A machining waste chip processing device

By combining eddy current centrifugal separation and electrostatic separation technologies, the problem of poor separation effect of mixed waste debris in existing technologies has been solved. This has enabled efficient separation of metal and non-metal debris with similar density but different electrical properties, thereby improving separation purity and metal recovery rate.

CN224673223UActive Publication Date: 2026-08-25GUOWEI PRECISION MFG TECH (WUXI) CO LTD
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Patent Information

Application Number
CN202522104415.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-29
Publication Date
2026-08-25
Estimated Expiration
2035-09-29

AI Technical Summary

Technical Problem

Existing methods for separating mixed waste in machining processes are ineffective in separating metal and non-metal debris with similar densities but different electrical properties, resulting in impure sorting and low metal recovery rates.

Method used

Combining eddy current centrifugal separation and electrostatic separation technologies, two-stage separation is achieved by utilizing the differences in density and electrical properties of waste materials. Efficient separation is realized through eddy current wind-powered separation mechanism and electrostatic separation mechanism.

Benefits of technology

It significantly improves sorting purity and metal recovery rate, and is particularly suitable for separating materials with similar densities but different electrical properties.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a kind of waste chip processing devices for machining, it is related to mechanical processing production equipment technical field, including sorting cabin, vortex wind power separation mechanism, electrostatic sorting mechanism and scrap collecting mechanism.The upper portion of sorting cabin is cylindrical, and the top is provided with feed inlet.Vortex wind power separation mechanism forms vortex in cabin by tangential air inlet, flow guide column and air blower, and realizes waste chip pre-separation using centrifugal force.Electrostatic sorting mechanism forms radial electrostatic field between negative plate and positive plate arranged coaxially, and accurately separates conductive metal chip and insulating chip using electrical characteristic difference.Scrap collecting mechanism adopts concentric circle design, and collects metal chip and insulating chip respectively.The utility model is sorted by centrifugal and electrostatic compound, and significantly improves sorting efficiency and purity.
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Description

Technical Field

[0001] This utility model relates to the field of mechanical processing production equipment technology, and in particular to a waste chip treatment device for mechanical processing. Background Technology

[0002] In the field of machining, processes such as turning, milling, and grinding generate a large amount of mixed waste. This waste typically contains recyclable metallic materials (such as steel, iron, copper, and aluminum shavings) and non-recyclable insulating non-metallic materials (such as plastic sheaths, paint chips, and abrasive grinding wheels). Achieving efficient separation of metallic and non-metallic waste is crucial for resource recovery, reducing production costs, and minimizing the environmental impact of industrial waste.

[0003] Currently, the industry primarily uses magnetic separation or air separation methods for the preliminary treatment of mixed waste debris. Magnetic separation is effective in separating ferromagnetic metals, but ineffective for non-ferromagnetic metals (such as copper and aluminum). Air separation relies on the density and aerodynamic characteristics of the waste debris for separation, but it is ineffective for metal and non-metal debris with similar densities, easily leading to impurities and low metal recovery rates. Furthermore, existing sorting equipment often has a relatively simple structure and a single sorting process, making it difficult to handle mixed waste debris with complex compositions.

[0004] Therefore, there is an urgent need for a waste disposal device with a more advanced sorting principle, a more reasonable structural design, and the ability to efficiently separate conductive metals from non-metallic waste. Utility Model Content

[0005] Purpose of the invention: The purpose of this utility model is to provide a waste chip treatment device for machining, which combines eddy current centrifugal separation with electrostatic separation technology. It utilizes the density and electrical property differences of the waste chips for two-stage separation, overcoming the limitations of single separation methods. It is particularly suitable for separating materials with similar densities but different electrical properties, and the separation purity and metal recovery rate are much higher than those of traditional methods.

[0006] Technical solution:

[0007] A waste chip treatment device for machining includes a sorting chamber, a vortex air separation mechanism, an electrostatic sorting mechanism, and a chip collection mechanism.

[0008] The upper part of the sorting chamber is cylindrical, and a feed inlet is provided at the top;

[0009] The vortex air separation mechanism includes a tangential air inlet, a guide column, and a blower. The tangential air inlet is tangentially connected to the side wall of the upper part of the sorting chamber. The guide column is coaxially suspended in the center of the cylindrical cavity of the sorting chamber by a radial support rod. The blower is connected to the tangential air inlet.

[0010] The electrostatic sorting mechanism includes an electrostatic field formed by coaxial electrodes. The inner wall of the cylindrical cavity of the sorting chamber is provided with a negative electrode plate for adsorbing conductive metal debris. The outer surface of the guide column is provided with a positive electrode plate. The positive and negative electrode plates are respectively connected to the two poles of the power supply. A radially distributed electrostatic field is formed between the positive and negative electrode plates.

[0011] The chip collection mechanism includes an insulating chip collection chamber and a metal chip collection chamber. The insulating chip collection chamber is located below the positive electrode plate and is cylindrical. The metal chip collection chamber is located below the negative electrode plate and is coaxially sleeved outside the insulating chip collection chamber. An air outlet is also provided inside the insulating chip collection chamber, and a filter screen is provided at the air outlet.

[0012] Furthermore, the positive electrode plate is a honeycomb conductive plate with an integrated piezoelectric ceramic vibrating sheet.

[0013] Furthermore, the positive plate is connected to the positive terminal of the power supply via a lead wire, which passes through a hollow channel inside the radial support rod, which is made of insulating material.

[0014] Furthermore, the negative plate is connected to the negative terminal of the power supply and grounded.

[0015] Furthermore, the air outlet is connected to an induced draft fan, the air extraction rate of which is matched with the air blowing rate of the blower, and the induced draft fan and the blower work together to create a slight negative pressure in the insulating debris collection chamber.

[0016] Furthermore, the lower part of the sorting chamber is provided with a conical chip guide mechanism, which consists of at least three hinged door flaps connected to the bottom wall of the sorting chamber via rotating shafts and a drive assembly for controlling their rotation.

[0017] Furthermore, the drive assembly includes a control motor, a drive ring driven by the control motor, and a number of connecting rods equal to the number of valve flaps. The drive ring is rotatably disposed below the bottom of the sorting chamber. The drive ring is coaxial with the center of the conical chip guide mechanism and is located outside the conical chip guide mechanism. One end of the connecting rod is universally hinged to the drive ring, and the other end of the connecting rod is universally hinged to the lower surface of the corresponding valve flap.

[0018] Furthermore, the outer circumference of the drive ring is provided with external teeth, which mesh with a transmission gear, and the transmission gear is fixedly connected to the output shaft of the control motor.

[0019] Beneficial effects: By combining eddy current centrifugal separation with electrostatic separation technology, two-stage separation is carried out by utilizing the differences in density and electrical properties of waste materials. This overcomes the limitations of a single separation method and is particularly suitable for separating materials with similar densities but different electrical properties. The separation purity and metal recovery rate are much higher than those of traditional methods. Attached Figure Description

[0020] Figure 1 This is a three-dimensional representation of the present invention. Figure 1 ;

[0021] Figure 2 This is a three-dimensional representation of the present invention. Figure 2 ;

[0022] Figure 3 This is an enlarged view of the position of the conical chip guide mechanism of this utility model;

[0023] Figure 4 This is a cross-sectional structural diagram of the chip collection mechanism of this utility model. Detailed Implementation

[0024] To make the technical solution of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0025] like Figure 1-4 As shown, a waste chip treatment device for machining includes a sorting chamber 1, a vortex air separation mechanism 2, an electrostatic sorting mechanism 3, and a chip collection mechanism 4.

[0026] The upper part of the cavity of the sorting chamber 1 is cylindrical, and the top is provided with a feed inlet 11;

[0027] The vortex airflow separation mechanism 2 includes a tangential air inlet 21, a guide column 22, and a blower 23. The tangential air inlet 21 is tangentially connected to the upper side wall of the sorting chamber 1. The guide column 22 is coaxially suspended in the center of the cylindrical cavity of the sorting chamber 1 via a radial support rod 24. The blower 23 is connected to the tangential air inlet 21. The high-pressure airflow generated by the blower 23 enters the cylindrical chamber tangentially from the tangential air inlet 21, forming a high-speed rotating vortex field. Under the action of centrifugal force, the denser metal fragments are thrown towards the chamber wall, while the less dense insulating fragments are concentrated in the central area. The guide column 22 plays a role in rectifying and stabilizing the central airflow, preventing turbulence in the core area of ​​the vortex, and ensuring the separation effect.

[0028] The electrostatic sorting mechanism 3 includes an electrostatic field formed by coaxial electrodes. The cylindrical cavity inner wall of the sorting chamber 1 is provided with a negative electrode plate 31 for adsorbing conductive metal debris. The outer surface of the guide column 22 is provided with a positive electrode plate 32. The positive electrode plate 32 and the negative electrode plate 31 are respectively connected to the two poles of the power supply 33, forming a radially distributed electrostatic field between them. This structure forms a uniform radial electrostatic field similar to that of a coaxial cylindrical capacitor. When the pre-separated waste debris passes through the electric field, the conductive metal debris becomes charged due to electrostatic induction and is strongly adsorbed by the negative electrode plate 31 with the opposite charge; the insulating debris is unaffected by the electric field force and continues to move with the airflow. This design makes full use of the chamber space, provides a uniform electric field distribution, and achieves high sorting efficiency.

[0029] The chip collection mechanism 4 includes an insulating chip collection chamber 41 and a metal chip collection chamber 42. The insulating chip collection chamber 41 is located below the positive electrode plate 32 and is cylindrical. The metal chip collection chamber 42 is located below the negative electrode plate 31 and is coaxially sleeved outside the insulating chip collection chamber 41. An air outlet 411 is also provided inside the insulating chip collection chamber 41. The air outlet is equipped with a filter and adopts a concentric circular collection chamber design, perfectly conforming to the movement trajectory of the sorted waste chips. Metal chips fall naturally into the outer annular metal chip collection chamber 42 after detaching from the bulkhead; insulating chips fall directly into the central insulating chip collection chamber 41 from the central area. This structure achieves path separation of waste chips, avoiding secondary mixing. The filter of the air outlet 411 can effectively capture fine dust, ensuring that emissions meet standards.

[0030] Furthermore, the positive electrode plate 32 is a honeycomb conductive plate with an integrated piezoelectric ceramic vibrating sheet. The honeycomb structure greatly increases the electrode surface area and improves the adsorption efficiency. The integrated piezoelectric ceramic vibrating sheet can generate high-frequency micro-vibrations during sorting intervals or periodically, effectively removing residual debris adhering to the electrode surface, keeping the electrode clean, and ensuring the stability of the electrostatic field.

[0031] Furthermore, the positive electrode plate 32 is connected to the positive terminal of the power supply via a lead wire. This lead wire passes through a hollow channel inside the radial support rod 24, which is made of insulating material. This concealed wiring design completely encapsulates the high-voltage lead wire within the insulating support rod, ensuring electrical safety and avoiding potential mechanical damage from exposed wires. The insulating material of the support rod ensures reliable isolation between the central electrode and the grounding chamber.

[0032] Furthermore, the negative electrode plate 31 is connected to the negative terminal of the power supply and grounded. Grounding the bulkhead electrodes is an important safety measure to prevent the entire sorting chamber from becoming electrified, ensuring the safety of operators. At the same time, the grounding design also facilitates the timely release of static charge, maintaining a stable electric field.

[0033] Furthermore, the air outlet 411 is connected to an induced draft fan 5, the suction rate of which matches the blowing rate of the blower 23. The induced draft fan 5, in conjunction with the blower 23, creates a slight negative pressure within the insulation debris collection chamber 41. The induced draft fan 5 and the blower 23 constitute an air supply system, forming a stable and controllable airflow field within the device. The slight negative pressure formed at the inlet of the insulation debris collection chamber 41 promotes rapid settling of insulation debris, prevents lightweight debris from rising, and ensures that all airflow is ultimately purified by the filter before being discharged.

[0034] Furthermore, the lower part of the sorting chamber 1 is provided with a conical chip guiding mechanism 6. The conical chip guiding mechanism 6 consists of at least three hinged valve flaps 61 that are hinged to the bottom wall of the sorting chamber 1 via rotating shafts, and a drive assembly 62 that controls their rotation. This mechanism realizes the movable design of the guide surface. When the valve flaps 61 are closed, they form a complete conical guide surface for guiding insulating debris into the central insulating debris collection chamber. When open, they form a straight channel for easy collection of metal debris.

[0035] Furthermore, the drive assembly 62 includes a control motor 621, a drive ring 622 driven to rotate by the control motor 621, and connecting rods 623 in number equal to the number of valve flaps 61. The drive ring 622 is rotatably disposed below the bottom of the sorting chamber 1. The drive ring 622 is coaxial with the center of the conical chip guide mechanism 6 and is located outside the conical chip guide mechanism 6. One end of the connecting rod 623 is universally hinged to the drive ring 622, and the other end of the connecting rod 623 is universally hinged to the lower surface of the corresponding valve flap 61.

[0036] Furthermore, the outer periphery of the drive ring 622 is provided with external teeth 6221, which mesh with a transmission gear 624, and the transmission gear 624 is fixedly connected to the output shaft of the control motor 621.

[0037] A one-drive-multiple synchronous control mechanism is adopted. A single control motor 621 achieves synchronous opening and closing of all valve flaps 61 through a drive ring 622 and a linkage mechanism. The universal joint design can automatically compensate for spatial position changes caused by the rotation of the valve flaps, ensuring smooth and jam-free movement of the mechanism.

[0038] Working principle: Mixed waste enters the sorting chamber 1 through the feed inlet 11. The blower 23 injects high-speed airflow into the chamber through the tangential air inlet 21, forming a strong rotating vortex. Under the action of centrifugal force, metal debris is thrown against the chamber wall, while insulating debris is enriched in the central area, completing the primary separation based on density. Subsequently, the waste enters the radial electrostatic field formed by the positive electrode plate 32 and the negative electrode plate 31. Conductive metal debris is adsorbed onto the negative electrode plate 31 with the opposite charge, while insulating debris continues to fall unaffected (at this time, the valve 61 of the conical chip guiding mechanism 6 is closed under the action of the drive component 62, forming a conical guide surface, guiding the insulating debris into the central insulating debris collection chamber). The electrostatic sorting process achieves precise separation based on electrical properties. After sorting, the electrostatic power supply is cut off, and the metal debris adsorbed on the negative electrode plate 31 falls off under gravity (at this time, the valve 61 of the conical chip guide mechanism 6 is open). The metal debris slides along the bulkhead into the outer metal debris collection chamber 42. The induced draft fan 5 and the blower 23 work together to create a slight negative pressure at the inlet of the insulating debris collection chamber 41, promoting debris settling and preventing dust from being stirred up. Fine dust carried by the airflow is captured by the filter screen at the air outlet 411, and the purified air is discharged from the system.

[0039] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of this patent should be determined by the appended claims.

Claims

1. A waste chip treatment device for machining, characterized in that, It includes a sorting chamber (1), an vortex wind separation mechanism (2), an electrostatic sorting mechanism (3), and a chip collection mechanism (4); The upper part of the cavity of the sorting chamber (1) is cylindrical, and the top is provided with a feed inlet (11); The vortex wind separation mechanism (2) includes a tangential air inlet (21), a guide column (22), and a blower (23). The tangential air inlet (21) is tangentially connected to the side wall of the upper part of the sorting chamber (1). The guide column (22) is coaxially suspended in the center of the cylindrical cavity of the sorting chamber (1) by a radial support rod (24). The blower (23) is connected to the tangential air inlet (21). The electrostatic sorting mechanism (3) includes an electrostatic field formed by coaxial electrodes. The inner wall of the cylindrical cavity of the sorting chamber (1) is provided with a negative electrode plate (31) for adsorbing conductive metal debris. The outer surface of the guide column (22) is provided with a positive electrode plate (32). The positive electrode plate (32) and the negative electrode plate (31) are respectively connected to the two poles of the power supply (33). A radially distributed electrostatic field is formed between the positive electrode plate (32) and the negative electrode plate (31). The chip collection mechanism (4) includes an insulating chip collection chamber (41) and a metal chip collection chamber (42). The insulating chip collection chamber (41) is located below the positive electrode plate (32) and is cylindrical. The metal chip collection chamber (42) is located below the negative electrode plate (31) and is coaxially sleeved outside the insulating chip collection chamber (41). An air outlet (411) is also provided inside the insulating chip collection chamber (41) and a filter screen is provided at the air outlet.

2. The waste chip treatment device for machining according to claim 1, characterized in that, The positive electrode plate (32) is a honeycomb conductive plate with integrated piezoelectric ceramic vibrating sheet.

3. The waste chip treatment device for machining according to claim 1, characterized in that, The positive plate (32) is connected to the positive terminal of the power supply via a lead wire, which passes through the hollow channel inside the radial support rod (24), which is made of insulating material.

4. The waste chip treatment device for machining according to claim 1, characterized in that, The negative plate (31) is connected to the negative terminal of the power supply and grounded.

5. The waste chip treatment device for machining according to claim 1, characterized in that, The air outlet (411) is connected to an induced draft fan (5), the air extraction rate of the induced draft fan (5) is matched with the air blowing rate of the blower (23), and the induced draft fan (5) works with the blower (23) to form a slight negative pressure in the insulating debris collection chamber (41).

6. The waste chip treatment device for machining according to claim 1, characterized in that, The lower part of the sorting chamber (1) is provided with a conical chip guide mechanism (6), which consists of at least three hinged valve flaps (61) that are connected to the bottom wall of the sorting chamber (1) via a rotating shaft and a drive assembly (62) that controls their rotation.

7. A waste chip treatment device for machining according to claim 6, characterized in that, The drive assembly (62) includes a control motor (621), a drive ring (622) driven by the control motor (621) to rotate, and a number of connecting rods (623) the same as the valve flaps (61). The drive ring (622) is rotatably disposed below the bottom of the sorting chamber (1). The drive ring (622) is coaxial with the center of the conical chip guide mechanism (6). The drive ring (622) is located outside the conical chip guide mechanism (6). One end of the connecting rod (623) is universally hinged to the drive ring (622), and the other end of the connecting rod (623) is universally hinged to the lower surface of the corresponding valve flap (61).

8. The waste chip treatment device for machining according to claim 7, characterized in that, The outer periphery of the drive ring (622) is provided with external teeth (6221), which mesh with a transmission gear (624). The transmission gear (624) is fixedly connected to the output shaft of the control motor (621).