A carrier mechanism for chip visual inspection

Abstract

This invention provides a carrier mechanism for chip visual inspection, belonging to the field of chip inspection technology. It includes an edge support, a central support, and a support platform. The edge support includes several splicable chip frames, each containing several chip carrier slots. The central support includes several central support columns aligned with the chip carrier slots, the tops of which can pass through the interior of the chip carrier slots. A gap is formed between the central support columns and the chip carrier slots. This invention, through the edge support and central support, uses the chip carrier slots on the chip frames to support the bottom edge of the chip, and uses the central support columns to support the bottom center of the chip. This achieves alternating support for the bottom center and edge of the chip, avoiding complete occlusion of the bottom of the chip due to support alone, thus facilitating comprehensive visual inspection of the chip.

Description

Technical Field

[0001] This utility model belongs to the field of chip inspection technology, specifically referring to a carrier mechanism for chip visual inspection. Background Technology

[0002] Chip visual inspection is a core step in semiconductor manufacturing to ensure product quality. It combines high-precision optical imaging with artificial intelligence algorithms to achieve real-time detection of chip surface defects, dimensional accuracy, and packaging integrity. During visual inspection, a support mechanism is needed to hold the chip in place, facilitating the inspection of pins and other components.

[0003] Existing technologies for visual inspection of chips mainly rely on specific fixtures. After placing the chip inside the fixture, the chip is inspected using a camera based on algorithms. However, the bottom of the chip is supported, which can cause occlusion, and transparent support components can easily lead to inaccurate inspection results.

[0004] Therefore, there is an urgent need for a carrier mechanism for chip visual inspection to solve the above problems. Utility Model Content

[0005] In view of the above situation and to overcome the defects of the prior art, the purpose of this utility model is to provide a solution that at least partially solves the problems mentioned in the background art.

[0006] The technical solution adopted by this utility model is as follows: A carrier mechanism for chip visual inspection is proposed, comprising: an edge support part, including a plurality of splicable chip frames, wherein the chip frames include a plurality of chip carrier slots, and the bottom end of the chip carrier slots is through; a central support part, including a plurality of central support columns aligned with the chip carrier slots, wherein the top end of the central support column can pass through the interior of the chip carrier slot, and an interval area is formed between the central support column and the chip carrier slot; wherein, the edge support part is configured such that the bottom edge of the chip carrier slot supports the bottom edge of the chip, and the central support part is configured such that, after the chip frames are raised and lowered, the top of the central support column and the chip carrier slot alternately support the bottom of the chip.

[0007] Furthermore, the carrier mechanism for chip visual inspection also includes a carrier platform, with the chip frame located above the surface of the carrier platform, and several central support columns evenly distributed and fixedly connected to the surface of the carrier platform.

[0008] Furthermore, a T-shaped locking block is fixedly connected to one side of the chip frame, and a T-shaped locking groove is opened on the other side of the chip frame. Adjacent chip frames are spliced ​​together through the locking block and the locking groove.

[0009] Furthermore, a cylinder is provided at the bottom of the bearing platform, and a lifting bracket is fixedly connected to the telescopic end of the top of the cylinder. Several evenly distributed support rods are fixedly connected to the top of the lifting bracket. The top of the support rods passes through holes opened on the surface of the bearing platform, and the bottom of the chip frame is detachably connected to the top of the support rods.

[0010] Furthermore, several evenly distributed guide rods are fixedly connected to the front and rear of the surface of the bearing platform, and mounting plates are fixedly connected to the front and rear of the chip frame. The guide rods are inserted into the slots of the mounting plates. Beneficial effects

[0011] By using edge support and center support, the bottom edge of the chip is supported by the chip carrier slot on the chip frame, and the bottom center of the chip is supported by the center support column. This achieves alternating support for the bottom center and edge of the chip, avoiding complete occlusion of the bottom of the chip due to support, and facilitating comprehensive visual inspection of the chip. Attached Figure Description

[0012] Figure 1 A three-dimensional schematic diagram of a carrier mechanism for chip visual inspection according to an embodiment of this utility model. Figure 1 ; Figure 2 A three-dimensional structural diagram of a carrier mechanism for chip visual inspection proposed in this utility model. Figure 2 ; Figure 3 A three-dimensional structural diagram of a carrier mechanism for chip visual inspection proposed in this utility model. Figure 3 ; Figure 4 This is a three-dimensional schematic diagram of a carrier mechanism for chip visual inspection proposed in this utility model. Figure 5 This is a three-dimensional enlarged schematic diagram of a carrier mechanism for chip visual inspection proposed in this utility model.

[0013] The components include: 1. Edge support; 2. Central support; 3. Chip frame; 4. Chip carrier slot; 5. Central support column; 6. Spacing area; 7. Carrying platform; 8. Card block; 9. Locking slot; 10. Cylinder; 11. Lifting bracket; 12. Support rod; 13. Guide rod; and 14. Mounting plate.

[0014] The accompanying drawings are provided to further understand the embodiments and form part of the specification. They are used together with the embodiments for explanation and do not constitute a limitation on the embodiments. Detailed Implementation

[0015] The technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection.

[0016] As mentioned earlier, the same defect occurs when the bottom of the chip is supported in the existing technology. The transparent support component can also easily lead to inaccurate test results.

[0017] To address this, the present invention provides a carrier mechanism for chip visual inspection, which uses the edge support part 1 and the center support part 2 to support the bottom edge of the chip with the chip carrier groove 4 on the chip frame 3, and uses the center support column 5 to support the bottom center of the chip, thereby achieving alternating support for the bottom center and edge of the chip, avoiding complete occlusion of the bottom of the chip due to support, and facilitating comprehensive visual inspection of the chip.

[0018] like Figures 1-5 As shown in the figure, this utility model provides a carrier mechanism for visual inspection, particularly a carrier mechanism for chip visual inspection, including an edge support part 1, a central support part 2, a carrier platform 7, a cylinder 10, a lifting bracket 11, and a support rod 12. The edge support part 1 includes several evenly distributed chip frames 3, each with several evenly distributed chip carrier slots 4 on its surface. The bottom of each chip carrier slot 4 is open and unsealed, and its bottom edge supports the bottom edge of the chip. The bottom of the chip is unobstructed except for the edge, facilitating visual inspection of the area outside the edge. The central support part 2 includes several vertically placed central support columns 5. The top of each central support column 5 can pass through the bottom of the chip carrier slot 4 to the top of the chip carrier slot 4, pushing the chip inside the chip carrier slot 4 upwards, thereby enabling visual inspection of the portion of the chip's bottom edge previously obscured by the chip carrier slot 4. An interval area 6 is formed between the top of the central support column 5 and the chip carrier groove 4, which allows for a staggered space between the central support column 5 and the chip carrier groove 4, and ensures that the bottom of the chip is not completely blocked.

[0019] Several central support columns 5 are evenly distributed and fixedly installed on the surface of the bearing platform 7. In order to achieve splicing, a T-shaped card block 8 is fixedly connected to one side of the chip frame 3, and a T-shaped locking groove 9 is opened on the other side of the chip frame 3. The two chip frames 3 can be spliced ​​by the card block 8 being locked in the locking groove 9 of the adjacent chip frame 3. To enable the chip frame 3 or the assembled chip frame 3 to be raised and lowered, a cylinder 10 is installed at the bottom of the support platform 7. A lifting bracket 11 is fixedly connected to the telescopic end of the top of the cylinder 10. Several evenly distributed support rods 12 are fixedly connected to the top of the lifting bracket 11. The top of the support rods 12 passes through the holes and grooves on the surface of the support platform 7 and extends to the bottom of the assembled chip frame 3. The top of the support rods 12 and the bottom of the chip frame 3 are detachably connected together to control the raising and lowering of the chip frame 3. After the chip frame 3 is raised, the chip is also raised. After the chip frame 3 is lowered, the central support column 5 pushes the chip out of the chip support groove 4. The bottom of the chip is visually inspected alternately.

[0020] To ensure the smooth up-and-down movement of the chip frame 3, mounting plates 14 with slots are fixedly connected to the front and back of each chip frame 3. Several guide rods 13 are fixedly connected to the front and back of the surface of the support platform 7. The guide rods 13 are inserted into the slots of the mounting plates 14 to form a limiting mechanism to limit the up-and-down movement of the chip frame 3.

[0021] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0022] The embodiments have been described above, and such description is not restrictive. The figures shown are only one embodiment, and the actual structure is not limited to this. In short, if a person skilled in the art is inspired by this description and designs a similar structure and embodiment without departing from the inventive spirit, such design should fall within the scope of protection.

Claims

1. A carrier mechanism for chip visual inspection, characterized in that, include: The edge support (1) includes several splicable chip frames (3), and the chip frames (3) include several chip carrier slots (4), with the bottom of the chip carrier slots (4) being through. The central support (2) includes several central support columns (5) aligned with the chip carrier groove (4). The top of the central support column (5) can pass through the interior of the chip carrier groove (4). A gap area (6) is formed between the central support column (5) and the chip carrier groove (4). The edge support part (1) is configured to support the bottom edge of the chip within the chip carrier groove (4), and the center support part (2) is configured such that after the chip frame (3) is raised or lowered, the top of the center support column (5) and the chip carrier groove (4) alternately support the bottom of the chip.

2. The carrier mechanism for chip visual inspection according to claim 1, characterized in that, The carrier mechanism for chip visual inspection also includes a carrier platform (7), the chip frame (3) is located above the surface of the carrier platform (7), and several central support columns (5) are evenly distributed and fixedly connected to the surface of the carrier platform (7).

3. The carrier mechanism for chip visual inspection according to claim 1, characterized in that, A T-shaped card block (8) is fixedly connected to one side of the chip frame (3), and a T-shaped locking groove (9) is opened on the other side of the chip frame (3). Adjacent chip frames (3) are spliced ​​together by the card block (8) and the locking groove (9).

4. The carrier mechanism for chip visual inspection according to claim 2, characterized in that, The bottom of the bearing platform (7) is provided with a cylinder (10), and the telescopic end of the top of the cylinder (10) is fixedly connected to a lifting bracket (11). The top of the lifting bracket (11) is fixedly connected with several evenly distributed support rods (12). The top of the support rods (12) passes through the holes opened on the surface of the bearing platform (7). The bottom of the chip frame (3) is detachably connected to the top of the support rods (12).

5. The carrier mechanism for chip visual inspection according to claim 4, characterized in that, The front and rear surfaces of the bearing platform (7) are fixedly connected with several evenly distributed guide rods (13), and the front and rear surfaces of the chip frame (3) are fixedly connected with mounting plates (14), and the guide rods (13) are inserted into the slots of the mounting plates (14).

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