A shielding structure for signal connection

Abstract

This application relates to the field of signal shielding device technology, and provides a shielding structure for signal connection, including a PCB board, a shielding cover, a board-end connector, an elastic conductive gasket, and a wire-end connector. The shielding cover is connected to the PCB board and forms a shielding cavity, with a through-hole on the side of the shielding cover facing away from the PCB board. The board-end connector is placed inside the shielding cavity, and its insertion end extends out of the shielding cover through the through-hole. The elastic conductive gasket is sleeved around the insertion end of the board-end connector and covers the through-hole, and the elastic conductive gasket is in electrical contact with the shielding cover. The wire-end connector is inserted into the insertion end of the board-end connector. Based on this, the sealing and shielding effect can be improved, and it is applicable to different scenarios.

Description

Technical Field

[0001] This invention relates to the field of signal shielding device technology, and more specifically to a shielding structure for signal connections. Background Technology

[0002] With the surge in bandwidth demands from in-vehicle infotainment, ADAS, and 5G communication modules, shielding integrity has become a key indicator determining the EMI / EMS (radiated interference) performance of a system. In some scenarios, 360° fully shielded connectors are commonly used, with an additional metal shielding cover added to the PCB to form segmented shielding: the connectors are connected to the circuitry within the shielding cover via traces.

[0003] However, this method has two major structural defects: First, the connector signal pins must first pass through a section of exposed trace outside the shield before entering the shielded area through a via. This exposed section is prone to interference (EMS problem) and radiated emissions (EMI problem). Second, if the connector and shield are placed on opposite sides of the PCB, the exposed trace can be eliminated, but this only applies to through-hole connectors. Surface mount devices still need to retain an exposed section, increasing the overall thickness and process complexity.

[0004] Especially when automotive electronics need to meet radiated immunity tests of 200V / m (200MHz-3.2GHz) and 400V / m (1.2-3.3GHz), the above two defects make it difficult to meet EMC standards, result in high rectification costs, and require repeated design iterations.

[0005] Therefore, this application studies a shielding structure for signal connection, which can improve the sealing and shielding effect and is applicable to different scenarios. Utility Model Content

[0006] In order to improve the sealing and shielding effect and to be applicable to different scenarios, this application provides a shielding structure for signal connection.

[0007] This application provides a shielding structure for a signal connection, which adopts the following technical solution:

[0008] A shielding structure for signal connection includes a PCB board, a shielding cover, a board-end connector, an elastic conductive pad, and a wire-end connector. The shielding cover is connected to the PCB board and forms a shielding cavity. The shielding cover has a through-hole on the side facing away from the PCB board. The board-end connector is placed inside the shielding cavity, and the plug end of the board-end connector extends out of the shielding cover through the through-hole. The elastic conductive pad is sleeved on the outer periphery of the plug end of the board-end connector and covers the through-hole. The elastic conductive pad is in electrical contact with the shielding cover. The wire-end connector is plugged into the plug end of the board-end connector.

[0009] By adopting the above technical solution, the exposed PCB traces that were originally located outside the shielding cover are completely enclosed in the shielding cavity through the combination of the shielding cover and the elastic conductive pad. This eliminates the interference and radiation problems caused by the exposed traces and vias, thereby significantly reducing EMI and improving EMS performance. This improves the sealing and shielding effect and is applicable to different scenarios.

[0010] Optionally, the elastic conductive pad has an installation opening, through which it is fitted onto the insertion end of the board connector.

[0011] By adopting the above technical solution, the elastic conductive pad can be accurately and quickly positioned on the outer periphery of the board connector, avoiding assembly misalignment, ensuring that the through-hole is completely covered, and further improving the assembly yield and shielding consistency.

[0012] Optionally, the diameter of the mounting port is smaller than the outer diameter of the board end connector plug-in end.

[0013] By adopting the above technical solution, an elastic clamping mechanism is formed between the mounting port and the board end connector, eliminating circumferential gaps, preventing radiation leakage from the mating gap, and improving shielding integrity.

[0014] Optionally, the elastic conductive pad is annular, and the outer diameter of the elastic conductive pad is larger than the diameter of the through opening.

[0015] By adopting the above technical solutions, it is possible to improve the sealing requirements of the shielding.

[0016] Optionally, the elastic conductive pad is square in shape, and the diagonal distance of the elastic conductive pad is greater than the diameter of the through opening.

[0017] Optionally, the thickness of the elastic conductive pad is greater than 60% of the gap height between the wire end connector and the shield.

[0018] By adopting the above technical solution, sufficient compression ensures that the gasket remains in an elastic compressed state after insertion, maintaining a long-term stable electrical contact pressure and preventing the shielding performance from deteriorating due to temperature cycling or vibration.

[0019] Optionally, the elastic conductive pad includes a conductive outer layer and an elastic substrate layer, wherein the conductive outer layer is wrapped around the elastic substrate layer, and the conductive outer layer is at least one of conductive cloth, conductive aluminum foil, or conductive copper foil; the elastic substrate layer is a composite layer of low-density polyethylene terephthalate and polyurethane foam.

[0020] By adopting the above technical solution, the elastic conductive pad has good compression and resilience, and can be compressed to 60% of its original thickness and can also rebound to its original thickness. It can also provide a low impedance shielding path, ensuring high-speed shielding effectiveness and long-term mechanical reliability.

[0021] Optionally, the elastic conductive pad is an EMI pad.

[0022] Optionally, when the wire-end connector is inserted into the plug end of the board-end connector, the elastic conductive pad is squeezed.

[0023] In summary, this application includes the following beneficial technical effects:

[0024] 1. By combining the shielding cover with the elastic conductive pad, the exposed PCB traces that were originally located outside the shielding cover are completely enclosed in the shielding cavity, eliminating the interference and radiation problems caused by exposed traces and vias, thereby significantly reducing EMI and improving EMS performance, thus improving the sealing and shielding effect, and is suitable for different scenarios.

[0025] 2. The mounting port allows the elastic conductive pad to be accurately and quickly positioned on the outer periphery of the board connector, avoiding assembly misalignment, ensuring that the through-hole is completely covered, and further improving assembly yield and shielding consistency.

[0026] 3. The diameter of the mounting port is smaller than the outer diameter of the board-end connector's insertion end, so that the mounting port and the board-end connector form an elastic clamp, eliminating circumferential gaps, preventing radiation from leaking from the mating gap, and improving shielding integrity. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other embodiments can be obtained based on these drawings without creative effort.

[0028] In the diagram:

[0029] Figure 1 This is an exploded view of the shielding structure for the signal connection in an embodiment of this application;

[0030] Figure 2 This is a schematic diagram of the shielding structure for signal connection in an embodiment of this application.

[0031] Reference numerals: 1. PCB board; 2. Shielding cover; 3. Board end connector; 4. Elastic conductive pad; 5. Wire end connector; 6. Through port; 7. Mounting port. Detailed Implementation

[0032] The following is in conjunction with the appendix Figure 1-2 This application will be described in further detail.

[0033] This application discloses a shielding structure for signal connections. (Refer to...) Figure 1 and Figure 2 The shielding structure for signal connection includes a PCB board 1, a shielding cover 2, a board-end connector 3, an elastic conductive pad 4, and a wire-end connector 5. The shielding cover 2 is connected to the PCB board 1 and forms a shielding cavity, with a through-hole 6 on the side away from the PCB board 1. The board-end connector 3 is placed inside the shielding cavity, and the insertion end of the board-end connector 3 extends out of the shielding cover 2 through the through-hole 6. The elastic conductive pad 4 is sleeved on the outer periphery of the insertion end of the board-end connector 3 and covers the through-hole 6. The elastic conductive pad 4 is in electrical contact with the shielding cover 2. The wire-end connector 5 is inserted into the insertion end of the board-end connector 3 and is connected to a shielded wire harness.

[0034] In some embodiments, when the wire-end connector 5 is inserted into the mating end of the board-end connector 3, the elastic conductive pad 4 is compressed. This further covers and seals the through-hole 6, improving the sealing effect.

[0035] After the wire connector 5 is plugged into the board connector 3, it will squeeze the elastic conductive pad 4, so that the elastic conductive pad 4 covers the connection position of the board connector 3 and the wire connector 5 and covers the through-hole 6, completely sealing the exposed PCB traces that were originally located outside the shielding cover 2 in the shielding cavity, eliminating the interference and radiation problems caused by exposed traces and vias, thereby significantly reducing EMI and improving EMS performance, thus improving the sealing and shielding effect, and being suitable for different scenarios.

[0036] Continue to refer to Figure 1 In some embodiments, the elastic conductive pad 4 has a mounting opening 7, the shape of which matches the shape of the protruding plug end of the board-end connector 3. The pad 4 is fitted onto the plug end of the board-end connector 3 through the mounting opening 7, thereby enabling better shielding against interference.

[0037] In some embodiments, the diameter of the mounting port 7 is smaller than the outer diameter of the mating end of the board-end connector 3. This allows for an interference fit between the board-end connector 3 and the mounting port 7 after insertion, thereby improving shielding integrity.

[0038] In some embodiments, the elastic conductive pad 4 is annular, and the outer diameter of the elastic conductive pad 4 is larger than the diameter of the through-hole 6. This allows the elastic conductive pad 4 to completely cover the mounting opening 7, improving the shielding capability.

[0039] In some embodiments, the elastic conductive pad 4 is square-shaped, and the diagonal distance of the elastic conductive pad 4 is greater than the diameter of the through-hole 6. That is, the elastic conductive pad 4 can completely cover the mounting opening 7, thereby improving the shielding capability.

[0040] In some embodiments, the thickness of the elastic conductive pad 4 is greater than 60% of the gap height between the wire connector 5 and the shield 2. This allows the elastic conductive pad 4 to be compressed after the wire connector 5 is inserted into the board connector 3, and the elastic conductive pad 4 rebounds to cover the mounting opening 7, thereby improving the shielding capability.

[0041] In some embodiments, the elastic conductive pad 4 includes a conductive outer layer and an elastic substrate layer. The conductive outer layer is wrapped around the elastic substrate layer, and the conductive outer layer is at least one of conductive cloth, conductive aluminum foil, or conductive copper foil. The elastic substrate layer is a composite layer of low-density polyethylene terephthalate and polyurethane foam. This gives the elastic conductive pad 4 good compressibility and resilience, allowing it to be compressed to a maximum of 60% of its original thickness and to rebound to its original thickness. It also provides a low-impedance shielding path, ensuring high-speed shielding effectiveness and long-term mechanical reliability.

[0042] In some embodiments, the elastic conductive pad 4 is an EMI pad. The EMI pad comprises a foam core wrapped with conductive fabric and is a sealing element for electromagnetic interference shielding.

[0043] The implementation principle of the shielding structure for signal connection in this application embodiment is as follows: by combining the shielding cover 2 and the elastic conductive pad 4, the exposed PCB traces that were originally located outside the shielding cover 2 are completely enclosed in the shielding cavity, and the through-hole 6 is covered by the elastic conductive pad 4, eliminating the interference and radiation problems caused by the exposed traces and vias, thereby significantly reducing EMI and improving EMS performance, thus improving the sealing and shielding effect, and being applicable to different scenarios.

[0044] The above are exemplary embodiments disclosed in this invention. However, it should be noted that various changes and modifications can be made without departing from the scope of the embodiments of this invention as defined by the claims. The functions, steps, and / or actions of the methods according to the disclosed embodiments described herein do not need to be performed in any particular order. Furthermore, although the elements disclosed in the embodiments of this invention may be described or claimed individually, they may be understood as multiple unless explicitly limited to a singular number.

[0045] It should be understood that, as used herein, the singular form "a" is intended to include the plural form as well, unless the context clearly supports an exception. It should also be understood that, as used herein, "and / or" refers to any and all possible combinations of one or more of the associatedly listed items. The embodiment numbers disclosed above are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0046] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of the invention (including the claims) is limited to these examples. Within the framework of the invention, technical features of the above embodiments or different embodiments can be combined, and many other variations of different aspects of the invention exist, which are not provided in the details for the sake of brevity. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the invention should be included within the protection scope of the invention.

Claims

1. A shielding structure for signal connection, characterized in that: The device includes a PCB board, a shielding cover, a board-end connector, an elastic conductive pad, and a wire-end connector. The shielding cover is connected to the PCB board and forms a shielding cavity. The shielding cover has a through-hole on the side facing away from the PCB board. The board-end connector is placed inside the shielding cavity, and the plug end of the board-end connector extends out of the shielding cover through the through-hole. The elastic conductive pad is sleeved on the outer periphery of the plug end of the board-end connector and covers the through-hole. The elastic conductive pad is in electrical contact with the shielding cover. The wire-end connector is plugged into the plug end of the board-end connector.

2. The shielding structure for a signal connection according to claim 1, characterized in that: The elastic conductive pad has an installation opening, through which it is fitted onto the insertion end of the board connector.

3. The shielding structure for a signal connection according to claim 2, characterized in that: The diameter of the mounting port is smaller than the outer diameter of the board end connector plug-in end.

4. The shielding structure for a signal connection according to claim 1, characterized in that: The elastic conductive pad is annular, and the outer diameter of the elastic conductive pad is larger than the diameter of the through opening.

5. The shielding structure for a signal connection according to claim 1, characterized in that: The elastic conductive pad is square in shape, and the diagonal distance of the elastic conductive pad is greater than the diameter of the through opening.

6. The shielding structure for a signal connection according to claim 1, characterized in that: The thickness of the elastic conductive pad is greater than 60% of the gap height between the wire connector and the shield.

7. The shielding structure for a signal connection according to claim 1, characterized in that: The elastic conductive pad includes a conductive outer layer and an elastic substrate layer. The conductive outer layer is wrapped around the elastic substrate layer. The conductive outer layer is at least one of conductive cloth, conductive aluminum foil, or conductive copper foil. The elastic substrate layer is a composite layer of low-density polyethylene terephthalate and polyurethane foam.

8. The shielding structure for a signal connection according to claim 1, characterized in that: The elastic conductive pad is an EMI pad.

9. The shielding structure for a signal connection according to claim 1, characterized in that: When the wire-end connector is inserted into the plug end of the board-end connector, the elastic conductive pad is squeezed.

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