A patch-type electronic component

Abstract

This utility model relates to the field of electronic component technology, and in particular to a surface-mount electronic component that overcomes the problems of existing surface-mount electronic components that may damage circuit boards, have poor soldering to circuit boards, and are not conducive to automated pick-up. The functional ceramic body has upper and lower electrodes on its upper and lower surfaces, respectively. Upper and lower leads are soldered to the upper and lower electrodes and extend from the functional ceramic body. An encapsulation layer covers the functional ceramic body, the upper and lower electrodes, and the encapsulated portion of the upper and lower leads. The portions of the upper and lower leads exposed in the encapsulation layer include a starting segment extending from the functional ceramic body, a downward bending segment from the starting segment, and a horizontal bending segment bending downwards from the downward bending segment towards the bottom of the functional ceramic body. The horizontal bending segment continues to extend and forms a support portion that contacts or tends to contact the bottom surface of the encapsulation layer. The bottoms of the horizontal bending segments of the upper and lower leads are on the same plane, and at least a portion of the horizontal bending segments of the upper and lower leads is the solder joint of the electronic component on the circuit board.

Description

Technical Field

[0001] This utility model relates to the field of electronic components technology, and in particular to a surface mount electronic component. Background Technology

[0002] Compared with through-hole electronic components, surface mount electronic components have the following advantages: First, they can achieve flattening of circuit board (PCB) products; second, the components are suitable for reflow soldering processes to be soldered onto the circuit board, improving soldering efficiency; and third, the components are easier to be automatically picked up, increasing production speed. However, existing surface mount electronic components also have shortcomings due to their structure.

[0003] The structure of existing surface-mount electronic components is roughly as shown in Chinese Patent Publication No. CN207217208U, published in April 2018, which describes a chip-type coated varistor. The upper and lower leads of the varistor extend in the same direction and are bent in a Z-shape so that the lower surfaces of the upper and lower leads are on the same plane. The main disadvantage of this type of surface-mount electronic component is:

[0004] 1. The component body is directly attached to the PCB surface. Taking thermistor as an example, its body temperature may rise to 150-250℃ after being powered on. The long-term high-temperature operation of the component will cause the PCB to be heated and baked, which may lead to carbonization or aging.

[0005] Second, because the center of gravity is significantly deviated from the geometric center, the two leads of the thermistor are difficult to keep coplanar and are prone to tilting, which in turn causes the leads to lift up, increasing the risk of incomplete solder joints or cold solder joints during the soldering process.

[0006] Third, the center of gravity is significantly deviated from the geometric center, and the state of the component body is not stable enough, which affects the suction of the component by the nozzle of the automated device. Utility Model Content

[0007] The technical problem to be solved by this utility model is to provide a surface-mount electronic component that overcomes the problems of existing surface-mount electronic components that may damage the circuit board, have poor soldering to the circuit board, and are not conducive to automated pick-up.

[0008] The technical solution adopted by this utility model to solve its technical problem is as follows: a surface-mount electronic component has a functional ceramic body, with upper and lower electrodes respectively provided on the upper and lower surfaces of the functional ceramic body, upper and lower leads respectively soldered to the upper and lower electrodes and extending from the functional ceramic body, and also has an encapsulation layer, the encapsulation layer encapsulating the functional ceramic body, the upper and lower electrodes and the encapsulated portion of the upper and lower leads, the portions of the upper and lower leads exposed in the encapsulation layer respectively including a starting segment extending from the functional ceramic body, a downward bending segment from the starting segment and a horizontal bending segment bending towards the bottom of the functional ceramic body from the downward bending segment, the horizontal bending segment further extending to form a support portion that contacts or tends to contact the bottom surface of the encapsulation layer, the bottom of the horizontal bending segments of the upper and lower leads are on the same plane, and at least a portion of the horizontal bending segments of the upper and lower leads is the solder joint of the electronic component and the circuit board.

[0009] Specifically, the support consists of two diagonal braces connected at their top ends.

[0010] Specifically, the angle between the two diagonal braces of the support section is 30 to 150 degrees.

[0011] Specifically, the diagonal brace on the support portion that extends from the horizontal fold section but is not connected to the horizontal fold section continues to extend into a stabilizing section, and the bottoms of the stabilizing sections of the upper and lower pins are on the same plane.

[0012] Specifically, the plane at the bottom of the stable section is 0.1 to 0.3 mm higher than the plane at the bottom of the transverse bend section.

[0013] Specifically, the starting segment of the upper pin is a straight line, and the starting segment of the lower pin is a broken line. The lower broken segments of the upper and lower pins are parallel to each other and of equal length.

[0014] Specifically, the horizontal bends of the upper and lower pins are parallel to each other and of equal length.

[0015] Specifically, in another structure, the horizontal bends of the upper and lower pins are parallel to each other but of unequal length.

[0016] Specifically, the support part is an upwardly arched arc shape, and the support part further extends into a stabilizing section, with the bottom of the stabilizing sections of the upper and lower pins on the same plane.

[0017] Specifically, the soldering sections where the upper and lower pins are soldered to the upper and lower electrodes and / or the soldering parts of the electronic components and circuit boards on the transverse folds are flat.

[0018] Specifically, to prevent deformation and displacement of the upper and lower pins, the electronic component also includes a clamping block for holding the upper and lower pins, and the clamping block is made of insulating material.

[0019] The beneficial effects of this utility model are:

[0020] 1. The exposed portion of the upper and lower leads of the component in the encapsulation layer creates a space between the encapsulation layer and the circuit board, effectively preventing the heat-generating element from contacting the circuit board and preventing the circuit board from carbonizing or aging due to long-term heat exposure.

[0021] 2. When the mechanical suction nozzle contacts the upper surface of the component, the support can provide a reaction force to effectively prevent tilting and help to realize automated suction operation;

[0022] Third, the components have good stability when placed on the circuit board, and the support can also suppress the lifting of the pins and the solder joint area of ​​the circuit board, reduce the risk of poor solder joints, and improve the reliability of soldering. Attached Figure Description

[0023] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0024] Figure 1 This is the three-dimensional representation of Embodiment 1 of this utility model. Figure 1 ;

[0025] Figure 2 This is the three-dimensional representation of Embodiment 1 of this utility model. Figure 2 ;

[0026] Figure 3 This is a front view of Embodiment 1 of this utility model;

[0027] Figure 4 This is a perspective view of Embodiment 2 of this utility model;

[0028] Figure 5 This is the three-dimensional representation of Embodiment 3 of this utility model. Figure 1 ;

[0029] Figure 6 This is the three-dimensional representation of Embodiment 3 of this utility model. Figure 2 ;

[0030] Figure 7 This is a perspective view of embodiment 4 of this utility model;

[0031] Figure 8 This is the three-dimensional representation of Embodiment 5 of this utility model. Figure 1 ;

[0032] Figure 9 This is the three-dimensional representation of Embodiment 5 of this utility model. Figure 2 ;

[0033] Figure 10 This is an enlarged view of the clamping block in Embodiment 5 of this utility model.

[0034] In the figure: 1. Functional ceramic body; 2. Upper electrode; 3. Lower electrode; 4. Upper pin; 5. Lower pin; 6. Encapsulation layer; 7. Starting section; 8. Lower fold section; 9. Horizontal fold section; 10. Support section; 11. Stabilizing section; 12. Clamping block; 12-1. Pin hole; 12-2. Pin slot. Detailed Implementation

[0035] The present invention will now be described in further detail with reference to the accompanying drawings and preferred embodiments. These drawings are simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention.

[0036] Example 1:

[0037] Appendix Figure 1 , 2 3 and 4 are the structures of Embodiment 1 of this utility model, and their external shapes are as follows: Figure 1 and Figure 2 Internal structure such as Figure 3 The device comprises a functional ceramic body 1, which can be a thermistor chip, a varistor chip, or other electronic chip with certain electrical properties sintered from a set composition. An upper electrode 2 and a lower electrode 3 are respectively provided on the upper and lower surfaces of the functional ceramic body 1. Upper leads 4 and lower leads 5 are respectively welded to the upper electrodes 2 and lower electrodes 3 and extend from the functional ceramic body 1. It also comprises an encapsulation layer 6, which encapsulates the functional ceramic body 1, the upper electrodes 2 and lower electrodes 3, and the encapsulated portion of the upper and lower leads. The portions of the upper and lower leads exposed in the encapsulation layer 6 respectively include a starting segment 7 extending from the functional ceramic body 1 and a downwardly bent segment 8 from the starting segment 7. The horizontal fold 9, which folds down from the lower fold 8 towards the functional ceramic body 1, extends further to form a support portion 10 that contacts or tends to contact the bottom surface of the encapsulation layer 6. The bottom of the horizontal fold 9 of the upper and lower leads is on the same plane. When the upper and lower leads are conductive wires, the lower side of the horizontal fold 9 actually corresponds to the contact line closest to the circuit board on the outer surface of the cylindrical conductive wire, that is, the lowest contact area where its circumferential surface contacts the circuit board. Making the bottom of the horizontal fold 9 of the upper and lower leads on the same plane is equivalent to making the upper and lower leads parallel. At least a part of the horizontal fold 9 of the upper and lower leads is the solder joint between the electronic component and the circuit board.

[0038] The support section 10 is formed by two diagonal braces connected at their top ends. For example, the two diagonal braces and the bottom together form a triangular support section. The included angle α of the two diagonal braces of the support section 10 is 60 degrees. When the included angle α of the diagonal braces is less than 30 degrees or greater than 150 degrees, it will not be able to effectively perform its supporting function, which may lead to insufficient structural strength or support failure. Therefore, about 60 degrees is optimal. The diagonal braces on the support section 10 that are not connected to the horizontal bend section 9 continue to extend into a stabilizing section 11. The bottoms of the stabilizing sections 11 of the upper and lower pins are on the same plane. The plane on which the bottom of the stabilizing section 11 is located is the same as the plane on which the bottom of the horizontal bend section 9 is located. The plane is parallel to the stabilizing section 11, and the bottom plane of the stabilizing section 11 is 0.1 to 0.3 mm higher than the bottom plane of the horizontal bend section 9. This ensures reliable contact between the horizontal bend section 9 and the circuit board and prevents the horizontal bend section 9 from not being able to stick tightly to the circuit board due to the presence of the stabilizing section 11. The entire length of the horizontal bend section 9 is not limited to the soldering connection with the circuit board. Therefore, the shape of the horizontal bend section 9 is not limited to the straight rod form shown in the figure. It can also be a bent structure such as an inverted U-shape, or a deformed structure with one or two short straight rods as soldering parts, to meet the actual installation and soldering requirements.

[0039] The starting segment 7 of the upper pin 4 is straight, while the starting segment 7 of the lower pin 5 is broken. The starting segment 7 of the broken segment of the lower pin 5 is Z-shaped. The lower folded segments 8 of the upper and lower pins are parallel to each other and of equal length. This structure facilitates the synchronous bending and forming of the upper and lower pins in subsequent processing, which helps improve the consistency of forming and processing efficiency. Optionally, the starting segment 7 of the lower pin 5 can also be straight. However, with this structure, the forming process of the lower pin 5 may be relatively inconvenient, and it may lead to inconsistent lengths of the lower folded segments 8 of the upper and lower pins, affecting the overall forming accuracy.

[0040] The horizontal bends 9 of the upper and lower pins are parallel to each other and of equal length, or there is another structure in which the horizontal bends 9 of the upper and lower pins are parallel to each other but of unequal length. This allows the support parts 10 of the upper and lower pins to be staggered, forming another support effect.

[0041] Example 2:

[0042] like Figure 4 As shown, the structural difference between Embodiment 2 and Embodiment 1 is that the welding sections of the upper pin 4 and the lower pin 5, which are respectively welded to the upper electrode 2 and the lower electrode 3, are protruding. The advantage of this structure is that less material is used for the encapsulation layer 6. The disadvantage is that although it can be automatically picked up, the pick-up reliability is insufficient or the requirements for the nozzle are high.

[0043] Example 3:

[0044] like Figure 5 and Figure 6As shown, the structural differences between Embodiment 3 and Embodiment 1 are that the welding section of the pin on the electrode is protruding, and the support part 10 is changed from a triangular support to an upwardly arched arc support.

[0045] Example 4:

[0046] like Figure 7 As shown, the structural difference between Embodiment 4 and Embodiment 1 is that the upper and lower pins are changed from conductive round wires to conductive flat wires.

[0047] Example 5:

[0048] like Figure 8 , 9 As shown in Figure 10, Embodiment 5 is an electronic component formed by adding a clamping block 12 for shaping and positioning the upper and lower pins based on Embodiment 4. The clamping block 12 is an insulating material component, which is provided with pin holes 12-1 and pin slots 12-2. There are two pin holes 12-1, which are used for the upper pin 4 and the lower pin 5 respectively. There are four pin slots 12-2. Based on the lower fold section 8 being located in the pin hole 12-1, the pin slots 12-2 at the two ends of the pin hole 12-1 respectively accommodate the part of the starting section 7 that is close to the lower fold section 8 and the part of the horizontal fold section 9 that is close to the lower fold section 8.

[0049] Of course, the electronic component can also be formed by adding the clamping block 12 to the structure of Embodiments 1-3.

[0050] The shapes of the upper and lower pins of the electronic component of this invention can be formed by extrusion molding using a mold.

[0051] In addition, the upper and lower pins can also be made of round wires that have undergone partial flattening treatment, such as flattening the soldering section and / or the connection between the electronic components and the circuit board on the soldering section and / or the transverse bend 9 of the upper and lower pins soldered on the electrode.

[0052] Finally, the top and bottom of the encapsulation layer 6 can be a plane as shown in Example 1, or a smooth spherical surface with a slightly bulging center. A smooth spherical surface can also well meet the requirements of automated suction.

[0053] The above description is only a specific embodiment of the present utility model. Various examples and illustrations do not constitute a limitation on the substantive content of the present utility model. Those skilled in the art can make modifications or variations to the above-described specific embodiments after reading the description without departing from the essence and scope of the utility model.

Claims

1. A surface-mount electronic component comprising a functional ceramic body, wherein upper and lower electrodes are respectively disposed on the upper and lower surfaces of the functional ceramic body, and upper and lower leads are respectively soldered to the upper and lower electrodes and extend from the functional ceramic body; and further comprising an encapsulation layer encapsulating the functional ceramic body, the upper and lower electrodes, and the encapsulated portion of the upper and lower leads, characterized in that: The portions of the upper and lower pins exposed in the encapsulation layer each include a starting segment extending from the functional ceramic body, a downward bending segment bending down from the starting segment, and a horizontal bending segment bending down from the downward bending segment towards the functional ceramic body. The horizontal bending segment continues to extend and forms a support portion that contacts or tends to contact the bottom surface of the encapsulation layer. The bottoms of the horizontal bending segments of the upper and lower pins are on the same plane, and at least a portion of the horizontal bending segments of the upper and lower pins is the solder joint between the electronic component and the circuit board.

2. A surface-mount electronic component according to claim 1, characterized in that: The support consists of two diagonal braces connected at their top ends.

3. A surface-mount electronic component according to claim 2, characterized in that: The angle between the two diagonal braces of the support section is 30 to 150 degrees.

4. A surface-mount electronic component according to claim 2 or 3, characterized in that: The diagonal brace on the support section, which is not connected to the horizontal fold section, continues to extend into a stabilizing section. The bottoms of the stabilizing sections of the upper and lower pins are on the same plane.

5. A surface-mount electronic component according to claim 4, characterized in that: The plane at the bottom of the stable section is 0.1 to 0.3 mm higher than the plane at the bottom of the transverse bend section.

6. A surface-mount electronic component according to claim 1, characterized in that: The starting segment of the upper pin is a straight line, and the starting segment of the lower pin is a broken line. The lower broken segments of the upper and lower pins are parallel to each other and of equal length.

7. A surface-mount electronic component according to claim 1, characterized in that: The horizontal bends of the upper and lower pins are parallel to each other and of equal length.

8. A surface-mount electronic component according to claim 1, characterized in that: The horizontal bends of the upper and lower pins are parallel to each other but of different lengths.

9. A surface-mount electronic component according to claim 1, characterized in that: The support portion is an upward-arched arc shape, and the support portion extends into a stabilizing section. The bottoms of the stabilizing sections of the upper and lower pins are on the same plane.

10. A surface-mount electronic component according to claim 1, characterized in that: The soldering sections where the upper and lower pins are soldered to the upper and lower electrodes and / or the soldering parts of the electronic components and circuit boards on the transverse folds are flat.

11. A surface-mount electronic component according to claim 1, characterized in that: The electronic component also includes a clamping block for holding the upper and lower pins, the clamping block being made of insulating material.

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