Neutral electrodes and medical devices

Abstract

This utility model discloses a neutral electrode and a medical device. The neutral electrode includes: an insulating carrier film; a metal composite film including a first conductive coating and a second conductive coating, the first conductive coating and the second conductive coating being disposed on top of the insulating carrier film; a first semiconductor film including a first semiconductor coating and a second semiconductor coating, the first semiconductor coating being disposed on top of the first conductive coating, the second semiconductor coating being disposed on top of the second conductive coating, and a first through-hole being formed between the first semiconductor coating and the second semiconductor coating; a second semiconductor film including a third semiconductor coating and a fourth semiconductor coating, the third semiconductor coating being disposed on top of the first semiconductor coating, the fourth semiconductor coating being disposed on top of the second semiconductor coating, and a second through-hole being formed between the third semiconductor coating and the fourth semiconductor coating, the diameter of the second through-hole being smaller than the diameter of the first through-hole; and a conductive gel layer disposed on top of the second semiconductor film.

Description

Technical Field

[0001] This utility model relates to the field of neutral electrode technology, and in particular to a neutral electrode and a medical device. Background Technology

[0002] The neutral electrode is used in conjunction with a high-frequency electrosurgical unit to provide a safe negative circuit for the high-frequency current. During high-frequency surgery, the current and the heat it generates can accumulate at the edge of the conductive metal of the neutral electrode, causing uneven current distribution and increasing the risk of burns to the patient. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a neutral electrode and a medical device that can avoid increasing the risk of burns to patients due to uneven current distribution.

[0004] This invention also proposes a medical device having the above-mentioned neutral electrode.

[0005] The neutral electrode according to a first aspect embodiment of the present invention comprises:

[0006] Insulating carrier film;

[0007] A metal composite film includes a first conductive coating and a second conductive coating, wherein the first conductive coating and the second conductive coating are symmetrically disposed on the top of the insulating carrier film.

[0008] The first semiconductor film includes a first semiconductor coating and a second semiconductor coating arranged symmetrically on the left and right sides. The first semiconductor coating is disposed on top of the first conductive coating, and the second semiconductor coating is disposed on top of the second conductive coating. A first through hole is formed between the first semiconductor coating and the second semiconductor coating.

[0009] The second semiconductor film includes a third semiconductor coating and a fourth semiconductor coating arranged symmetrically on the left and right sides. The third semiconductor coating is disposed on top of the first semiconductor coating, and the fourth semiconductor coating is disposed on top of the second semiconductor coating. A second through hole is formed between the third semiconductor coating and the fourth semiconductor coating. The diameter of the second through hole is smaller than the diameter of the first through hole.

[0010] A conductive gel layer is disposed on top of the third semiconductor coating and the fourth semiconductor coating, respectively.

[0011] The neutral electrode according to the present invention has at least the following beneficial effects: Since the second through hole formed between the third semiconductor coating and the fourth semiconductor coating is smaller than the first through hole formed between the first semiconductor coating and the second semiconductor coating, the coverage area of ​​the third semiconductor coating is larger than that of the first semiconductor coating, and the coverage area of ​​the fourth semiconductor coating is larger than that of the second semiconductor coating. The resistance of the part where the third semiconductor coating overlaps with the first semiconductor coating is greater than the resistance of the part where the third semiconductor coating does not overlap. Similarly, the resistance of the part where the fourth semiconductor coating overlaps with the second semiconductor coating is greater than the resistance of the part where the fourth semiconductor coating does not overlap. Therefore, when the current flows through the first semiconductor film and the second semiconductor film, the current distribution can be balanced, thereby reducing the risk of burns to the patient.

[0012] According to some embodiments of the present invention, the neutral electrode further includes a metal wire, the metal composite film includes a first part and a second part, the metal wire is disposed in the first part, and the first semiconductor film and the second semiconductor film are both located in the second part.

[0013] According to some embodiments of the present invention, the neutral electrode further includes an insulating adhesive layer, which is adhered to the top of the conductive gel layer, and the shape of the insulating adhesive layer is the same as the shape of the insulating carrier film.

[0014] According to some embodiments of the present invention, the neutral electrode further includes insulating foam, the insulating carrier film has a first groove and a second groove, the insulating foam is disposed in the first part, the metal wire is disposed between the first part and the insulating foam, and the two ends of the insulating foam pass through the first groove and the second groove respectively and are fixed to the bottom of the insulating carrier film.

[0015] According to some embodiments of the present invention, the neutral electrode further includes a third semiconductor film, the third semiconductor film including a fifth semiconductor coating and a sixth semiconductor coating symmetrically arranged on the left and right, the fifth semiconductor coating being disposed on top of the third semiconductor coating, the sixth semiconductor coating being disposed on top of the fourth semiconductor coating, and a third through hole being formed between the fifth semiconductor coating and the sixth semiconductor coating, the diameter of the third through hole being smaller than the diameter of the second through hole.

[0016] According to some embodiments of the present invention, the neutral electrode further includes a fourth semiconductor film, the fourth semiconductor film including a seventh semiconductor coating and an eighth semiconductor coating symmetrically arranged on the left and right, the seventh semiconductor coating being disposed on top of the fifth semiconductor coating, the eighth semiconductor coating being disposed on top of the sixth semiconductor coating, a fourth through hole being formed between the seventh semiconductor coating and the eighth semiconductor coating, the diameter of the fourth through hole being smaller than the diameter of the third through hole.

[0017] The medical device according to a second aspect of the present invention includes the neutral electrode described in the first aspect.

[0018] The medical device according to the present invention has at least the following beneficial effects: Since the second through hole formed between the third semiconductor coating and the fourth semiconductor coating is smaller than the first through hole formed between the first semiconductor coating and the second semiconductor coating, the coverage area of ​​the third semiconductor coating is larger than that of the first semiconductor coating, and the coverage area of ​​the fourth semiconductor coating is larger than that of the second semiconductor coating. The resistance of the part where the third semiconductor coating overlaps with the first semiconductor coating is greater than the resistance of the part where the third semiconductor coating does not overlap. Similarly, the resistance of the part where the fourth semiconductor coating overlaps with the second semiconductor coating is greater than the resistance of the part where the fourth semiconductor coating does not overlap. Therefore, when the current flows through the first semiconductor film and the second semiconductor film, the current distribution can be balanced, thereby reducing the risk of burns to the patient.

[0019] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0021] Figure 1 This is a schematic diagram of the neutral electrode in an embodiment of the present invention. Detailed Implementation

[0022] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0023] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0024] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" or "second" is used in the description, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0025] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0026] Reference Figure 1 , Figure 1 This is a schematic diagram of the structure of a neutral electrode provided in an embodiment of this application.

[0027] It is understood that the neutral electrode includes an insulating carrier film 100, a metal composite film, a first semiconductor film, a second semiconductor film, a third semiconductor film, a fourth semiconductor film, a conductive gel layer 700, an insulating adhesive layer 800, and a metal wire 900. The first semiconductor film includes a first semiconductor coating 300 and a second semiconductor coating 310 arranged symmetrically from left to right. The second semiconductor film includes a third semiconductor coating 400 and a fourth semiconductor coating 410 arranged symmetrically from left to right. The third semiconductor film includes a fifth semiconductor coating 500 and a sixth semiconductor coating 510 arranged symmetrically from left to right. The fourth semiconductor film includes a seventh semiconductor coating 600 and an eighth semiconductor coating 610 arranged symmetrically from left to right. The metal composite film includes a first conductive coating 200 and a second conductive coating 210. The first conductive coating 200 and the second conductive coating 210 are symmetrically adhered to the top of the insulating carrier film 100. A first semiconductor coating 300, a third semiconductor coating 400, a fifth semiconductor coating 500, and a seventh semiconductor coating 600 are sequentially adhered to the top of the first conductive coating 200 from bottom to top. A second semiconductor coating 310, a fourth semiconductor coating 410, a sixth semiconductor coating 510, and an eighth semiconductor coating 610 are sequentially adhered to the top of the second conductive coating 210 from bottom to top. At the top of the 0, a first through-hole 320 is formed between the first semiconductor coating 300 and the second semiconductor coating 310, a second through-hole 420 is formed between the third semiconductor coating 400 and the fourth semiconductor coating 410, a third through-hole 520 is formed between the fifth semiconductor coating 500 and the sixth semiconductor coating 510, and a fourth through-hole 620 is formed between the seventh semiconductor coating 600 and the eighth semiconductor coating 610. The apertures of the first through-hole 320, the second through-hole 420, the third through-hole 520, and the fourth through-hole 620 decrease sequentially, with the fourth through-hole 620 having the smallest aperture. Therefore, the thickness of the semiconductor coating in the metal composite film decreases from the edge to the center.

[0028] It should be noted that the resistance of each semiconductor coating is the same. The thicker the semiconductor coating, the greater the resistance; that is, the resistance of the semiconductor coating in the metal composite film increases from the edge to the center. When current passes through the first, second, third, and fourth semiconductor films, the current can be balanced to ensure that the current is evenly distributed across the semiconductor coating, thereby reducing the risk of burns to the patient.

[0029] It should be noted that in some embodiments, the insulating carrier film 100 is a coated nonwoven fabric.

[0030] Understandably, the neutral electrode also includes a metal wire 900, and the metal composite film includes a first portion 220 and a second portion 230. The metal wire 900 is disposed in the first portion 220, and the first semiconductor film, the second semiconductor film, the third semiconductor film, and the fourth semiconductor film are all located in the second portion 230. The metal wire 900 includes a first connecting end and a second connecting end. The first connecting end is fixed to the first conductive coating 200, and the second connecting end is fixed to the second conductive coating 210.

[0031] Specifically, the neutral electrode also includes insulating foam 910, which is used to fix the metal wire to the first part 220. The insulating carrier film 100 includes a third part 110 and a fourth part 120. The shape of the third part 110 is the same as that of the first part 220. The edge of the fourth part 120 protrudes from the edge of the third part 110. The fourth part 120 has a first groove 121 and a second groove 122. The first groove 121 and the second groove 122 are located on both sides of the third part 110, respectively. The insulating foam 910 is disposed in the first part 220. The metal wire 900 is disposed between the first part 220 and the insulating foam 910. The two ends of the insulating foam 910 pass through the first groove 121 and the second groove 122 and are fixed to the bottom of the third part 110.

[0032] Understandably, the neutral electrode also includes an insulating adhesive layer 800, which is used to protect the conductive gel layer 700 before the neutral electrode is used. The insulating adhesive layer 800 is attached to the top of the conductive gel layer 700, and the shape of the insulating adhesive layer 800 is the same as that of the insulating carrier film 100. The insulating adhesive layer is a PET anti-stick film.

[0033] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A neutral electrode, characterized in that, include: Insulating carrier film; A metal composite film includes a first conductive coating and a second conductive coating, wherein the first conductive coating and the second conductive coating are symmetrically disposed on the top of the insulating carrier film; The first semiconductor film includes a first semiconductor coating and a second semiconductor coating arranged symmetrically on the left and right sides. The first semiconductor coating is disposed on top of the first conductive coating, and the second semiconductor coating is disposed on top of the second conductive coating. A first through hole is formed between the first semiconductor coating and the second semiconductor coating. The second semiconductor film includes a third semiconductor coating and a fourth semiconductor coating arranged symmetrically on the left and right sides. The third semiconductor coating is disposed on top of the first semiconductor coating, and the fourth semiconductor coating is disposed on top of the second semiconductor coating. A second through hole is formed between the third semiconductor coating and the fourth semiconductor coating. The diameter of the second through hole is smaller than the diameter of the first through hole. A conductive gel layer is disposed on top of the third semiconductor coating and the fourth semiconductor coating, respectively.

2. The neutral electrode according to claim 1, characterized in that, The neutral electrode further includes a metal wire, and the metal composite film includes a first part and a second part. The metal wire is disposed in the first part, and the first semiconductor film and the second semiconductor film are both located in the second part.

3. The neutral electrode according to claim 1, characterized in that, The neutral electrode also includes an insulating adhesive layer, which is attached to the top of the conductive gel layer, and the shape of the insulating adhesive layer is the same as that of the insulating carrier film.

4. The neutral electrode according to claim 2, characterized in that, The neutral electrode also includes insulating foam. The insulating carrier film has a first groove and a second groove. The insulating foam is disposed in the first part. The metal wire is disposed between the first part and the insulating foam. The two ends of the insulating foam pass through the first groove and the second groove respectively and are fixed to the bottom of the insulating carrier film.

5. The neutral electrode according to claim 1, characterized in that, The neutral electrode further includes a third semiconductor film, which includes a fifth semiconductor coating and a sixth semiconductor coating arranged symmetrically on the left and right sides. The fifth semiconductor coating is disposed on top of the third semiconductor coating, and the sixth semiconductor coating is disposed on top of the fourth semiconductor coating. A third through hole is formed between the fifth semiconductor coating and the sixth semiconductor coating, and the diameter of the third through hole is smaller than the diameter of the second through hole.

6. The neutral electrode according to claim 5, characterized in that, The neutral electrode further includes a fourth semiconductor film, which includes a seventh semiconductor coating and an eighth semiconductor coating arranged symmetrically on the left and right. The seventh semiconductor coating is disposed on top of the fifth semiconductor coating, and the eighth semiconductor coating is disposed on top of the sixth semiconductor coating. A fourth through hole is formed between the seventh semiconductor coating and the eighth semiconductor coating. The diameter of the fourth through hole is smaller than the diameter of the third through hole.

7. A medical device, characterized in that, Includes the neutral electrode as described in any one of claims 1 to 6.

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