SMT welding cooling device with high-efficiency cooling function

By using the multi-angle design of the guide ring and exhaust holes, as well as the heat dissipation fins and heat dissipation channels of the auxiliary cooling components, the problem of uneven cooling in SMT soldering cooling devices is solved, thereby improving soldering quality and adaptability.

CN224587155UActive Publication Date: 2026-08-04ZHILAI OPTICS ELECTRONICS (SUZHOU) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
ZHILAI OPTICS ELECTRONICS (SUZHOU) CO LTD
Filing Date
2025-09-05
Publication Date
2026-08-04

AI Technical Summary

Technical Problem

Existing SMT soldering cooling devices have uneven cooling effects, especially the solder joints facing the air vent cool down quickly while those facing away from the air vent cool down slowly, which affects the soldering quality.

Method used

The design incorporates a guide ring and exhaust vents, and through the cooperation of a lead screw and a rotary knob, it achieves multi-angle airflow cooling. Combined with the heat dissipation fins and heat dissipation channels of the auxiliary cooling components, it improves the uniformity of cooling.

Benefits of technology

It achieves uniform cooling around the weld joint and improves the overall cooling effect, adapting to the welding cooling needs of substrates with different thicknesses.

✦ Generated by Eureka AI based on patent content.

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Abstract

This utility model discloses an SMT soldering cooling device with high-efficiency cooling function, including a fixed frame, a fixed seat fixedly mounted on the side of the top of the fixed frame, and a connecting frame fixedly mounted in the middle of one side of the fixed frame; a cooling component, including a fan, with an air collector fixedly mounted on the exhaust end of the fan, and a connecting hose connected to one side of the air collector. This utility model, by providing a guide ring and an exhaust hole, rotates a knob, which drives a lead screw to rotate, thereby moving the guide ring upwards until the exhaust hole on the inner wall of the guide ring moves to a suitable height. Then, the fan is turned on, and the fan delivers cooling air into the air collector. Some of the cooling air enters the guide ring through the connecting hose and is discharged outwards from the exhaust hole. Multi-angle cooling can be achieved through the guide ring and exhaust hole, thus improving the uniformity of cooling around the solder joint and improving the overall cooling effect of the device.
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Description

Technical Field

[0001] This utility model relates to the field of SMT (Surface Mount Technology) assembly technology, specifically to an SMT soldering cooling device with high-efficiency cooling function. Background Technology

[0002] SMT (Surface Mount Technology) is an abbreviation for a series of processes performed on a PCB (Printed Circuit Board). It is a circuit assembly technology that mounts leadless or short-lead surface mount components onto the surface of a printed circuit board or other substrates and assembles them by reflow soldering or dip soldering. During SMT processing, the soldering process generates high temperatures. If cooling measures are not taken in time, the solder paste will collapse, leading to poor soldering or even burning of the substrate. Therefore, cooling devices are needed to reduce the temperature.

[0003] In actual production, when using SMT soldering cooling devices to cool down the solder joints, most of them use cooling fans to blow cold air directly towards the solder joints for cooling. This results in the solder joints facing the air vent being cooled more slowly than those facing away from the solder joints, leading to poor cooling uniformity and affecting the cooling effect of the device. Utility Model Content

[0004] The purpose of this utility model is to provide an SMT soldering cooling device with high-efficiency cooling function to solve the problems mentioned in the background art. To solve the above technical problems, this utility model is achieved through the following technical solution:

[0005] This utility model is an SMT soldering cooling device with high-efficiency cooling function, comprising:

[0006] A fixing frame, wherein a fixing seat is fixedly provided on the side of the top of the fixing frame, and a connecting frame is fixedly provided in the middle of one side of the fixing frame;

[0007] A cooling component, comprising a fan, wherein an air collector is fixedly provided at the exhaust end of the fan, a connecting hose is connected to one side of the air collector, a guide ring is connected to one end of the connecting hose, a plurality of exhaust holes are provided on the inner side of the guide ring, and connecting blocks are fixedly provided on both sides of the outer wall of the guide ring, wherein a lead screw is provided through the top of one of the connecting blocks, a knob is fixedly provided at the top of the lead screw, and the outer wall of the lead screw is provided through the top of the fixed base.

[0008] Furthermore, the ventilation holes are arranged circumferentially at equal intervals.

[0009] Furthermore, fixing grooves are provided on both sides of the top of the fixing frame, and the bottom end of one of the fixing grooves is rotatably connected to the bottom end of the lead screw.

[0010] Furthermore, the cooling component also includes a slide bar, the outer wall of which extends through the top of another connecting block, and the bottom end of the slide bar is fixedly connected to the bottom end of another fixing groove.

[0011] Furthermore, mounting seats are symmetrically provided at both ends of both sides of the fixing frame.

[0012] Furthermore, the system also includes an auxiliary cooling component, which comprises two placement plates. Limiting plates are fixedly provided on both sides of the top of the two placement plates, and several heat dissipation fins are fixedly provided in the middle of the bottom of the two placement plates.

[0013] Furthermore, several heat dissipation holes are symmetrically opened on opposite sides of both limiting plates.

[0014] Furthermore, the top of the heat dissipation fins and the top of the placement plate are located on the same horizontal plane, and a heat dissipation channel is formed between two adjacent heat dissipation fins.

[0015] This utility model has the following beneficial effects:

[0016] This invention features a guide ring and an exhaust port. Rotating the knob causes the lead screw to rotate, which in turn moves the guide ring upward until the exhaust port on the inner wall of the guide ring reaches a suitable height. Then, the fan is turned on, delivering cooling air into the air collection hood. Some of the cooling air enters the guide ring through a connecting hose and is discharged outward from the exhaust port. The guide ring and exhaust port enable multi-angle cooling, improving the uniformity of cooling around the weld joint and thus enhancing the overall cooling effect of the device. Furthermore, this method of adjusting the position of the exhaust port for cooling can meet the welding cooling needs of substrates with different thicknesses. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the cooling component structure of this utility model;

[0020] Figure 3 This is a schematic diagram of the fixing frame connection structure of this utility model;

[0021] Figure 4This is a schematic diagram of the interconnection structure of the two placement plates of this utility model.

[0022] The attached diagram lists the components represented by each number as follows:

[0023] 11. Fixing bracket; 12. Connecting frame; 13. Fixing base; 14. Fixing groove; 15. Mounting base; 21. Fan; 22. Air collector cover; 23. Connecting hose; 24. Air guide ring; 241. Exhaust hole; 25. Connecting block; 26. Lead screw; 27. Rotary knob; 28. Slide rod; 31. Placement plate; 32. Limiting plate; 33. Heat dissipation fins; 34. Heat dissipation channel; 35. Heat dissipation hole. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be described in further detail below with reference to the accompanying drawings.

[0026] Please see Figure 1-4 As shown, this utility model is an SMT soldering cooling device with high-efficiency cooling function, comprising:

[0027] A fixing frame 11 is provided with a fixing seat 13 fixed on the side of the top of the fixing frame 11, and a connecting frame 12 is fixed in the middle of one side of the fixing frame 11.

[0028] The cooling component includes a fan 21. An air collector shroud 22 is fixedly provided at the exhaust end of the fan 21. A connecting hose 23 is connected to one side of the air collector shroud 22. A guide ring 24 is connected to one end of the connecting hose 23. Several exhaust holes 241 are opened on the inner side of the guide ring 24. Connecting blocks 25 are fixedly provided on both sides of the outer wall of the guide ring 24. A lead screw 26 is passed through the top of one of the connecting blocks 25. A knob 27 is fixedly provided at the top of the lead screw 26. The outer wall of the lead screw 26 passes through the top of the fixing seat 13.

[0029] The fan 21 is model 9225 and is used for welding cooling. The guide ring 24, in conjunction with the exhaust hole 241, can blow air and cool down at multiple angles. The lead screw 26 is threadedly engaged with the connecting block 25. The outer wall of the knob 27 is provided with anti-slip threads to increase the friction between the hand and the knob 27, making it easy to rotate the knob 27. The lead screw 26 is rotatably engaged with the fixed base 13. The air collector shroud 22 is in the shape of a square.

[0030] Several exhaust vents 241 are arranged circumferentially at equal intervals.

[0031] Fixing grooves 14 are provided on both sides of the top of the fixing frame 11, and the bottom end of one of the fixing grooves 14 is rotatably connected to the bottom end of the lead screw 26.

[0032] The cooling component also includes a slide bar 28, the outer wall of which extends through the top of another connecting block 25, and the bottom end of the slide bar 28 is fixedly connected to the bottom end of another fixing groove 14.

[0033] The slide bar 28 is used to limit the movement of the guide ring 24, so that it moves up and down along the direction of the lead screw 26. The slide bar 28 is slidably engaged with another connecting block 25, and the length of the slide bar 28 is adapted to the length of the lead screw 26.

[0034] Mounting bases 15 are symmetrically provided at both ends of both sides of the fixing frame 11;

[0035] The fixing bracket 11 can be installed and fixed to the bottom of the welding frame via the mounting base 15.

[0036] Working principle: Before SMT surface mount soldering, the knob 27 is rotated according to the substrate thickness. The rotation of the knob 27 drives the lead screw 26 to rotate. The rotation of the lead screw 26 drives the guide ring 24 to move upward through the connecting block 25 until the exhaust hole 241 on the inner wall of the guide ring 24 moves to a suitable height. Then, the fan 21 is turned on, and the fan 21 delivers cooling air to the air collector shroud 22. Some of the cooling air enters the guide ring 24 through the connecting hose 23 and is discharged outward from the exhaust hole 241. Multi-angle blowing and cooling can be achieved through the guide ring 24 and the exhaust hole 241, which improves the uniformity of cooling around the solder joint and thus improves the overall cooling effect of the SMT soldering cooling device. At the same time, this method of adjusting the position of the exhaust hole 241 to blow and cool can meet the cooling needs of soldering substrates of different thicknesses.

[0037] Please see Figure 1-4 As shown, this embodiment, based on the above embodiment, further includes:

[0038] The auxiliary cooling component includes two placement plates 31. Limiting plates 32 are fixedly provided on both sides of the top of the two placement plates 31, and several heat dissipation fins 33 are fixedly provided in the middle of the bottom of the two placement plates 31.

[0039] The heat dissipation fins 33 are made of copper sheets, which can improve the heat dissipation effect of the heat dissipation fins 33.

[0040] Several heat dissipation holes 35 are symmetrically opened on the opposite side of the two limiting plates 32;

[0041] Several heat dissipation holes 35 are equidistantly arranged, and the heat dissipation holes 35 are used to cool and dissipate heat on one side of the substrate bonding limiting plate 32.

[0042] The top of the heat dissipation fin 33 and the top of the placement plate 31 are on the same horizontal plane, and a heat dissipation channel 34 is formed between two adjacent heat dissipation fins 33.

[0043] The heat dissipation channel 34 and the air collection shroud 22 are located on the same horizontal plane.

[0044] Working principle: Before welding the substrate, the substrate is placed on top of the two placement plates 31. At this time, the bottom of the substrate is in contact with the top of the heat dissipation fins 33. During the welding of the substrate, some of the heat is transferred to the heat dissipation fins 33. The heat dissipation fins 33 dissipate heat to the outside and into the heat dissipation channel 34. At the same time, when the fan 21 delivers cooling air to the air collector shroud 22, another part of the cooling air is blown through the air collector shroud 22 onto the heat dissipation fins 33 and the heat dissipation channel 34, which makes the air flow in the heat dissipation channel 34 faster and improves the heat dissipation efficiency of the heat dissipation fins 33. In this way, auxiliary welding cooling can be performed, thereby further improving the cooling effect of the device.

[0045] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. An SMT soldering cooling device with high-efficiency cooling function, characterized in that, include: A fixed frame (11) is provided with a fixed seat (13) fixed on the side of the top of the fixed frame (11), and a connecting frame (12) is fixed in the middle of one side of the fixed frame (11). The cooling component includes a fan (21), and a collector shroud (22) is fixedly provided at the exhaust end of the fan (21). A connecting hose (23) is connected to one side of the collector shroud (22), and a guide ring (24) is connected to one end of the connecting hose (23). Several exhaust holes (241) are opened on the inner side of the guide ring (24). Connecting blocks (25) are fixed on both sides of the outer wall of the guide ring (24). A lead screw (26) is provided through the top of one of the connecting blocks (25). A knob (27) is fixedly provided at the top of the lead screw (26), and the outer wall of the lead screw (26) is connected through the top of the fixing seat (13).

2. The SMT welding cooling device with high-efficiency cooling function according to claim 1, characterized in that: The ventilation holes (241) are arranged circumferentially at equal intervals.

3. The SMT soldering cooling device with high-efficiency cooling function according to claim 1, characterized in that: The top of the fixing frame (11) has fixing grooves (14) on both sides, and the bottom end of one of the fixing grooves (14) is rotatably connected to the bottom end of the lead screw (26).

4. The SMT soldering cooling device with high-efficiency cooling function according to claim 3, characterized in that: The cooling component also includes a slide bar (28), the outer wall of which penetrates the top of another connecting block (25), and the bottom end of the slide bar (28) is fixedly connected to the bottom end of another fixing groove (14).

5. The SMT soldering cooling device with high-efficiency cooling function according to claim 1, characterized in that: Mounting seats (15) are symmetrically provided at both ends of the two sides of the fixing frame (11).

6. The SMT soldering cooling device with high-efficiency cooling function according to claim 1, characterized in that: It also includes an auxiliary cooling component, which includes two placement plates (31), with limiting plates (32) fixedly provided on both sides of the top of the two placement plates (31), and a number of heat dissipation fins (33) fixedly provided in the middle of the bottom of the two placement plates (31).

7. The SMT soldering cooling device with high-efficiency cooling function according to claim 6, characterized in that: Several heat dissipation holes (35) are symmetrically opened on the opposite side of the two limiting plates (32).

8. The SMT soldering cooling device with high-efficiency cooling function according to claim 6, characterized in that: The top of the heat dissipation fins (33) and the top of the placement plate (31) are on the same horizontal plane, and a heat dissipation channel (34) is formed between two adjacent heat dissipation fins (33).