An integrated circuit chip solder strength testing device
By designing an integrated circuit chip welding strength testing device with nested pressure tubes and clamping mechanisms, the problem of not being able to adjust the applied force area in existing technologies has been solved, enabling flexible adaptation to different solder joints and chip sizes and improving the accuracy of testing.
CN224552941UActive Publication Date: 2026-07-24SHENZHEN BAGE ELECTRONICS CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN BAGE ELECTRONICS CO LTD
- Filing Date
- 2025-08-06
- Publication Date
- 2026-07-24
AI Technical Summary
Technical Problem
Existing integrated circuit chip welding strength testing devices cannot flexibly adjust the applied force area according to the size of the solder joint and the chip size, resulting in inaccurate test results.
Method used
An integrated circuit chip welding strength testing device was designed. By using nested pressure tubes and pressure rods, combined with a hydraulic system and clamping mechanism, the area applied to the solder joint can be adjusted to accommodate chips of different sizes, thus achieving accurate testing.
Benefits of technology
It enables flexible adjustments based on different solder joints and chip sizes, improving the accuracy and reliability of test results and ensuring the precision of solder strength testing.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224552941U_ABST
Abstract
The utility model discloses an integrated circuit chip welding strength testing arrangement belongs to welding strength test field, including base, is provided with clamping mechanism on the base, and the vertical board is installed with moving mechanism, and moving mechanism includes moving frame and plane adjusting assembly, and moving frame swing setting is in the top of base, and the movable block is swing setting on moving frame, and is provided with the pressing mechanism on movable block. Advantageous effect lies in: setting the pressing mechanism and test mechanism, through the nested setting of no. The pressure pipe, no. 2 pressure pipe and pressure rod can change the area of the circuit chip welding point position, so as to cope with different strength test requirements, reach more accurate test result, and through the setting of clamping mechanism can adapt to different size integrated circuit chip, through the setting of moving mechanism can make test mechanism move on the horizontal plane, and accurately align the strength test of welding point position.
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