Heating disc and food processor

Abstract

The application relates to a heating disc and a food processor. The heating disc comprises a disc body, a heating element and a heat-conducting plate. The disc body comprises a food material contact surface for contacting food material and a lower disc surface opposite to the food material contact surface. The heating element is arranged on one side of the lower disc surface, and the heating element can generate heat when powered on. The heating element comprises a first heating area and a second heating area, and the heat generation of the first heating area is higher than that of the second heating area. The heat-conducting plate is arranged between the disc body and the heating element. The heat-conducting plate comprises an upper heat-conducting surface facing the lower disc surface and a lower heat-conducting surface facing the heating element. At least one of the lower disc surface, the upper heat-conducting surface and the lower heat-conducting surface is provided with a groove corresponding to at least the first heating area. The groove is filled with a filler, and the thermal conductivity of the filler is lower than that of the heat-conducting plate. The heat of the first heating area is transferred to the disc body through the filler. The heating disc can reduce the risk of paste bottoming.

Description

Technical Field

[0001] This application relates to the field of small household appliance technology, and more specifically, to a heating plate and a food processor. Background Technology

[0002] Some food processors have a heating element consisting of a stainless steel plate, a heat-conducting aluminum plate, and a heating element. When powered on, the heating element generates heat, which is transferred to the stainless steel plate via the heat-conducting aluminum plate, thus heating the food. However, because the heat-conducting aluminum plate is relatively thin, the area where it is in close contact with the heating element can generate localized high temperatures, causing food to easily burn and become difficult to clean. Summary of the Invention

[0003] This application provides a heating plate and a food processor that can reduce the risk of food burning.

[0004] A heating plate, comprising:

[0005] The plate body includes a food contact surface for contacting food and a lower plate surface facing away from the food contact surface;

[0006] A heating element is disposed on one side of the lower plate surface. The heating element can generate heat when energized, and includes a first heating area and a second heating area. The heat generation of the first heating area is higher than that of the second heating area.

[0007] A heat-conducting plate is disposed between the plate and the heating element. The heat-conducting plate includes an upper heat-conducting surface facing the lower plate and a lower heat-conducting surface facing the heating element. At least one of the lower plate and the upper heat-conducting surface and / or the lower heat-conducting surface is provided with a groove. The groove is provided at least corresponding to the first heating area and is filled with filler. The thermal conductivity of the filler is less than that of the heat-conducting plate. The heat of the first heating area is transferred to the plate via the filler.

[0008] The heating plate provided in this application transfers heat from the heating element from bottom to top to the plate body through the heat-conducting plate. Therefore, the grooves between the heat-conducting plate and the plate body and / or between the heating element and the heat-conducting plate are filled with fillers with low thermal conductivity. The heat is also transferred upward through the fillers, which can reduce the heat transfer efficiency of the first heating zone, so as to balance the heat transfer of the first heating zone and the second heating zone, making the plate body heat evenly as a whole, thereby reducing the risk of the plate body burning.

[0009] Optionally, the disk body is welded to the heat-conducting plate, and at least one of the lower disk surface and the upper heat-conducting surface is provided with the groove. This ensures a tight fit between the disk body and the heat-conducting plate, preventing leakage of the filler in the groove.

[0010] Optionally, the heat-conducting plate is welded to the heating element, and the lower heat-conducting surface is provided with the groove. This ensures a tight bond between the heat-conducting plate and the heating element, preventing leakage of the filler in the groove.

[0011] Optionally, the filler is a solder with a thermal conductivity lower than that of the heat-conducting plate. Thus, the solder also serves as a filler, melting directly and filling the groove during the welding process. Because the thermal conductivity of the solder is lower than that of the heat-conducting plate, it can serve as a connector, slow down heat transfer, and reduce processing steps.

[0012] Optionally, the filler is made by uniformly mixing the solder and at least one low thermal conductivity material, wherein at least one of the solder and the low thermal conductivity material has a lower thermal conductivity than the heat-conducting plate. This ensures the low thermal conductivity of the filler.

[0013] Optionally, the filler includes the solder and at least one low thermal conductivity material, wherein at least one of the solder and the low thermal conductivity material has a lower thermal conductivity than the heat-conducting plate, and wherein the solder and the at least one low thermal conductivity material form a multilayer structure within the groove, with the solder located on the outermost layer of the multilayer structure. The low thermal conductivity material is encapsulated within the solder, not only creating a heat transfer gradient to meet the low thermal conductivity requirement, but the solder on the outer layer can also be used for soldering.

[0014] Optionally, multiple grooves are provided and distributed in a dotted pattern. This allows for flexible adjustment of the number of grooves according to actual needs.

[0015] Optionally, the groove is a strip-shaped groove and there are multiple grooves, at least some of which are arranged in parallel to each other to make the heat transfer uniform.

[0016] Optionally, the multiple grooves are divided into multiple groups, with the grooves in each group arranged parallel to each other. This creates multiple spaced-apart packing strips in the area, which facilitates gradient heat transfer and prevents localized overheating and scorching of the plate.

[0017] Optionally, the heating element is annular, including two ends and a middle section between the two ends. The middle section at least partially forms the first heating zone. A plurality of grooves are disposed within a range of α, corresponding to a central angle of 30° ≤ α ≤ 180°, along with the middle section of the heating element. Thus, the grooves are concentrated in the middle section of the heating element and mainly correspond to the first heating zone. This allows for more effective gradient heat transfer by adding filler within the grooves, preventing localized overheating and scorching of the plate.

[0018] Optionally, the distance between two adjacent grooves is L1, 0.5mm ≤ L1 ≤ 3mm, and the groove width is L2, 0.5mm ≤ L2 ≤ 5mm. This distance L1 facilitates heat balance, while the groove width L2 facilitates gradient heat transfer.

[0019] Optionally, the grooves are strip-shaped grooves and multiple grooves are arranged in an alternating pattern to form a grid. In this way, within the same size heating area, the number of grooves can be increased, and correspondingly, the amount of filler can also be increased, which can further reduce the heat transfer rate.

[0020] Optionally, the grooves are strip-shaped and multiple grooves are provided. The heating element is annular, and the multiple grooves are divided into multiple groups and arranged along the extension direction of the heating element. The grooves in the same group are parallel, and the grooves in different groups intersect. In this way, more grooves can be reasonably arranged according to the shape of the first heating zone, which facilitates the transfer of low heat to the corresponding parts of the first heating zone.

[0021] Optionally, the heating element is annular, and the grooves are strip-shaped grooves with multiple grooves extending along the extension direction of the heating element, arranged in multiple rings from the outside in. This allows the grooves to cover the entire area of ​​the first heating zone, increasing the number of grooves and improving the heat transfer rate reduction effect.

[0022] Optionally, the lower plate surface is provided with multiple grooves, and a metal protective layer is also provided within the grooves. This enables gradient heat transfer, resulting in more even heat distribution. The metal protective layer also protects the lower plate surface from corrosion or rust.

[0023] Optionally, multiple grooves are distributed across the entire lower plate surface. This further mitigates the heat transferred by the heat-conducting plate, reducing the risk of burnt residue.

[0024] A food processor, comprising:

[0025] Host;

[0026] A cup assembly, comprising a cup body forming a cavity, the cup body including a heating plate as described in any of the preceding claims. This food processor carries a low risk of food burning at the bottom. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of a food processor shown in an exemplary embodiment of this application;

[0028] Figure 2 for Figure 1 An exploded view of the cup assembly shown in the image;

[0029] Figure 3 yes Figure 1 The cross-sectional view of the cup assembly shown in the image;

[0030] Figure 4 This is a cross-sectional view of the heating plate and stirring blade in their assembled state;

[0031] Figure 5 yes Figure 4An enlarged view of part A in the middle;

[0032] Figure 6 This is a schematic diagram showing the position of the groove relative to the heating element;

[0033] Figure 7 This is a schematic diagram of yet another embodiment of the groove;

[0034] Figure 8 This is a cross-sectional view of yet another embodiment of the heating plate;

[0035] Figure 9 This is a schematic diagram of the lower plate of the disc.

[0036] Figure 10 This is a cross-sectional view of the disc. Detailed Implementation

[0037] The technical solutions in the embodiments (or "implementations") of this application will be clearly and completely described herein with reference to the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0038] If the embodiments of this application contain terms relating to directional indications or positional relationships (such as up, down, left, right, front, back, inside, outside, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are only used to explain the relative positional relationships and movements between components in a specific posture (as shown in the attached figures); if the specific posture changes, the directional indications or positional relationships will also change accordingly. Furthermore, the terms "first" and "second" used in the embodiments of this application are only for descriptive convenience and should not be construed as indicating or implying relative importance.

[0039] Please refer to Figure 1 , Figure 1 This is a schematic diagram of a food processor 100 shown as an exemplary embodiment of this application.

[0040] This application provides a food processor 100, which includes a main unit 10 and a cup assembly 20. The cup assembly 20 is assembled to the main unit 10, and the assembly method includes, but is not limited to, detachable assembly. The main unit 10 is located below the cup assembly 20, forming a base-type main unit 10.

[0041] Please refer to Figure 2 and Figure 3 , Figure 2 for Figure 1 An exploded view of the cup component 20 shown in the figure. Figure 3 yes Figure 1 The image shows a cross-sectional view of the cup assembly 20.

[0042] The cup assembly 20 includes a cup body 21 and a cup base 22 disposed at the bottom of the cup body 21. The cup body 21 includes a cup body 210 and a heating plate 212 connected to the bottom of the cup body 210. The cup body 210 and the heating plate 212 together form a cup cavity 200, which can hold food. The cup body 210 and the heating plate 212 can be sealed by a sealing ring 213 to prevent food leakage from the cup cavity 200. The cup body 210 may be provided with a handle 214 for easy handling. The cup body 210 includes, but is not limited to, a glass cup.

[0043] The cup holder 22 includes a cup holder housing 220 and a cup holder cover 222 disposed within the cup holder housing 220. The cup holder cover 222 is connected to the bottom of the cup holder housing 220 and is used to seal the opening at the bottom of the cup holder housing 220. The cup holder cover 222 is provided with a cup body coupler. The cup assembly 20 also includes a cup lid 23, which covers the top of the cup body 21. The cup lid 23 can be configured to screw onto the cup body 21, but is not limited to this configuration.

[0044] exist Figure 2 and Figure 3 In the embodiment shown, the cup assembly 20 also includes a stirring blade 26, which is rotatably mounted on the heating plate 212. The rotation axis of the stirring blade 26 is aligned with the height direction of the cup body 21. The blades of the stirring blade 26 are located inside the cup cavity 200 and are used to stir and crush food. The blade shaft of the stirring blade 26 is connected to a motor inside the main unit 10 to drive the stirring blade 26 to rotate.

[0045] Please refer to Figures 4 to 6 , Figure 4 This is a cross-sectional view of the heating plate 212 and the stirring blade 26 in their assembled state. Figure 5 for Figure 4 A magnified view of part A in the middle. Figure 6 This is a schematic diagram showing the position of the groove relative to the heating element 2124.

[0046] The heating plate 212 includes a plate body 2120, a heat-conducting plate 2122, and a heating element 2124. The plate body 2120, heat-conducting plate 2122, and heating element 2124 can be welded together. The plate body 2120 includes a food contact surface 2120a for contacting food and a lower plate surface 2120b facing away from the food contact surface 2120a. The plate body 2120, serving as the bottom of the cup cavity 200, can be made of food-grade stainless steel. A temperature sensor can be installed on the plate body 2120 for detecting its temperature.

[0047] A heating element 2124 is located on the side of the plate 2120 facing away from the food contact surface 2120a. The heating element 2124 generates heat when energized. In this embodiment, the heating element 2124 is a heating tube, approximately annular in shape, including a first terminal (L terminal) and a second terminal (N terminal). The L terminal is used to connect to the live wire, and the N terminal is used to connect to the neutral wire. The heating element 2124 includes a first heating area 2124a and a second heating area 2124b. The heat output of the first heating area 2124a is greater than that of the second heating area 2124b. The areas near the L terminal and N terminal at both ends of the heating element 2124 are the second heating area 2124b, and the middle area of ​​the heating element 2124 is the first heating area 2124a. A gap is left between the two terminals of the heating element 2124. Therefore, the area of ​​the heating element 2124 near the L and N terminals is conducive to heat dissipation, and the heat in this area is relatively smaller than that in the middle area. This results in the heating element 2124 forming a first heating area 2124a and a second heating area 2124b with uneven heat distribution. It should be noted that the first heating area 2124a and the second heating area 2124b may differ depending on the structural form of the heating element 2124.

[0048] A heat-conducting plate 2122 is disposed between the plate body 2120 and the heating element 2124. The heat-conducting plate 2122 includes an upper heat-conducting surface 2122a facing the lower plate surface 2120b and a lower heat-conducting surface 2122b facing the heating element 2124. The upper heat-conducting surface 2122a may have a groove 21220. The groove 21220 is provided corresponding to the first heating area 2124a and is filled with filler 21222. The thermal conductivity of the filler 21222 is less than that of the heat-conducting plate 2122. It should be noted that the groove can be provided on the lower plate surface 2120b, or simultaneously on both the upper heat-conducting surface 2122a and the lower plate surface 2120b. Alternatively, the groove can also be provided on the lower heat-conducting surface 2122b. This application uses the example of the upper heat-conducting surface 2122a having a groove 21220 for illustration. The formation method of the groove 21220 is not limited.

[0049] As described above, the heat emitted by the heating element 2124 is transferred from bottom to top and then to the disk body 2120 through the heat-conducting plate 2122. Therefore, the groove 21220 between the heat-conducting plate 2122 and the disk body 2120 and / or between the heating element 2124 and the heat-conducting plate 2122 is filled with filler 21222 with low thermal conductivity. At this time, the heat is also transferred upward through the filler 21222, which can reduce the heat transfer efficiency of the first heating area, so as to balance the heat transfer of the first heating area 2124a and the second heating area 2124b, so that the disk body 2120 is heated evenly as a whole, thereby reducing the risk of the disk body 2120 burning.

[0050] In one alternative embodiment, the disk body 2120 is welded to the heat-conducting plate 2122, and at least one of the lower disk surface 2120b and the upper heat-conducting surface 2122a is provided with the groove 21220. This ensures a tight bond between the heat-conducting plate 2122 and the disk body 2120, preventing leakage of the filler in the groove 21220. In another alternative embodiment, the filler 21222 is solder used for welding the disk body 2120 and the heat-conducting plate 2122, and the thermal conductivity of the solder is lower than that of the heat-conducting plate 2122. Thus, the solder can also serve as the filler 21222, melting directly and filling the groove 21220 during the welding process. Because the thermal conductivity of the solder is lower than that of the heat-conducting plate 2122, it achieves both the connection between the two and the reduction of heat transfer, while also reducing processing steps.

[0051] In another alternative embodiment, the heat-conducting plate 2122 is welded to the heating element 2124, wherein the lower heat-conducting surface 2122b is provided with the groove 21220. In an alternative embodiment, the filler 21222 is solder used to weld the heat-conducting plate 2122 and the heating element 2124, and the thermal conductivity of the solder is lower than that of the heat-conducting plate 2122. In this embodiment, the solder also serves as the filler 21222. Because the thermal conductivity of the solder is lower than that of the heat-conducting plate 2122, it can both provide a connection and slow down heat transfer, and also reduce processing steps.

[0052] In the two embodiments described above, tin solder can be used, which has a thermal conductivity of 50-80 W / (m·K). The soldering temperature is controlled between 300℃ and 650℃, the holding time is 15-40s, the heating rate is ≤3℃ / s, and the cooling rate is ≤4℃ / s. Of course, other metal alloy solders with low thermal conductivity can also be used.

[0053] This application does not limit the specific arrangement of the filler. For example, filler 21222 can be made by uniformly mixing solder and at least one low thermal conductivity material to ensure low thermal conductivity. Alternatively, the filler may include the solder and at least one low thermal conductivity material, wherein the solder and the at least one low thermal conductivity material form a multilayer structure within the groove 21220, with the solder located on the outermost layer of the multilayer structure. In this way, the low thermal conductivity material is encapsulated by the solder, not only forming a gradient heat transfer to meet the low thermal conductivity requirement, but the solder on the outer layer is used for soldering. Wherein, at least one of the aforementioned low thermal conductivity material and solder has a lower thermal conductivity than the heat-conducting plate; more preferably, the thermal conductivity of both the aforementioned low thermal conductivity material and solder is lower than the thermal conductivity of the heat-conducting plate. The aforementioned low thermal conductivity material may be ceramic nanoparticles, silane coupling agents, etc., but is not limited to these.

[0054] This application does not limit the shape or arrangement of the grooves 21220. For example, in some other embodiments, multiple grooves 21220 are provided, and the multiple grooves 21220 can be circular, square, or irregular in shape, and distributed in a dotted pattern, so that the number of grooves 21220 can be flexibly set according to actual needs. Please continue to refer to Figure 6 In one embodiment, the grooves 21220 are strip-shaped grooves and there are multiple grooves, with at least a portion of the grooves 21220 arranged parallel to each other. This allows for the formation of multiple spaced-apart packing strips 21222 in this area, which facilitates gradient heat transfer and prevents localized overheating and scorching of the disc 2120. Figure 6 In the illustrated embodiment, the plurality of grooves 21220 are divided into multiple groups, with the grooves 21220 in each group arranged in parallel to each other. This allows multiple groups of grooves 21220 to be placed in different areas, resulting in a more flexible and diverse arrangement.

[0055] Optionally, the distance between two adjacent grooves 21220 is L1, 0.5mm ≤ L1 ≤ 3mm. For example, L1 can be 0.5mm, 1mm, 2mm, or 3mm, but is not limited to these. The groove width is L2, 0.5mm ≤ L2 ≤ 5mm. For example, L2 can be 0.5mm, 1mm, 2mm, 3mm, 4mm, or 5mm, but is not limited to these. This distance L1 is beneficial for achieving heat balance. This groove width L2 is beneficial for achieving gradient heat transfer. Figure 6 In the illustrated embodiment, the heating element 2124 is generally annular, including two ends and a middle section between the two ends. The middle section at least partially forms a first heating zone 2124a. A plurality of grooves 21220 are correspondingly disposed within the range of the central angle α corresponding to the middle section of the heating element 2124, where 30° ≤ α ≤ 180°. Thus, the grooves 21220 are concentrated in the middle section of the heating element 2124 and mainly correspond to the first heating zone 2124a. This allows for more effective gradient heat transfer by adding filler within the grooves 21220, preventing localized overheating and scorching of the plate 2120. For example, α is the sum of angles deflected clockwise and counterclockwise by α / 2 from the centerline of the heating element 2124. For example, α can be 30°, 45°, 60°, 90°, 120°, 135°, or 180°, but is not limited to these.

[0056] In this embodiment, the plurality of grooves 21220 are all strip-shaped grooves and divided into multiple groups. The heating element 2124 is annular, and the multiple groups of grooves 21220 are arranged along the extension direction of the heating element 2124. The grooves 21220 in the same group are parallel, and the grooves 21220 in different groups intersect. In this way, more grooves 21220 can be reasonably arranged according to the shape of the first heating area 2124a, which facilitates the low heat transfer to the corresponding part of the first heating area 2124a. For example, the extension direction of the grooves 21220 in two adjacent groups can be perpendicular.

[0057] exist Figure 6 In the illustrated embodiment, the plurality of grooves 21220 are divided into three groups. The middle group of grooves 21220 corresponds to the middle region of the heating element 2124, and the two groups of grooves 21220 on both sides are symmetrically arranged on both sides of the middle groove 21220. The extending direction of the middle groove 21220 is perpendicular to the extending direction of the two groups of grooves 21220 on both sides. In this way, the plurality of grooves 21220 can basically cover the first heating area 2124a, making the heat distribution of the disk body 2120 to the first heating area 2124a more even. It should be noted that the middle region or middle section of the heating element 2124 is the first heating area 2124a.

[0058] Of course, in some other embodiments, the grooves 21220 are strip-shaped grooves and multiple grooves are provided, and the multiple grooves 21220 are arranged in an alternating pattern to form a grid. In this way, within the same size heating area, the number of grooves 21220 can be increased, and correspondingly, the amount of filler 21222 also increases, which can further reduce the heat transfer rate.

[0059] Please refer to Figure 7 , Figure 7 This is a schematic diagram of another embodiment of the groove 21220.

[0060] exist Figure 7 In the illustrated embodiment, the heating element 2124 is annular, and the grooves 21220 are strip-shaped grooves with multiple grooves. All grooves 21220 extend along the extending direction of the heating element 2124, and are arranged in multiple rings from the outside inwards. Thus, the grooves 21220 can cover the entire area of ​​the first heating zone 2124a, allowing for a greater number of grooves and a better reduction in heat transfer rate.

[0061] Please refer to Figures 8 to 10 , Figure 8 This is a cross-sectional view of another embodiment of the heating plate 212. Figure 9 This is a schematic diagram of the lower plate of the disc. Figure 10 This is a cross-sectional view of disk body 2120.

[0062] In one embodiment, the lower plate surface 2120b is provided with a plurality of grooves 21220, each groove 21220 containing a metal protective layer. These grooves correspond to the first heating area 2124a. This achieves heat isolation of the first heating area, resulting in uniform heating. The grooves 21220 are formed by sandblasting. Sandblasting not only forms the grooves 21220 but also increases the strength and density of the lower plate surface 2120b. Furthermore, a metal protective layer is provided within each groove 21220. This metal protective layer can be formed by deposition, but is not limited to this method. The metal protective layer covers the outside of the sandblasted lower plate surface 2120b.

[0063] In the illustrated embodiment, the plurality of grooves 21220 are distributed across the entire lower plate surface 2120b, which not only blocks the heat from the first heating zone, but also comprehensively slows down the heat transferred through the heat-conducting plate 2122, further reducing the risk of burning.

[0064] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A heating plate, characterized in that, include: The plate body (2120) includes a food contact surface (2120a) for contacting food and a lower plate surface (2120b) facing away from the food contact surface; A heating element (2124) is disposed on one side of the lower plate surface (2120b). The heating element (2124) can generate heat when energized, and includes a first heating area (2124a) and a second heating area (2124b). The heat generation of the first heating area (2124a) is higher than that of the second heating area (2124b). A heat-conducting plate (2122) is disposed between the plate (2120) and the heating element (2124). The heat-conducting plate (2122) includes an upper heat-conducting surface (2122a) facing the lower plate surface (2120b) and a lower heat-conducting surface (2122b) facing the heating element (2124). At least one of the lower plate surface (2120b) and the upper heat-conducting surface (2122a) and / or the lower heat-conducting surface is provided with a groove (21220). The groove (21220) is provided at least corresponding to the first heating area (2124a) and is filled with filler (21222). The thermal conductivity of the filler (21222) is less than that of the heat-conducting plate (2122). The heat of the first heating area (2124a) is transferred to the plate (2120) via the filler (21222).

2. The heating plate according to claim 1, characterized in that, The disk body (2120) is welded to the heat-conducting plate (2122), and at least one of the lower disk surface (2120b) and the upper heat-conducting surface (2122a) is provided with the groove (21220), and / or, the heat-conducting plate (2122) is welded to the heating element (2124), and the lower heat-conducting surface (2122b) is provided with the groove (21220).

3. The heating plate according to claim 2, characterized in that, The filler (21222) is a solder with a thermal conductivity lower than that of the heat-conducting plate (2122); or The filler (21222) is made by uniformly mixing solder and at least one low thermal conductivity material, wherein at least one of the solder and the low thermal conductivity material has a lower thermal conductivity than the heat-conducting plate (2122); or The filler (21222) includes solder and at least one low thermal conductivity material, wherein at least one of the solder and the low thermal conductivity material has a lower thermal conductivity than the heat-conducting plate (2122), wherein the solder and the at least one low thermal conductivity material form a multilayer structure in the groove (21220), and the solder is located in the outermost layer of the multilayer structure.

4. The heating plate according to any one of claims 1 to 3, characterized in that, The grooves (21220) are provided in multiple ways and are distributed in a dotted pattern.

5. The heating plate according to any one of claims 1 to 3, characterized in that, The groove (21220) is a strip-shaped groove and there are multiple grooves, and at least a portion of the grooves (21220) are arranged in parallel to each other.

6. The heating plate according to claim 5, characterized in that, The plurality of grooves (21220) are divided into multiple groups, and the grooves (21220) in each group are arranged in parallel to each other; and / or The heating element (2124) is annular, including two ends and a middle section located between the two ends. The middle section at least partially forms the first heating area. A plurality of the grooves (21220) are arranged within the range of the central angle α corresponding to the middle section of the heating element (2124), where 30°≤α≤180°. And / or, the distance between two adjacent grooves (21220) is L1, 0.5mm≤L1≤3mm, and the groove width of the groove (21220) is L2, 0.5mm≤L2≤5mm.

7. The heating plate according to any one of claims 1 to 3, characterized in that, The grooves (21220) are strip-shaped grooves and multiple grooves are provided, and the multiple grooves (21220) are arranged in an alternating pattern to form a grid; or The groove (21220) is a strip groove and multiple grooves are provided. The heating element (2124) is annular. The multiple grooves (21220) are divided into multiple groups and arranged along the extension direction of the heating element (2124). The grooves (21220) in the same group are parallel, and the grooves (21220) in different groups are intersecting. Alternatively, the heating element (2124) may be annular, and the groove (21220) may be a strip-shaped groove with multiple grooves. The multiple grooves (21220) may extend along the extension direction of the heating element (2124), and the multiple grooves (21220) may be arranged in multiple rings from the outside to the inside.

8. The heating plate according to any one of claims 1 to 3, characterized in that, The lower plate surface (2120b) is provided with a plurality of grooves (21220), and a metal protective layer is provided in the grooves (21220).

9. The heating plate according to claim 8, characterized in that, Multiple grooves (21220) are distributed across the entire lower plate surface (2120b).

10. A food processor, characterized in that, include: Host (10); A cup assembly (20) comprising a cup body (21) having a cup cavity (200) and the cup body (21) comprising a heating plate (212) as claimed in any one of claims 1 to 9.

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