Memory stick production cooling waistcoat fixing device

Abstract

The utility model discloses a memory stick production technical field's heat dissipation waistcoat fixing device for memory stick production, including bottom plate, two guide rods are installed on the bottom plate upper wall surface rear end both sides, two the movable sleeve of two installation sleeve is equipped on the guide rod upper end, two fixed shafts are installed in two installation sleeve side wall department, the movable sleeve of rotating sleeve is equipped on the fixed shaft upper end, two fixed frames are installed in rotating sleeve one side and bottom plate upper end, two adjusting fixed structures are installed in two fixed frames, adopt two -way screw rod drive both sides moving block, realize the synchronous symmetrical movement of clamping block, ensure that heat dissipation waistcoat stress uniform, avoid memory stick deviation or deformation, and the pull rod in adjusting fixed structure and the cooperation first spring of propelling block, can fast fixed heat dissipation waistcoat.

Description

Technical Field

[0001] This utility model relates to the field of memory module manufacturing technology, specifically to a heat dissipation heat spreader fixing device used in memory module manufacturing. Background Technology

[0002] During the production of memory modules, heat spreaders need to be precisely assembled onto the memory chips using a fixing device; Traditional fixing methods often employ manual alignment or a single clamp. A single clamp cannot accommodate heatsinks of different sizes, and product replacement requires adjustment of the clamp structure, resulting in low efficiency. Furthermore, relying on manual cover plate assembly leads to slow assembly speed and the risk of damage to memory modules due to uneven force application. Additionally, the lack of a buffer mechanism during clamping can easily damage memory chips or gold fingers. Moreover, manual alignment can easily lead to misalignment between the heatsink and the memory chip, affecting heat dissipation performance. Therefore, a new technical solution is needed to address these issues. Utility Model Content

[0003] The purpose of this utility model is to provide a heatsink fixing device for memory module production, to solve the problems mentioned in the background art. Traditional fixing methods for heatsink fixing devices used in memory module production often involve manual alignment or a single clamp. A single clamp cannot accommodate heatsinks of different sizes, and changing products requires adjusting the clamp structure, resulting in low efficiency. Furthermore, relying on manual clamping leads to slow assembly speed and is prone to damaging the memory module due to uneven force application. Additionally, the lack of a buffer mechanism during clamping can easily damage memory chips or gold fingers. Moreover, manual alignment can easily lead to misalignment between the heatsink and the memory chip, affecting heat dissipation performance.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a heat sink fixing device for memory module production, comprising a base plate, two guide rods installed on both sides of the rear end of the upper wall of the base plate, two mounting sleeves movably fitted on the upper ends of the two guide rods, a fixing shaft installed on the side wall of the two mounting sleeves, a rotating sleeve movably fitted on the upper end of the fixing shaft, two fixing frames installed on one side of the rotating sleeve and the upper end of the base plate, and two adjusting fixing structures installed in the two fixing frames; Both of the aforementioned adjustment and fixing structures include a mounting groove, a bearing block, a lead screw, two moving blocks, two clamping blocks, a fixing groove, a pull rod, a first spring, and a pushing block; The mounting groove is formed on the upper wall of the fixed frame. The bearing block is fixedly installed at the center of the inner wall of the mounting groove. The center of the lead screw is movably embedded in the bearing block, and both ends of the lead screw movably pass through both sides of the fixed frame. The two moving blocks are movably fitted onto both ends of the lead screw. The two clamping blocks are respectively installed on the side walls of the two moving blocks. The fixed groove is formed at the center of the mounting groove. One end of the pull rod movably passes through the side wall of the fixed groove. The first spring is movably fitted onto the upper end of the pull rod and is located in the fixed groove. The push block is fixedly installed on one end of the pull rod and movably embedded in the fixed groove.

[0005] As a preferred embodiment of the heat sink fixing device for memory module production according to this utility model, a second spring is movably fitted on the upper end of the guide rod, and the second spring is located below the mounting sleeve.

[0006] As a preferred embodiment of the heat sink fixing device for memory module production according to this utility model, a flip-limiting bracket is installed at the lower end of the side wall of the two mounting sleeves.

[0007] As a preferred embodiment of the heat sink fixing device for memory module production according to this utility model, the lead screw is a bidirectional threaded lead screw.

[0008] As a preferred embodiment of the heat sink fixing device for memory module production according to this utility model, an operating block is installed at one end of the lead screw.

[0009] As a preferred embodiment of the heat sink fixing device for memory module production according to this utility model, a pressure block is installed on the upper wall of one of the fixing frames.

[0010] As a preferred embodiment of the heat sink fixing device for memory module production according to this utility model, a limit block is installed at the top of the guide rod.

[0011] Compared with the prior art, the beneficial effects of this utility model are: the design of the heat dissipation heat sink fixing device for memory module production is reasonable; The system employs a bidirectional threaded screw to drive the moving blocks on both sides, achieving synchronous and symmetrical movement of the clamping blocks. This ensures uniform force on the heatsink and prevents memory module misalignment or deformation. Furthermore, the adjusting and fixing structure, with its pull rod and push block working in conjunction with a first spring, allows for quick fixation of the heatsink. The first spring also provides cushioning during clamping. Combined with a flip-up fixing frame, precise positioning of the heatsink's base and cover plate is achieved, significantly improving processing efficiency. A second spring is added to the guide rod to absorb impact during pressing, preventing damage to the memory chips. The operating block directly drives the screw, allowing for single-handed clamping and releasing actions, improving assembly efficiency. The precise coordination between the moving blocks and the screw ensures accurate movement of the clamping blocks, preventing memory module misalignment. Attached Figure Description

[0012] Figure 1 This is a front-view three-dimensional structural schematic diagram of the present invention; Figure 2 This is a rear-view three-dimensional structural diagram of the present invention; Figure 3 This is a schematic diagram of the unfolded three-dimensional structure of the present invention. Figure 4 This is a schematic diagram of the main structure of this utility model.

[0013] In the diagram: 1. Base plate, 2. Guide rod, 3. Mounting sleeve, 4. Fixed shaft, 5. Rotating sleeve, 6. Fixed frame, 7. Mounting groove, 8. Bearing block, 9. Lead screw, 10. Moving block, 11. Clamping block, 12. Fixed groove, 13. Pull rod, 14. First spring, 15. Pushing block, 16. Flipping limit frame, 17. Operating block, 18. Pressing block, 19. Limiting block, 20. Second spring. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0015] Please see Figure 1-4 This utility model provides a technical solution: In this technical solution, a heat sink fixing device for memory module production includes a base plate 1. Two guide rods 2 are installed on both sides of the rear end of the upper wall of the base plate 1. Two mounting sleeves 3 are movably fitted on the upper ends of the two guide rods 2. Fixed shafts 4 are installed on the side walls of the two mounting sleeves 3. Rotating sleeves 5 are movably fitted on the upper ends of the fixed shafts 4. Two fixing frames 6 are installed on one side of the rotating sleeves 5 and the upper end of the base plate 1. Two adjusting fixing structures are installed in the two fixing frames 6. Both adjustment and fixing structures include a mounting groove 7, a bearing block 8, a lead screw 9, two moving blocks 10, two clamping blocks 11, a fixing groove 12, a pull rod 13, a first spring 14, and a push block 15; The mounting groove 7 is located on the upper wall of the fixed frame 6. The bearing block 8 is fixedly installed at the center of the inner wall of the mounting groove 7. The center of the lead screw 9 is movably embedded in the bearing block 8, and both ends of the lead screw 9 movably pass through both sides of the fixed frame 6. The two moving blocks 10 are movably fitted onto both ends of the lead screw 9. The two clamping blocks 11 are installed on the side walls of the two moving blocks 10. The fixed groove 12 is located in the center of the mounting groove 7. One end of the pull rod 13 movably passes through the side wall of the fixed groove 12. The first spring 14 is movably fitted onto the upper end of the pull rod 13 and is located in the fixed groove 12. The push block 15 is fixedly installed on one end of the pull rod 13 and movably embedded in the fixed groove 12.

[0016] In this technical solution, when installing the heatsink for the memory module, the operator first moves the device to the designated position and supports it using the base plate 1. Then, according to the specifications of the heatsink, the two adjusting and fixing structures within the two fixing frames 6 are adjusted sequentially. By turning the lead screw 9 inside the bearing block 8, the two moving blocks 10 are moved relative to each other within the mounting slot 7 under the engagement of the lead screw 9 and the internal threads inside the two moving blocks 10 until they match the width of the memory module heatsink. Then, by pulling the pull rod 13 inside the fixing slot 12, the pushing block 15 is moved outward. Subsequently, the operator places the base and cover plate of the heatsink into the two adjusting and fixing structures, and releases one end of the pull rod 13. Under the reset action of the first spring 14, one side of the pushing block 15 is moved outward. The heat sink is attached to one side of the heat sink and cooperates with two clamping blocks 11 to fix the heat sink at multiple points. Then, under the movable connection between the rotating sleeve 5 and the fixed shaft 4, one of the adjusting and fixing structures is rotated 180 degrees so that the two adjusting and fixing structures correspond. One end of the memory module is placed on the upper end of the base of the heat sink. Then, one of the fixing frames 6 is pressed down. Under the guidance of the mounting sleeve 3 and the two guide rods 2, the upper fixing frame 6 carrying the heat sink cover plate is fastened to the upper end of the base of the heat sink. Under the action of the second spring 20 at the upper end of the guide rod 2, the mounting sleeve 3 can be automatically reset. And through the set flip limit bracket 16, the flip limit of one of the fixing frames 6 can be realized to ensure the flip angle of the fixing frame 6, thereby ensuring the alignment accuracy of the heat sink.

[0017] In some technical solutions, reference Figure 1 The guide rod 2 is movably fitted with a second spring 20, which is located below the mounting sleeve 3. The lower side walls of the two mounting sleeves 3 are fitted with flip-limiting brackets 16. The lead screw 9 is a bidirectional threaded lead screw 9. An operating block 17 is installed at one end of the lead screw 9. A pressing block 18 is installed on the upper wall of one of the fixed frames 6. A limit block 19 is installed at the top of the guide rod 2.

[0018] The second spring 20 enables automatic reset of the mounting sleeve 3. The flipping limit bracket 16 enables flipping and limiting of the fixed frame 6, ensuring the alignment accuracy of the two fixed frames 6. The operating block 17 can directly drive the lead screw 9, allowing for clamping and releasing actions with one hand. The limit block 19 at the top of the guide rod 2 enables movement limitation of the mounting sleeve 3, preventing accidental detachment.

[0019] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0020] Although the present invention has been described above with reference to embodiments, various modifications can be made and components can be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the features in the embodiments disclosed in this invention can be combined with each other in any way. The lack of an exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A heat sink fixing device for memory module manufacturing, comprising a base plate (1), characterized in that, Two guide rods (2) are installed on both sides of the rear end of the upper wall of the base plate (1). Two mounting sleeves (3) are movably fitted on the upper ends of the two guide rods (2). Fixed shafts (4) are installed on the side walls of the two mounting sleeves (3). Rotating sleeves (5) are movably fitted on the upper ends of the fixed shafts (4). Two fixed frames (6) are installed on one side of the rotating sleeves (5) and the upper end of the base plate (1). Two adjusting and fixing structures are installed inside the two fixed frames (6). Each of the two adjusting and fixing structures includes a mounting groove (7), a bearing block (8), a lead screw (9), two moving blocks (10), two clamping blocks (11), a fixing groove (12), a pull rod (13), a first spring (14), and a push block (15). The mounting groove (7) is opened on the upper wall of the fixed frame (6). The bearing block (8) is fixedly installed at the center of the inner wall of the mounting groove (7). The screw (9) is movably embedded in the bearing block (8) at the center, and its two ends are respectively movably inserted through both sides of the fixed frame (6). The two moving blocks (10) are respectively movably fitted on both ends of the screw (9). The two clamping blocks (11) are respectively installed on the side walls of the two moving blocks (10). The fixed groove (12) is opened at the center of the mounting groove (7). One end of the pull rod (13) is movably inserted through the side wall of the fixed groove (12). The first spring (14) is movably fitted on the upper end of the pull rod (13) and located in the fixed groove (12). The push block (15) is fixedly installed on one end of the pull rod (13) and movably embedded in the fixed groove (12).

2. The heat sink fixing device for memory module production according to claim 1, characterized in that, The guide rod (2) is movably fitted with a second spring (20), which is located below the mounting sleeve (3).

3. The heat sink fixing device for memory module production according to claim 1, characterized in that, The two mounting sleeves (3) are fitted with flip-limit brackets (16) at the lower end of their side walls.

4. The heat sink fixing device for memory module production according to claim 1, characterized in that, The lead screw (9) is a bidirectional threaded lead screw (9).

5. The heat sink fixing device for memory module production according to claim 1, characterized in that, An operating block (17) is installed at one end of the lead screw (9).

6. The heat sink fixing device for memory module production according to claim 1, characterized in that, One of the fixed frames (6) has a pressure block (18) installed on the upper wall.

7. The heat sink fixing device for memory module manufacturing according to claim 1, characterized in that, A limit block (19) is installed at the top of the guide rod (2).

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