Heating disc and food processor

Abstract

The application relates to a heating disc and a food processor. The heating disc comprises a disc body, a heat-conducting plate, a heating element and an auxiliary heat-conducting disc. The heating disc comprises a food material contact surface. The heat-conducting plate is arranged on the side of the disc body away from the food material contact surface. The heating element can generate heat when electrified, the heating element is arranged on the side of the heat-conducting plate away from the disc body, the heating element comprises a first heating area and a second heating area, and the heat generation of the first heating area is greater than that of the second heating area. The auxiliary heat-conducting plate is arranged between the heat-conducting plate and the heating element, and the thermal conductivity of the auxiliary heat-conducting plate is greater than that of the heat-conducting plate. The auxiliary heat-conducting plate comprises a main body part corresponding to the central area of the disc body and a heat-conducting part extending outward from the main body part. The heat-conducting part is arranged corresponding to the first heating area and is provided with heat dissipation apertures. In the orthographic projection formed in the thickness direction of the disc body, the projection of the main body part is located in the projection of the heating element. The heating disc can reduce the risk of paste bottoming.

Description

Technical Field

[0001] This application relates to the field of small household appliance technology, and more specifically, to a heating plate and a food processor. Background Technology

[0002] Some food processors have a heating element consisting of a stainless steel plate, a heat-conducting aluminum plate, and a heating element. When powered on, the heating element generates heat, which is transferred to the stainless steel plate via the heat-conducting aluminum plate, thus heating the food. However, because the heat-conducting aluminum plate is relatively thin, the area where it is in close contact with the heating element can generate localized high temperatures, causing food to easily burn and become difficult to clean. Summary of the Invention

[0003] This application provides a heating plate and a food processor that can reduce the risk of food burning.

[0004] A heating plate, comprising:

[0005] The plate body, including the food contact surface for contacting food;

[0006] A heat-conducting plate is located on the side of the plate that faces away from the food contact surface;

[0007] A heating element that generates heat when powered on is located on the side of the heat-conducting plate facing away from the plate. The heating element includes a first heating area and a second heating area, wherein the heat generated by the first heating area is greater than the heat generated by the second heating area.

[0008] An auxiliary heat-conducting sheet is disposed between the heating part and the heating element, and has a thermal conductivity greater than that of the heat-conducting plate. The auxiliary heat-conducting sheet includes a main body disposed corresponding to the central region of the disk and a heat-conducting part extending outward from the main body. The heat-conducting part is disposed corresponding to the first heating area and has heat dissipation holes. In the orthographic projection formed along the thickness direction of the disk, the projection of the main body is located within the projection of the heating element.

[0009] The heating plate provided in this application has a first heating zone of the heating element that is thermally connected to the heat-conducting part of the auxiliary heat-conducting plate. Since the heat-conducting part is provided with heat dissipation holes, a portion of the heat in the first heating zone can be dissipated through the heat dissipation holes, while the remaining heat can be quickly transferred laterally to the main body through the heat-conducting part, so that the heat is evenly diffused laterally on the auxiliary heat-conducting plate to achieve the effect of uniform heating. Then, the heat is transferred to the plate body through the heat-conducting plate, so that the heat received by the plate body is more dispersed and uniform, thereby reducing the risk of burning.

[0010] Optionally, the heat-conducting portion includes multiple heat-conducting pins extending from the outer edge of the main body, with the gap between two adjacent heat-conducting pins forming the heat dissipation hole. The arrangement of multiple heat-conducting pins can disperse and transfer heat from the first heating area, ensuring uniform heat transfer, and the formation of the heat dissipation hole is simple and easy to implement.

[0011] Optionally, multiple heat-conducting pins are arranged corresponding to the first heating area and around the center of the disk body. The two heat-conducting pins located at the outermost edge are spaced apart by an angle α, where 30°≤α≤180°. Arranging the heat-conducting pins within this angle range ensures a more even distribution of heat transferred from the first heating area to the disk body, while also guaranteeing heat transfer efficiency.

[0012] Optionally, the first heating area includes a central heating area and edge heating areas on both sides of the central heating area. Multiple heat-conducting pins are grouped together, corresponding to the central heating area and the edge heating areas respectively. The number of heat-conducting pins corresponding to the central heating area is greater than the number of heat-conducting pins corresponding to any one of the edge heating areas. Since the heat generation in the central heating area is greater than that in the edge heating areas, providing more heat-conducting pins in the central heating area can correspondingly increase the number of heat dissipation pores, making the heat transfer between the central and edge heating areas more even and ensuring heat transfer efficiency.

[0013] Optionally, multiple heat-conducting pins are provided corresponding to any one of the edge heating areas, and all of them are arranged around the center of the disk body. Among the multiple heat-conducting pins corresponding to any one of the edge heating areas, the two heat-conducting pins located at the outermost edge are spaced apart by an angle β, where 0°≤β≤90°. In this way, an appropriate number of heat-conducting pins can be set within this angle range to ensure that the edge heating area transfers appropriate heat to the disk body.

[0014] Optionally, the two sets of heat-conducting pins, corresponding one-to-one with the two edge heating areas, are symmetrically arranged on both sides of the central heating area. This ensures more even heat transfer. Optionally, in the orthographic projection along the thickness direction of the disk body, the projection of the root of each heat-conducting pin is closer to the center of the disk body than the projection of the heating element. With this arrangement, when the auxiliary heat-conducting sheet is welded to the heating element, a large amount of heat can be generated instantaneously due to the high thermal conductivity of the auxiliary heat-conducting sheet. While reducing the size of the main body, the radial length of the heat-conducting pins can be appropriately extended, which can reduce the contact area between the heat-conducting pins and the heat-conducting plate, avoid transferring too much heat to the heat-conducting plate, and reduce the risk of the heat-conducting plate melting.

[0015] Optionally, the width of the heat-conducting pin is L1, where 3mm ≤ L1 ≤ 10mm. An appropriate width facilitates processing.

[0016] Optionally, the spacing between two adjacent heat-conducting pins is L2, where 2mm ≤ L2 ≤ 5mm. This allows for adequate heat dissipation gaps to be reserved between adjacent heat-conducting pins.

[0017] Optionally, the first heat-conducting portion includes a perforated section extending along the thickness direction, the perforated section forming the heat dissipation pores. This perforated section has a simple structure and is easy to manufacture.

[0018] Optionally, the heat-conducting part is connected to the outer edge of the main body and is disposed around the center of the disk. Extending along the disk reduces heat loss during the transfer process.

[0019] Optionally, the auxiliary heat-conducting sheet is a copper heat-conducting sheet with a thickness of 0.1–2 mm or 0.3–0.5 mm. Copper heat-conducting sheets have high thermal conductivity and are readily available.

[0020] Optionally, in the orthographic projection formed along the thickness direction of the disk body, the projection of the outer contour line of the main body is closer to the center of the disk body than the projection of the inner contour line of the heating element. With this configuration, the main body does not contact the heating element, and the auxiliary heat-conducting sheet only conducts heat to the first heating zone of the heating element through its heat-conducting portion, thereby effectively dispersing the heat from the first heating zone.

[0021] Optionally, the orthographic projection of the heating element is annular, and the orthographic projection of the main body is annular or circular. The main body conforms to the shape of the disk, which can effectively transfer heat and reduce heat loss. The conformity between the heating element and the main body facilitates assembly and has a reasonable structure.

[0022] Optionally, the heat-conducting plate has a groove on its surface facing away from the disk body, and the auxiliary heat-conducting sheet is disposed in the groove. The groove provides installation space for the auxiliary heat-conducting sheet, making the assembly of the heat-conducting plate and the auxiliary heat-conducting sheet more compact.

[0023] Optionally, the distance between the groove and the outer edge of the heat-conducting plate is D, where 0.3mm ≤ D ≤ 5mm. This ensures that the auxiliary heat-conducting sheet can be completely contained within the groove, its outer contour dimension does not exceed that of the heat-conducting plate, and the groove edge distance is appropriate.

[0024] A food processor, comprising:

[0025] Host;

[0026] A cup assembly, assembled to the main unit, includes a cup body forming a cavity, the cup body including the heating plate described in any of the above embodiments. This food processor has a low risk of food burning at the bottom. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of a food processor shown in an exemplary embodiment of this application;

[0028] Figure 2 yes Figure 1 An exploded view of the food processor shown in the image;

[0029] Figure 3 yes Figure 1 The cross-sectional view of the cup assembly shown in the image;

[0030] Figure 4 This is an exploded view of the heating plate and the stirring blade;

[0031] Figure 5 This is a cross-sectional view of the heating plate and the stirring blade;

[0032] Figure 6 This is an exploded view of the heating element;

[0033] Figure 7 This is a bottom view of the heating element;

[0034] Figure 8 This is the front view of the auxiliary heat-conducting plate;

[0035] Figure 9 This is the front view of the heating element;

[0036] Figure 10 This is a schematic diagram of the auxiliary heat-conducting plate being installed in the groove of the heat-conducting plate;

[0037] Figure 11 This is a schematic diagram of yet another embodiment of the auxiliary heat-conducting sheet;

[0038] Figure 12 This is a schematic diagram of another embodiment of the auxiliary heat-conducting sheet. Detailed Implementation

[0039] The technical solutions in the embodiments (or "implementations") of this application will be clearly and completely described herein with reference to the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0040] If the embodiments of this application contain terms relating to directional indications or positional relationships (such as up, down, left, right, front, back, inside, outside, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are only used to explain the relative positional relationships and movements between components in a specific posture (as shown in the attached figures); if the specific posture changes, the directional indications or positional relationships will also change accordingly. Furthermore, the terms "first" and "second" used in the embodiments of this application are only for descriptive convenience and should not be construed as indicating or implying relative importance.

[0041] Please refer to Figure 1 , Figure 1 This is a schematic diagram of a food processor 100 shown as an exemplary embodiment of this application.

[0042] This application provides a food processor 100, which includes a main unit 10 and a cup assembly 20. The cup assembly 20 is assembled to the main unit 10, and the assembly method includes, but is not limited to, detachable assembly. The main unit 10 is located below the cup assembly 20, forming a base-type main unit 10.

[0043] Please refer to Figure 2 and Figure 3 , Figure 2 yes Figure 1 An exploded view of the food processor 100 shown in the image. Figure 3 for Figure 1 The image shows a cross-sectional view of the cup assembly 20.

[0044] The cup assembly 20 includes a cup body 21 and a cup base 22 disposed at the bottom of the cup body 21. The cup body 21 includes a cup body 210 and a heating plate 212 connected to the bottom of the cup body 210. The cup body 210 and the heating plate 212 together form a cup cavity 200, which can hold food. The cup body 210 and the heating plate 212 can be sealed by a sealing ring 213 to prevent food leakage from the cup cavity 200. The cup body 210 may be provided with a handle 214 for easy handling. The cup body 210 includes, but is not limited to, a glass cup.

[0045] The cup assembly 20 also includes a cup lid 23 and a cup holder cover 24. The cup lid 23 covers the top of the cup body 21 and can be configured to screw onto the cup body 21, but is not limited to this. The cup holder cover 24 covers the bottom of the cup holder 22 and is used to cover the components inside the cup holder 22. The cup body coupler 25 can also be provided on the cup holder cover 24.

[0046] exist Figure 2 and Figure 3 In the embodiment shown, the cup assembly 20 also includes a stirring blade 26, which is rotatably mounted on the heating plate 212. The rotation axis of the stirring blade 26 is aligned with the height direction of the cup body 21. The blades of the stirring blade 26 are located inside the cup cavity 200 and are used to stir and crush food. The blade shaft of the stirring blade 26 is connected to a motor inside the main unit 10 to drive the stirring blade 26 to rotate.

[0047] Please refer to Figure 4 and Figure 5 , Figure 4 An exploded view of the heating plate 212 and the stirring blade 26. Figure 5 yes Figure 4 The image shows a cross-sectional view of the heating plate 212 and the stirring blade 26.

[0048] The heating plate 212 includes a plate body 2120, a heat-conducting plate 2122, a heating element 2124, and an auxiliary heat-conducting sheet 2126. The plate body 2120 includes a food contact surface 2120a for contacting food. The heating plate 212 can be a stainless steel plate, but is not limited to this. A temperature sensor 2121 can be installed on the plate body 2120 to sense the temperature of the plate body 2120. The heat-conducting plate 2122 is located on the side of the plate body 2120 opposite to the food contact surface 2120a. The heat-conducting plate 2122 may include, but is not limited to, an aluminum plate.

[0049] The heating element 2124 generates heat when energized. The heating element 2124 is located on the side of the heat-conducting plate 2122 facing away from the disk body 2120. The heating element 2124 includes a first heating area 2124a and a second heating area 2124b. The heat generated by the first heating area 2124a is greater than the heat generated by the second heating area 2124b.

[0050] The heating element 2124 is generally annular. In one embodiment, the heating element 2124 is a heating tube, including a first terminal (L terminal) and a second terminal (N terminal). The L terminal is used to connect to the live wire, and the N terminal is used to connect to the neutral wire. The areas near the L terminal and N terminal of the heating element 2124 are respectively designated as the second heating area 2124b, and the middle area of ​​the heating element 2124 is designated as the first heating area 2124a. A gap is left between the two terminals of the heating element 2124. Therefore, the areas near the L terminal and N terminal of the heating element 2124 are conducive to heat dissipation, and the heat in these areas is relatively smaller than in the middle area, thus causing the heating element 2124 to form unevenly heated first heating area 2124a and second heating area 2124b. It should be noted that the first heating area 2124a and the second heating area 2124b may differ depending on the structural form of the heating element 2124.

[0051] The auxiliary heat-conducting sheet 2126 is disposed between the heat-conducting plate 2111 and the heating element 2124, and the thermal conductivity of the auxiliary heat-conducting sheet 2126 is greater than that of the heat-conducting plate 2122. The auxiliary heat-conducting sheet 2126 includes, but is not limited to, a copper heat-conducting sheet. Please refer to... Figure 7 The auxiliary heat-conducting sheet 2126 includes a main body 2126a corresponding to the central region of the disk 2120 and a heat-conducting part 2126b extending outward from the main body 2126a. The heat-conducting part 2126b is correspondingly disposed to the first heating area 2124a and is provided with heat dissipation holes 21260, which may be one or more. In the orthographic projection formed along the thickness direction of the disk 2120, the projection of the main body 2126a is located within the projection of the heating element 2124. The auxiliary heat-conducting sheet 2126 can be welded and fixed to the heat-conducting plate 2122 and / or the heating element 2124, or it can be riveted and fixed by rivets 2127, but is not limited to these methods.

[0052] As described above, the first heating zone 2124a of the heating element 2124 is thermally connected to the heat-conducting part 2126b of the auxiliary heat-conducting plate 2126. Since the heat-conducting part 2126b is provided with heat dissipation holes 21260, a portion of the heat in the first heating zone 2124a can be dissipated through the heat dissipation holes 21260, while the remaining heat can be quickly transferred laterally to the main body 2126a through the heat-conducting part 2126b, so that the heat is evenly diffused laterally on the auxiliary heat-conducting plate 2126 to achieve the effect of uniform heating. Then, it is transferred to the plate 2120 through the heat-conducting plate 2122, so that the plate 2120 is heated more evenly and dispersed, thereby reducing the risk of burning.

[0053] In one embodiment, the heat-conducting plate 2122 has a groove 21220 on its surface facing away from the disk body 2120. The depth of the groove 21220 is less than the thickness of the heat-conducting plate 2122, and it does not extend to the outer edge of the heat-conducting plate 2122. The groove edge distance is D. An auxiliary heat-conducting sheet 2126 is housed within the groove 21220. That is, the groove 21220 does not extend through the thickness direction of the heat-conducting plate 2122, and in the orthographic projection formed along the thickness direction of the heat-conducting plate 2122, the outer contour line of the heat-conducting plate 2122 is located outside the contour line of the groove 21220, and the two do not intersect. The auxiliary heat-conducting sheet 2126 can also be relatively fixed to the heat-conducting plate 2122 by press-fitting. Thus, the groove 21220 provides installation space for the auxiliary heat-conducting sheet 2126, making the assembly of the heat-conducting plate 2122 and the auxiliary heat-conducting sheet 2126 more compact.

[0054] Please refer to Figure 6 and Figure 7 , Figure 6 This is an exploded view of the heating plate 212. Figure 7 This is a bottom view of the heating plate 212.

[0055] In one embodiment, the heat-conducting portion 2126b includes a plurality of heat-conducting pins 21261 extending from the outer edge of the main body portion 2126a, and the gap between two adjacent heat-conducting pins 21261 forms the heat dissipation hole 21260. This configuration creates a toothed structure at the outer edge of the heat-conducting portion 2126b, reducing the contact area between the heat-conducting portion 2126b and the first heat-generating area 2124a, allowing heat to be dissipated through the heat dissipation hole 21260. The formation of the heat dissipation hole 21260 is simple and easy to implement.

[0056] In one embodiment, such as Figure 7As shown, the heating element 2124 is generally annular in shape with a trapezoidal cross-section. In the orthographic projection along the thickness direction of the disk 2120, the projection of the outer contour line of the main body 2126a is closer to the center of the disk 2120 than the projection of the inner contour line of the heating element 2124. With this configuration, the main body 2126a does not contact the heating element 2124, and the auxiliary heat-conducting plate 2126 is only thermally connected to the first heating zone 2124a of the heating element 2124 through the heat-conducting part 2126b, thereby effectively dispersing the heat of the first heating zone 2124a.

[0057] exist Figure 7 In the illustrated embodiment, the orthographic projection of the heating element 2124 is an annular shape, the orthographic projection of the main body 2126a is an annular shape, the minimum diameter of the inner contour surface of the heating element 2124 is S2, the diameter of the main body 2126a is S1, and S2 > S1. It should be noted that the orthographic projection of the main body 2126a can also be a circle without a central hole or a cutting hole.

[0058] exist Figure 7 In the illustrated embodiment, in the orthographic projection along the thickness direction of the disk body 2120, the projection of the root of each heat-conducting pin 21261 is closer to the center of the disk body 2120 than the projection of the heating element 2124. With this configuration, when the auxiliary heat-conducting sheet 2126 is welded to the heating element 2124, the high thermal conductivity of the auxiliary heat-conducting sheet 2126 allows for the instantaneous generation of a large amount of heat. While reducing the size of the main body 2126a, the radial length of the heat-conducting pins 21261 can be appropriately extended, reducing the contact area between the heat-conducting pins 21261 and the heat-conducting plate 2122. This avoids transferring excessive heat to the heat-conducting plate 2122 and reduces the risk of the heat-conducting plate 2122 melting.

[0059] Please refer to Figure 8 , Figure 8 The front view of the auxiliary heat-conducting plate 2126.

[0060] The shape of the thermally conductive pin 21261 includes, but is not limited to, rectangles, triangles, trapezoids, etc. Figure 8In the illustrated embodiment, the heat-conducting pins 21261 are rectangular. Multiple heat-conducting pins 21261 are distributed corresponding to the first heating area 2124a and are arranged around the center of the disk body 2120. The two heat-conducting pins 21261 located at the outermost edges are spaced at an angle α, where 30° ≤ α ≤ 180°. For example, α can be 30°, 40°, 50°, 60°, 70°, 80°, 90°, 100°, 110°, 120°, 130°, 140°, 150°, 160°, 170°, or 180°, but is not limited to these. Within this angle range, heat can be transferred more effectively through the heat-conducting pins 21261, and some heat can be effectively dissipated through the heat dissipation holes 21260, resulting in more even heating of the disk body 2120. The multiple heat-conducting pins 21261 can be arranged in parallel or at certain angular intervals with the center of the disk body 2120 as the center.

[0061] exist Figure 8 In the illustrated embodiment, multiple heat-conducting pins 21261 are arranged in parallel, with uniform spacing between each pin. Exemplarily, the width of each heat-conducting pin 21261 is L1, where 3mm ≤ L1 ≤ 10mm. For example, L1 can be 3mm, 4mm, 5mm, 6mm, 7mm, 8mm, 9mm, or 10mm, but is not limited to these. The distance between two adjacent heat-conducting pins 21261 is L2, where 2mm ≤ L2 ≤ 5mm. For example, L2 can be 2mm, 3mm, 4mm, or 5mm, but is not limited to these.

[0062] Please refer to Figure 8 and Figure 9 , Figure 9 This is the front view of the heating element 2124.

[0063] The first heating zone 2124a includes a central heating zone 2124aa located in the middle and edge heating zones 2124ab located on both sides of the central heating zone 2124aa. The edge heating zones 2124ab on both sides are close to the second heating zone 2124b. The heat generated by the edge heating zones 2124ab is less than that of the central heating zone 2124aa, but greater than that of the second heating zone 2124b.

[0064] In one embodiment, a plurality of thermally conductive pins 21261 are grouped together, corresponding to the intermediate heating region 2124aa and the edge heating region 2124ab, respectively. The number of thermally conductive pins 21261 corresponding to the intermediate heating region 2124aa is greater than the number of thermally conductive pins 21261 corresponding to any one of the edge heating regions 2124ab. That is, by providing a larger number of thermally conductive pins 21261 in the higher heating regions, the number of heat dissipation pores can be increased accordingly, resulting in a more even distribution of heat between the intermediate heating region 2124aa and the edge heating region 2124ab.

[0065] In one embodiment, there are multiple heat-conducting pins 21261 corresponding to the edge heating area 2124ab, arranged around the center of the disk body 2120. Among any plurality of heat-conducting pins 21261 corresponding to the edge heating area 2124ab, the two heat-conducting pins 21261 located at the outermost edge are spaced apart by an angle β, where 0°≤β≤90°. For example, β can be 30°, 40°, 50°, 60°, 70°, 80°, or 90°, but is not limited to these. In this way, an appropriate number of heat-conducting pins 21261 can be set within this angle range to ensure that the heat transferred from the edge heating area 2124ab to the disk body 2120 is more even.

[0066] For example, two sets of heat-conducting pins 21261, which correspond one-to-one with the two edge heating areas 2124ab, are symmetrically arranged on both sides of the middle heating area 2124aa to ensure more balanced heat transfer.

[0067] Please refer to Figure 10 , Figure 10 A schematic diagram showing the auxiliary heat-conducting plate 2126 installed in the groove of the heat-conducting plate 2122.

[0068] In one embodiment, the distance D between the groove 21220 and the outer edge of the heat-conducting plate 2122 is 0.3mm ≤ D ≤ 5mm. D can be 0.3mm, 0.5mm, 1mm, 1.5mm, 2mm, 2.5mm, 3mm, 3.5mm, 4mm, 4.5mm, or 5mm, but is not limited to these values. This allows the auxiliary heat-conducting sheet 2126 to be completely contained within the groove 21220, and its outer contour dimensions will not exceed the heat-conducting plate 2122. The auxiliary heat-conducting sheet 2126 can be fixed in the groove 21220 by press-fitting. After press-fitting, the auxiliary heat-conducting sheet 2126 extends and deforms, remaining fixed within the groove 21220. Alternatively, it can be press-fitted and then riveted for a more reliable fixing method. For example, D can be set to 5mm, which is about half the width of the heating element 2124. This allows the auxiliary heat-conducting plate 2126 to be closer to the center of the plate 2120, resulting in better heat transfer.

[0069] The auxiliary heat-conducting sheet 2126 is a copper heat-conducting sheet with a thickness of 0.1–2 mm or 0.3–0.5 mm. For example, the thickness of the auxiliary heat-conducting sheet 2126 can be 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, or 1 mm, but is not limited to these. Alternatively, the thickness of the auxiliary heat-conducting sheet 2126 can be 0.3 mm, 0.4 mm, or 0.5 mm, but is not limited to these. Of course, the auxiliary heat-conducting sheet 2126 is not limited to copper; it can also be made of other materials with a thermal conductivity greater than that of the heat-conducting plate 2122.

[0070] Please refer to Figure 11 and Figure 12 , Figure 11 A schematic diagram of another embodiment of the auxiliary heat-conducting sheet 2126. Figure 12 This is a schematic diagram of another embodiment of the auxiliary heat-conducting sheet 2126.

[0071] exist Figure 11 In the embodiment shown, the heat-conducting pin 21261 can be configured as a triangular structure, which can ensure a larger heat dissipation hole 21260 and better heat dissipation effect.

[0072] exist Figure 12 In the example shown, the heat-conducting part 2126b includes a perforated part 21264 extending along the thickness direction, which forms the heat dissipation hole 21260. The perforated part 21264 can be circular, but is not limited to this. The perforated part 21264 has a simple structure and is easy to process and manufacture.

[0073] exist Figure 11 and Figure 12 In the embodiment shown, a through hole 21265 is provided at the center of the auxiliary heat-conducting plate 2126, through which the stirring blade 26 passes. A plurality of riveting holes 21266 are provided in the annular area surrounding the through hole 21265 on the auxiliary heat-conducting plate 2126, through which rivets 2127 pass for riveting with the heat-conducting plate 2122.

[0074] exist Figure 11 and Figure 12 In the illustrated embodiment, the heat-conducting portion 2126b is connected to the outer edge of the main body 2126a and is disposed around the center of the disk 2120. The auxiliary heat-conducting sheet 2126 contacts the first heating zone 2124a through the heat-conducting portion 2126b, achieving heat transfer. Furthermore, the heat-conducting portion 2126b is disposed around the center of the disk 2120, thus extending along the disk 2120 and reducing heat loss during the transfer process.

[0075] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A heating plate, characterized in that, include: The plate body (2120) includes a food contact surface (2120a) for contacting food ingredients; A heat-conducting plate (2122) is disposed on the side of the plate body (2120) facing away from the food contact surface (2120a); The heating element (2124) generates heat when energized. The heating element (2124) is located on the side of the heat-conducting plate (2122) facing away from the disk body (2120). The heating element (2124) includes a first heating area (2124a) and a second heating area (2124b). The heat generation of the first heating area (2124a) is greater than that of the second heating area (2124b). An auxiliary heat-conducting sheet (2126) is disposed between the heat-conducting plate and the heating element, and has a thermal conductivity greater than that of the heat-conducting plate (2122). The auxiliary heat-conducting sheet (2126) includes a main body (2126a) disposed corresponding to the central region of the disk (2120) and a heat-conducting part (2126b) extending outward from the main body (2126a). The heat-conducting part (2126b) is disposed corresponding to the first heating area (2124a) and has heat dissipation holes (21260). In the orthographic projection formed along the thickness direction of the disk (2120), the projection of the main body (2126a) is located within the projection of the heating element (2124).

2. The heating plate according to claim 1, characterized in that, The heat-conducting part (2126b) includes a plurality of heat-conducting pins (21261) extending from the outer edge of the main body part (2126a), and the gap between two adjacent heat-conducting pins (21261) forms the heat dissipation hole (21260).

3. The heating plate according to claim 2, characterized in that, Multiple heat-conducting pins (21261) are arranged corresponding to the first heating area (2124a) and are arranged around the center of the disk body (2120). The two heat-conducting pins (21261) located at the outermost edge are spaced apart by an angle α, where 30°≤α≤180°.

4. The heating plate according to claim 3, characterized in that, The first heating area (2124a) includes a central heating area (2124aa) located in the middle and edge heating areas (2124ab) located on both sides of the central heating area (2124aa). A plurality of heat-conducting pins (21261) are arranged in groups, respectively corresponding to the central heating area (2124aa) and the edge heating areas (2124ab) on both sides. The number of heat-conducting pins (21261) corresponding to the central heating area (2124aa) is greater than the number of heat-conducting pins (21261) corresponding to any one of the edge heating areas (2124ab).

5. The heating plate according to claim 4, characterized in that, Multiple heat-conducting pins (21261) are provided corresponding to any one of the edge heating areas (2124ab), and they are all arranged around the center of the disk body (2120). Among the multiple heat-conducting pins corresponding to any one of the edge heating areas (2124ab), the two heat-conducting pins (21261) located at the outermost edge are spaced apart by an angle β, where 0°≤β≤90°; and / or Two sets of heat-conducting pins (21261) are arranged symmetrically on both sides of the middle heating area (2124aa), corresponding one-to-one with the two edge heating areas (2124ab).

6. The heating plate according to claim 2, characterized in that, In the orthographic projection formed along the thickness direction of the disk body (2120), the projection of the root of each of the heat-conducting pins (21261) is closer to the center of the disk body (2120) than the projection of the heating element (2124).

7. The heating plate according to claim 2, characterized in that, The width of the heat-conducting pin (21261) is L1, where 3mm ≤ L1 ≤ 10mm; and / or The distance between two adjacent heat-conducting pins (21261) is L2, where 2mm≤L2≤5mm.

8. The heating plate according to claim 1, characterized in that, The heat-conducting part (2126b) includes a hollow part (21264) extending through the thickness direction, and the hollow part (21264) forms the heat dissipation hole (21260).

9. The heating plate according to claim 8, characterized in that, The heat-conducting part (2126b) is arranged around the center of the disk body (2120).

10. The heating plate according to any one of claims 1 to 9, characterized in that, The auxiliary heat-conducting sheet (2126) is a copper heat-conducting sheet with a thickness of 0.1-2 mm or 0.3-0.5 mm.

11. The heating plate according to claim 10, characterized in that, In the orthographic projection formed along the thickness direction of the disk (2120), the projection of the outer contour line of the main body (2126a) is closer to the center of the disk (2120) than the projection of the inner contour line of the heating element (2124); and or, the orthographic projection of the heating element (2124) is annular, and the orthographic projection of the main body (2126a) is annular or circular.

12. The heating plate according to any one of claims 1 to 9, characterized in that, The heat-conducting plate (2122) has a groove (21220) on the side surface facing away from the disk body (2120), and the auxiliary heat-conducting sheet (2126) is disposed in the groove (21220).

13. The heating plate according to claim 12, characterized in that, The distance between the groove (21220) and the outer edge of the heat-conducting plate (2122) is D, where 0.3mm≤D≤5mm.

14. A food processor, characterized in that, include: Host (10); A cup assembly (20) is assembled to the host (10), the cup assembly (20) including a cup body (21) having a cup cavity (200) and the cup body (21) including a heating plate (212) as claimed in any one of claims 1 to 13.

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