A substrate mounting clamp and a turning positioning tool

Abstract

The utility model relates to the technical field of substrate installation, especially to a substrate installation clamp and a turning positioning tool, which comprise a carrier bracket and a substrate carrier, the carrier bracket is provided with a mounting port, the edge of the mounting port is sunken to form a mounting table, a sliding groove is formed between the mounting table and the bottom surface of the sample table, the substrate carrier comprises a heat conduction plate and a substrate installation pressing plate, and the substrate installation pressing plate is provided with a mounting groove, the substrate installation pressing plate is connected to the bottom surface of the heat conduction plate, the edge of the heat conduction plate is embedded in the sliding groove through sliding connection, and the substrate carrier is installed on the carrier bracket, the turning positioning tool comprises a supporting rod, a positioning rod is arranged on the top of one side of the supporting plate, and a positioning screw connects the substrate installation pressing plate and the heat conduction plate to the supporting plate. The utility model realizes rapid and accurate installation of multiple substrates through the sliding and pulling structure, the spring positioning ball and the turning positioning tool, and significantly improves the machining precision and the operation convenience.

Description

Technical Field

[0001] This utility model relates to the field of substrate mounting technology, and in particular to a substrate mounting fixture and flipping positioning tool. Background Technology

[0002] In substrate fabrication processes in semiconductors, optical devices, and other fields, multiple small substrates often need to be mounted and fixed on a sample stage for processes such as coating and photolithography. Traditional substrate mounting methods have the following problems:

[0003] Low installation efficiency: When multiple small substrates need to be installed, the manual positioning and fixing operation is cumbersome, and the human operation can easily cause the substrates to shift during installation or processing, affecting the processing accuracy.

[0004] Difficulty in flipping: Some processes require the substrate to face the processing area with a specific side (such as the reverse side), but due to gravity, it is difficult to position it directly when it is installed face down. The lack of reliable positioning assistance during the process may increase the risk of misoperation, which may cause damage to equipment or people.

[0005] Inconvenient disassembly: The substrate often needs to be replaced frequently after installation. Traditional clamps mostly use bolts and other fixing methods, and the disassembly process is time-consuming and laborious, affecting production efficiency.

[0006] Existing technologies lack efficient positioning and mounting structures for multi-substrate mounting fixtures, making it difficult to meet the demands of high-precision, automated processing. Therefore, there is an urgent need for a substrate mounting fixture that is simple in structure, accurate in positioning, and easy to install. Utility Model Content

[0007] This invention addresses the shortcomings of existing technologies by developing a substrate mounting fixture and flipping positioning tool. Through a sliding pull-out structure, spring positioning ball, and flipping positioning tool, this invention enables rapid and accurate mounting of multiple substrates, significantly improving processing accuracy and operational convenience.

[0008] The technical solution to the technical problem solved by this utility model is as follows:

[0009] This utility model provides a substrate mounting fixture, including a carrier bracket and a substrate carrier;

[0010] The carrier bracket is provided with an installation opening, the edge of which is recessed to form an installation platform. The carrier bracket is connected to the bottom surface of the sample stage, and a sliding groove is formed between the installation platform and the bottom surface of the sample stage.

[0011] The substrate carrier includes a heat-conducting plate and a substrate mounting plate. The substrate mounting plate has multiple mounting slots for placing substrates. The substrate mounting plate is connected to the bottom surface of the heat-conducting plate. The edge of the heat-conducting plate is adapted to the mounting platform and is slidably embedded in the slot, so that the substrate carrier is installed on the carrier bracket by a pull-out method.

[0012] As an improvement to the above solution, the mounting platform is embedded with a spring, the outer end of which is connected to a positioning ball, and the corresponding position of the heat-conducting plate is provided with a positioning groove; when the heat-conducting plate is fully pushed into the mounting opening, the top of the positioning ball is embedded in the positioning groove.

[0013] As an improvement to the above solution, a pull block is provided on the outer side of the heat-conducting plate.

[0014] As an improvement to the above solution, the pull block is detachably connected to the outer side of the heat-conducting plate by bolts or clips.

[0015] As an improvement to the above solution, the bottom of the mounting groove is provided with an opening.

[0016] As an improvement to the above solution, the cross-sectional shape of the groove matches the edge contour of the heat-conducting plate, and is a rectangular or trapezoidal guide groove.

[0017] As an improvement to the above solution, the heat-conducting plate and the substrate mounting plate are fixedly connected by fixing screws passing through the fixing holes.

[0018] This utility model also provides a substrate flipping and positioning fixture, including a support plate, positioning screws, and the substrate carrier described in any one of the above.

[0019] A support rod is connected to the bottom of the support plate, a positioning rod is provided on the upper side of one side of the support plate, and a plurality of first positioning threaded holes are evenly opened on the edge of the support plate.

[0020] The edge of the substrate mounting plate is provided with a first positioning hole that is adapted to the positioning rod, and a second positioning threaded hole corresponding to the first positioning threaded hole;

[0021] The heat-conducting plate is provided with a second positioning hole adapted to the positioning rod, and a third positioning threaded hole corresponding to the first positioning threaded hole;

[0022] The positioning rod is used to pass through the first positioning hole and the second positioning hole to position the substrate mounting plate and the heat-conducting plate.

[0023] The positioning screw is used to sequentially pass through the third positioning threaded hole, the second positioning threaded hole and the first positioning threaded hole to connect the substrate mounting plate and the heat-conducting plate to the support plate.

[0024] Compared with existing technologies, the above solution has the following advantages or beneficial effects:

[0025] 1. Efficient installation and precise positioning

[0026] Sliding pull-out structure: The substrate carrier is slidably connected to the carrier bracket through the edge of the heat-conducting plate, realizing "drawer-style" quick installation and disassembly, eliminating the need for cumbersome bolt fixing and greatly improving clamping efficiency.

[0027] Automatic positioning with spring-loaded positioning ball: The spring and positioning ball on the mounting platform work together with the positioning groove of the heat-conducting plate. When the substrate carrier is fully pushed in, the positioning ball automatically engages with the positioning groove, ensuring accurate positioning of the substrate carrier and the bracket, avoiding manual alignment errors, and ensuring the stability of the substrate during processing.

[0028] Stepped limiting structure: The groove wall of the mounting slot adopts a stepped design, which can limit the substrate in the horizontal direction, prevent the substrate from shifting during installation, and further improve the positioning accuracy.

[0029] 2. Innovative flipping and positioning fixture to assist installation

[0030] Positioning rod and threaded hole fit: The flipping positioning fixture uses a positioning rod to pass through the positioning holes of the substrate mounting plate and the heat conduction plate to achieve quick alignment between the two and avoid positional deviation; the multi-stage positioning threaded holes on the edge are fixed by positioning screws, so that the substrate carrier and the flipping positioning fixture form a rigid whole, which facilitates safe flipping.

[0031] Integrated reverse installation: By using a flipping positioning fixture, the substrate can be installed face up first and then flipped over as a whole, which solves the problem of difficult installation with the face down and ensures that the substrate is accurately facing the processing area with a specific face, meeting the requirements of complex processes. Attached Figure Description

[0032] The accompanying drawings are provided to further understand the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation thereof.

[0033] Figure 1 This is a schematic diagram of the substrate carrier in Embodiment 1. Figure 1 .

[0034] Figure 2 This is a schematic diagram of the vehicle bracket in this embodiment.

[0035] Figure 3 This is a schematic diagram of the substrate carrier in Embodiment 1. Figure 2 .

[0036] Figure 4 This is a schematic diagram of the substrate mounting fixture in Embodiment 1. Figure 1 .

[0037] Figure 5 This is a schematic diagram of the substrate mounting fixture in Embodiment 1. Figure 2 .

[0038] Figure 6 This is a schematic diagram of the substrate mounting fixture in Embodiment 1. Figure 3 .

[0039] Figure 7 This is a schematic diagram of the substrate flipping and positioning fixture in Embodiment 2. Figure 1 .

[0040] Figure 8 This is a schematic diagram of the substrate flipping and positioning fixture in Embodiment 2. Figure 2 .

[0041] Figure 9 This is a schematic diagram of the substrate flipping and positioning fixture in Embodiment 2. Figure 3 .

[0042] Figure 10 This is a schematic diagram of the substrate flipping and positioning fixture in Embodiment 2. Figure 4 .

[0043] In the diagram: A. Substrate, B. Sample stage, 1. Carrier bracket, 101. Mounting port, 102. Mounting platform, 103. Positioning ball, 2. Substrate carrier, 201. Heat-conducting plate, 202. Substrate mounting pressure plate, 203. Mounting groove, 204. Pull block, 205. Positioning groove, 206. First positioning hole, 207. Second positioning threaded hole, 208. Second positioning hole, 209. Third positioning threaded hole, 210. Fixing screw, 211. Fixing hole, 3. Support plate, 301. Support rod, 302. Positioning rod, 303. First positioning threaded hole, 4. Positioning screw. Detailed Implementation

[0044] To clearly illustrate the technical features of this solution, the present invention will be described in detail below through specific embodiments and in conjunction with the accompanying drawings. The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Furthermore, the present invention may repeat reference numerals and / or letters in different examples. This repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. It should be noted that the components illustrated in the drawings are not necessarily drawn to scale. The present invention omits descriptions of well-known components and processing techniques and processes to avoid unnecessarily limiting the present invention. The terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0045] Example 1

[0046] See Figures 1-6 This embodiment provides a substrate mounting fixture, including a carrier bracket 1 and a substrate carrier 2.

[0047] The carrier bracket 1 has a mounting opening 101 that is adapted to the substrate carrier 2, and the edge of the mounting opening 101 is recessed to form a mounting platform 102. The carrier bracket 1 is fixedly mounted on the bottom surface of the sample stage B used for mounting the substrate, and the mounting platform 102 and the bottom surface of the sample stage B form a sliding groove at a distance.

[0048] The substrate carrier 2 includes a heat-conducting plate 201 and a substrate mounting plate 202. The substrate mounting plate 202 has multiple mounting slots 203 for placing small substrates A. The bottom of each mounting slot 203 has an opening for depositing a pattern of the corresponding shape. The substrate A is placed in the mounting slot 203, and the substrate mounting plate 202 is fixedly mounted on the bottom surface of the heat-conducting plate 201. The edge of the heat-conducting plate 201 is adapted to the mounting platform 102 and is slidably connected to a groove, allowing the substrate carrier 2 to be mounted on the carrier bracket 1 by sliding and pulling.

[0049] In an embodiment of this utility model, a pull block 204 is detachably connected to the outer side of the heat-conducting plate 201 by bolts or clips, so as to pull out the carrier bracket 1.

[0050] In this embodiment of the invention, a spring is embedded in the mounting platform 102, and a positioning ball 103 is connected to the outer end of the spring. A positioning groove 205 is provided at the corresponding position of the heat-conducting plate 201. When the heat-conducting plate 201 is fully pushed into the mounting opening 101, the top end of the positioning ball 103 is located in the positioning groove 205, thereby realizing the installation and positioning of the substrate carrier 2 and the carrier bracket 1. The bottom end of the positioning ball 103 is fixedly connected to the spring, and the lifting and resetting of the positioning ball 103 is realized by the elastic extension and contraction of the spring.

[0051] In an embodiment of this utility model, the cross-sectional shape of the groove matches the edge contour of the heat-conducting plate 201, and is a rectangular or trapezoidal guide groove.

[0052] In an embodiment of this utility model, the heat-conducting plate 201 and the substrate mounting plate 202 are fixedly connected by a fixing screw 210 passing through the fixing hole 211 on the heat-conducting plate 201 and the substrate mounting plate 202.

[0053] In operation, the small substrate A is first placed into the mounting slots 203 of the substrate mounting plate 202, and then the substrate mounting plate 202 is fixedly connected to the bottom surface of the heat-conducting plate 201 to form the substrate carrier 2; the push block 204 pushes the substrate carrier 2 along the slide to the mounting port 101 of the carrier bracket 1, thereby mounting the substrate A on the sample stage B.

[0054]

Example 2

[0055] See Figures 7-10 This embodiment provides a substrate flipping and positioning fixture, including the substrate carrier 2 in the above embodiment 1, and a support plate 3 adapted to the substrate carrier 2.

[0056] A support rod 301 is fixedly connected to the bottom of the support plate 3, a positioning rod 302 is provided on the upper side of one side of the support plate 3, and first positioning threaded holes 303 are evenly opened on the edge of the support plate 3.

[0057] The edge of the substrate mounting plate 202 is provided with a first positioning hole 206 adapted to the positioning rod 302 and a second positioning threaded hole 207 corresponding to the position of the first positioning threaded hole 303. The heat-conducting plate 201 is provided with a second positioning hole 208 adapted to the positioning rod 302 and a third positioning threaded hole 209 corresponding to the position of the first positioning threaded hole 303.

[0058] In use, the substrate mounting plate 202 is placed on the support plate 3 by passing the positioning rod 302 through the first positioning hole 206. The small substrate A is then placed into the mounting slots 203 of the substrate mounting plate 202. Finally, the heat-conducting plate 201 is placed above the substrate mounting plate 202 by passing the positioning rod 302 through the second positioning hole 208. Figure 8 and Figure 9 As shown, the heat-conducting plate 201 and the substrate mounting plate 202 are then fixed to the support plate 3 by passing the positioning screws 4 sequentially through the third positioning threaded hole 209, the second positioning threaded hole 207, and the first positioning threaded hole 303 from top to bottom. The support plate 3 is then flipped over along with the substrate carrier 2. Alternatively, the plates can be fixed separately by passing the fixing screws 210 through the fixing holes 211, as shown. Figure 10 As shown, finally remove the positioning screws 4 and remove the installed substrate carrier 2 from the support plate 3.

[0059] Although the specific embodiments of the utility model have been described above in conjunction with the accompanying drawings, this is not intended to limit the scope of protection of the utility model. Based on the technical solution of the utility model, various modifications or variations that can be made by those skilled in the art without creative effort are still within the scope of protection of the utility model.

Claims

1. A substrate mounting fixture, characterized in that: Includes a carrier bracket (1) and a substrate carrier (2); The carrier bracket (1) is provided with an installation port (101), the edge of the installation port (101) is recessed to form an installation platform (102), the carrier bracket (1) is connected to the bottom surface of the sample stage (B), and a sliding groove is formed between the installation platform (102) and the bottom surface of the sample stage (B). The substrate carrier (2) includes a heat-conducting plate (201) and a substrate mounting plate (202). The substrate mounting plate (202) has multiple mounting slots (203) for placing the substrate (A). The substrate mounting plate (202) is connected to the bottom surface of the heat-conducting plate (201). The edge of the heat-conducting plate (201) is adapted to the mounting platform (102) and is inserted into the sliding slot through a sliding connection, so that the substrate carrier (2) is installed on the carrier bracket (1) in a pull-out manner.

2. The substrate mounting fixture according to claim 1, characterized in that: The mounting platform (102) is embedded with a spring, and the outer end of the spring is connected to a positioning ball (103). The heat-conducting plate (201) is provided with a positioning groove (205) at the corresponding position. When the heat-conducting plate (201) is fully pushed into the mounting port (101), the top of the positioning ball (103) is embedded in the positioning groove (205).

3. A substrate mounting fixture according to claim 1, characterized in that: The heat-conducting plate (201) is provided with a pull block (204) on its outer side.

4. A substrate mounting fixture according to claim 3, characterized in that: The pull block (204) is detachably connected to the outer side of the heat-conducting plate (201) by bolts or clips.

5. A substrate mounting fixture according to claim 1, characterized in that: The bottom of the mounting groove (203) is provided with an opening.

6. A substrate mounting fixture according to claim 1, characterized in that: The cross-sectional shape of the groove matches the edge contour of the heat-conducting plate (201), and is a rectangular or trapezoidal guide groove.

7. A substrate mounting fixture according to claim 1, characterized in that: The heat-conducting plate (201) and the substrate mounting plate (202) are fixedly connected by fixing screws (210) passing through fixing holes (211).

8. A substrate flipping and positioning fixture, characterized in that: Includes a support plate (3), positioning screws (4), and a substrate carrier (2) as described in any one of claims 1 to 7; A support rod (301) is connected to the bottom of the support plate (3), a positioning rod (302) is provided on the upper side of one side of the support plate (3), and a plurality of first positioning threaded holes (303) are evenly opened on the edge of the support plate (3). The edge of the substrate mounting plate (202) is provided with a first positioning hole (206) that is adapted to the positioning rod (302) and a second positioning threaded hole (207) corresponding to the first positioning threaded hole (303); The heat-conducting plate (201) is provided with a second positioning hole (208) adapted to the positioning rod (302) and a third positioning threaded hole (209) corresponding to the first positioning threaded hole (303); The positioning rod (302) is used to pass through the first positioning hole (206) and the second positioning hole (208) to position the substrate mounting plate (202) and the heat-conducting plate (201); The positioning screw (4) is used to pass through the third positioning threaded hole (209), the second positioning threaded hole (207) and the first positioning threaded hole (303) in sequence to connect the substrate mounting plate (202) and the heat-conducting plate (201) to the support plate (3).

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