A heat dissipation device for a two-dimensional phased array radar antenna array

Abstract

This utility model discloses a heat dissipation device for a two-dimensional phased array radar antenna array, relating to the field of radar antenna array technology. It includes an antenna array unit with a heat dissipation base plate on its outer side. A heat pipe is fixedly connected to the back of the heat dissipation base plate, and heat dissipation fins are fixedly connected to the other end of the heat pipe. A fan is fixedly connected to the side of the heat dissipation fins away from the heat dissipation base plate. Key heat-generating components of the antenna array unit are signal-connected to temperature sensors, which are then signal-connected to a controller. This utility model utilizes a stacked and spaced design for the heat dissipation fins to form a longitudinal heat dissipation channel, guiding airflow directionally along the channel, reducing airflow turbulence, and enhancing convective heat transfer efficiency. Simultaneously, it avoids the problem of "increased wind resistance and reduced airflow" caused by traditional dense fins.

Description

Technical Field

[0001] This utility model relates to the field of radar antenna array technology, and in particular to a heat dissipation device for a two-dimensional phased array radar antenna array. Background Technology

[0002] Two-dimensional phased array radar achieves electronic scanning of the beam in both azimuth and elevation dimensions by controlling the phase and amplitude of each radiating element in the array, without the need for mechanical rotation. Its core is based on phased array technology, which adjusts the phase difference between adjacent elements to change the beam direction, forming pencil or fan-shaped beams. With policy support and industry chain collaboration, two-dimensional phased array radar will continue to expand its applications in fields such as advanced autonomous driving, smart cities, and national defense security, promoting the development of integrated "radar + AI" solutions and achieving more efficient and secure perception systems.

[0003] In existing two-dimensional phased array radar antenna arrays, passive cooling or simple air cooling is often used for heat dissipation, resulting in low efficiency and failing to meet the heat dissipation requirements of high-power-density phased array radars. Overheating of equipment leads to a decline in component performance, affecting the radar's detection accuracy and lifespan, and in severe cases, even causing equipment damage. Overheating of core components such as T / R modules and power amplifiers causes signal attenuation, increased noise, and frequent beam pointing errors and frequency drift. Inefficient heat dissipation not only directly impairs the radar's detection accuracy, lifespan, and reliability, but also creates a vicious cycle of "performance-cost-safety" by increasing maintenance costs, limiting environmental adaptability, and introducing safety risks.

[0004] To address the low heat dissipation efficiency of the aforementioned two-dimensional phased array radar antenna array, a highly efficient heat-conducting base plate is added to ensure full contact with the antenna array elements. Heat pipe technology is then employed for rapid heat transfer, and large-area heat sink fins and a fan further enhance the cooling effect. The heat sink base plate directly contacts the antenna array elements, reducing interfacial thermal resistance. Combined with the phase change heat transfer of the heat pipes, rapid heat transfer from the heat source to the heat sink fins is achieved, increasing heat conduction efficiency by 3-5 times compared to traditional passive cooling. The large-area aluminum alloy heat sink fins, by increasing the contact area with air and combined with variable frequency fan speed control, enhance convective heat transfer efficiency.

[0005] However, in the heat dissipation process of existing two-dimensional phased array radar antenna arrays, the continuous high-speed operation of the fans leads to a significant increase in system power consumption. Moreover, in low-load scenarios such as at night or in low-temperature environments, excessive heat dissipation results in energy waste. Continuous strong winds may also disrupt the laminar flow state on the surface of the heat sink fins, leading to boundary layer thickening and a decrease in the heat transfer coefficient. Utility Model Content

[0006] The purpose of this invention is to address the shortcomings of existing technologies by proposing a heat dissipation device for a two-dimensional phased array radar antenna array, which solves the problem of low heat dissipation efficiency of existing two-dimensional phased array radar antenna arrays.

[0007] To achieve the above objectives, the present invention adopts the following technical solution:

[0008] A heat dissipation device for a two-dimensional phased array radar antenna array includes an antenna array unit. A heat dissipation base plate is disposed on the outer side of the antenna array unit. A heat pipe is fixedly connected to the back of the heat dissipation base plate, and a heat dissipation fin is fixedly connected to the other end of the heat pipe. A fan is fixedly connected to the side of the heat dissipation fin away from the heat dissipation base plate. Key heat-generating components of the antenna array unit are signal-connected to temperature sensors, which are then signal-connected to a controller. The heat dissipation fins and fan provide a dual heat dissipation effect. The large-area aluminum alloy heat dissipation fins increase the contact area with air, and combined with forced convection from the fan, the surface temperature of the fins is controlled below 45°C, which is 20-30°C lower than passive heat dissipation. This ensures that the temperature of core components remains stable within the safe threshold of 65°C, guaranteeing radar detection accuracy, resolution, and anti-interference capability.

[0009] As a further improvement of this utility model, the heat dissipation base plate is in direct contact with the antenna array unit for rapid heat dissipation. The heat dissipation base plate is made of high thermal conductivity aluminum alloy by stamping, and its thickness is 2mm to 4mm. The surface of the heat dissipation base plate is treated with fine sandblasting and coated with thermal grease. The 2-4mm thickness achieves a "thin and efficient" design in the heat conduction path. While ensuring structural rigidity, the 2-4mm thickness shortens the heat conduction time to the millisecond level, ensuring that heat is quickly transferred from the heat source to the heat dissipation fins.

[0010] As a further improvement of this utility model, the heat pipe adopts heat pipe technology. The heat pipe utilizes the phase change heat transfer principle to rapidly transfer heat from the heat dissipation base plate to the heat dissipation fins. The heat pipe is a U-shaped heat pipe, and its interior is filled with a low-boiling-point working fluid, which is a phase change heat transfer medium. The hot end of the U-shaped heat pipe is close to the heat dissipation base plate, and the cold end is close to the heat dissipation fins. The U-shaped design achieves physical separation of the hot and cold ends within a limited space, forming a straight path of "heat source-hot end-cold end-fins," reducing the length of the heat conduction path and thermal resistance.

[0011] As a further improvement of this utility model, the heat dissipation fins are made of aluminum alloy. The fins are in close contact with the heat pipe and dissipate heat to the environment through convection heat transfer. The heat dissipation fins are made of high thermal conductivity aluminum alloy in a stacked, spaced design, forming a longitudinal heat dissipation channel. Micro-holes are machined on the surface of the heat dissipation fins, and a corrugated structure is provided on the surface to increase the heat exchange area. As a "convective heat dissipation terminal," the heat dissipation fins, together with the heat pipe and the heat dissipation base plate, form a highly efficient end-to-end heat dissipation path of "heat source-base plate-heat pipe-fins-environment." Combined with fan frequency conversion control, precise matching of heat dissipation power and energy consumption can be achieved, improving the system's energy efficiency ratio.

[0012] As a further improvement of this invention, the fan employs frequency conversion control. The fan speed is adjusted based on feedback from a temperature sensor. The fan is mounted on the side of the heat sink fins, with its airflow direction directly facing the gap between the fins. The fan speed and the feedback signal from the temperature sensor are linearly related. This linear relationship ensures smooth adjustment of heat dissipation capacity with temperature changes. When the equipment load increases and the temperature rises, the fan speed increases linearly to quickly remove heat; when the temperature decreases, the speed decreases accordingly, avoiding energy waste or the risk of localized condensation due to excessive heat dissipation. The temperature sensor monitors and provides feedback signals in real time, forming a closed-loop "temperature-speed" control system. This allows for rapid response to changes in equipment load or fluctuations in ambient temperature, preventing overheating shutdowns or performance degradation due to insufficient heat dissipation.

[0013] As a further improvement of this invention, the temperature sensor monitors temperature changes in real time, and these temperature changes provide feedback signals to the controller. Real-time temperature monitoring enables the controller to capture temperature fluctuations within milliseconds and immediately adjust the actuators to counteract interference and maintain a stable target temperature. Real-time temperature monitoring can be configured with safety thresholds, triggering alarms, frequency reduction, or shutdown protection when the temperature rises abnormally, preventing electronic components from failing due to overheating or even burning.

[0014] As a further improvement of this invention, the controller receives temperature signals from a temperature sensor. When the temperature signal exceeds 65°C, the fan starts; when the temperature signal is below 45°C, the fan stops. The controller also includes an alarm module that triggers an audible and visual alarm when the temperature signal exceeds 70°C or falls below 30°C. Starting the fan at 65°C ensures timely heat dissipation when the equipment approaches its safe limit, preventing heat accumulation that could lead to performance degradation or damage. Stopping the fan at 45°C avoids "start-stop oscillation." This "hysteresis control" strategy extends the lifespan of the fan motor and bearings, while reducing the risk of circuit failures caused by start-stop current surges.

[0015] Compared with the prior art, the advantages of this utility model are as follows:

[0016] 1. By using a stacked and spaced design of heat dissipation fins, a longitudinal heat dissipation channel is formed, which guides the airflow to flow in a directional manner along the channel, reduces airflow turbulence, and enhances convective heat transfer efficiency; at the same time, it avoids the problem of "increased wind resistance and reduced air volume" caused by traditional dense fins.

[0017] 2. Temperature sensors and controllers monitor the temperature of key heat-generating components in real time. The controller only activates the fan when the temperature exceeds 65°C and shuts it off when the temperature drops below 45°C, preventing "overheating." When the equipment is running under low load, the cooling system can maintain a stable temperature through natural convection, eliminating the need to activate the fan and completely preventing energy waste. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0019] Figure 2 This is a three-dimensional structural diagram of the heat dissipation base plate in this utility model.

[0020] In the diagram: 1. Heat sink base plate; 2. Heat pipe; 3. Heat sink fins; 4. Fan; 5. Temperature sensor; 6. Controller. Detailed Implementation

[0021] To make the above-mentioned objectives, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0022] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0023] See attached document Figure 1 -Appendix Figure 2 A heat dissipation device for a two-dimensional phased array radar antenna array includes a heat dissipation base plate 1, a heat pipe 2, heat dissipation fins 3, a fan 4, a temperature sensor 5, and a controller 6.

[0024] This embodiment takes heat dissipation for a two-dimensional phased array radar antenna array as an example. The present invention includes an antenna array unit, with a heat dissipation base plate 1 disposed on the outer side of the antenna array unit. The heat dissipation base plate 1 is in direct contact with the antenna array unit for rapid heat dissipation. The heat dissipation base plate 1 is made of high thermal conductivity aluminum alloy by stamping, and its thickness is 2mm to 4mm. The surface of the heat dissipation base plate 1 is treated with fine sandblasting and coated with thermally conductive silicone grease. The 2-4mm high thermal conductivity aluminum alloy base plate is in direct contact with the antenna array, and combined with the sandblasted surface treatment and thermally conductive silicone grease, a low thermal resistance channel is formed between the heat source and the base plate, ensuring rapid heat dissipation. A heat pipe 2 is fixedly connected to the back of the heat dissipation base plate 1. The heat pipe 2 uses heat pipe technology and utilizes the phase change heat transfer principle to quickly transfer heat from the heat dissipation base plate 1 to the heat dissipation fins 3. The heat pipe 2 is a U-shaped heat pipe, and its interior is filled with a low-boiling-point working fluid, which is a phase change heat transfer medium. The hot end of the U-shaped heat pipe is close to the heat dissipation base plate 1, and the cold end is close to the heat dissipation fins 3. The other end of the heat pipe 2 is fixedly connected to the heat dissipation fins 3, which are made of aluminum alloy. The heat dissipation fins 3 are in close contact with the heat pipe 2 and dissipate heat to the environment through convection heat transfer. The heat dissipation fins 3 are made of high thermal conductivity aluminum alloy and have a stacked and spaced design. The stacked and spaced design forms a longitudinal heat dissipation channel. The surface of the heat dissipation fins 3 is processed with micro-holes for heat dissipation and has a corrugated structure to increase the heat exchange area. The heat dissipation fins 3 employ a stacked and spaced design to form a longitudinal heat dissipation channel, guiding airflow directionally along the channel, reducing airflow turbulence, and enhancing convective heat transfer efficiency; at the same time, it avoids the problem of "increased wind resistance and reduced airflow" caused by traditional dense fins. Moreover, the micropores and corrugated structure on the surface of the heat dissipation fins 3 further increase the heat transfer area and enhance local heat transfer capacity. Through the synergistic design of "direct-contact heat-conducting base plate + phase change heat pipe + structured fins", low-resistance and high-efficiency heat transfer from the heat source to the environment is achieved, while taking into account lightweight, compactness, reliability, and energy efficiency optimization.

[0025] Furthermore, a fan 4 is fixedly connected to the side of the heat sink fin 3 away from the heat sink base plate 1. The fan 4 uses frequency conversion control, and its speed is adjusted according to the feedback from the temperature sensor 5. The fan 4 is installed on the side of the heat sink fin 3, and the air outlet direction of the fan 4 is directly facing the gap of the heat sink fin 3. The speed of the fan 4 is linearly related to the feedback signal of the temperature sensor 5. The air outlet of the fan 4 is directly facing the gap of the heat sink fin 3, forming a "jet impact + longitudinal channel" directional airflow. The airflow penetrates the gap of the heat sink fin 3 and directly reaches the heat source area, improving the heat exchange efficiency by 40%-60% compared with the traditional scattered airflow design and avoiding heat dissipation blind spots. The key heat-generating parts of the antenna array unit are all connected to the temperature sensor 5. The temperature sensor 5 monitors the temperature changes in real time, and the temperature changes provide feedback signals to the controller 6. The temperature sensor 5 is connected to the controller 6. The controller 6 receives the temperature signal from the temperature sensor 5. When the temperature signal exceeds 65°C, the fan 4 is started. When the temperature signal is below 45°C, the fan is turned off. The controller 6 is also equipped with an alarm module. When the temperature signal exceeds 70°C or falls below 30°C, an audible and visual alarm is triggered. The fan speed of fan 4 has a linear relationship with the feedback from temperature sensor 5, achieving smooth "temperature-speed" adjustment and avoiding temperature fluctuations or sudden noise changes caused by abrupt speed adjustments. Temperature sensor 5 monitors the temperature of key heat-generating components in real time, and controller 6 only activates fan 4 when the temperature exceeds 65℃ and shuts it off when the temperature is below 45℃, avoiding "overheating". When the equipment is running under low load, the cooling system can maintain a stable temperature through natural convection, eliminating the need to activate fan 4 and completely preventing energy waste.

[0026] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A heat dissipation device for a two-dimensional phased array radar antenna array, comprising antenna array elements, characterized in that, The antenna array unit is provided with a heat dissipation base plate (1) on the outside. A heat pipe (2) is fixedly connected to the back of the heat dissipation base plate (1). A heat dissipation fin (3) is fixedly connected to the other end of the heat pipe (2). A fan (4) is fixedly connected to the side of the heat dissipation fin (3) away from the heat dissipation base plate (1). The key heat-generating parts of the antenna array unit are all connected to a temperature sensor (5). The temperature sensor (5) is connected to a controller (6).

2. The heat dissipation device for a two-dimensional phased array radar antenna array according to claim 1, characterized in that, The heat dissipation base plate (1) is in direct contact with the antenna array unit for rapid heat dissipation. The heat dissipation base plate (1) is made of aluminum alloy with high thermal conductivity and is stamped. The thickness of the heat dissipation base plate (1) is 2mm to 4mm. The surface of the heat dissipation base plate (1) is treated with fine sandblasting and coated with thermal grease.

3. The heat dissipation device for a two-dimensional phased array radar antenna array according to claim 1, characterized in that, The heat pipe (2) adopts heat pipe technology. The heat pipe (2) uses the phase change heat transfer principle to quickly transfer heat from the heat dissipation base plate (1) to the heat dissipation fins (3). The heat pipe (2) adopts a U-shaped heat pipe. The heat pipe (2) is filled with a low boiling point working fluid. The working fluid is a phase change heat transfer medium. The hot end of the U-shaped heat pipe is close to the heat dissipation base plate (1), and the cold end of the U-shaped heat pipe is close to the heat dissipation fins (3).

4. The heat dissipation device for a two-dimensional phased array radar antenna array according to claim 1, characterized in that, The heat dissipation fins (3) are made of aluminum alloy. The heat dissipation fins (3) are in close contact with the heat pipe (2) and dissipate heat to the environment through convection heat transfer. The heat dissipation fins (3) are made of high thermal conductivity aluminum alloy in a stacked and spaced design. The stacked and spaced design forms a longitudinal heat dissipation channel. The surface of the heat dissipation fins (3) is processed with micro-hole heat dissipation holes. The surface of the heat dissipation fins (3) is provided with a corrugated structure to increase the heat transfer area.

5. The heat dissipation device for a two-dimensional phased array radar antenna array according to claim 1, characterized in that, The fan (4) is controlled by frequency conversion. The fan (4) adjusts its speed according to the feedback from the temperature sensor (5). The fan (4) is installed on the side of the heat sink fins (3). The air outlet direction of the fan (4) is directly opposite the gap of the heat sink fins (3). The speed of the fan (4) is linearly related to the feedback signal of the temperature sensor (5).

6. The heat dissipation device for a two-dimensional phased array radar antenna array according to claim 1, characterized in that, The temperature sensor (5) is used to monitor temperature changes in real time, and the temperature changes provide feedback signals to the controller (6).

7. The heat dissipation device for a two-dimensional phased array radar antenna array according to claim 1, characterized in that, The controller (6) receives a temperature signal from the temperature sensor (5). When the temperature signal exceeds 65°C, the fan (4) is started. When the temperature signal is below 45°C, the fan is turned off. The controller (6) is also equipped with an alarm module. When the temperature signal exceeds 70°C or is below 30°C, an audible and visual alarm is triggered.

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