is a schematic diagram of a carrier frame provided in an embodiment of the present disclosure; Figure 2 This is a schematic diagram of the structure of a carrier plate device provided in an embodiment of the present disclosure; Figure 3 This is a schematic diagram of the structure of a carrier tray provided in an embodiment of the present disclosure; Figure 4 This is a side view of a carrier plate device provided in an embodiment of the present disclosure.
[0022] In the picture: Carrier frame 1, mounting position 11, first magnet 12, mounting step 13, fixing block 14, first fixing hole 15; Carrier tray 2, limiting plate placement slot 21, metal wire 211, limiting plate 212, second magnet 213, second fixing hole 214, silicon wafer placement slot 22, passageway 23. Detailed Implementation
[0023] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0024] The following detailed description, with reference to the accompanying drawings, describes some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.
[0025] like Figure 1 , Figure 2 As shown, at least one embodiment also provides a carrier plate device for vertical hot filament CVD, including: a carrier plate frame 1 and a carrier plate tray 2.
[0026] Specifically, such as Figure 1 As shown, the carrier frame 1 is set vertically, and a recessed mounting position 11 is opened in the middle of one side wall.
[0027] Specifically, such as Figure 2 As shown, the carrier tray 2 is set in the mounting position 11 of the carrier frame 1.
[0028] Specifically, such as Figure 3 As shown, the carrier tray 2 has a plurality of positioning plate placement slots 21 arranged in a matrix; wherein, in each row of positioning plate placement slots 21, a silicon wafer placement slot 22 is provided between the connected positioning plate placement slots 21.
[0029] Specifically, such as Figure 3 As shown, at least one metal wire 211 is provided in the limiting piece placement groove 21. The end of the metal wire 211 away from the limiting piece placement groove 21 extends into the silicon wafer placement groove 22 and rests on the silicon wafer in the silicon wafer placement groove 22.
[0030] Specifically, such as Figure 3 As shown, a limiting piece 212 is provided in the limiting piece placement groove 21. The limiting piece 212 is connected to the limiting piece placement groove 21 to clamp the metal wire 211 and make the end of the metal wire 211 curl up.
[0031] In this embodiment, a metal wire 211 (optionally, the metal wire 211 is a tantalum wire, niobium wire, tungsten wire, etc.) is used to press the silicon wafer. Since the shielding area of the metal wire 211 is small, and the end of the metal wire 211 will bend up after contacting the silicon wafer, forming an inclined angle with the silicon wafer, direct contact with the silicon wafer is avoided, and the shielding area is further reduced.
[0032] like Figure 1 As shown, in some embodiments, a plurality of first magnets 12 are provided at the bottom of the mounting position 11; wherein the carrier tray 2 is disposed in the mounting position 11 and is attracted to the first magnets 12 for positioning.
[0033] like Figure 1 As shown, in some embodiments, inclined mounting steps 13 are provided at both ends of the mounting position 11.
[0034] In this embodiment, the first magnet 12 can be used to attract the carrier tray 2 for subsequent fixation, and at the same time, it cooperates with the inclined mounting step 13 to quickly position the carrier tray 2 to the required position.
[0035] like Figure 3 As shown, in some embodiments, a passage 23 is provided between the limiting piece placement groove 21 and the adjacent silicon wafer placement groove 22; wherein, the metal wire 211 is adapted to pass through the passage 23 and extend into the silicon wafer placement groove 22.
[0036] In this embodiment, one end of the metal wire 211 is clamped by the limiting piece 212, and the other end rests on the silicon wafer in the silicon wafer placement groove 22; wherein, the surface height of the silicon wafer is higher than the bottom of the passage 23, that is, the metal wire 211 will be lifted after it comes into contact with the silicon wafer, thereby avoiding direct contact with the silicon wafer.
[0037] like Figure 3 As shown, in some embodiments, at least one second magnet 213 is provided in the limiting piece placement groove 21; wherein the limiting piece 212 is disposed in the limiting piece placement groove 21 and is attracted to the second magnet 213 for positioning.
[0038] In this embodiment, the second magnet 213 can be used to attract the limiting piece 212, so as to fix the limiting piece 212 in place.
[0039] In some embodiments, the bottom of the carrier frame 1 is provided with a plurality of fixing blocks 14; wherein the carrier frame 1 is adapted to be connected to the drive shaft 3 through the fixing blocks 14.
[0040] In this embodiment, the bottom of the carrier frame 1 adopts a cylindrical drive shaft 3, thereby reducing wear and improving transmission stability.
[0041] like Figure 1 As shown, in some embodiments, the bottom of the mounting position 11 is provided with a plurality of first fixing holes 15; wherein after the carrier tray 2 is positioned, the carrier frame 1 fixes the carrier tray 2 by providing connectors in each of the first fixing holes 15.
[0042] like Figure 3 As shown, in some embodiments, the bottom of the limiting piece placement groove 21 is provided with a plurality of second fixing holes 214; wherein after the limiting piece 212 is positioned, the carrier plate tray 2 fixes the limiting piece 212 by providing connectors in each of the second fixing holes 214.
[0043] At least one embodiment also provides a carrier tray for a carrier device, comprising: a plurality of positioning plate placement slots 21 arranged in a matrix on the carrier tray 2; a silicon wafer placement slot 22 is provided between the adjacent positioning plate placement slots 21 in each row of positioning plate placement slots 21; at least one metal wire 211 is provided in the positioning plate placement slot 21, and the end of the metal wire 211 rests on the silicon wafer in the silicon wafer placement slot 22; a positioning plate 212 is provided in the positioning plate placement slot 21, and the positioning plate 212 is connected to the positioning plate placement slot 21 to clamp the metal wire 211 so that the end of the metal wire 211 is raised.
[0044] In this embodiment, a metal wire 211 (optionally, the metal wire 211 is a tantalum wire, niobium wire, tungsten wire, etc.) is used to press the silicon wafer. Since the shielding area of the metal wire 211 is small, and the end of the metal wire 211 will bend up after contacting the silicon wafer, forming an inclined angle with the silicon wafer, direct contact with the silicon wafer is avoided, and the shielding area is further reduced.
[0045] In some embodiments, a passage 23 is provided between the limiting piece placement groove 21 and the adjacent silicon wafer placement groove 22; wherein, the metal wire 211 is adapted to pass through the passage 23 and extend into the silicon wafer placement groove 22.
[0046] In some embodiments, at least one second magnet 213 is provided in the limiting piece placement groove 21; wherein, the limiting piece 212 is disposed in the limiting piece placement groove 21 and is attracted to the second magnet 213 for positioning.
[0047] In some embodiments, the bottom of the limiting piece placement groove 21 is provided with a plurality of second fixing holes 214; wherein, after the limiting piece 212 is positioned, the carrier plate tray 2 fixes the limiting piece 212 by providing connectors in each of the second fixing holes 214.
[0048] In summary, the carrier plate device and carrier plate tray of this vertical hot wire CVD device use metal wire 211 to press the silicon wafer. Since the shielding area of metal wire 211 is small, and the end of metal wire 211 will bend up after contacting the silicon wafer to form an inclined angle with the silicon wafer, direct contact with the silicon wafer is avoided, further reducing the shielding area.
[0049] In this document, exemplary embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as “at least one of…” modify the entire list of elements when following a list of elements, rather than individual elements in the list. For example, the expression “at least one of a, b, and c” should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.
[0050] As used herein, the phrases “in one embodiment,” “according to one embodiment,” “in some embodiments,” etc., generally refer to the fact that a particular feature, structure, or characteristic following the phrase can be included in at least one embodiment of this disclosure. Therefore, a particular feature, structure, or characteristic can be included in more than one embodiment of this disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms “example,” “exemplary,” etc., are used to “serve as an example, instance, or illustration.” Any implementation, aspect, or design described herein as “example” or “exemplary” is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. Rather, the use of the terms “example,” “exemplary,” etc., is intended to present concepts in a specific manner.
[0051] In the description of the embodiments of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0052] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the figures, the thickness of parts may be exaggerated or reduced for the purpose of effectively depicting the technical content.
[0053] In the above discussion, unless otherwise stated, when used to describe numerical values, the terms “about,” “approximately,” “basically,” etc., indicate a change of + / - 10% in that value.
[0054] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.
Claims
1. A carrier plate device for vertical hot-wire CVD, characterized in that, include: A vertically arranged carrier frame (1) has a recessed mounting position (11) in the middle of one side wall. The carrier tray (2) is set in the mounting position (11); wherein The carrier tray (2) has several positioning slots (21) arranged in a matrix. In each row of limiting plate placement slots (21), a silicon wafer placement slot (22) is provided between the connected limiting plate placement slots (21). At least one metal wire (211) is provided in the limiting plate placement groove (21), and the end of the metal wire (211) rests on the silicon wafer in the silicon wafer placement groove (22); A limiting piece (212) is provided in the limiting piece placement groove (21). The limiting piece (212) is connected to the limiting piece placement groove (21) to clamp the metal wire (211) and make the end of the metal wire (211) curl up.
2. The carrier plate device for vertical hot-wire CVD as described in claim 1, characterized in that, The bottom of the mounting position (11) is provided with a plurality of first magnets (12); wherein The carrier tray (2) is positioned in the mounting position (11) and is attracted to the first magnet (12) for positioning.
3. The carrier plate device for vertical hot-wire CVD as described in claim 1, characterized in that, The mounting position (11) is provided with inclined mounting steps (13) at both ends.
4. The carrier plate device for vertical hot-wire CVD as described in claim 1, characterized in that, A passageway (23) is provided between the limiting piece placement slot (21) and the adjacent silicon wafer placement slot (22); The metal wire (211) is adapted to pass through the passage (23) and extend into the silicon wafer placement slot (22).
5. The vertical hot-wire CVD carrier plate device as described in claim 1, characterized in that, At least one second magnet (213) is provided in the limiting piece placement groove (21); wherein The limiting piece (212) is placed in the limiting piece placement groove (21) and attracted to the second magnet (213) for positioning.
6. The carrier plate device for vertical hot-wire CVD as described in claim 1, characterized in that, The bottom of the carrier frame (1) is provided with several fixing blocks (14); wherein The carrier frame (1) is adapted to be connected to the drive shaft (3) via a fixing block (14).
7. The vertical hot-wire CVD carrier plate device as described in claim 1, characterized in that, The bottom of the mounting position (11) is provided with a plurality of first fixing holes (15); wherein After the carrier tray (2) is positioned, the carrier frame (1) fixes the carrier tray (2) by providing connectors in each of the first fixing holes (15).
8. The vertical hot-wire CVD carrier plate device as described in claim 1, characterized in that, The bottom of the limiting piece placement groove (21) is provided with a plurality of second fixing holes (214); wherein After the limiting piece (212) is positioned, the carrier plate tray (2) fixes the limiting piece (212) by providing connectors in each of the second fixing holes (214).
9. A carrier tray for a carrier plate device, characterized in that, include: The carrier tray (2) has several positioning slots (21) arranged in a matrix. In each row of limiting plate placement slots (21), a silicon wafer placement slot (22) is provided between the connected limiting plate placement slots (21). At least one metal wire (211) is provided in the limiting plate placement groove (21), and the end of the metal wire (211) rests on the silicon wafer in the silicon wafer placement groove (22); A limiting piece (212) is provided in the limiting piece placement groove (21). The limiting piece (212) is connected to the limiting piece placement groove (21) to clamp the metal wire (211) so that the end of the metal wire (211) is raised.
10. The carrier tray for the carrier device as described in claim 9, characterized in that, A passageway (23) is provided between the limiting piece placement slot (21) and the adjacent silicon wafer placement slot (22); The metal wire (211) is adapted to pass through the passage (23) and extend into the silicon wafer placement groove (22); At least one second magnet (213) is provided in the limiting piece placement groove (21); The limiting piece (212) is disposed in the limiting piece placement groove (21) and is attracted to the second magnet (213) for positioning; The bottom of the limiting piece placement groove (21) is provided with several second fixing holes (214). After the limiting piece (212) is positioned, the carrier plate tray (2) fixes the limiting piece (212) by setting connectors in each of the second fixing holes (214).