A bonding wire mold cleaning mechanism

Abstract

This utility model relates to a bonding wire mold cleaning mechanism, belonging to the field of bonding wire mold cleaning technology. It includes a cleaning box and a cleaning box. A lower partition is fixedly installed inside the cleaning box, and a sealing cover is fitted onto the upper end of the cleaning box. An upper partition is fixedly installed at the lower middle position of the sealing cover. An ultrasonic cleaner is fixedly installed on one side of the cleaning box. The cleaning box is located below the cleaning box. A water pump is fixedly installed on one side of the upper end of the cleaning box, and a return water pipe is fixedly installed at the lower end of the other side of the cleaning box. Filter blocks are evenly inserted inside the cleaning box. By using a water pump and an ultrasonic cleaner, ultrasonic cleaning of the bonding wire mold is facilitated. Impurities removed during cleaning are discharged into the cleaning box via flowing water and collected by the filter blocks. The filter blocks can be replaced or cleaned during cleaning for continued use. This design is convenient to operate and improves cleaning efficiency and effectiveness.

Description

Technical Field

[0001] This utility model relates to the field of bonding wire mold cleaning technology, and in particular to a bonding wire mold cleaning mechanism. Background Technology

[0002] Bonding wire is a gold alloy wire used as an interconnect in integrated circuits, also known as ball bonding gold wire or lead wire. Bonding wire is an important material in the microelectronics industry, used as the connecting wire between the chip and the lead frame. During the production of bonding wire, a bonding wire die is needed to draw the wire to the appropriate diameter. During production, the bonding wire die often retains some oil or impurities, which can lead to a decline in subsequent production quality. Therefore, regular cleaning of the bonding wire die is necessary.

[0003] For example, CN213763468U discloses a bonding wire mold cleaning device, which includes a workbench (1) and a liquid collection cylinder (2) fixed on the workbench (1). Clamping mechanisms (3) are provided on both the left and right side walls of the liquid collection cylinder (2). Each clamping mechanism (3) includes a square rod (4), a spring (5), a support plate (6), a movable plate (7), and a square groove (8) opened on the side wall of the liquid collection cylinder (2). The square rod (4) is slidably installed in the square groove (8). The movable plate (7) is located inside the liquid collection cylinder (2) and slidably installed on the square rod (4). The spring (5) is sleeved on the square rod (4). The support plate (6) is fixed on the movable plate (7). An arc-shaped groove (9) is opened on the top surface of the support plate (6). The beneficial effects of this utility model are: compact structure, ability to clean bonding wire molds with different outer diameters, saving cleaning costs, and more thorough cleaning of the wire drawing holes.

[0004] However, during use, the impurities and oil stains generated after cleaning are not easy to collect and clean, and the cleaning efficiency and effect are poor, which affects the subsequent cleaning of bonding wire molds and makes it inconvenient to use. Utility Model Content

[0005] To overcome the technical defects of the existing technology, this utility model provides a bonding wire mold cleaning mechanism, which facilitates efficient and effective cleaning during use, and makes it easy to collect and clean the impurities generated after cleaning, making it convenient to operate.

[0006] The technical solution adopted by this utility model is: a bonding wire mold cleaning mechanism, including a cleaning box and a cleaning box. A lower partition is fixedly installed inside the cleaning box, and a sealing cover is fitted onto the upper end of the cleaning box. An upper partition is fixedly installed at the lower middle position of the sealing cover. An ultrasonic cleaner is fixedly installed on one side of the cleaning box, and the output end of the ultrasonic cleaner extends into the interior of the cleaning box. The cleaning box is located below the cleaning box, and a water pump is fixedly installed on one side of the upper end of the cleaning box. The output end of the water pump is connected to the lower end of one side of the cleaning box. A return water pipe is fixedly installed on the lower end of the other side of the cleaning box, and the return water pipe is connected to the upper side of the cleaning box. Filter blocks are evenly inserted inside the cleaning box. The interior of the cleaning box is divided into a first cavity and a second cavity by the lower partition. The output end of the ultrasonic cleaner is located inside the first cavity. The outlet end of the water pump is connected to the lower side of the first cavity. The upper end of the return water pipe is connected to the second cavity. In use, the sealing cover is removed, the bonding wire mold to be cleaned is placed on the lower partition, and cleaning fluid is injected into the cleaning tank until it covers the bonding wire mold. The sealing cover is then replaced, pressing the bonding wire mold between the lower and upper partitions. The ultrasonic cleaner is then turned on to perform ultrasonic cleaning on the bonding wire mold, facilitating the removal of oil or impurities. After cleaning, the water pump is turned on, drawing the cleaning fluid from the cleaning tank into the first chamber. The cleaning fluid in the second chamber flows back into the cleaning tank through the return pipe, allowing the cleaning fluid to flow on the bonding wire mold. This facilitates the removal of impurities from the cleaning process, which are then filtered out by the filter block. This method is convenient and improves the cleaning effect on the bonding wire mold. For long-term use, the filter block can be replaced or cleaned to maintain the functionality of this invention.

[0007] Preferably, a clamping groove is provided at the middle position of both the lower partition and the upper partition. A water inlet pipe is fixedly installed at the outlet end of the water pump, and the water outlet end of the water pump is connected to the cleaning tank through the water inlet pipe. A feeding hopper is fixedly installed at the lower end of the second cavity. A return water pipe is fixedly installed on the lower side of the feeding hopper, and the return water pipe is connected to the second cavity through the feeding hopper. A support rod is fixedly installed between the cleaning tank and the cleaning tank. The sealing cover is sleeved on the upper end of the cleaning tank, and a handle is fixedly installed at the upper end of the sealing cover. Observation windows are fixedly installed on both sides of the upper end of the sealing cover. During use, the clamping groove facilitates the clamping and fixing of the external bonding wire mold, the handle facilitates the removal of the sealing cover, and the observation windows facilitate the observation of the interior of the first cavity and the second cavity, making it convenient to use. The feeding hopper facilitates the feeding of the cleaned impurities into the interior of the cleaning tank, making it convenient to use.

[0008] Preferably, a blind groove is provided on one side of the cleaning box, and the filter block is inserted into the blind groove. The water inlet end of the water pump and the lower end of the return water pipe are both connected to the blind groove. A groove is provided on one side of the blind groove, and a sealing plate is fixedly installed inside the groove. Perforated plates are evenly fixedly installed inside the blind groove, and the filter block is inserted between each of the perforated plates. Fixing ears are fixedly installed on both sides of the sealing plate. The sealing plate is fixedly installed on the cleaning box through the fixing ears, and the sealing plate seals the blind groove. During use, it is convenient to place and remove the filter block, and it is convenient to clean and replace it. The sealing plate makes it easy to seal the blind groove, so as to prevent overflow when filtering the cleaning liquid.

[0009] The beneficial effects of this utility model are: by using a water pump and an ultrasonic cleaner, it is convenient to perform ultrasonic cleaning on the inside of the bonding wire mold, and the impurities washed off are discharged into the cleaning box through the flowing water and collected by the filter block. During cleaning, the filter block can be replaced or cleaned, and it can be reused. This is convenient to operate and improves cleaning efficiency and cleaning effect. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0011] Figure 2 This is a partial structural schematic diagram of the present invention.

[0012] Figure 3 This is a structural diagram of the sealing cap position in this utility model.

[0013] Figure 4This is a structural diagram of the cleaning box location in this utility model.

[0014] Figure 5 This is a structural diagram showing the location of the filter block in this utility model.

[0015] Explanation of reference numerals in the attached drawings: 1. Cleaning tank; 2. Cleaning box; 3. Lower partition; 4. Sealing cover; 5. Upper partition; 6. Ultrasonic cleaner; 7. Water pump; 8. Return water pipe; 9. Filter block; 10. First chamber; 11. Second chamber; 12. Clamping groove; 13. Water inlet pipe; 14. Feed hopper; 15. Support rod; 16. Handle; 17. Observation window; 18. Blind groove; 19. Groove; 20. Sealing plate; 21. Perforated plate; 22. Fixing lug. Detailed Implementation

[0016] The present invention will be further described below with reference to the accompanying drawings: like Figure 1-5As shown, this embodiment provides a bonding wire mold cleaning mechanism, including a cleaning tank 1 and a cleaning tank 2. A lower partition 3 is fixedly installed inside the cleaning tank 1, and a sealing cover 4 is sleeved on the upper end of the cleaning tank 1. An upper partition 5 is fixedly installed at the middle position of the lower end of the sealing cover 4. An ultrasonic cleaner 6 is fixedly installed on one side of the cleaning tank 1, and the output end of the ultrasonic cleaner 6 extends into the interior of the cleaning tank 1. The cleaning tank 2 is located below the cleaning tank 1, and a water pump 7 is fixedly installed on one side of the upper end of the cleaning tank 2. The output end is connected to the lower end of one side of the cleaning tank 1. A return water pipe 8 is fixedly installed on the lower end of the other side of the cleaning tank 1, and the return water pipe 8 is connected to the upper side of the cleaning tank 2. Filter blocks 9 are evenly inserted inside the cleaning tank 2. The interior of the cleaning tank 1 is divided into a first chamber 10 and a second chamber 11 by a lower partition 3. The output end of the ultrasonic cleaner 6 is located inside the first chamber 10. The outlet end of the water pump 7 is connected to the lower side of the first chamber 10, and the upper end of the return water pipe 8 is connected to the second chamber 11. In use, the sealing cap 4 is removed, and the bonding wire mold to be cleaned is placed on the lower partition 3. Cleaning fluid is injected into the cleaning tank 1 until it covers the bonding wire mold. The sealing cap 4 is then closed, pressing the bonding wire mold between the lower partition 3 and the upper partition 5. The ultrasonic cleaner 6 is then turned on to perform ultrasonic cleaning on the bonding wire mold, facilitating the removal of oil or impurities. After cleaning, the water pump 7 is turned on, drawing the cleaning fluid from the cleaning tank 2 into the first chamber 10. The cleaning fluid in the second chamber 11 is returned to the cleaning tank 2 through the return water pipe 8, allowing the cleaning fluid to flow on the bonding wire mold. This facilitates the removal of impurities from the cleaning process, which are then filtered out through the filter block 9. This method is convenient and improves the cleaning effect on the bonding wire mold. For long-term use, the filter block 9 can be replaced or cleaned to maintain the cleanliness of the device.

[0017] A clamping groove 12 is provided in the middle of both the lower partition 3 and the upper partition 5. A water inlet pipe 13 is fixedly installed at the outlet of the water pump 7, and the outlet of the water pump 7 is connected to the cleaning tank 1 through the water inlet pipe 13. A feeding hopper 14 is fixedly installed at the lower end of the second cavity 11. A return water pipe 8 is fixedly installed on the lower side of the feeding hopper 14, and the return water pipe 8 is connected to the second cavity 11 through the feeding hopper 14. A support rod 15 is fixedly installed between the cleaning tank 1 and the cleaning tank 2. A sealing cover 4 is fitted onto the upper end of the cleaning tank 1. A handle 16 is fixedly installed on the upper end of the sealing cover 4, and observation windows 17 are fixedly installed on both sides of the upper end of the sealing cover 4. When in use, the external bonding wire mold can be clamped and fixed through the clamping groove 12, the sealing cover 4 can be removed through the handle 16, and the interior of the first cavity 10 and the second cavity 11 can be observed through the observation windows 17, which is convenient for use. The impurities washed off can be sent into the cleaning box 2 through the feeding hopper 14, which is convenient for use.

[0018] A blind groove 18 is provided on one side of the cleaning box 2, and the filter block 9 is inserted into the blind groove 18. The water inlet end of the water pump 7 and the lower end of the return water pipe 8 are both connected to the blind groove 18. A groove 19 is provided on one side of the blind groove 18, and a sealing plate 20 is fixedly installed inside the groove 19. Perforated plates 21 are evenly fixedly installed inside the blind groove 18, and the filter block 9 is inserted between each perforated plate 21. Fixing ears 22 are fixedly installed on both sides of the sealing plate 20. The sealing plate 20 is fixedly installed on the cleaning box 2 through the fixing ears 22, and the sealing plate 20 seals the blind groove 18. During use, it is convenient to place and remove the filter block 9, and to clean and replace it. The sealing plate 20 makes it easy to seal the blind groove 18, so as to prevent overflow when filtering the cleaning liquid.

[0019] The foregoing has shown and described the basic principles and main features of this invention, as well as its advantages. Those skilled in the art should understand that this invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this invention. Various changes and modifications can be made to this invention without departing from its spirit and scope. All such changes and modifications fall within the scope of this invention as defined by the appended claims and their equivalents.

Claims

1. A bonding wire mold cleaning mechanism, characterized in that: The cleaning box includes a cleaning box (1) and a cleaning box (2). The cleaning box (1) has a lower partition (3) fixedly installed inside, and a sealing cover (4) is fitted onto the upper end of the cleaning box (1). An upper partition (5) is fixedly installed at the middle position of the lower end of the sealing cover (4). An ultrasonic cleaner (6) is fixedly installed on one side of the cleaning box (1), and the output end of the ultrasonic cleaner (6) extends into the interior of the cleaning box (1). The cleaning box (2) is located below the cleaning box (1), and a water pump (7) is fixedly installed on one side of the upper end of the cleaning box (2). The output end of the water pump (7) is connected to the lower end of one side of the cleaning box (1). A return water pipe (8) is fixedly installed on the lower end of the other side of the cleaning box (1), and the return water pipe (8) is connected to one side of the upper end of the cleaning box (2). Filter blocks (9) are evenly inserted inside the cleaning box (2).

2. The bonding wire mold cleaning mechanism according to claim 1, characterized in that: The interior of the cleaning tank (1) is divided into a first cavity (10) and a second cavity (11) by the lower partition (3), and the output end of the ultrasonic cleaner (6) is located inside the first cavity (10). The water outlet of the water pump (7) is connected to the lower side of the first cavity (10), and the upper end of the return water pipe (8) is connected to the second cavity (11).

3. The bonding wire mold cleaning mechanism according to claim 1, characterized in that: The lower partition (3) and the upper partition (5) are both provided with clamping grooves (12) at the middle position.

4. The bonding wire mold cleaning mechanism according to claim 1, characterized in that: The water pump (7) has an inlet pipe (13) fixedly installed at its outlet end, and the water pump (7) outlet end is connected to the cleaning tank (1) through the inlet pipe (13).

5. The bonding wire mold cleaning mechanism according to claim 2, characterized in that: A feeding hopper (14) is fixedly installed at the lower end of the second cavity (11). The return water pipe (8) is fixedly installed on the lower side of the feeding hopper (14), and the return water pipe (8) is connected to the second cavity (11) through the feeding hopper (14). A support rod (15) is fixedly installed between the cleaning box (1) and the cleaning box (2).

6. The bonding wire mold cleaning mechanism according to claim 1, characterized in that: The sealing cover (4) is fitted onto the upper end of the cleaning box (1), and a handle (16) is fixedly installed on the upper end of the sealing cover (4). Observation windows (17) are fixedly installed on both sides of the upper end of the sealing cover (4).

7. The bonding wire mold cleaning mechanism according to claim 1, characterized in that: A blind groove (18) is provided on one side of the cleaning box (2), and the filter block (9) is inserted into the blind groove (18). The water inlet end of the water pump (7) and the lower end of the return water pipe (8) are both connected to the blind groove (18). A groove (19) is provided on one side of the blind groove (18), and a sealing plate (20) is fixedly installed inside the groove (19).

8. The bonding wire mold cleaning mechanism according to claim 7, characterized in that: The blind groove (18) is uniformly fixedly installed with perforated plates (21), and the filter block (9) is inserted between each of the perforated plates (21). The sealing plate (20) is fixedly installed with fixing ears (22) on both sides. The sealing plate (20) is fixedly installed on the cleaning box (2) through the fixing ears (22), and the sealing plate (20) seals the blind groove (18).

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