Bottom plate for cooling silicon steel coil

Abstract

This utility model relates to the field of silicon steel coil processing technology, specifically disclosing a base plate for cooling silicon steel coils. It includes: a first base plate arranged in a plurality of circumferential arrays and a second base plate arranged in a plurality of circumferential arrays. The array axes of the first and second base plates are collinear, and the first and second base plates are staggered. The two sides of the top surface of each first base plate are fixedly connected to one edge of the bottom surface of two second base plates, forming a heat dissipation groove between the top surface of each first base plate and the edges of the two connected second base plates. The heat dissipation groove of this base plate significantly improves the heat dissipation conditions at the bottom of the silicon steel coil, increases the heat dissipation area, promotes air convection, and allows heat to be dissipated more quickly and evenly. This solves the problem of limited heat dissipation conditions when silicon steel coils are statically cooled, achieving the effect of improving cooling speed and uniformity, and improving product quality.

Description

Technical Field

[0001] This application relates to the field of silicon steel coil processing technology, and more specifically, to a base plate for cooling silicon steel coils. Background Technology

[0002] After high-temperature annealing in a bell-type furnace, the cooling process of silicon steel coils is a crucial step in ensuring product quality and production efficiency. In related technologies, silicon steel coils are typically placed directly on the ground or a flat steel plate for static cooling, a method commonly used in industrial applications.

[0003] However, this cooling method of placing the coil directly on a flat surface has significant drawbacks. Due to the tight contact between the silicon steel coil and the supporting surface, and the lack of effective airflow or heat dissipation channels underneath, heat dissipates very slowly from the bottom of the coil. This limited heat dissipation slows down the overall cooling rate of the silicon steel coil, prolonging the required cooling time. More importantly, because heat is mainly dissipated through the top and sides, while heat dissipation from the bottom is poor, uneven temperature distribution within the silicon steel coil is likely to occur. This uneven temperature not only affects the microstructure of the silicon steel coil but may also adversely affect its mechanical properties, thereby reducing product quality consistency. Simultaneously, the lengthy cooling cycle directly impacts the connection of subsequent processes, reducing overall production efficiency.

[0004] There is currently no effective technical solution to the above problems. Utility Model Content

[0005] The purpose of this application is to provide a base plate for cooling silicon steel coils, so that the heat of the silicon steel coils can be dissipated more quickly and evenly, solving the problem of limited heat dissipation conditions when silicon steel coils are left to cool, thereby improving the cooling speed and uniformity and improving product quality.

[0006] This application provides a base plate for cooling silicon steel coils, used to support annealed silicon steel coils for static cooling treatment. The base plate for cooling silicon steel coils includes: a plurality of first substrates arranged in a circumferential array and a plurality of second substrates arranged in a circumferential array. The array axes of the first substrates and the second substrates are collinear. The first substrates and the second substrates are staggered, and the two sides of the top surface of each first substrate are fixedly connected to one edge of the bottom surface of two second substrates, so that a heat dissipation groove is formed between the top surface of each first substrate and the edges of the two second substrates connected thereto.

[0007] The base plate for cooling silicon steel coils in this application is formed by interleaving multiple first and second base plates arranged in a circumferential array with their array axes collinear, and by a specific connection method between each first base plate and two adjacent second base plates, thereby creating a through heat dissipation groove under the base plate. These heat dissipation grooves significantly improve the heat dissipation conditions at the bottom of the silicon steel coil, increase the heat dissipation area, promote air convection, and enable heat to be dissipated more quickly and evenly. This solves the problem of limited heat dissipation conditions when silicon steel coils are left to cool, achieving the effect of improving cooling speed and uniformity, and improving product quality.

[0008] The base plate for cooling silicon steel coils, wherein the cross-sections of the first substrate and the second substrate are both fan-shaped and have the same dimensions.

[0009] Through the above design, this application can form a base plate with a regular structure and a bearing surface that matches the shape of the silicon steel coil. Furthermore, the heat dissipation grooves formed on the base plate have a regular radial extension shape, which is conducive to forming an effective convection heat dissipation channel, thereby improving the heat dissipation efficiency and uniformity of the silicon steel coil during the static cooling process.

[0010] The base plate for cooling silicon steel coils, wherein the central angle of the fan-shaped ring is 25-30°.

[0011] The base plate for cooling silicon steel coils, wherein the ratio of the inner arc diameter to the outer arc diameter of the fan-shaped annulus is 1:9-1:7.

[0012] The aforementioned base plate for cooling silicon steel coils, wherein two adjacent second substrates are symmetrically arranged based on the radial centerline of the first substrate between them.

[0013] The base plate for cooling silicon steel coils, wherein the number of the first substrate and the second substrate is the same, and is 10-14 in number.

[0014] The base plate for cooling silicon steel coils, wherein the bottom edge of the second substrate is welded and fixed to the edge of the corresponding top surface of the first substrate through a plurality of equally spaced welding areas.

[0015] The aforementioned base plate for cooling silicon steel coils, wherein the heat dissipation groove is a U-shaped groove of equal width.

[0016] The base plate for cooling silicon steel coils, wherein the width-to-depth ratio of the heat dissipation groove is 1:6-1:4.

[0017] The base plate for cooling silicon steel coils, wherein, in a top view, there is a slit between the end of the first substrate near the array axis and the end of the second substrate near the array axis.

[0018] As can be seen from the above, the base plate for cooling silicon steel coils provided in this application forms a through heat dissipation groove under the base plate by staggering multiple first and second base plates arranged in a circumferential array with their array axes collinear, and by a specific connection method between each first base plate and two adjacent second base plates. These heat dissipation grooves significantly improve the heat dissipation conditions at the bottom of the silicon steel coil, increase the heat dissipation area, promote air convection, and enable heat to be dissipated more quickly and evenly. This solves the problem of limited heat dissipation conditions when silicon steel coils are left to cool, achieving the effect of improving cooling speed and uniformity, and improving product quality. Attached Figure Description

[0019] Figure 1 A three-dimensional structural diagram of the base plate for cooling silicon steel coils provided in the embodiments of this application.

[0020] Figure 2 for Figure 1 Enlarged view of point A in the middle.

[0021] Figure 3 This is a top view of the base plate for cooling silicon steel coils provided in an embodiment of this application.

[0022] Figure 4 for Figure 3 Enlarged view of section B in the middle.

[0023] Reference numerals: 1. First substrate; 2. Second substrate; 3. Heat sink; 4. Welding area; 5. Slit. Detailed Implementation

[0024] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0025] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0026] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation", "connection" and "joining" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections.

[0027] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0028] The following disclosure provides many different embodiments or examples for implementing various structures of this invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0029] Please refer to Figures 1-4Some embodiments of this application provide a base plate for cooling silicon steel coils, used to support annealed silicon steel coils for static cooling treatment. The base plate for cooling silicon steel coils includes: a plurality of first substrates 1 arranged in a circumferential array and a plurality of second substrates 2 arranged in a circumferential array. The array axes of the first substrates 1 and the second substrates 2 are collinear. The first substrates 1 and the second substrates 2 are staggered. The two sides of the top surface of each first substrate 1 are fixedly connected to one edge of the bottom surface of the two second substrates 2, so that a heat dissipation groove 3 is formed between the top surface of each first substrate 1 and the edges of the two second substrates 2 connected thereto.

[0030] Specifically, the combination of the first substrate 1 and the second substrate 2 forms the basic load-bearing structure of the base plate and provides a foundation for the subsequent formation of heat dissipation channels. The collinearity of the array axes of the first substrate 1 and the second substrate 2 means that the first substrate 1 and the second substrate 2 are arranged around the same central axis, ensuring that the base plate is circular, near-circular, or near-annular in shape to accommodate the shape of the silicon steel coil. The staggered arrangement of the first substrate 1 and the second substrate 2 means that the first substrate 1 and the second substrate 2 are arranged at intervals in the circumferential direction and are not directly aligned. This can be achieved by offsetting the initial angles of the first substrate 1 and the second substrate 2 in the circumferential direction, mainly to create space between them, thus creating conditions for constructing the heat dissipation groove 3. The two sides of the top surface of each first substrate 1 are fixedly connected to one edge of the bottom surface of each of the two second substrates 2, which means that the top edge of each first substrate 1 is connected to the bottom edge of the two adjacent second substrates 2 to form a bridge structure. This can be achieved by welding, bolting, or riveting. For example, the edge of the second substrate 2 can be fixed to the edge of the first substrate 1 by welding. This is mainly used to connect the first substrate 1 and the second substrate 2 into a whole structure. The staggered arrangement below the connection area forms an open space as a heat dissipation groove 3. The heat dissipation groove 3 can be used as a channel for air circulation to increase the heat dissipation area at the bottom of the silicon steel coil, promote air convection, and remove heat.

[0031] More specifically, when the annealed silicon steel coil is placed on the base plate, its bottom is no longer a completely enclosed flat surface, but is connected to the outside air through these heat dissipation grooves 3. Heat is transferred from the bottom of the silicon steel coil to the base plate and dissipated through air convection and radiation within the heat dissipation grooves 3. The presence of the heat dissipation grooves 3 increases the effective heat dissipation area at the bottom of the silicon steel coil and promotes air circulation, allowing heat to dissipate more effectively from the bottom of the silicon steel coil, thereby accelerating the overall cooling process and helping to reduce the temperature difference between the bottom and top, promoting cooling uniformity. In addition, the middle part of the silicon steel coil has a hollow structure, and the heat dissipation grooves 3 help guide the airflow within the hollow structure of the middle part of the silicon steel coil, further improving heat dissipation efficiency.

[0032] The base plate for cooling silicon steel coils of this application is formed by staggering multiple first substrates 1 and second substrates 2 arranged in a circumferential array with collinear array axes, and by a specific connection method between each first substrate 1 and two adjacent second substrates 2, thereby forming a through heat dissipation groove 3 under the base plate. These heat dissipation grooves 3 significantly improve the heat dissipation conditions at the bottom of the silicon steel coil, increase the heat dissipation area, promote air convection, and enable heat to be dissipated more quickly and evenly. This solves the problem of limited heat dissipation conditions when silicon steel coils are left to cool, and achieves the effect of improving cooling speed and uniformity, and improving product quality.

[0033] In some preferred embodiments, the cross-sections of the first substrate 1 and the second substrate 2 are both fan-shaped and have the same dimensions.

[0034] Specifically, a fan-shaped ring refers to a planar shape enclosed by two radial lines and two concentric circular arcs. In the top view of the above structure, multiple first substrates 1 and multiple substrates constitute a near-circular base plate, making the heat dissipation groove 3 extend radially; wherein, the near-circular base plate means that after multiple fan-shaped ring substrates are assembled, its overall shape is approximately circular, providing a roughly circular bearing surface; the heat dissipation groove 3 extending radially means that the formed heat dissipation groove 3 extends radially from the center of the base plate outwards.

[0035] Specifically, when multiple fan-shaped annular first substrates 1 and second substrates 2 of the same size are arranged in a circumferential array and staggered, they can be tightly and regularly spliced ​​together to form a base plate structure with an overall annular appearance. This annular base plate structure can match the shape of the circular silicon steel coil well, providing stable and uniform support. At the same time, since the substrates themselves are fan-shaped and arranged along the circumferential direction, the heat dissipation grooves 3 formed by their staggered connection naturally extend along the radial direction of the base plate. These radially extending heat dissipation grooves 3 constitute a ventilation channel penetrating the base plate, which is conducive to the radial flow of air under the base plate, thereby forming effective convection heat dissipation and carrying away the heat of the silicon steel coil.

[0036] Through the above design, this application can form a base plate with a regular structure and a bearing surface that matches the shape of the silicon steel coil. The heat dissipation groove 3 formed on the base plate has a regular radial extension shape, which is conducive to forming an effective convection heat dissipation channel, thereby improving the heat dissipation efficiency and uniformity of the silicon steel coil during static cooling process.

[0037] In some preferred embodiments, the central angle of the fan ring is 25-30°, preferably 27°.

[0038] It should be noted that, in the embodiments of this application, reference is made to... Figure 3 As shown, the center of the circle corresponding to the central angle of the sector ring ( Figure 3The corner point indicated by the dashed line does not coincide with the array axis of the aforementioned circular array.

[0039] Specifically, by selecting this specific angle range for the design of the first substrate 1 and the second substrate 2, the problem of too few substrates leading to excessively large individual substrate size, excessive weight, manufacturing difficulties, or sparse radial groove distribution is avoided. It also avoids the problem of too many substrates leading to complex manufacturing and assembly, increased costs, and too many structural connection points.

[0040] In some preferred embodiments, the ratio of the inner arc diameter of the fan-shaped ring to its outer arc diameter is 1:9-1:7, preferably 1:8.

[0041] Specifically, by defining the ratio of the inner arc diameter to the outer arc diameter of the fan-shaped annulus, a suitable radial length and width distribution is ensured, avoiding adverse effects on the stability and load-bearing capacity of the base plate structure caused by improper substrate shape. More importantly, this ratio optimizes the geometry of the radially extending heat dissipation groove 3, giving it a suitable length and width in the radial direction, thereby promoting effective airflow within the heat dissipation groove 3 and increasing the heat dissipation area.

[0042] In some preferred embodiments, two adjacent second substrates 2 are symmetrically arranged based on the radial centerline of the first substrate 1 between them.

[0043] Specifically, the radial centerline refers to a straight line that starts from the center of the base plate (i.e., the axis of the base plate array) and passes through the geometric center of a specific first base plate 1 in a near-circular base plate structure composed of fan-shaped annular base plates, or the symmetrical centerline of the two radius lines of the fan-shaped annular base plate.

[0044] More specifically, this solution solves the problems of uneven heat dissipation grooves 3 and unbalanced support that may occur when using fan-shaped annular substrates to form the bottom plate of radial heat dissipation grooves 3 by defining two adjacent second substrates 2 symmetrically arranged based on the radial centerline of the first substrate 1 between them. This ensures uniform cooling and structural stability. This symmetrical arrangement ensures that the heat dissipation grooves 3 formed by connecting the top edge of the first substrate 1 with the bottom edges of the two second substrates 2 have a uniform shape and width, because the second substrates 2 on both sides define the boundaries of the heat dissipation grooves 3 in the same way. The uniform heat dissipation grooves 3 facilitate the formation of a stable and evenly distributed heat dissipation airflow, allowing the heat at the bottom of the silicon steel coil to dissipate outward at a more consistent rate, thereby achieving uniform cooling of the silicon steel coil. At the same time, this symmetrical arrangement also makes the bottom plate structure more balanced, providing uniform support for the silicon steel coil it supports, and enhancing the stability and reliability of the bottom plate.

[0045] In some preferred embodiments, the number of first substrate 1 and second substrate 2 is the same, and is 10-14, preferably 12.

[0046] Specifically, limiting the number of the first substrate 1 and the second substrate 2 to the same 10-14 can effectively balance heat dissipation efficiency, structural reliability and manufacturing feasibility.

[0047] In addition, limiting the central angle to the range of 25-30° means that the number of substrates required to form a complete 360° circular base plate will be between 12 and 14.4. When the center of the circle corresponding to the central angle does not coincide with the array axis of the aforementioned circumferential array, limiting the number of the first substrate 1 and the second substrate 2 to 10-14 will allow the first substrate 1 and the second substrate 2 to have enough space to form the heat dissipation groove 3.

[0048] In some preferred embodiments, the bottom edge of the second substrate 2 is welded and fixed to the edge of the corresponding top surface of the first substrate 1 by a plurality of equally spaced welding areas 4. The welding areas 4 are preferably three in number and are elongated.

[0049] Specifically, welding area 4 refers to the specific location or area where the welding operation is actually performed and a weld is formed. Equidistant array refers to the layout in which these welding areas 4 are arranged at equal intervals along the connection edge.

[0050] More specifically, the connection between the first substrate 1 and the second substrate 2 is not achieved through a continuous weld, but rather through a equidistant array of multiple discrete welding areas 4. This equidistant array arrangement results in a more uniform stress distribution at the connection edges, avoiding structural defects that may result from stress concentration, and improving the reliability and durability of the connection. Simultaneously, it allows for a gap between the first substrate 1 and the second substrate 2 at the transition portion in the non-welded area 4, enhancing heat dissipation. The elongated welding area 4 increases the effective length and area of ​​the weld, providing greater load-bearing capacity and better resistance to deformation compared to spot welding, further strengthening the connection.

[0051] This specific welding method and layout, combined with the overall structure of the base plate, ensures that the connection between the first substrate 1 and the second substrate 2 remains stable and reliable under high temperature and heavy load conditions. This guarantees the geometric shape and dimensional accuracy of the heat dissipation groove 3, maintains the effective ventilation and heat dissipation function of the heat dissipation groove 3, and improves the cooling efficiency of the silicon steel coil and the service life of the base plate.

[0052] In some preferred embodiments, the heat dissipation groove 3 is a U-shaped groove of equal width, or a U-shaped groove that expands outward from the center of the base plate.

[0053] Specifically, a constant-width U-groove refers to a U-groove whose width remains constant along its radial extension direction. A U-groove that expands outward from the center of the base plate refers to a U-groove whose width gradually increases as it extends radially outward.

[0054] More specifically, when the heat dissipation slot 3 is a U-shaped slot of uniform width, it provides a uniform channel size in the radial direction, which is beneficial for achieving a relatively consistent airflow velocity and heat dissipation rate. When the heat dissipation slot 3 is a U-shaped slot that expands outward from the center of the base plate, its channel width gradually increases in the radial direction. This design can adapt to the trend of heat diffusion from the center to the outside, or provide a larger airflow channel in areas far from the center, further enhancing the overall heat dissipation effect.

[0055] In some preferred embodiments, the width-to-depth ratio of the heat dissipation groove 3 is 1:6-1:4, and when the heat dissipation groove 3 is a U-shaped groove of equal width, it is preferably 1:5.

[0056] Specifically, this solution optimizes the geometry of the heat dissipation groove 3 by limiting its width-to-depth ratio to between 1:6 and 1:4, thereby improving the static cooling effect of the silicon steel coil. An appropriate width-to-depth ratio also ensures that the surface area of ​​the heat dissipation groove 3 is fully utilized, increasing heat exchange efficiency, thus accelerating the cooling process of the silicon steel coil and contributing to a more uniform temperature distribution, ultimately improving the product quality of the silicon steel coil.

[0057] In some preferred embodiments, in a top view, there is a slit 5 between the end of the first substrate 1 near the array axis and the end of the second substrate 2 near the array axis.

[0058] Specifically, a slit 5 is provided between the ends of the first substrate 1 and the second substrate 2 near the array axis (i.e., the center of the base plate). This slit 5 is located directly in the central region of the base plate and communicates with the radial heat dissipation groove 3. Heat from the center of the silicon steel coil can be conducted to the central region of the base plate through contact with the base plate, and then dissipated upwards or downwards through the slit 5, or carried away by the airflow introduced through the slit 5. This arrangement compensates for the insufficient heat dissipation capacity of the radial heat dissipation groove 3 in the central region, thereby improving the heat dissipation efficiency of the central region of the base plate.

[0059] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0060] The above descriptions are merely some embodiments of this utility model. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this utility model, and all such modifications and improvements fall within the protection scope of this utility model.

Claims

1. A base plate for cooling silicon steel coils, used to support annealed silicon steel coils for static cooling treatment, characterized in that, The base plate for cooling silicon steel coils includes: a plurality of first substrates arranged in a circumferential array and a plurality of second substrates arranged in a circumferential array. The array axes of the first substrates and the second substrates are collinear. The first substrates and the second substrates are staggered. The two sides of the top surface of each first substrate are respectively fixedly connected to one edge of the bottom surface of two second substrates, so that a heat dissipation groove is formed between the top surface of each first substrate and the edges of the two second substrates connected thereto.

2. The base plate for cooling silicon steel coils according to claim 1, characterized in that, Both the first substrate and the second substrate have a fan-shaped cross-section and the same dimensions.

3. The base plate for cooling silicon steel coils according to claim 2, characterized in that, The central angle of the fan-shaped ring is 25-30°.

4. The base plate for cooling silicon steel coils according to claim 2, characterized in that, The ratio of the inner arc diameter to the outer arc diameter of the fan-shaped ring is 1:9 to 1:

7.

5. The base plate for cooling silicon steel coils according to claim 2, characterized in that, The two adjacent second substrates are symmetrically arranged based on the radial centerline of the first substrate between them.

6. The base plate for cooling silicon steel coils according to claim 1, characterized in that, The number of the first substrate and the second substrate is the same, and is 10-14.

7. The base plate for cooling silicon steel coils according to claim 1, characterized in that, The bottom edge of the second substrate is welded and fixed to the edge of the corresponding top surface of the first substrate through multiple equally spaced welding areas.

8. The base plate for cooling silicon steel coils according to claim 1, characterized in that, The heat dissipation groove is a U-shaped groove of equal width.

9. The base plate for cooling silicon steel coils according to claim 1, characterized in that, The width to depth ratio of the heat dissipation groove is 1:6-1:

4.

10. The base plate for cooling silicon steel coils according to claim 1, characterized in that, In a top view, there is a slit between the end of the first substrate near the array axis and the end of the second substrate near the array axis.

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