Vacuum brazing cold plate

Abstract

The utility model discloses a kind of vacuum brazing cold plates, it is related to brazing cold plate technical field, to solve the problem of avoiding solder and the contact of runner, to avoid the slag pollution and the problem of blocking runner after solder dissolving;The top surface of bottom plate is equipped with runner, and the first and last of runner are respectively equipped with the mouth of communicating with outside;Through the structural design of the device, by the baffle additionally arranged on runner top, solder does not contact runner, eliminates the risk of blocking tiny runner by solder accumulation in runner;Reduce the risk of forming excess after solder accumulation in runner in long-term vibration working condition use process;Avoid the contact of solder and fluid in runner to thereby pollute the phenomenon of fluid;There is no solder slag on runner wall surface, so that the inner wall smoothness of runner is improved, to reduce flow resistance.

Description

Technical Field

[0001] This utility model relates to the field of brazing cold plate technology, and in particular to a vacuum brazing cold plate. Background Technology

[0002] Brazed cold plates are widely used in the heat dissipation of electronic equipment. Currently, the main conventional structure of a brazed cold plate consists of a base plate, a cover plate, and solder brazed together and then machined. During assembly, solder is laid on the welding plane above the flow channel of the base plate, and then the cover plate is stacked on top of the solder. After vacuum brazing, the solder melts and then solidifies, welding the base plate and cover plate together. The fluid channel after welding is in direct contact with the solder, and solder slag will remain inside the channel. Under prolonged use or vibration, the solder residue in the flow channel will fall off, forming excess material. In the aerospace field, strict control of excess material in the flow channel is generally required. Excess material in the flow channel can contaminate other equipment in the system with the flow of liquid coolant, and in severe cases, it can damage micro-pumps and liquid cooling joints. For cold plates with small flow channels, the solder melts during brazing and flows into the channel. After the temperature drops, the solder solidifies in the channel, forming an accumulation, causing complete or partial blockage of the flow channel and affecting the normal use of the product. Therefore, in applications requiring high reliability, due to solder contamination and clogging issues, vacuum brazing is often ruled out in favor of the more expensive pressure diffusion welding process. This limits the application of vacuum brazed cold plates in high-reliability applications.

[0003] Therefore, this application provides a vacuum brazed cold plate to meet the requirements. Utility Model Content

[0004] The purpose of this application is to provide a vacuum brazing cold plate, which aims to solve the problem of avoiding contact between the solder and the flow channel, thereby avoiding the contamination and blockage of the flow channel by the solder slag after melting.

[0005] To achieve the above objectives, this application provides the following technical solution: a vacuum brazing cold plate, comprising a base plate, solder, and a cover plate, characterized in that: the top surface of the base plate is provided with a flow channel, and the beginning and end of the flow channel are respectively provided with openings connecting to the outside; A baffle is provided between the base plate and the solder, and the position and size of the baffle correspond to those of the flow channel.

[0006] Preferably, the flow channel is serpentine or other irregular in shape, and the width of the flow channel is within 25 mm.

[0007] Preferably, the cross-sectional shape of the flow channel is T-shaped.

[0008] Preferably, when the cross-sectional width of the flow channel does not exceed 3.5 mm, the baffle cross-section is circular, and the depth of the flow channel is more than twice the diameter of the baffle.

[0009] Preferably, when the cross-sectional width of the flow channel exceeds 3.5 mm, the cross-section of the baffle is rectangular.

[0010] Preferably, the diameter of the baffle does not exceed 1 / 4 of the channel depth, and the width of the baffle is the width of the channel + 2mm.

[0011] Preferably, the four corners of the baffle are chamfered with a diameter of C0.1-0.3mm.

[0012] In summary, the technical effects and advantages of this utility model are as follows: This invention, through its structural design, uses a baffle plate added above the flow channel to prevent the solder from contacting the flow channel, thus eliminating the risk of solder accumulation clogging the micro-flow channel; it also reduces the risk of solder falling off and forming excess material during long-term vibration operation after accumulation in the flow channel; it avoids the phenomenon of solder contacting the fluid in the flow channel and thus contaminating the fluid; and the absence of solder slag on the flow channel wall improves the smoothness of the inner wall of the flow channel, thereby reducing flow resistance.

[0013] In this invention, the flow channel is changed from the original "I"-shaped planar weld to a "T"-shaped weld, which increases the welding width. Due to the presence of rounded or chamfered corners, triangular weld corners are formed at the intersection of horizontal and vertical welds, making the weld more reliable and secure, and improving its reliability. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of the present invention; Figure 2 This is a schematic diagram of the base plate structure of Embodiment 1 of this utility model; Figure 3 This is a schematic diagram of the baffle structure of Embodiment 1 of this utility model; Figure 4 This is a schematic diagram of the base plate structure of Embodiment 2 of this utility model; Figure 5 This is a partial explosion structure diagram of Embodiment 2 of this utility model.

[0016] In the diagram: 1. Base plate; 2. Flow channel; 3. Through port; 4. Baffle; 5. Solder; 6. Cover plate. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] Example 1: Reference Figure 1-3 The vacuum brazing cold plate shown includes a base plate 1, a flow channel 2, a through-hole 3, a baffle 4, a solder 5, and a cover plate 6. The top surface of the base plate 1 is milled to provide a reference surface for the formation of the flow channel 2, and the bottom surface of the cover plate 6 is polished to ensure the welding seal when it is in contact with the solder 5. The flow channel 2 adopts a serpentine layout with a T-shaped cross-section. Specifically, it is divided into two flow channel 2 units with different widths. In this embodiment, when the cross-sectional width of the flow channel 2 exceeds 3.5mm, the cross-section of the baffle 4 in this embodiment is a rectangular structure, and the diameter of the baffle 4 does not exceed 1 / 4 of the depth of the flow channel 2. The width of the baffle 4 is the cross-sectional width of the flow channel 2 + 2mm, ensuring that its shape can completely cover the shape of the flow channel 2, forming an isolation and blocking the direct contact between the solder 5 and the flow channel 2. Openings 3 are made at the beginning and end of flow channel 2 for connecting to external coolant pipelines to achieve circulation.

[0019] All four corners of the baffle 4 are machined with a C0.2mm chamfer to prevent the edge of the baffle 4 from scratching the solder 5 or the cover plate 6, and to facilitate the formation of a triangular weld bead during brazing.

[0020] Example 2: Reference Figure 4-5 The vacuum brazing cold plate shown in this embodiment differs from the previous embodiment in that, when the cross-sectional width of the flow channel 2 does not exceed 3.5mm, the cross-section of the baffle 4 in this embodiment is made of a circular standard wire material, and the cross-sectional width of the flow channel 2 is closely matched with the diameter of the standard wire material (the depth of the flow channel 2 is more than twice that of the baffle 4 in this embodiment).

[0021] The working principle of this practical solution is as follows: During assembly, the cold plate in this design is precisely fixed above the flow channel 2 of the base plate 1 by the baffle 4. The solder 5 is only laid on the top surface of the base plate 1 outside the baffle 4. At this time, the baffle 4 acts as a "physical barrier," completely blocking the opening of the flow channel 2, ensuring that the solder 5 and the flow channel 2 always maintain a certain distance (depending on the height of the baffle), thus structurally preventing the solder 5 from falling directly into the flow channel 2. At the same time, the "vertical side" (flow channel sidewall) and "horizontal side" (top surface of the baffle 4) of the T-shaped flow channel 2 form a three-dimensional welding surface, laying the foundation for the subsequent solidification of the solder 5 to form a "T-shaped weld".

[0022] The electromechanical connections involved in this utility model are common practices used by those skilled in the art, and technical inspiration can be obtained through a limited number of experiments; they are common knowledge.

[0023] Components not described in detail in this article are existing technologies.

[0024] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A vacuum brazing cold plate, comprising a base plate (1), solder (5), and a cover plate (6), characterized in that: The top surface of the base plate (1) is provided with a flow channel (2), and the beginning and end of the flow channel (2) are respectively provided with openings (3) connecting to the outside. A baffle (4) is provided between the base plate (1) and the solder (5), and the baffle (4) is positioned and matched with the flow channel (2).

2. The vacuum brazing cold plate according to claim 1, characterized in that: The flow channel (2) is serpentine or other irregular in shape, and the width of the flow channel (2) is within 25 mm.

3. The vacuum brazing cold plate according to claim 2, characterized in that: The cross-sectional shape of the flow channel (2) is T-shaped.

4. A vacuum brazed cold plate according to claim 3, characterized in that: When the cross-sectional width of the flow channel (2) does not exceed 3.5 mm, the cross-section of the baffle (4) is circular, and the depth of the flow channel (2) is more than twice the diameter of the baffle (4).

5. A vacuum brazed cold plate according to claim 3, characterized in that: When the cross-sectional width of the flow channel (2) exceeds 3.5 mm, the cross-section of the baffle (4) is rectangular.

6. A vacuum brazed cold plate according to claim 4 or 5, characterized in that: The diameter of the baffle (4) is no more than 1 / 4 of the depth of the flow channel (2), and the width of the baffle (4) is the width of the flow channel (2) + 2mm.

7. A vacuum brazed cold plate according to claim 5, characterized in that: The four corners of the baffle (4) are provided with chamfers of C0.1-0.3mm.

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