Electrostatic chuck and advanced packaging equipment

Abstract

The utility model provides a kind of electrostatic chuck and advanced packaging equipment, belong to semiconductor production equipment technical field, electrostatic chuck includes dielectric layer, electrode adsorption layer, insulating layer and base in turn superposed, the side of dielectric layer away from electrode adsorption layer is set and the field pattern convex structure matched with board level substrate, to support board level substrate, the profile of electrode adsorption layer is matched with field pattern convex structure. By setting field pattern convex structure on dielectric layer to support board level substrate, and utilize electrode adsorption layer to form electrostatic adsorption, improve traditional mechanical chuck to electrostatic adsorption fixation, there is no mechanical contact and mechanical movement when fixing board level substrate, dust and other pollutants will not be produced, and can effectively ensure the position accuracy of board level substrate, both can effectively fix board level substrate, also cannot contact the area that cannot contact, while it is advantageous to increase the contact surface of board level substrate and base, improve heat dissipation effect.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing equipment technology, specifically relating to an electrostatic chuck and advanced packaging equipment. Background Technology

[0002] Traditional packaging primarily uses leadframe packaging, where the chip is connected to the leadframe via wire bonding. The leadframe pins then connect to the PCB. Common package types include DIP, SOP, QFP, and QFN. The main functions of traditional packaging are chip protection, scalability enhancement, and electrical connectivity. Advanced packaging, also known as high-density packaging, employs advanced design and processes to restructure the chip at the package level, effectively improving system performance. Compared to traditional packaging, advanced packaging features increased pin count, smaller chip systems, and higher system integration. Semiconductor advanced packaging can be categorized into three main levels: chip-level packaging, board-level packaging, and system-level packaging. The advantage of advanced packaging technology lies in its ability to integrate chips with different functions and manufacturing processes at the system level. This not only increases chip integration but also shortens development cycles and reduces overall costs.

[0003] In the manufacturing process of advanced semiconductor packaged integrated circuits, a surface vacuum coating process is required on the substrate, necessitating the fixation of the board-level substrate. In existing technologies, mechanical chucks are used to fix the board-level substrate during this process, which suffers from poor heat dissipation and dust generation. Especially when the board-level substrate has inaccessible grid-like areas, traditional chuck structures are insufficient to meet the substrate fixation requirements. Utility Model Content

[0004] The present invention aims to at least solve one of the aforementioned technical problems existing in the prior art. To this end, in a first aspect, the present invention provides an electrostatic chuck capable of addressing the need for fixing plate-level substrates with non-touchable areas.

[0005] Secondly, this utility model proposes an advanced packaging device that uses the above-mentioned electrostatic chuck.

[0006] According to a first aspect of the present invention, an electrostatic chuck includes a dielectric layer, an electrode adsorption layer, an insulating layer and a substrate stacked sequentially. The dielectric layer has a grid-like protrusion structure matching the plate-level substrate on the side opposite to the electrode adsorption layer to support the plate-level substrate. The outline of the electrode adsorption layer matches the grid-like protrusion structure.

[0007] The electrostatic chuck according to the embodiments of the present invention has at least the following beneficial effects:

[0008] The electrostatic chuck of this embodiment supports the board-level substrate by setting a grid-like protrusion structure on the dielectric layer and using an electrode adsorption layer to form electrostatic adsorption. It improves the traditional mechanical chuck to electrostatic adsorption fixation. There is no mechanical contact or mechanical movement when fixing the board-level substrate, so no dust or other contaminants are generated. It can effectively ensure the positional accuracy of the board-level substrate, effectively fix the board-level substrate, and avoid contact with areas that cannot be contacted. At the same time, it helps to increase the contact area between the board-level substrate and the substrate and improve the heat dissipation effect.

[0009] According to some embodiments of this utility model, the substrate is provided with air channels, which are connected to the four concave regions formed by the grid-like protrusion structure, and are used to introduce cooling gas into the concave regions.

[0010] According to some embodiments of this utility model, the airway includes:

[0011] Four sets of equalizing air channels, each set of equalizing air channels is located within the vertical projection range of the four concave regions onto the substrate, and the equalizing air channels connect multiple positions of the corresponding concave regions.

[0012] An air intake duct extends from the center of the base to the center of the equalization air duct and connects to the equalization air duct.

[0013] According to some embodiments of the present invention, the air distribution channel is provided with multiple branches in a centrally divergent manner, and the end of each branch is connected to the concave region.

[0014] According to some embodiments of this utility model, the air intake includes:

[0015] The first air intake channel extends from the center of the substrate to opposite sides;

[0016] Two second air intake channels are arranged parallel to each other at both ends of the first air intake channel. The midpoint of the second air intake channel is connected to the first air intake channel. Each end of the air intake channel is connected to a set of equalization channels.

[0017] According to some embodiments of the present invention, the air passage is disposed on one side of the substrate that is attached to the insulating layer.

[0018] According to some embodiments of the present invention, the substrate is provided with water channels for introducing cooling water.

[0019] According to some embodiments of this utility model, the dielectric layer is an alumina ceramic structure, the electrode adsorption layer is a tungsten structure, and the insulating layer is a thermally conductive ceramic structure.

[0020] According to some embodiments of the present invention, the thickness of the dielectric layer is 0.5 mm to 0.6 mm, the thickness of the electrode adsorption layer is 0.15 mm to 0.16 mm, and the protrusion height of the grid-like protrusion structure is 15 μm to 0.2 mm.

[0021] An advanced packaging apparatus according to a second aspect of the present invention includes an electrostatic chuck with any of the above-described structures.

[0022] The advanced packaging equipment according to the embodiments of this utility model has at least the following beneficial effects:

[0023] The advanced packaging equipment in this embodiment uses the aforementioned electrostatic chuck to adsorb and fix the board-level substrate, improving the traditional mechanical chuck to electrostatic adsorption and fixation. There is no mechanical contact or movement when fixing the board-level substrate, so no dust or other contaminants are generated. It can effectively ensure the positional accuracy of the board-level substrate, effectively fix the board-level substrate, and avoid contact with areas that cannot be contacted. At the same time, it helps to increase the contact area between the board-level substrate and the substrate and improve the heat dissipation effect.

[0024] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and some of these additional aspects and advantages will become apparent from the description or may be learned by practice of the invention. Attached Figure Description

[0025] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0026] Figure 1 This is an exploded view of the structure of this utility model;

[0027] Figure 2 This is a schematic diagram of an axonal structure of the present invention;

[0028] Figure 3 A schematic diagram of an airway structure on a matrix;

[0029] Figure 4 A schematic diagram of a waterway structure on a substrate;

[0030] Figure 5 This is a structural cross-sectional view of the present invention. Detailed Implementation

[0031] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0032] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0033] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0034] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0035] In the description of this utility model, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0036] Traditional packaging primarily uses leadframe packaging, where the chip is connected to the leadframe via wire bonding. The leadframe pins then connect to the PCB. Common package types include DIP, SOP, QFP, and QFN. The main functions of traditional packaging are chip protection, scalability enhancement, and electrical connectivity. Advanced packaging, also known as high-density packaging, employs advanced design and processes to restructure the chip at the package level, effectively improving system performance. Compared to traditional packaging, advanced packaging features increased pin count, smaller chip systems, and higher system integration. Semiconductor advanced packaging can be categorized into three main levels: chip-level packaging, board-level packaging, and system-level packaging. The advantage of advanced packaging technology lies in its ability to integrate chips with different functions and manufacturing processes at the system level. This not only increases chip integration but also shortens development cycles and reduces overall costs.

[0037] In the manufacturing process of advanced semiconductor packaged integrated circuits, a surface vacuum coating process is required on the substrate, necessitating the fixation of the board-level substrate. In existing technologies, mechanical chucks are used to fix the board-level substrate during this process, which suffers from poor heat dissipation and dust generation. Especially when the board-level substrate has inaccessible grid-like areas, traditional chuck structures are insufficient to meet the substrate fixation requirements.

[0038] This invention provides an electrostatic chuck that can solve the fixation requirements of board-level substrates with areas that cannot be touched.

[0039] Reference Figures 1 to 5 The electrostatic chuck of this embodiment includes a dielectric layer 100, an electrode adsorption layer 200, an insulating layer 300, and a substrate 400 stacked sequentially. A grid-like protrusion structure 101, matching the substrate, is provided on the side of the dielectric layer 100 opposite to the electrode adsorption layer 200 to support the substrate. Supporting the substrate with the grid-like protrusion structure 101 avoids contact with unremovable grid areas on the substrate. The four concave regions 102 formed by the grid-like protrusion structure 101 completely correspond to the grid areas on the substrate, thus increasing the contact area between the substrate and the dielectric layer 100 and ensuring adsorption strength. The contour of the electrode adsorption layer 200 matches the grid-like protrusion structure 101.

[0040] During operation, the electrode adsorption layer 200 is introduced into the electrode, causing polarization of the corresponding grid-like protrusion structure 101, effectively adsorbing and fixing the plate-level substrate. The insulating layer 300 effectively insulates between the electrode adsorption layer 200 and the substrate 400, preventing breakdown.

[0041] Therefore, the electrostatic chuck of this embodiment supports the board-level substrate by setting a grid-like protrusion structure 101 on the dielectric layer 100 and forming electrostatic adsorption using the electrode adsorption layer 200. This improves the traditional mechanical chuck to electrostatic adsorption fixation. There is no mechanical contact or mechanical movement when fixing the board-level substrate, so no dust or other contaminants are generated. It can also effectively ensure the positional accuracy of the board-level substrate. It can effectively fix the board-level substrate without contacting areas that cannot be contacted. At the same time, it helps to increase the contact area between the board-level substrate and the substrate 400 and improve the heat dissipation effect.

[0042] In order to further improve the heat dissipation effect of the board-level substrate, in some embodiments of this utility model, the substrate 400 is provided with an air channel 401, which is connected to the four concave regions 102 formed by the grid protrusion structure 101, and is used to introduce cooling gas into the concave regions 102.

[0043] It is understandable that, since the board-level substrate will adhere to and be adsorbed by the grid-shaped protrusion structure 101, the four concave regions 102 formed by the grid-shaped protrusion structure 101 will form a relatively closed cavity between the board-level substrate and the board-level substrate. In this embodiment, by setting an air channel 401 that connects to the cavity, the board-level substrate can be effectively cooled by cooling gas, thereby improving the heat dissipation problem of the board-level substrate.

[0044] Reference Figure 3 In some embodiments of this utility model, the air duct 401 includes four sets of equalizing air ducts 4013 and an air inlet connecting the four sets of equalizing air ducts 4013. Specifically, the four sets of equalizing air ducts 4013 are respectively located within the vertical projection range of the four concave regions 102 onto the substrate 400, such that each set of equalizing air ducts 4013 corresponds to one concave region 102. The equalizing air ducts 4013 connect to multiple positions of the corresponding concave regions 102, thereby allowing cooling gas to enter simultaneously from multiple positions of the concave regions 102, ensuring uniform distribution of cooling gas in the corresponding chambers and synchronicity of cooling gas entry, thus enabling uniform temperature control of the entire substrate and helping to avoid local temperature unevenness. The air inlet extends from the center of the substrate 400 to the center of the equalizing air ducts 4013 and connects the four sets of equalizing air ducts 4013.

[0045] The air duct 401 design in this embodiment introduces cooling gas from the center of the substrate 400, guides it at a uniform speed through the air inlet duct into four sets of uniform air ducts 4013, and then enters the cavity between the board-level substrate and the dielectric layer 100 from the uniform air ducts 4013. This design can effectively ensure the heat dissipation control of the entire board-level substrate and maintain the consistency of heat dissipation effect at various parts of the board-level substrate, which helps to improve process quality.

[0046] Reference Figure 3 In some embodiments of this utility model, the uniform airflow channel 4013 is provided with multiple branches 4014 in a centrally radiating manner, with the end of each branch 4014 connecting to the concave region 102. It is understood that, since each concave region 102 is rectangular, this embodiment provides multiple branches 4014 in a centrally radiating manner, and the ends of the branches 4014 connect to the concave region 102, allowing cooling gas to be uniformly delivered into the concave region 102. Furthermore, the center of the uniform airflow channel 4013 is preferably aligned with the center of the concave region 102, and the length of each branch 4014 is consistent, thereby maintaining the synchronicity of cooling gas entering different positions within the concave region 102, and the synchronicity of cooling gas entering the four concave regions 102, thus enabling better control of heat dissipation from the substrate.

[0047] Reference Figure 3In some embodiments of this utility model, the air intake includes a first air intake duct 4011 and two second air intake ducts 4012. The first air intake duct 4011 extends from the center of the base 400 to opposite sides. The two second air intake ducts 4012 are arranged parallel to each other at both ends of the first air intake duct 4011. The midpoint of the second air intake duct 4012 is connected to the first air intake duct 4011. Both ends of the air intake ducts are respectively connected to a set of equalization air ducts 4013.

[0048] When the cooling gas is introduced, it is first introduced into the first air intake channel 4011 from the center of the substrate 400, and then simultaneously enters the two second air intake channels 4012 along the first air intake channel 4011. Finally, it enters the four sets of equalizing air channels 4013 at the same time, which can effectively ensure the consistency and uniformity of the cooling gas entering the four concave regions 102.

[0049] Understandably, an air inlet is provided at the center of the first air inlet channel 4011 on the substrate 400 to introduce cooling gas. Holes are also provided at the ends of the corresponding branches 4014 of the insulating layer 300 and dielectric layer 100 to allow cooling gas to pass through and enter the recessed region 102. Furthermore, cooling gas outlet channels are also provided on the substrate 400, which are not specifically limited here.

[0050] Reference Figure 1 and Figure 3 In some embodiments of this utility model, the air passage 401 is disposed on the side of the substrate 400 that is attached to the insulating layer 300, and the air passage 401 is defined by the attachment and fixation of the insulating layer 300 and the substrate 400. With the structural configuration of this embodiment, it is only necessary to open an air inlet on the side of the substrate 400 away from the insulating layer 300, and then process the air passage 401 from the side closer to the insulating layer 300. This facilitates flexible processing of the air passage 401 according to design requirements, reduces production difficulty, and also facilitates the processing of complex air passages 401.

[0051] Reference Figure 4 In some embodiments of this utility model, the substrate 400 is provided with a water channel 402 for introducing cooling water. Combined with the structural configuration of the aforementioned embodiments, this embodiment also provides a water channel 402, which can effectively prevent interference between the water channel 402 and the air channel 401, and can also effectively control the overall thickness of the substrate 400, avoiding excessive size.

[0052] Understandably, the water channels 402 are also evenly distributed within the base 400 to ensure effective temperature control throughout the base 400.

[0053] Reference Figure 5In some embodiments of this utility model, the water channel 402 is formed on the side of the substrate 400 away from the insulating layer 300, so as to process complex water channels 402 as needed. At the same time, the water channel 402 is covered by a cover structure to form a complete channel.

[0054] In some embodiments of this utility model, the insulating layer 300 is provided with a groove that matches the electrode adsorption layer 200 to accommodate the electrode adsorption layer 200, so that the insulating layer 300 and the dielectric layer 100 are in contact to ensure the heat conduction effect.

[0055] In some embodiments of this invention, the dielectric layer 100 is an alumina ceramic structure, the electrode adsorption layer 200 is a tungsten structure, and the insulating layer 300 is a thermally conductive ceramic structure. During operation, by introducing electrodes into the electrode adsorption layer 200, the dielectric layer 100 electrostatically adsorbs onto the substrate under polarization. Simultaneously, the insulating layer 300 effectively conducts heat, ensuring effective heat dissipation from the substrate.

[0056] In some embodiments of this invention, the dielectric layer 100 has a thickness of 0.5 mm to 0.6 mm, the electrode adsorption layer 200 has a thickness of 0.15 mm to 0.16 mm, and the protrusion height of the grid-like raised structure 101 is 15 μm to 0.2 mm. Through the dimensional control of this embodiment, the reliability of the electrostatic chuck's operation can be effectively ensured, while avoiding excessive size.

[0057] In some embodiments of this utility model, the electrostatic chuck employs a four-layer functional structure precisely stacked from top to bottom:

[0058] Dielectric layer 100: Made of alumina ceramic material, precision ground to a thickness of 0.55mm. Its surface is formed with a grid-like raised structure 101 using laser micromachining technology, with the raised height strictly controlled at 80μm.

[0059] Electrode adsorption layer 200: The electrode pattern, made of tungsten material and formed by photolithography, perfectly matches the grid pattern and has a thickness of 0.155 mm.

[0060] Insulation layer 300: Made of high thermal conductivity ceramic, achieving both electrical isolation and thermal conduction functions.

[0061] Substrate 400: Internally integrated air passage 401 and water passage 402 system, surface and insulating layer 300 are vacuum brazed together.

[0062] Reference Figures 1 to 5In some embodiments of this utility model, the electrostatic chuck is stacked from top to bottom with a dielectric layer 100, an electrode adsorption layer 200, an insulating layer 300, and a substrate 400. The dielectric layer 100 is an alumina ceramic structure, the electrode adsorption layer 200 is a tungsten structure, and the insulating layer 300 is a thermally conductive ceramic structure. A grid-like protrusion structure 101 protrudes from the upper end of the dielectric layer 100. The total thickness of the dielectric layer 100 is 0.5 mm, and the protrusion height of the grid-like protrusion structure 101 is 0.1 mm, which is included within the total thickness of the dielectric layer 100. The electrode adsorption layer 200 has a thickness of 0.15 mm. An air passage 401 is provided on the upper surface of the substrate 400. The air passage 401 includes four sets of equalizing air passages 4013 and an air inlet passage connecting the four sets of equalizing air passages 4013. Four sets of equalizing air channels 4013 are located within the vertical projection range of the four concave regions 102 formed by the grid-like protrusion structure 101 on the base 400. Each equalizing air channel 4013 has four branches 4014 radiating from the center, with the end of each branch 4014 connecting to a concave region 102. The air intake includes a first air intake channel 4011 and two second air intake channels 4012. The first air intake channel 4011 extends from the center of the base 400 to opposite sides. The two second air intake channels 4012 are parallel to each other at both ends of the first air intake channel 4011, with their midpoints connecting to the first air intake channel 4011. Each end of the air intake channel connects to a set of equalizing air channels 4013. An air inlet is located at the center of the base 400, corresponding to the midpoint of the first air intake channel 4011. The air inlet is connected to the lower end face of the base 400 for introducing cooling gas. Meanwhile, the air passage 401 is covered by the insulating layer 300, forming a complete channel. Water channels 402 are also evenly distributed inside the substrate 400, and the water channels 402 have inlets and outlets on the lower surface of the substrate 400.

[0063] Embodiments of this utility model also propose an advanced packaging device, including an electrostatic chuck with any of the above-described structures.

[0064] It is understood that the advanced packaging equipment in this embodiment uses the aforementioned electrostatic chuck to adsorb and fix the board-level substrate, improving the traditional mechanical chuck to electrostatic adsorption and fixation. There is no mechanical contact or mechanical movement when fixing the board-level substrate, so no dust or other contaminants are generated. It can effectively ensure the positional accuracy of the board-level substrate, effectively fix the board-level substrate, and avoid contact with areas that cannot be contacted. At the same time, it helps to increase the contact surface between the board-level substrate and the substrate 400 and improve the heat dissipation effect.

[0065] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof can be combined with each other unless otherwise specified.

Claims

1. An electrostatic chuck, characterized in that, The device includes a dielectric layer, an electrode adsorption layer, an insulating layer, and a substrate stacked sequentially. The dielectric layer has a grid-like protrusion structure on the side opposite to the electrode adsorption layer to support the board-level substrate. The outline of the electrode adsorption layer matches the grid-like protrusion structure.

2. The electrostatic chuck according to claim 1, characterized in that, The substrate is provided with air channels, which are connected to the four concave areas formed by the grid-like protrusion structure, and are used to introduce cooling gas into the concave areas.

3. The electrostatic chuck according to claim 2, characterized in that, The airway includes: Four sets of equalizing air channels, each set of equalizing air channels is located within the vertical projection range of the four concave regions onto the substrate, and the equalizing air channels connect multiple positions of the corresponding concave regions. An air intake duct extends from the center of the base to the center of the equalization air duct and connects to the equalization air duct.

4. The electrostatic chuck according to claim 3, characterized in that, The air distribution channel is provided with multiple branches in a centrally divergent manner, and the end of each branch is connected to the concave region.

5. The electrostatic chuck according to claim 3, characterized in that, The air intake includes: The first air intake channel extends from the center of the substrate to opposite sides; Two second air intake channels are arranged parallel to each other at both ends of the first air intake channel. The midpoint of the second air intake channel is connected to the first air intake channel. Each end of the air intake channel is connected to a set of equalization channels.

6. The electrostatic chuck according to claim 2, characterized in that, The air passage is located on one side of the substrate that is attached to the insulating layer.

7. The electrostatic chuck according to claim 1, characterized in that, The substrate is provided with water channels for introducing cooling water.

8. The electrostatic chuck according to claim 1, characterized in that, The dielectric layer is an alumina ceramic structure, the electrode adsorption layer is a tungsten structure, and the insulating layer is a thermally conductive ceramic structure.

9. The electrostatic chuck according to claim 1, characterized in that, The dielectric layer has a thickness of 0.5 mm to 0.6 mm, the electrode adsorption layer has a thickness of 0.15 mm to 0.16 mm, and the protrusion height of the grid-like raised structure is 15 μm to 0.2 mm.

10. An advanced packaging device, characterized in that, Includes the electrostatic chuck as described in any one of claims 1 to 9.

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