A wax structure on a semiconductor wafer

Abstract

The utility model discloses a semiconductor wafer waxing structure, including waxing machine body, wax feeding mechanism, hot pressing mechanism and brush sweeping mechanism, the top of waxing machine body is provided with operation mouth, is provided with rotating work position table in operation mouth, and the wax feeding mechanism sets up in the top of waxing machine body and is located one side at operation mouth, and the wax feeding mechanism is used to drop wax to rotating work position table, hot pressing mechanism sets up in operation mouth, brush sweeping mechanism is suspended in the top of operation mouth, and brush sweeping mechanism includes connecting piece and brush sweeping part, and the inner wall of connecting piece and operation mouth top end is detachably fixed, and brush sweeping part sets up in the bottom of connecting piece. The utility model discloses the setting of brush sweeping mechanism makes before loading, can utilize brush sweeping mechanism and carry out the brush sweeping of rotating work position table, under such operation, rotating work position table can guarantee that there is no wax liquid's residue when loading, and then will not influence the subsequent waxing process, makes the waxing of wafer surface more uniform.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing equipment, and in particular to a waxing structure for semiconductor wafers. Background Technology

[0002] Waxing semiconductor wafers is a key process before wafer thinning, grinding and other processes. By coating hot melt wax onto a ceramic disk, the wafer is temporarily fixed to ensure the flatness and stability of the wafer in subsequent processing.

[0003] An existing semi-automatic wafer waxing machine requires manual placement of the wafer in the loading area during the semiconductor wafer waxing operation. The wafer is then sequentially transferred to the waxing area, hot-pressing area, and unloading area via a rotary station before returning to the new loading area. Since the waxing is applied to the wafer surface using a hot-pressing method, some wax inevitably remains at the rotary station. If this wax is not removed during the new loading process, it will affect the thickness of the next waxing. Therefore, this solution proposes a semiconductor wafer waxing structure to address the aforementioned problems. Utility Model Content

[0004] The purpose of this invention is to provide a semiconductor wafer waxing structure to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor wafer waxing structure, comprising a waxing machine body, an operation port on the top of the waxing machine body, a rotary worktable disposed within the operation port, and further comprising:

[0006] A waxing mechanism is located on the top of the waxing machine body and on one side of the operating port. The waxing mechanism is used to drip wax onto the rotating worktable.

[0007] A hot pressing mechanism is disposed inside the operating port and is used for hot pressing and spreading of wax liquid on the top of the wafer.

[0008] A brushing mechanism is suspended at the top of the operating port. The brushing mechanism includes a connector and a brushing component. The connector is detachably fixed to the inner wall at the top of the operating port. The brushing component is located at the bottom of the connector and is used for brushing the rotating worktable.

[0009] Preferably, the rotary worktable has a bearing groove inside, which is used to fill the wafer, and the discharge end of the wax feeding mechanism is aligned with the bearing groove.

[0010] Preferably, the waxing mechanism includes:

[0011] L-shaped connecting bracket, one end of which is detachably fixed to the side wall of the top of the waxing machine body;

[0012] A wax supply tank is located at the other end of an L-shaped connecting frame, and the discharge end of the wax supply tank passes through the bottom end of the L-shaped connecting frame.

[0013] The feed pipe has one end connected to the discharge end of the wax tank, and the other end is suspended directly above the bearing trough.

[0014] Preferably, the hot pressing mechanism includes:

[0015] A vertically moving module, which is fixedly connected to the inner wall on the back of the operating port in a vertical direction;

[0016] Connecting seat, the connecting seat being drively connected to the output end of the vertical moving module;

[0017] A hot-pressing component is disposed at the end of the connecting seat away from the vertically moving module.

[0018] Preferably, the hot-pressing component includes:

[0019] A downward pressing cylinder is located at the end of the connecting seat away from the vertical moving module, and the output end of the downward pressing cylinder is vertically downward.

[0020] A hot press plate, which is fixedly connected to the output end of the pressure cylinder.

[0021] Preferably, the connector includes:

[0022] A carrying tube, the top end of which is fixedly connected to a connecting plate, the connecting plate being detachably connected to the inner wall at the top of the operating port;

[0023] An extension rod, one end of which is inserted and connected to the bottom of a support tube, has a storage groove at the bottom for connecting a brush.

[0024] Preferably, the inner wall of the bearing tube is provided with a traction spring, the two ends of the traction spring are fixedly connected to the inner wall of the top end of the bearing tube and the top end of the extension rod, respectively, and the top end of the extension rod is provided with a blocking ring, which is slidably inserted into the bearing tube.

[0025] Preferably, the brush component includes:

[0026] A brush sweeping motor is installed in a storage slot, and the output end of the brush sweeping motor is vertically downward and extends through the bottom end of the extension rod.

[0027] A brush and sweeping disc is fixedly connected to the output end of a brush and sweeping motor, and multiple sets of bristles are provided at the bottom end of the brush and sweeping disc.

[0028] Preferably, a battery is provided on the top inner wall of the storage slot, and a push switch is provided at the bottom of the extension rod and through the storage slot. The power terminal of the push switch, the battery output terminal, and the control terminal of the brush motor are connected in series.

[0029] The technical effects and advantages of this utility model are as follows:

[0030] This invention incorporates a brushing mechanism. By setting up the brushing mechanism, the rotating worktable can be brushed before material loading. Under this operation, the rotating worktable can be guaranteed to be free of wax residue during material loading, thus not affecting the subsequent waxing process and making the waxing on the wafer surface more uniform. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0032] Figure 2 This is a side view of the overall structure of this utility model.

[0033] Figure 3 This is a front view of the overall structure of this utility model.

[0034] Figure 4 This is a schematic diagram of the brushing mechanism of this utility model.

[0035] Figure 5 This is a cross-sectional view of the connector of this utility model.

[0036] In the diagram: 1. Waxing machine body; 2. Rotary worktable; 201. Bearing groove; 3. L-shaped connecting frame; 301. Wax tank; 302. Feeding pipe; 4. Vertical moving module; 401. Connecting seat; 402. Pressing cylinder; 403. Hot press plate; 5. Bearing pipe; 501. Connecting plate; 502. Traction spring; 6. Extension rod; 601. Blocking ring; 602. Battery; 603. Brush motor; 604. Press switch; 7. Brush plate; 701. Brush bristles. Detailed Implementation

[0037] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0038] refer to Figure 1 - Figure 5 As shown;

[0039] In embodiment one, the present invention provides a semiconductor wafer waxing structure, including a waxing machine body 1, an operation port on the top of the waxing machine body 1, a rotating worktable 2 inside the operation port, and a carrying groove 201 inside the rotating worktable 2 for loading wafers.

[0040] It should be noted that a rotary motor is installed at the bottom of the waxing machine body 1. The output end of the rotary motor extends through to the bottom of the operating port, and the output end of the rotary motor is connected to the top of the rotary worktable 2 for transmission, thereby driving the rotary worktable 2 to rotate. In this design, a total of four sets of bearing grooves 201 are set, corresponding to four processing stations: the material loading station, the waxing station, the hot pressing and spreading station, and the material unloading station. Therefore, the rotary motor driving the rotary worktable 2 needs to stop four times within one rotation cycle, that is, to perform four intermittent one-cycle rotations.

[0041] In embodiment two, the present invention provides a waxing mechanism, which is applied to a semiconductor wafer waxing structure in embodiment one. The waxing mechanism is set on the top of the waxing machine body 1 and located on one side of the operation port. The waxing mechanism is used to drip wax onto the rotating worktable 2. The discharge end of the waxing mechanism is aligned with the bearing groove 201.

[0042] Specifically, waxing services include:

[0043] L-shaped connecting bracket 3, one end of which is detachably fixed to the side wall of the top of the waxing machine body 1;

[0044] A wax tank 301 is located at the other end of an L-shaped connecting frame 3, and the discharge end of the wax tank 301 passes through the bottom end of the L-shaped connecting frame 3.

[0045] Feed pipe 302, one end of which is connected to the discharge end of wax tank 301, and the other end of which is suspended directly above the bearing trough 201.

[0046] It should be noted that the wax tank 301 can be fed by air pressure. By pressing the air inlet down to a certain depth on the inner wall of the wax tank 301, a fixed volume of wax is provided. During this operation, it is necessary to ensure that the wax is kept at a constant temperature and remains in a liquid state. In the actual setup, a photoelectric sensor is installed on the inner wall at the top of the operating port, at the position where the feeding pipe 302 discharges. After the wafer is shielded from light, the photoelectric sensor sends a start signal to the discharge control of the wax tank 301, and the wax tank 301 begins a fixed-volume wax feeding operation.

[0047] Example 3: This utility model provides a hot pressing mechanism, which is applied to a semiconductor wafer waxing structure in Example 1. The hot pressing mechanism is set in the operating port and is used for hot pressing and spreading of wax liquid on the top of the wafer.

[0048] Specifically, the hot pressing mechanism includes:

[0049] Vertical moving module 4 is fixedly connected to the inner wall on the back of the operating port in the vertical direction;

[0050] The connecting seat 401 is connected to the output end of the vertical moving module 4. Through the transmission of the output end of the vertical moving module 4, the connecting seat 401 is driven to move in the vertical direction.

[0051] A hot-pressing component is located at the end of the connecting seat 401 away from the vertically moving module 4.

[0052] Furthermore, the hot-pressed component includes:

[0053] The downward pressure cylinder 402 is located at the end of the connecting seat 401 away from the vertical moving module 4, and the output end of the downward pressure cylinder 402 is vertically downward.

[0054] The hot press plate 403 is fixedly connected to the output end of the pressing cylinder 402. The hot press plate 403 is suspended above the bearing groove 201 and concentric with the bearing groove 201. In the actual setting operation, the hot press plate 403 can be heated by a heating structure to maintain constant temperature. This heat is sufficient to keep the wax liquid in a liquid state. In this way, the wax liquid can be spread on the surface of the wafer by hot pressing.

[0055] In Embodiment 4, this utility model provides a brushing mechanism, which is applied to a semiconductor wafer waxing structure in Embodiment 1. The brushing mechanism is suspended at the top of the operating port. The brushing mechanism includes a connector and a brushing component. The connector is detachably fixed to the inner wall at the top of the operating port. The brushing component is located at the bottom of the connector and is used for brushing the rotating worktable 2.

[0056] Specifically, the connectors include:

[0057] The top end of the bearing tube 5 is fixedly connected to the connecting plate 501, and the connecting plate 501 is detachably connected to the inner wall of the top end of the operating port.

[0058] Extension rod 6, one end of which is inserted and connected to the bottom of the support tube 5. The bottom of extension rod 6 is provided with a storage groove for connecting the brush.

[0059] Furthermore, a traction spring 502 is provided on the inner wall of the bearing tube 5. The two ends of the traction spring 502 are fixedly connected to the inner wall of the top end of the bearing tube 5 and the top end of the extension rod 6, respectively. A blocking ring 601 is sleeved on the top of the extension rod 6, and the blocking ring 601 is slidably inserted into the bearing tube 5.

[0060] It should be noted that the inner diameter of the bottom opening of the bearing tube 5 is the same as the outer diameter of the extension rod 6, while the inner diameter of the bearing tube 5 is the same as the outer diameter of the blocking ring 601. The extension rod 6 is lifted upward by the traction spring 502.

[0061] Specifically, the scanning items include:

[0062] The brush motor 603 is installed in the storage slot, and the output end of the brush motor 603 is vertically downward and extends through the bottom end of the extension rod 6.

[0063] The brushing disc 7 is fixedly connected to the output end of the brushing motor 603, and the bottom end of the brushing disc 7 is provided with multiple sets of bristles 701.

[0064] Furthermore, a battery 602 is installed on the top inner wall of the storage slot, and a push switch 604 is installed at the bottom of the extension rod 6 and through the storage slot. The power terminal of the push switch 604, the output terminal of the battery 602, and the control terminal of the brush motor 603 are connected in series.

[0065] It should be noted that with the power terminal of the push switch 604, the output terminal of the battery 602, and the control terminal of the brush motor 603 connected in series, when the push switch 604 is pressed down, the push switch 604, the battery 602, and the brush motor 603 are in a closed circuit state. At this time, the battery 602 supplies power to the brush motor 603, and the brush motor 603 starts to output. Therefore, when the push switch 604 is pressed down, the brush motor 603 continues to rotate and drives the brush disk 7 and the bristles 701 to rotate through the output terminal.

[0066] During the actual operation of brushing the carrier groove 201, first grasp the bottom of the extension rod 6, place your finger on the press switch 604, and pull down the extension rod 6. At this time, the extension rod 6 drives the brush motor 603 and the brush disk 7 to move down, and pulls the traction spring 502 to put it in a stretched state. Continue to pull down the extension rod 6 until the brush bristles 701 cover the carrier groove 201. Then, press down the press switch 604. At this time, the brush motor 603 starts and drives the brush disk 7 and the brush bristles 701 to rotate and brush the carrier groove 201.

[0067] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A semiconductor wafer waxing structure, comprising a waxing machine body (1), wherein the top of the waxing machine body (1) is provided with an operating port, and a rotary worktable (2) is provided inside the operating port, characterized in that, Also includes: Waxing mechanism, which is located on the top of the waxing machine body (1) and on one side of the operating port, is used to drip wax onto the rotating worktable (2); A hot pressing mechanism is disposed inside the operating port and is used for hot pressing and spreading of wax liquid on the top of the wafer. The brushing mechanism is suspended at the top of the operating port. The brushing mechanism includes a connector and a brushing component. The connector is detachably fixed to the inner wall at the top of the operating port. The brushing component is located at the bottom of the connector and is used for brushing the rotating worktable (2).

2. The semiconductor wafer waxing structure according to claim 1, characterized in that, The rotating worktable (2) is provided with a bearing groove (201) inside. The bearing groove (201) is used to fill the wafer. The discharge end of the wax feeding mechanism is aligned with the bearing groove (201).

3. The semiconductor wafer waxing structure according to claim 2, characterized in that, The waxing mechanism includes: L-shaped connecting frame (3), one end of which is detachably fixed to the side wall of the top of the waxing machine body (1); Wax tank (301), the wax tank (301) is set at the other end of the L-shaped connecting frame (3), and the discharge end of the wax tank (301) passes through the bottom end of the L-shaped connecting frame (3); Feed pipe (302), one end of which is connected to the discharge end of wax tank (301), and the other end of which is suspended directly above the bearing trough (201).

4. The semiconductor wafer waxing structure according to claim 1, characterized in that, The hot pressing mechanism includes: A vertical moving module (4) is fixedly connected to the inner wall on the back of the operating port in the vertical direction; Connecting seat (401), the connecting seat (401) is connected to the output end of the vertical moving module (4); A hot press component is disposed at one end of the connecting seat (401) away from the vertical moving module (4).

5. The semiconductor wafer waxing structure according to claim 4, characterized in that, The hot-pressing component includes: A downward pressing cylinder (402) is provided at one end of the connecting seat (401) away from the vertical moving module (4), and the output end of the downward pressing cylinder (402) is set vertically downward; Hot press plate (403), which is fixedly connected to the output end of the pressure cylinder (402).

6. The semiconductor wafer waxing structure according to claim 1, characterized in that, The connector includes: The top end of the support tube (5) is fixedly connected to a connecting plate (501), and the connecting plate (501) is detachably connected to the inner wall of the top end of the operating port. An extension rod (6) is provided, one end of which is inserted into the bottom of the support tube (5). A storage groove is provided at the bottom of the extension rod (6) for connecting the brush.

7. The semiconductor wafer waxing structure according to claim 6, characterized in that, The inner wall of the bearing tube (5) is provided with a traction spring (502). The two ends of the traction spring (502) are fixedly connected to the inner wall of the top of the bearing tube (5) and the top of the extension rod (6), respectively. The top of the extension rod (6) is fitted with a blocking ring (601), which is slidably inserted into the bearing tube (5).

8. The semiconductor wafer waxing structure according to claim 6, characterized in that, The brush / scanning component includes: A brush sweeping motor (603) is installed in a storage slot. The output end of the brush sweeping motor (603) is vertically downward and extends through the bottom end of the extension rod (6). The brushing disc (7) is fixedly connected to the output end of the brushing motor (603), and the bottom end of the brushing disc (7) is provided with multiple sets of bristles (701).

9. A semiconductor wafer waxing structure according to claim 8, characterized in that, A battery (602) is provided on the top inner wall of the storage slot, and a push switch (604) is provided at the bottom of the extension rod (6) and through the storage slot. The power terminal of the push switch (604), the output terminal of the battery (602) and the control terminal of the brush motor (603) are connected in series.

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