Positionable wafer test probe station

Abstract

The application relates to a positionable wafer test probe station, and relates to the technical field of wafer testing, which comprises a bottom plate, a detection assembly and a moving support assembly are fixedly connected to the top of the bottom plate, and a clamping cylinder is fixedly connected to the top of the moving support assembly. The application is provided with a handle, the handle is rotated, the annular block is driven to rotate in the annular groove, the annular rack synchronously drives a plurality of meshing gears to rotate, then the rack plate drives the sliding block to slide in the L-shaped sliding groove, the plurality of clamping plates can be moved to the center or separated, so that stable clamping of wafers of different sizes can be realized, wherein the protective pad is made of elastic rubber material, can avoid causing indentation damage to the edge of the wafer during clamping, can increase the friction force with the surface of the wafer, and can further improve the positioning stability.

Description

Technical Field

[0001] This application relates to wafer testing, and more particularly to a positionable wafer testing probe station. Background Technology

[0002] A wafer is a silicon wafer used to manufacture silicon semiconductor circuits. Its raw material is silicon. High-purity polycrystalline silicon is dissolved and infiltrated into silicon crystal seeds, and then slowly pulled out to form a cylindrical single-crystal silicon. A wafer test probe station is an electronic measurement instrument used in the field of biology. It is widely used in the precision electrical measurement of complex, high-speed devices. It can test wafers before packaging, thereby avoiding damaged wafer packaging, unnecessary losses, and the inability to use damaged wafers properly.

[0003] However, current wafer test probe stations do not perform a positioning operation when placing the wafer. The lack of this crucial positioning step means that if the wafer moves during the testing process, it will adversely affect the testing results, significantly reducing the accuracy of the test results and failing to achieve the intended testing purpose. To solve the above problems, a positioning wafer test probe station is proposed. Utility Model Content

[0004] The purpose of this application is to provide a positioning wafer test probe station with advantages such as positioning function, which solves the problems of existing probe stations lacking effective positioning when placing wafers and easily causing a decrease in detection accuracy due to wafer movement.

[0005] The positioning wafer test probe station provided in this application adopts the following technical solution: it includes a base plate, a detection component and a movable support component are fixedly connected to the top of the base plate, and a clamping cylinder is fixedly connected to the top of the movable support component; The clamping cylinder has multiple L-shaped sliding grooves inside. Each L-shaped sliding groove has a rotating groove on its inner side. Each rotating groove has an annular groove on its side. Each annular groove has an arc-shaped groove on its inner side. A slider is slidably connected inside the L-shaped sliding groove. A clamping plate is fixedly connected to one side of the slider. A rack plate is fixedly connected to the other side of the slider. A rotating rod is tightly nested inside the rotating groove via a bearing. A meshing gear is fixedly connected to the surface of the rotating rod. An annular block is slidably connected inside the annular groove. An annular rack is fixedly connected to the inner side of the annular block. The meshing gear meshes with the rack plate. The annular rack meshes with the meshing gear. A handle is fixedly connected to the surface of the annular block. The handle is slidably connected within the arc-shaped groove. A protective pad is fixedly connected to the side of the clamping plate. By adopting the above technical solution, a handle is provided. When the handle is rotated, the annular block rotates within the annular groove. Simultaneously, the annular rack drives multiple meshing gears to rotate. This, in turn, drives the slider to slide within the L-shaped sliding groove via the rack plate. This allows multiple clamping plates to move closer to or separate towards the center, thus achieving stable clamping of wafers of different sizes. The protective pad is made of elastic rubber, which not only avoids indentation damage to the wafer edge during clamping but also increases friction with the wafer surface, further improving positioning stability. The vertical section of the L-shaped sliding groove provides initial clearance space for the clamping plates when the wafer is placed, while the horizontal section ensures that the clamping plates move horizontally during clamping. Combined with the circumferential limit of the annular block by the annular groove, positioning errors caused by component offset during clamping are prevented, thereby ensuring the accuracy of the testing components when testing the wafer.

[0006] Preferably, annular sliding grooves are provided at both the top and bottom of the annular groove, and annular sliding blocks are fixedly connected to the top and bottom of the annular block, with the annular sliding blocks slidably connected within the annular sliding groove. By adopting the above technical solution and setting a sliding fit structure between the annular sliding groove and the annular sliding block, the rotation trajectory of the annular block in the annular groove can be precisely limited. This can prevent the annular block from axially shifting or deviating during rotation, and ensure that the annular rack always maintains a stable meshing state with the meshing gear. This can avoid transmission jamming or uneven clamping force caused by axial misalignment of components.

[0007] Preferably, a positioning plate is fixedly connected to the side of the arc-shaped groove, and multiple positioning holes are opened inside the positioning plate. A movable groove is opened inside the handle, and a positioning spring is fixedly connected to the top of the movable groove. A movable plate is fixedly connected to the bottom of the positioning spring. By adopting the above technical solution, and by setting up a positioning plate, positioning hole, movable groove, positioning spring and movable plate cooperation structure, after the handle drives the clamping component to complete the position adjustment, the positioning spring pushes the positioning rod into the corresponding positioning hole, which can quickly lock the position of the handle. This design not only makes it convenient for people to flexibly adjust the clamping range according to the wafer size, but also can quickly fix the structure after the adjustment is completed. It can avoid the clamping position from loosening due to external force collision during the testing process, and can improve the stability and ease of operation of the device.

[0008] Preferably, a positioning rod and a top block are fixedly connected to the bottom of the movable plate. The bottom end of the positioning rod slides through the movable groove and is engaged in the positioning hole. The pressing end of the top block is located at the bottom of the handle. By adopting the above technical solution and setting a linkage structure between the positioning rod and the top block, when it is necessary to adjust the clamping position, pressing the top block will drive the movable plate to compress the positioning spring, causing the positioning rod to disengage from the positioning hole. At this time, the handle can be slid freely to adjust the position.

[0009] Preferably, the clamping cylinder has a shrinkage groove inside, which is located in the middle of multiple L-shaped sliding grooves. The bottom of the shrinkage groove is tightly nested with a rotating shaft through a bearing. The top of the rotating shaft is fixedly connected to a threaded rod. A threaded cylinder is threadedly connected to the surface of the threaded rod. A top plate is fixedly connected to the top of the threaded cylinder. By adopting the above technical solution and setting up a lifting structure for the threaded rod and threaded cylinder, the threaded rod can be driven to rotate synchronously when the rotating shaft is rotated. This allows the threaded cylinder to slide up and down along the inner wall of the shrinkage groove, thereby pushing the top plate to achieve height adjustment. The support height of the top plate can be flexibly adjusted according to the thickness of the wafer, providing stable bottom support for wafers of different specifications. This avoids the problem of unstable clamping caused by differences in wafer thickness and improves the adaptability of the device to diverse wafer testing scenarios.

[0010] Preferably, a first bevel gear is fixedly connected to the surface of the rotating shaft, and a transmission rod is tightly nested inside the inner side of the shrinkage groove through a bearing. A knob and a second bevel gear are fixedly connected to both ends of the transmission rod, and the first bevel gear and the second bevel gear mesh with each other. By adopting the above technical solution and setting up a meshing transmission structure between the first bevel gear and the second bevel gear, when the knob is rotated, the transmission rod and the second bevel gear can be driven to rotate synchronously. By using the meshing of the first bevel gear and the second bevel gear, the first bevel gear and the rotating shaft can be driven to rotate, thereby realizing the indirect rotation control of the threaded rod.

[0011] Preferably, an annular plate is fixedly connected to the inner side of the shrinkage groove, two limiting rods are fixedly connected to the top of the annular plate, two limiting grooves are opened inside the threaded cylinder, and the limiting rods are slidably connected in the limiting grooves; By adopting the above technical solution and setting a combination structure of annular plate and limiting rod, when the threaded cylinder slides up and down along the inner wall of the shrinkage groove, the limiting rod can slide synchronously in the limiting groove. By using the guiding effect of the limiting rod on the limiting groove, the circumferential rotation of the threaded cylinder can be restricted, and it can be ensured that the threaded cylinder moves stably only in the vertical direction.

[0012] Preferably, adjustable support feet are fixedly connected to the four corners of the bottom of the base plate; By adopting the above technical solution and setting adjustable support feet, the horizontal height of the base plate can be flexibly adjusted.

[0013] In summary, this application includes at least one of the following beneficial technical effects: This positioning wafer test probe station features a handle. Rotating the handle causes an annular block to rotate within an annular groove. Simultaneously, an annular rack drives multiple meshing gears to rotate, which in turn drives a slider to slide within an L-shaped sliding groove via a rack plate. This allows multiple clamping plates to move closer together or separate, achieving stable clamping of wafers of different sizes. The protective pads are made of elastic rubber, which not only prevents indentation damage to the wafer edges during clamping but also increases friction with the wafer surface, further improving positioning stability. The vertical section of the L-shaped sliding groove provides initial clearance space for the clamping plates when the wafer is placed, while the horizontal section ensures that the clamping plates move horizontally during clamping. Combined with the circumferential limit of the annular block by the annular groove, this prevents positioning errors caused by component misalignment during clamping, thus ensuring the accuracy of wafer testing by the testing components. Attached Figure Description

[0014] Figure 1 This is a frontal three-dimensional structural diagram of this application; Figure 2 This is a schematic diagram of the structure in frontal cross-section in this application; Figure 3 This is a structural schematic diagram of the cross-section of the rotating groove in this application; Figure 4 This is a structural schematic diagram of the cross-section of the shrinkage channel in this application; Figure 5 for Figure 3 A magnified cross-sectional view of the structure at point A in the middle.

[0015] In the diagram: 1. Base plate; 101. Adjustable support foot; 2. Detection component; 3. Moving support component; 4. Clamping cylinder; 401. L-shaped sliding groove; 402. Rotating groove; 403. Annular groove; 404. Annular sliding groove; 405. Arc groove; 406. Slider; 407. Rack plate; 408. Clamping plate; 409. Protective pad; 4010. Rotating rod; 4011. Meshing gear; 4012. Annular block; 4013. Annular sliding block; 4014. Annular rack; 4015. Handle; 4016, Movable groove; 4017, Positioning plate; 4018, Positioning hole; 4019, Positioning spring; 4020, Movable plate; 4021, Positioning rod; 4022, Top block; 4023, Contraction groove; 4024, Rotating shaft; 4025, First bevel gear; 4026, Threaded cylinder; 4027, Top plate; 4028, Transmission rod; 4029, Knob; 4030, Second bevel gear; 4031, Annular plate; 4032, Limiting rod; 4033, Limiting groove; 4034, Threaded rod. Detailed Implementation

[0016] The following is in conjunction with the appendix Figure 1 - Appendix Figure 5This application will be described in further detail below.

[0017] Example 1: A positionable wafer test probe station, referring to... Figure 1 , Figure 2 and Figure 3 It includes a base plate 1, a detection component 2 and a movable support component 3 fixedly connected to the top of the base plate 1, and a clamping cylinder 4 fixedly connected to the top of the movable support component 3; The clamping cylinder 4 has multiple L-shaped sliding grooves 401 inside. Rotating grooves 402 are formed on the inner side of each L-shaped sliding groove 401. Annular grooves 403 are formed on the sides of each rotating groove 402. Arc-shaped grooves 405 are formed on the inner side of each annular groove 403. A slider 406 is slidably connected inside the L-shaped sliding groove 401. A clamping plate 408 is fixedly connected to one side of the slider 406. A rack plate 407 is fixedly connected to the other side of the slider 406. A rotating rod 4010 is tightly nested inside the rotating groove 402 via bearings. A meshing gear 4011 is fixedly connected to the surface of the rotating rod 4010. An annular block 4012 is slidably connected inside the annular groove 403. An annular rack 4014 is fixedly connected to the inner side of the annular block 4012. The meshing gear 4011 meshes with the rack plate 407, and the annular rack 4014 meshes with the meshing gear 4011. A handle 4015 is fixedly connected to the surface of the annular block 4012. The handle 4015 is slidably connected inside the arc-shaped groove 405. A protective pad 40 is fixedly connected to the side of the clamping plate 408. 9. By rotating the handle 4015, the annular block 4012 can be rotated within the annular groove 403. Simultaneously, the annular rack 4014 drives multiple meshing gears 4011 to rotate. This, in turn, via the rack plate 407, drives the slider 406 to slide within the L-shaped sliding groove 401. This allows multiple clamping plates 408 to move closer together or separate, thus achieving stable clamping of wafers of different sizes. The protective pad 409 is made of elastic rubber, which helps to prevent damage during clamping. The indentation damage caused by the wafer edge can increase the friction with the wafer surface, which can further improve the positioning stability. The vertical section of the L-shaped sliding groove 401 can provide initial clearance space for the clamping plate 408 when the wafer is placed, while the horizontal section ensures that the clamping plate 408 maintains horizontal movement in the clamping state. Then, in conjunction with the annular groove 403 to limit the circumferential movement of the annular block 4012, it can prevent positioning errors caused by component offset during the clamping process, thereby ensuring the accuracy of the detection component 2 when testing the wafer.

[0018] Please see Figure 3The annular groove 403 has annular sliding grooves 404 at both the top and bottom. The annular block 4012 has annular sliding blocks 4013 fixedly connected to its top and bottom. The annular sliding blocks 4013 are slidably connected in the annular sliding groove 404. By setting the sliding fit structure between the annular sliding groove 404 and the annular sliding blocks 4013, the rotation trajectory of the annular block 4012 in the annular groove 403 can be precisely limited. This can prevent the annular block 4012 from axially moving or shifting during rotation. It can also ensure that the annular rack 4014 always maintains a stable meshing state with the meshing gear 4011. This can avoid transmission jamming or uneven clamping force caused by axial misalignment of components.

[0019] Please see Figure 5 A positioning plate 4017 is fixedly connected to the side of the arc-shaped groove 405. Multiple positioning holes 4018 are formed inside the positioning plate 4017. A movable groove 4016 is formed inside the handle 4015. A positioning spring 4019 is fixedly connected to the top of the movable groove 4016, and a movable plate 4020 is fixedly connected to the bottom of the positioning spring 4019. Through the cooperative structure of the positioning plate 4017, positioning holes 4018, movable groove 4016, positioning spring 4019, and movable plate 4020, after the handle 4015 drives the clamping assembly to complete position adjustment, the positioning rod 4021 is pushed into the corresponding positioning hole 4018 by the positioning spring 4019, thus quickly locking the position of the handle 4015. This design facilitates flexible adjustment according to wafer size. The clamping range is wide, and the structure can be quickly fixed after adjustment. This can prevent the clamping position from loosening due to external force collision during the testing process, and can improve the stability and ease of operation of the device. The bottom of the movable plate 4020 is fixedly connected to the positioning rod 4021 and the top block 4022. The bottom end of the positioning rod 4021 slides through the movable groove 4016 and is locked in the positioning hole 4018. The pressing end of the top block 4022 is set at the bottom of the handle 4015. By setting the linkage structure between the positioning rod 4021 and the top block 4022, when the clamping position needs to be adjusted, the top block 4022 is pressed to drive the movable plate 4020 to compress the positioning spring 4019, so that the positioning rod 4021 is disengaged from the positioning hole 4018. At this time, the handle 4015 can be slid freely to adjust the position.

[0020] Please see Figure 4The clamping cylinder 4 has a shrinkage groove 4023 inside, which is located in the middle of multiple L-shaped sliding grooves 401. A rotating shaft 4024 is tightly nested inside the bottom of the shrinkage groove 4023 via a bearing. A threaded rod 4034 is fixedly connected to the top of the rotating shaft 4024, and a threaded cylinder 4026 is threadedly connected to the surface of the threaded rod 4034. A top plate 4027 is fixedly connected to the top of the threaded cylinder 4026. By setting a lifting structure for the threaded rod 4034 and the threaded cylinder 4026, rotating the rotating shaft 4024 can drive the threaded rod 4034 to rotate synchronously, allowing the threaded cylinder 4026 to slide up and down along the inner wall of the shrinkage groove 4023. This, in turn, pushes the top plate 4027 to achieve height adjustment. The support height of the top plate 4027 can be flexibly adjusted according to the thickness of the wafer, providing stable bottom support for wafers of different specifications and avoiding the impact of wafer thickness on the support height. To address the clamping instability caused by temperature differences, the device can be made more adaptable to diverse wafer testing scenarios. A first bevel gear 4025 is fixedly connected to the surface of the rotating shaft 4024. A transmission rod 4028 is tightly nested inside the shrinkage groove 4023 via bearings. A knob 4029 and a second bevel gear 4030 are fixedly connected to both ends of the transmission rod 4028, respectively. The first bevel gear 4025 and the second bevel gear 4030 mesh with each other. By setting the meshing transmission structure of the first bevel gear 4025 and the second bevel gear 4030, when the knob 4029 is rotated, the transmission rod 4028 and the second bevel gear 4030 can be driven to rotate synchronously. By utilizing the meshing of the first bevel gear 4025 and the second bevel gear 4030, the first bevel gear 4025 and the rotating shaft 4024 can be driven to rotate, thereby realizing the indirect rotation control of the threaded rod 4034.

[0021] Please see Figure 4 An annular plate 4031 is fixedly connected to the inner side of the shrinkage groove 4023. Two limiting rods 4032 are fixedly connected to the top of the annular plate 4031. Two limiting grooves 4033 are opened inside the threaded cylinder 4026. The limiting rods 4032 are slidably connected in the limiting grooves 4033. By setting the combination structure of the annular plate 4031 and the limiting rods 4032, when the threaded cylinder 4026 slides up and down along the inner wall of the shrinkage groove 4023, the limiting rods 4032 can slide synchronously in the limiting grooves 4033. By using the guiding effect of the limiting rods 4032 on the limiting grooves 4033, the circumferential rotation of the threaded cylinder 4026 can be restricted, and it can be ensured that the threaded cylinder 4026 moves stably only in the vertical direction.

[0022] Please see Figure 2 The bottom of the base plate 1 is fixedly connected to four corners with adjustable support feet 101. By setting the adjustable support feet 101, the horizontal height of the base plate 1 can be flexibly adjusted.

[0023] The implementation principle of this application embodiment is as follows: In use, according to the wafer thickness, the user rotates the knob 4029, which, through the transmission rod 4028, the second bevel gear 4030, and the first bevel gear 4025, drives the rotating shaft 4024 and the threaded rod 4034 to rotate. This allows the threaded cylinder 4026 to rise and fall along the guide direction of the limiting rod 4032, adjusting the top plate 4027 to a suitable support height. Then, the user places the wafer on top of the top plate 4027. Finally, according to the wafer size, the user presses the top block 4022 to disengage the positioning rod 4021. Positioning hole 4018, then rotating handle 4015 drives annular block 4012 to rotate in annular groove 403, annular rack 4014 synchronously drives multiple meshing gears 4011 to rotate, and then drives slider 406 to slide in L-shaped sliding groove 401 through rack plate 407, so that clamping plate 408 moves towards the center to clamp the wafer. After clamping, release top block 4022, positioning spring 4019 pushes positioning rod 4021 to insert into corresponding positioning hole 4018 to complete locking. Among them, protective pad 409 can prevent wafer edge damage; Next, the wafer is moved to the test assembly 2 for testing by moving the support assembly 3. During the test, the support foot 101 is adjusted to ensure that the base plate 1 is level. The annular sliding block 4013 and the annular sliding groove 404 cooperate to ensure that the annular block 4012 rotates stably. The limit rod 4032 and the limit groove 4033 cooperate to prevent the threaded cylinder 4026 from deviating.

Claims

1. A positionable wafer test probe station, comprising a base plate (1), characterized in that: The bottom plate (1) is fixedly connected to the top of the detection component (2) and the movable support component (3), and the movable support component (3) is fixedly connected to the top of the clamping cylinder (4). The clamping cylinder (4) has multiple L-shaped sliding grooves (401) inside. A rotating groove (402) is formed on the inner side of each L-shaped sliding groove (401). An annular groove (403) is formed on the side of each rotating groove (402). An arc-shaped groove (405) is formed on the inner side of each annular groove (403). A slider (406) is slidably connected inside the L-shaped sliding groove (401). A clamping plate (408) is fixedly connected to one side of the slider (406). A rack plate (407) is fixedly connected to the other side of the slider (406). A rotating rod (4010) is tightly nested inside the rotating groove (402) via a bearing. A meshing gear (4011) is fixedly connected to the surface of the rotating rod (4010). An annular block (4012) is slidably connected inside the annular groove (403). An annular rack (4014) is fixedly connected to the inner side of the annular block (4012). The meshing gear (4011) meshes with the rack plate (407). The annular rack (4014) meshes with the meshing gear (4011). A handle (4015) is fixedly connected to the surface of the annular block (4012). The handle (4015) is slidably connected inside the arc groove (405). A pad (409) is fixedly connected to the side of the clamping plate (408).

2. The positionable wafer test probe station according to claim 1, characterized in that: The annular groove (403) has an annular sliding groove (404) at both the top and bottom. The annular block (4012) has an annular sliding block (4013) fixedly connected to both the top and bottom. The annular sliding block (4013) is slidably connected in the annular sliding groove (404).

3. The positionable wafer test probe station according to claim 1, characterized in that: A positioning plate (4017) is fixedly connected to the side of the arc-shaped groove (405). The positioning plate (4017) has multiple positioning holes (4018) inside. The handle (4015) has a movable groove (4016) inside. A positioning spring (4019) is fixedly connected to the top of the movable groove (4016). A movable plate (4020) is fixedly connected to the bottom of the positioning spring (4019).

4. A positionable wafer test probe station according to claim 3, characterized in that: The bottom of the movable plate (4020) is fixedly connected to a positioning rod (4021) and a top block (4022). The bottom end of the positioning rod (4021) slides through the movable groove (4016) and is engaged in the positioning hole (4018). The pressing end of the top block (4022) is located at the bottom of the handle (4015).

5. A positionable wafer test probe station according to claim 1, characterized in that: The clamping cylinder (4) has a shrinkage groove (4023) inside. The shrinkage groove (4023) is located in the middle of multiple L-shaped sliding grooves (401). The bottom of the shrinkage groove (4023) is tightly nested with a rotating shaft (4024) through a bearing. The top of the rotating shaft (4024) is fixedly connected to a threaded rod (4034). The surface of the threaded rod (4034) is threadedly connected to a threaded cylinder (4026). The top of the threaded cylinder (4026) is fixedly connected to a top plate (4027).

6. A positionable wafer test probe station according to claim 5, characterized in that: A first bevel gear (4025) is fixedly connected to the surface of the rotating shaft (4024). A transmission rod (4028) is tightly nested inside the inner side of the shrinkage groove (4023) through a bearing. A knob (4029) and a second bevel gear (4030) are fixedly connected to both ends of the transmission rod (4028). The first bevel gear (4025) and the second bevel gear (4030) mesh with each other.

7. A positionable wafer test probe station according to claim 5, characterized in that: An annular plate (4031) is fixedly connected to the inner side of the shrinkage groove (4023), and two limiting rods (4032) are fixedly connected to the top of the annular plate (4031). Two limiting grooves (4033) are opened inside the threaded cylinder (4026), and the limiting rods (4032) are slidably connected in the limiting grooves (4033).

8. A positionable wafer test probe station according to claim 1, characterized in that: The bottom of the base plate (1) is fixedly connected to four corners with adjustable support feet (101).

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