Semiconductor test fixture

Abstract

This utility model provides a semiconductor test fixture, relating to the field of semiconductor testing technology. The fixture includes a test stage, a test groove located in the center of the test stage, and test components symmetrically arranged on both sides of the test groove. Each test component includes a fixing plate, a pushing component, a test plate, a buffer component, and a connector. The pushing component drives the test plate to flexibly press the connector onto the semiconductor device pins via the buffer component, ensuring stable contact and preventing device damage. The pushing component includes a pushing cylinder and a reset component. The reset component consists of a pushing pin, a pushing block, a guide rod, a pressure ring, and a reset spring, enabling automatic reset after testing. The buffer component consists of a connecting rod, a bushing, an end cap, and a buffer spring, effectively absorbing the impact force during the pressing process and improving test stability.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor testing technology, and in particular to a semiconductor testing fixture. Background Technology

[0002] With the rapid development of the semiconductor industry, the testing requirements for semiconductor devices are also increasing. In semiconductor manufacturing processes, testing is a crucial step in ensuring product quality and performance. Among these, test fixtures, as key devices for achieving electrical connections, signal transmission, and mechanical positioning, directly impact testing efficiency and accuracy through their structural design.

[0003] Traditional semiconductor test fixtures, such as the patented CN222636204U, typically use a rigid pressing method to directly press the test probes or pins onto the pins of the device under test. Although this method is simple in structure, it is easy for the pins to deform or even break due to excessive pressure during the pressing process. In addition, due to the lack of a buffer structure, the contact pressure is uneven, which may cause poor contact and affect the stability and reliability of the test results. Utility Model Content

[0004] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a semiconductor testing fixture to solve the problem that the pins are easily deformed due to excessive pressure during the crimping process in the prior art.

[0005] To achieve the above and other related objectives, this utility model provides the following technical solution:

[0006] A semiconductor test fixture includes: a test stage; a plurality of test grooves disposed in the middle of the test stage and used to place a semiconductor device to be tested; test components symmetrically disposed on both sides of the test grooves; each test component includes a fixing plate, a push component disposed on the fixing plate, a test plate disposed parallel to the fixing plate and located between the test grooves and the fixing plate, a plurality of buffer components disposed on the test plate, and a connector disposed on the buffer components.

[0007] To achieve the above technical solution, the semiconductor test fixture of this utility model, during use, places the semiconductor device under test in a test groove located in the center of the test stage. Test components are symmetrically arranged on both sides of the test groove, and each test component includes a fixing plate, a pushing component, a test plate, a buffer component, and a connector. During testing, the pushing component drives the test plate to move towards the test groove, causing the connector to flexibly press against the pins of the semiconductor device through the buffer component, thereby establishing a stable and reliable electrical connection. The buffer component absorbs the impact force during the pushing process, ensuring uniform contact pressure and preventing damage to the device.

[0008] In one embodiment of the present invention, the pushing assembly includes a pushing plate, a pushing cylinder with its output end disposed on the pushing plate, and a reset assembly disposed between the pushing plate and the fixed plate for pushing the buffer assembly.

[0009] To achieve the above technical solution, the jacking assembly includes a jacking plate, a jacking cylinder mounted on the jacking plate, and a reset assembly located between the jacking plate and the fixed plate. When the test begins, the jacking cylinder is activated, pushing the jacking plate towards the test groove. After the test is completed, the jacking cylinder retracts, and the reset assembly automatically resets to its initial position, preparing for the next test.

[0010] In one embodiment of the present invention, the reset assembly includes a push pin screwed onto the push plate and a push block disposed on the push pin near one end of the fixed plate; the push pin includes a threaded portion screwed onto the push plate and a smooth portion passing through the fixed plate and connected to the push block; a pressure ring is fixed on the smooth portion, a guide rod passing through the fixed plate is provided on the pressure ring, and a reset spring located between the pressure ring and the push plate is sleeved on the outer periphery of the smooth portion.

[0011] To achieve the above technical solution, in the semiconductor testing fixture of this utility model, a reset assembly is disposed between a push plate and a fixed plate, comprising a push pin, a push block, a guide rod, a pressure ring, and a reset spring. The push pin has a threaded portion that screws onto the push plate and a smooth portion that passes through the fixed plate, with the end of the smooth portion connected to the push block. The pressure ring is fixed to the outer circumference of the smooth portion and forms a guiding fit with the fixed plate through the guide rod, ensuring the stability and linearity of the movement during reset. The reset spring is sleeved on the smooth portion and located between the pressure ring and the fixed plate. When the push cylinder pushes the push plate forward to complete the test and then retracts, the reset spring, relying on its elastic restoring force, pushes the pressure ring and the push block back to their initial positions, achieving automatic reset. By adjusting the threaded portion of the push pin, the initial position between the push block and the fixed plate can also be adjusted, achieving fine-tuning control of the reset force and stroke.

[0012] In one embodiment of the present invention, the buffer assembly includes a connecting rod that passes through the test plate and is connected to the connector, a bushing that is embedded in the test plate and sleeved on the connecting rod, an end cap that is fixed to the end of the connecting rod near the push block, and a buffer spring that is sleeved on the connecting rod and located between the end cap and the bushing.

[0013] To achieve the above technical solution, a buffer assembly is positioned between the test board and the connector, including a connecting rod, a bushing, an end cap, and a buffer spring. The connecting rod passes through the test board and connects to the connector. The buffer spring is sleeved on the connecting rod and located between the end cap and the bushing. When the push assembly pushes the test board down, the connector moves downward via the connecting rod and contacts the semiconductor device pins. At this time, the buffer spring is compressed, absorbing the impact force caused by the push action. This buffer structure allows the connector to flexibly conform to the device pins, avoiding pin damage or poor contact caused by rigid contact, thereby ensuring a stable and reliable testing process.

[0014] In one embodiment of the present invention, the connector includes a connector body and a plurality of pins disposed on the connector body; the connector body is provided with a slide rod that passes through the test plate.

[0015] To achieve the above technical solution, in the semiconductor test fixture of this utility model, the connector includes a connector body and a plurality of pins disposed thereon. The connector body is provided with slide bars that pass through the test plate, allowing the connector to move along the direction of the slide bars under the action of the push assembly. The design of the slide bars ensures that the connector maintains stable linear movement during crimping operations, avoiding offset or tilting, thereby guaranteeing accurate alignment and stable contact between the pins and the device leads.

[0016] As described above, the semiconductor test fixture of this utility model has the following beneficial effects: by setting a buffer component, the connector can absorb the impact force through the buffer spring during the crimping process, avoiding pin damage caused by rigid crimping and improving the safety and reliability of the testing process; the push component is equipped with a reset spring and guide rod structure, which can automatically reset to the initial position after the test is completed without manual intervention, facilitating continuous testing operations; by setting multiple test grooves and corresponding test components, multiple sets of semiconductor devices can be tested simultaneously in one operation, significantly improving testing efficiency. Attached Figure Description

[0017] Figure 1 The diagram shown is a structural schematic of this utility model.

[0018] Figure 2 The diagram shows the structure of a semiconductor device.

[0019] Component designation explanation

[0020] 1. Test stand; 2. Test groove; 3. Fixing plate; 4. Test plate; 5. Connector; 51. Connector body; 52. Pin; 6. Push plate; 7. Push cylinder; 8. Push pin; 81. Threaded part; 82. Smooth part; 9. Push block; 10. Pressure ring; 11. Guide rod; 12. Return spring; 13. Connecting rod; 14. Bushing; 15. End cap; 16. Buffer spring; 17. Slide rod. Detailed Implementation

[0021] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. It should be noted that, unless otherwise specified, the following embodiments and features can be combined with each other.

[0022] Please see Figures 1 to 2 This utility model provides a semiconductor test fixture, including: a test stage 1; a plurality of test grooves 2, the test grooves 2 being disposed in the middle of the test stage 1 and used to place the semiconductor device to be tested; test components symmetrically disposed on both sides of the test grooves 2; the test components include a fixing plate 3, a push component disposed on the fixing plate 3, a test plate 4 disposed parallel to the fixing plate 3 and located between the test grooves 2 and the fixing plate 3, a plurality of buffer components disposed on the test plate 4, and a connector 5 disposed on the buffer components.

[0023] In use, the semiconductor test fixture of this invention places the semiconductor device under test in the test groove 2 located in the center of the test stage 1. Test components are symmetrically arranged on both sides of the test groove 2. Each test component includes a fixing plate 3, a pushing component, a test plate 4, a buffer component, and a connector 5. During testing, the pushing component drives the test plate 4 to move towards the test groove 2, causing the connector 5 to flexibly press against the pins of the semiconductor device through the buffer component, thereby establishing a stable and reliable electrical connection. The buffer component absorbs the impact force during the pushing process, ensuring uniform contact pressure and preventing damage to the device.

[0024] The pushing assembly includes a pushing plate 6, a pushing cylinder 7 with its output end disposed on the pushing plate 6, and a reset assembly disposed between the pushing plate 6 and the fixed plate 3 for pushing the buffer assembly.

[0025] The push assembly includes a push plate 6, a push cylinder 7 mounted on the push plate 6, and a reset assembly located between the push plate 6 and the fixed plate 3. When the test begins, the push cylinder 7 is activated, pushing the push plate 6 towards the test groove 2. After the test is completed, the push cylinder 7 retracts, and the reset assembly automatically resets to its initial position, preparing for the next test.

[0026] The reset assembly includes a pusher 8 screwed onto the pusher plate 6 and a pusher block 9 disposed on the pusher 8 near the fixed plate 3. The pusher 8 includes a threaded portion 81 screwed onto the pusher plate 6 and a smooth portion 82 passing through the fixed plate 3 and connected to the pusher block 9. A pressure ring 10 is fixed on the smooth portion 82, and a guide rod 11 passing through the fixed plate 3 is provided on the pressure ring 10. A reset spring 12 located between the pressure ring 10 and the pusher plate is sleeved on the outer periphery of the smooth portion 82.

[0027] In the semiconductor testing fixture described in this utility model, a reset assembly is disposed between the push plate 6 and the fixed plate 3, and includes a push pin 8, a push block 9, a guide rod 11, a pressure ring 10, and a reset spring 12. The push pin 8 has a threaded portion 81 that screws onto the push plate 6 and a smooth portion 82 that passes through the fixed plate 3, with the end of the smooth portion 82 connected to the push block 9. The pressure ring 10 is fixed to the outer periphery of the smooth portion 82 and forms a guiding fit with the fixed plate 3 through the guide rod 11, ensuring the stability and linearity of the movement during the reset process. The reset spring 12 is sleeved on the smooth portion 82 and is located between the pressure ring 10 and the fixed plate 3. When the push cylinder 7 pushes the push plate 6 forward to complete the test and then retracts, the reset spring 12 uses its elastic restoring force to push the pressure ring 10 and the push block 9 back to their initial positions, achieving automatic reset. By adjusting the threaded portion 81 of the push pin 8, the initial position between the push block 9 and the fixed plate 3 can also be adjusted, achieving fine-tuning control of the reset force and stroke.

[0028] The buffer assembly includes a connecting rod 13 that passes through the test plate 4 and connects to the connector 5, a bushing 14 that is embedded in the test plate 4 and sleeved on the connecting rod 13, an end cap 15 that is fixed to the end of the connecting rod 13 near the push block 9, and a buffer spring 16 that is sleeved on the connecting rod 13 and located between the end cap 15 and the bushing 14.

[0029] A buffer assembly, comprising a connecting rod 13, a bushing 14, an end cap 15, and a buffer spring 16, is positioned between the test plate 4 and the connector 5. The connecting rod 13 passes through the test plate 4 and connects to the connector 5. The buffer spring 16 is sleeved on the connecting rod 13 and located between the end cap 15 and the bushing 14. When the push assembly pushes the test plate 4 downwards, the connector 5 moves downwards via the connecting rod 13 and contacts the semiconductor device pins. At this time, the buffer spring 16 is compressed, absorbing the impact force from the push action. This buffer structure allows the connector 5 to flexibly conform to the device pins, avoiding pin damage or poor contact caused by rigid contact, thereby ensuring a stable and reliable testing process.

[0030] The connector 5 includes a connector 5 body and a plurality of pins 52 disposed on the connector 5 body; the connector 5 body is provided with slide bars 17 that pass through the test plate 4. In the semiconductor test fixture of this utility model, the connector 5 includes a connector 5 body and a plurality of pins 52 disposed thereon. The connector 5 body is provided with slide bars 17, which pass through the test plate 4, allowing the connector 5 to move along the direction of the slide bars 17 under the action of the push assembly. The design of the slide bars 17 ensures that the connector 5 can maintain stable linear movement during crimping operations, avoiding offset or tilting, thereby ensuring accurate alignment and stable contact between the pins 52 and the device pins.

[0031] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit this utility model. All equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A semiconductor test fixture, characterized in that, include: Test bench; Several test recesses are provided, which are located in the middle of the test stage and are used to place the semiconductor device to be tested. Test components symmetrically arranged on both sides of the test groove; The test assembly includes a fixed plate, a pushing assembly disposed on the fixed plate, a test plate disposed parallel to the fixed plate and located between the test groove and the fixed plate, a plurality of buffer assemblies disposed on the test plate, and a connector disposed on the buffer assemblies.

2. The semiconductor test fixture according to claim 1, characterized in that: The pushing assembly includes a pushing plate, a pushing cylinder with its output end disposed on the pushing plate, and a reset assembly disposed between the pushing plate and the fixed plate for pushing the buffer assembly.

3. The semiconductor test fixture according to claim 2, characterized in that: The reset assembly includes a push pin screwed onto the push plate and a push block disposed on the push pin near one end of the fixed plate. The pusher includes a threaded portion screwed onto the pusher plate and a smooth portion passing through the fixed plate and connected to the pusher block; A pressure ring is fixed on the smooth part, and a guide rod is provided on the pressure ring that passes through the fixed plate. A return spring is sleeved on the outer periphery of the smooth part between the pressure ring and the push plate.

4. The semiconductor test fixture according to claim 3, characterized in that: The buffer assembly includes a connecting rod that passes through the test plate and connects to the connector, a bushing that is embedded in the test plate and sleeved on the connecting rod, an end cap that is fixed to the end of the connecting rod near the push block, and a buffer spring that is sleeved on the connecting rod and located between the end cap and the bushing.

5. The semiconductor test fixture according to claim 1, characterized in that: The connector includes a connector body and a plurality of pins disposed on the connector body; The connector body is provided with a slide rod that passes through the test plate.

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