Hot spot area porous ball distribution micro-channel heat sink

Abstract

The utility model discloses a kind of hotspot area porous ball distribution microchannel radiator, including intermediate conductor and several porous balls;Intermediate conductor is equipped with liquid cooling cavity, liquid inlet and liquid outlet, and liquid inlet and liquid outlet are all communicated liquid cooling cavity;Porous ball is scattered in liquid cooling cavity with roll, and gap between porous ball is cooperated to form microchannel.After cooling liquid flows into liquid cooling cavity, the impact force of cooling liquid can make porous ball roll, and the porous ball that rolls can make cooling liquid turbulent, and turbulent can strengthen the heat exchange capacity between cooling liquid and porous ball, so that cooling liquid can quickly absorb the heat generated by chip, greatly improve the heat dissipation capacity to chip.The utility model strengthens the heat transfer capacity between cooling liquid and chip by the formation of turbulent on the basis of retaining microchannel small volume, high heat exchange capacity, can further improve the heat dissipation capacity of microchannel radiator to chip local hotspot, with higher heat exchange capacity.

Description

Technical Field

[0001] This utility model relates to the field of electronic device cooling technology, and in particular to a microchannel heat sink with porous spheres distributed in hot spots. Background Technology

[0002] In electronics, a chip is a miniaturized form of circuit (mainly including semiconductor devices, but also passive components), often fabricated on the surface of a semiconductor wafer. A chip primarily consists of a wafer, integrated circuit devices, and metal leads. The wafer, the main body of the chip, is called the chip substrate and is typically made of silicon. Chips work by constructing digital circuits using transistors and other components, and implementing various functions using logic gates, memory, arithmetic logic units, and other modules. A transistor consists of three regions: p-type semiconductor, n-type semiconductor, and p-type semiconductor (or n-type semiconductor, p-type semiconductor, and n-type semiconductor). When a positive bias voltage is applied to the p-region, an electric field is formed between the p-region and the n-region, allowing charge to flow from the p-region to the n-region along this electric field. When a negative bias voltage is applied to the p-region, charge cannot flow. Transistors are typically fabricated on a silicon wafer substrate through steps such as wet washing, photolithography, ion implantation, etching, plasma washing, and rapid thermal annealing.

[0003] Chips are among the most critical components in modern computers, robots, electronic devices, and other industrial equipment. With the rapid development of technology, chip power output and assembly density are increasing, and they are becoming increasingly integrated into packaging designs. This leads to smaller chip sizes but larger heat dissipation per unit area, resulting in a dramatic increase in heat flux density and ultimately, higher chip temperatures. Excessively high operating temperatures can severely or even irreversibly affect the normal operation of chips and the reliable operation of equipment. The well-known 10°C rule states that the reliability of electronic components is closely related to temperature. When the temperature is between 70°C and 80°C, the reliability of electronic components decreases by 50% for every 10°C increase. The quality of heat dissipation directly affects the stability of chips. Solving the problem of heat dissipation for ultra-high heat flux density not only improves product reliability but also reduces the power consumption of electronic devices, making it one of the key technologies for developing next-generation electronic chips. The development of high power, high assembly density, and integrated packaging designs places increasingly higher demands on chip heat dissipation design.

[0004] Conventional natural and forced air cooling methods are no longer sufficient to meet the heat dissipation requirements of chips. Therefore, researchers have proposed emerging technologies such as micro heat pipes, vacuum vapor chambers, carbon nanotubes, and microchannels. Among these, microchannel technology, which utilizes fluid cooling, has received the most extensive research. Microchannel heat sinks were first proposed by Tucherman and Pease in 1981. Compared to conventional heat sinks, microchannel heat sinks offer advantages such as a large heat exchange area, high heat exchange capacity, and small size.

[0005] Most existing microchannel heat sinks use finned structures to form microchannels to dissipate heat from the chip. However, the heat dissipation capacity of this microchannel structure is not ideal. It is still easy to cause serious local hot spots on the chip and low heat dissipation efficiency, resulting in insufficient thermal safety and reliability of the device. Utility Model Content

[0006] This invention provides a microchannel heat sink with porous spheres in hot spot areas. Its purpose is to solve the problem that existing heat sinks with microchannel structures formed by ribs have unsatisfactory heat dissipation effect on chips and are prone to causing serious local hot spots and low heat dissipation efficiency.

[0007] To achieve the above objectives, this utility model provides a microchannel heat sink with porous spherical distribution in the hot spot area, comprising:

[0008] An intermediate conductor is provided with a liquid cooling cavity, a liquid inlet, and a liquid outlet, wherein the liquid inlet and the liquid outlet are both connected to the liquid cooling cavity;

[0009] Several porous spheres are distributed in the liquid cooling cavity in a rolling manner, and the gaps between the porous spheres are matched to form multiple microchannels that allow coolant to pass through.

[0010] In one embodiment of this application, the porous spheres are randomly laid in a layer inside the liquid cooling cavity.

[0011] In one embodiment of this application, the diameter of the porous sphere is 1 / 5 to 1 times the height of the liquid cooling cavity.

[0012] In one embodiment of this application, the porous sphere is made of Cu or Al.

[0013] In one embodiment of this application, the pore size of the porous sphere is set at the nanometer level.

[0014] In one embodiment of this application, the intermediate conductor includes a substrate and a cover plate connected together, the cover plate being located on one side of the substrate, and the liquid cooling cavity being formed on the side of the substrate facing the cover plate.

[0015] In one embodiment of this application, the cover plate and the substrate are made of LTCC, Cu or Al material.

[0016] In one embodiment of this application, the cover plate and the substrate are non-detachably connected, and the cover plate and the substrate are connected by adhesive, welding or high-temperature bonding.

[0017] In one embodiment of this application, the cover plate and the substrate are detachably connected, and a sealing ring is provided between the cover plate and the substrate.

[0018] 1. In one embodiment of this application, the inlet and outlet are located on the same side of the intermediate conductor, or the outlet and inlet are located on different sides of the intermediate conductor.

[0019] The above-mentioned solution of this utility model has the following beneficial effects:

[0020] This invention places several porous spheres within the liquid-cooling cavity of an intermediate conductor. The gaps between the porous spheres interact to form multiple microchannels through which cooling fluid flows. These microchannels enable the heat sink of this invention to have excellent heat dissipation. After the coolant flows into the liquid-cooling cavity, the impact force of the coolant causes the porous spheres to roll. The rolling of the porous spheres creates turbulence in the coolant, which enhances the heat transfer between the coolant and the porous spheres. This allows the coolant to quickly absorb the heat generated by the chip, significantly improving the heat dissipation capacity of the chip. This invention, while retaining the small size and high heat transfer capacity of microchannels, enhances the heat transfer between the coolant and the chip through the formation of turbulence, further improving the heat dissipation capacity of the microchannel heat sink for local hot spots on the chip, and exhibiting high heat transfer capacity and heat transfer limit.

[0021] Other beneficial effects of this invention will be described in detail in the following detailed description section. Attached Figure Description

[0022] Figure 1 This is a three-dimensional structural schematic diagram of a microchannel heat sink with porous spheres distributed in a hot spot area, as shown in some embodiments of this utility model.

[0023] Figure 2 This is an exploded view of a microchannel heat sink with porous spheres distributed in a hotspot area, as shown in some embodiments of this application.

[0024] Figure 3 This is a schematic cross-sectional view of an intermediate conductor shown in some embodiments of this application;

[0025] Figure 4 This is a top view of an assembly consisting of a substrate and porous spheres, as shown in some embodiments of this application. Figure 1 ;

[0026] Figure 5 This is a schematic diagram of the three-dimensional structure of the cover plate shown in some embodiments of this application;

[0027] Figure 6 This is a top view of an assembly consisting of a substrate and porous spheres, as shown in some embodiments of this application. Figure 2 ;

[0028] Figure 7This is a top view of an assembly consisting of a substrate and porous spheres, as shown in some embodiments of this application. Figure 3 .

[0029] [Explanation of Labels in the Attached Image]

[0030] 10-Intermediate conductor; 11-Substrate; 111-Liquid cooling cavity; 12-Cover plate; 121-Liquid inlet; 122-Liquid outlet;

[0031] 20-Porous sphere;

[0032] 30-Screw;

[0033] 40 - Sealing ring. Detailed Implementation

[0034] To make the technical problems, solutions, and advantages of this utility model clearer, a detailed description will be provided below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model. Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0035] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0036] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a locking connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0037] Please refer to the following: Figures 1 to 7The present invention provides a microchannel heat sink with porous spheres in a hot spot area, comprising an intermediate conductor 10 and a plurality of porous spheres 20.

[0038] like Figure 2 The intermediate conductor 10 is provided with a liquid cooling cavity 111, a liquid inlet 121, and a liquid outlet 122. Both the liquid inlet 121 and the liquid outlet 122 are connected to the liquid cooling cavity 111. The liquid inlet 121 is used for external coolant to be input into the liquid cooling cavity 111, and the liquid outlet 122 is used for outputting the coolant after heat exchange. Porous balls 20 are rotatably distributed in the liquid cooling cavity 111. The gaps between the porous balls 20 are matched to form multiple microchannels that allow coolant to pass through. When the coolant enters the liquid cooling cavity 111 from the liquid inlet 121, it flows through the microchannels and quickly removes the heat generated by the chip through convection heat transfer within the microchannels. During the flow through the microchannel, the intermediate conductor 10 transfers heat to the coolant in two ways: directly to the coolant and indirectly through porous balls 20 in contact with the intermediate conductor 10. Furthermore, the impact force of the coolant causes the porous balls 20 to roll, creating turbulence in the coolant. This turbulence enhances the heat transfer between the coolant and the porous balls 20, allowing the coolant to quickly absorb the heat generated by the chip, significantly improving heat dissipation. This invention, while retaining the small size and high heat transfer capacity of the microchannel, enhances the heat transfer between the coolant and the porous balls 20 through turbulence, further improving the heat dissipation capacity of the microchannel heat sink for localized heat sources on the chip, exhibiting high heat transfer capacity and a high heat transfer limit.

[0039] Please see Figure 2 In one embodiment of this application, the intermediate conductor 10 includes a substrate 11 and a cover plate 12 connected to each other. The cover plate 12 is located on one side of the substrate 11, and a liquid cooling cavity 111 is formed on the side of the substrate 11 facing the cover plate 12.

[0040] Optionally, the cover plate 12 and the substrate 11 are made of LTCC, Cu, or Al. LTCC, Cu, or Al are all materials with good heat dissipation performance. Using these materials to make the cover plate 12 and the substrate 11 allows the heat generated by the chip to be quickly transferred to the coolant through the intermediate conductor 10. Of course, the materials used to make the cover plate 12 and the substrate 11 are not limited to these; other materials that can achieve rapid heat transfer can also be used to make the cover plate 12 and the substrate 11.

[0041] Optionally, the intermediate conductor 10 may be square or other shapes. The shape of the intermediate conductor 10 may be modified according to the shape of the chip so that the heat sink of this invention can achieve the beneficial effect of maximizing heat dissipation over the chip area.

[0042] In one embodiment of this application, the inlet 121 and the outlet 122 are located on the same side of the intermediate conductor 10. For example, as Figure 1 As shown, both the inlet 121 and the outlet 122 are disposed on the cover plate 12, or the inlet 121 and the outlet 122 are disposed on the side of the substrate 11 facing away from the cover plate 12. In other optional embodiments, the outlet 122 and the inlet 121 may be disposed on different sides of the intermediate conductor 10. For example, the inlet 121 may be disposed on the cover plate 12, and the outlet 122 may be disposed on the side of the substrate 11 facing away from the cover plate 12; or, for another example, the inlet 121 may be disposed on the side of the substrate 11 facing away from the cover plate 12, and the outlet 122 may be disposed on the cover plate 12.

[0043] Please see Figure 1 In one embodiment of this application, the connection between the cover plate 12 and the substrate 11 is non-removable. For example, the cover plate 12 and the substrate 11 are connected by adhesive, welding, or high-temperature bonding. These connection methods not only ensure the sealing between the cover plate 12 and the substrate 11, but also make the overall volume of the intermediate conductor 10 small, suitable for heat dissipation of chips that are trending towards miniaturization. In other optional embodiments, the connection between the cover plate 12 and the substrate 11 can be made detachable, for example... Figure 3 The cover plate 12 and the base plate 11 are connected by screws 30, and a sealing ring 40 is provided between the cover plate 12 and the base plate 11 to ensure that the coolant in the liquid cooling cavity 111 does not flow out from between the cover plate 12 and the base plate 11, thus ensuring the airtightness between the cover plate 12 and the base plate 11. Over time, the holes on the porous balls 20 may become clogged due to impurities in the coolant. Once clogged, the heat dissipation effect of the entire radiator will be affected. By providing a detachable connection between the cover plate 12 and the base plate 11, when a large number of porous balls 20 have clogged holes, the cover plate 12 can be removed from the base plate 11, exposing the liquid cooling cavity 111. All the porous balls 20 in the liquid cooling cavity 111 can be replaced, and then the cover plate 12 can be reinstalled on the base plate 11, thus ensuring the heat dissipation effect without replacing the entire radiator, reducing maintenance costs.

[0044] In one embodiment of this application, such as Figure 2 As shown, the inlet 121 and outlet 122 are respectively located at both ends of the intermediate conductor 10, meaning that the coolant flows into the liquid cooling chamber 111 from one end of the intermediate conductor 10 and flows out from the other end of the intermediate conductor 10. Correspondingly, the liquid cooling chamber 111 can be shaped as follows: Figure 1 The straight arrangement shown can also be presented as... Figure 4 The snake-shaped configuration shown has its two ends of the snake-shaped liquid cooling cavity 111 located at the two ends of the intermediate conductor 10. In other optional embodiments, such as... Figure 5As shown, the inlet 121 and outlet 122 can be located at the same end of the intermediate conductor 10, meaning the coolant flows in and out from the same end of the intermediate conductor 10. Correspondingly, the liquid cooling chamber 111 has its two ends located at the same end of the intermediate conductor 10, as shown in the diagram. Figure 6 The U-shaped shape shown or like Figure 7 The snake shape shown.

[0045] Please see Figure 2 In one embodiment of this application, porous spheres 20 are arranged in a layer and randomly dispersed within the liquid cooling cavity. The microchannels formed by a single layer of porous spheres 20 offer less resistance to the fluid compared to microchannels formed by at least two layers of porous spheres 20, resulting in better coolant flow and heat exchange. Furthermore, while ensuring good heat exchange, the entire radiator also has a smaller volume.

[0046] Optionally, the porous sphere 20 is made of Cu or Al, which have good heat transfer properties. Of course, the materials used to make the porous sphere 20 are not limited to these; other materials that can achieve good heat transfer can also be used to make the porous sphere 20 in this invention.

[0047] Optionally, the pore size of the porous sphere 20 is at the nanometer level. This configuration allows the porous sphere 20 to form numerous pores, which greatly increases the contact area between the porous sphere 20 and the coolant, thereby significantly improving the heat exchange effect between the porous sphere 20 and the coolant.

[0048] Optionally, based on the porous ball 20 being made of metal materials such as Cu or Al, the diameter of the porous ball 20 is 1 / 2 to 1 times the height of the liquid cooling cavity 111. This diameter setting of the porous ball 20, under reasonable coolant flow rate, ensures that when the porous ball 20 is impacted by the coolant, it will not float in the coolant and will always be in contact with the intermediate conductor 10. This ensures that the substrate 11 can transfer the heat generated by the chip to the coolant through the porous ball 20, thus ensuring the heat dissipation effect of the heat sink.

[0049] The above description is the preferred embodiment of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications should also be considered within the protection scope of this utility model.

Claims

1. A microchannel heat sink with porous spheres distributed in a hotspot area, characterized in that, include: An intermediate conductor is provided with a liquid cooling cavity, a liquid inlet, and a liquid outlet, wherein the liquid inlet and the liquid outlet are both connected to the liquid cooling cavity; Several porous spheres are distributed in the liquid cooling cavity in a rolling manner, and the gaps between the porous spheres are matched to form multiple microchannels that allow coolant to pass through.

2. The hotspot area porous ball-distributed microchannel heat sink according to claim 1, characterized in that, The porous spheres are randomly arranged in a layer inside the liquid cooling cavity.

3. A microchannel heat sink with porous spherical distribution in a hotspot area according to claim 2, characterized in that, The diameter of the porous sphere is 1 / 5 to 1 times the height of the liquid cooling cavity.

4. A microchannel radiator with porous spherical distribution in a hotspot area according to claim 1, characterized in that, The porous sphere is made of Cu or Al.

5. A microchannel heat sink with porous spherical distribution in a hotspot area according to claim 1, characterized in that, The pore size of the porous sphere is set at the nanometer level.

6. A microchannel heat sink with porous spherical distribution in a hotspot area according to claim 1, characterized in that, The intermediate conductor includes a substrate and a cover plate connected together. The cover plate is located on one side of the substrate, and the liquid cooling cavity is formed on the side of the substrate facing the cover plate.

7. A microchannel heat sink with porous spherical distribution in a hotspot area according to claim 6, characterized in that, The cover plate and the substrate are made of LTCC, Cu or Al materials.

8. A microchannel heat sink with porous spherical distribution in a hotspot area according to claim 6, characterized in that, The cover plate and the substrate are not detachably connected, and the cover plate and the substrate are connected by adhesive, welding or high-temperature bonding.

9. A microchannel heat sink with porous spherical distribution in a hotspot area according to claim 6, characterized in that, The cover plate and the base plate are detachably connected, and a sealing ring is provided between the cover plate and the base plate.

10. A microchannel heat sink with porous spherical distribution in a hotspot area according to any one of claims 2 to 9, characterized in that, The inlet and outlet are located on the same side of the intermediate conductor, or the outlet and inlet are located on different sides of the intermediate conductor.

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