Computer mainboard heat sink
By using a heat-conducting component composed of copper and aluminum plates on the computer motherboard, combined with fastening and heat dissipation components, the problem of heavy and poor heat dissipation performance of existing LGA1700 heatsinks has been solved, achieving efficient CPU cooling and long-term stability.
Patent Information
- Application Number
- CN202521750610.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-15
- Publication Date
- 2026-08-25
- Estimated Expiration
- 2035-08-15
AI Technical Summary
The existing LGA1700 heatsink is made of sunflower aluminum extrusion, which is heavy and has poor heat dissipation performance, and cannot meet the heat dissipation requirements of high-power CPUs.
The thermally conductive components, composed of copper and aluminum plates, are combined with fastening and heat dissipation components. Thermal resistance is reduced by using thermal grease, increasing the contact area and efficiency between the heat source and the heat dissipation body, and heat dissipation is achieved through forced convection via heat pipes and fans.
It improves the rapid conduction and uniform heat dissipation of the CPU, ensuring long-term stability and heat dissipation effect, adapts to slight height differences and deformation, prevents screws from loosening, and enhances the overall heat dissipation performance of the heatsink.
Smart Images
Figure CN224682622U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of motherboard heat sink technology, specifically to heat sinks for computer motherboards. Background Technology
[0002] Since the introduction of the 12th generation Core processors, the Intel LGA1700 socket has become the core foundation of Intel's desktop platform, and its technological changes have brought new heat dissipation challenges to computer motherboards.
[0003] Currently, most LGA1700 CPU coolers on the market are made of extruded aluminum with a fan. However, extruded aluminum is relatively heavy, and pure aluminum has poor heat dissipation performance, which cannot solve the problem of increasingly powerful computer chips and higher heat dissipation requirements. Therefore, this solution provides a CPU cooler for computer motherboards to solve the above-mentioned problems. Utility Model Content
[0004] To solve the above-mentioned technical problems, a heat sink for computer motherboards is provided. This technical solution solves the problems mentioned in the background section.
[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:
[0006] A heat sink for a computer motherboard includes a base plate, a heat-conducting component, a fastening component, and a heat-dissipating component. The heat-conducting component, the fastening component, and the heat-dissipating component are all mounted on the base plate. The base plate includes an aluminum plate with a fixing groove at its lower end and two sets of mounting grooves, namely, mounting groove one and mounting groove two, at its upper end. The heat-conducting component includes a copper plate, a first heat pipe, and a second heat pipe. The copper plate is fixedly installed inside the fixing groove. There are two sets of the first heat pipe and the second heat pipe. The two sets of the first heat pipe are fixedly installed in mounting groove one, and the two sets of the second heat pipe are fixedly installed in mounting groove two.
[0007] Preferably, both sets of mounting slot one and both sets of mounting slot two are symmetrically arranged about the central axis of the aluminum plate, and both mounting slot one and mounting slot two are connected to the fixing slot on the lower side.
[0008] Preferably, the lower end of the copper plate is coated with thermal grease, and each of the two sets of first heat pipes has a first opening at the opposite end, and each of the two sets of second heat pipes has a second opening at the opposite end.
[0009] Preferably, the outer side of the mounting groove 2 is provided with several sets of mounting holes opened on the aluminum plate, and fastening components are provided inside the mounting holes.
[0010] Preferably, the fastening assembly includes a screw body disposed in the mounting hole, a nut fixedly connected to the top of the screw body, a cross groove formed on the nut, and a threaded rod fixedly connected to the lower end of the screw body; a spring is sleeved on the outer side of the screw body, with the two ends of the spring abutting against the nut and the inner wall of the mounting hole respectively; a groove is formed at the lower end of the screw body, and a washer is engaged inside the groove, with the upper end of the washer abutting against the lower end of the aluminum plate.
[0011] Preferably, the heat dissipation assembly includes multiple sets of heat dissipation fins fixedly mounted on the aluminum plate, and each heat dissipation fin has a through slot at the position corresponding to the fastening assembly.
[0012] Compared with the prior art, the present invention proposes a heat sink for computer motherboards, which has the following advantages:
[0013] 1. This utility model includes a heat-conducting component. A highly thermally conductive copper plate is embedded in the aluminum base plate. The lower end of the copper plate is used to contact the CPU, and thermal grease is applied to the copper plate to reduce thermal resistance, thereby absorbing the heat from the CPU. A first heat pipe and a second heat pipe are fixedly installed in mounting slots one and two on the upper end of the aluminum plate, respectively. Both mounting slots one and two are connected to the fixing slot on the lower side, so that the embedded first heat pipe and second heat pipe are connected to the copper plate. This effectively increases the contact area and efficiency of heat transfer from the heat source (copper plate) to the heat dissipation body (aluminum plate). The heat from the copper plate can be quickly and evenly transferred to the entire aluminum plate through the first and second heat pipes, enhancing the heat storage function of the heat sink. At the same time, the first and second heat pipes can immediately carry the heat to the entire heat dissipation fins, and then the heat is dissipated through forced convection created by the computer's built-in fan.
[0014] 2. This utility model includes a fastening assembly. By aligning the mounting holes on the aluminum plate with the mounting holes on the chip, and then rotating the nut, the threaded rod at the lower end is inserted into the mounting hole on the chip, thus completing the overall installation. At this time, the spring sleeved on the outside of the screw body is in a compressed state, and the washer is stuck in the groove at the lower end of the screw body and abuts against the lower surface of the substrate, so that the spring provides a constant and adaptive downward pressure, which can compensate for the slight height difference between the motherboard, CPU top cover, and heat sink substrate or the deformation after long-term use, ensuring that the copper plate and CPU top cover are always in close contact and maintain good heat conduction. At the same time, the preload of the spring can effectively resist the loosening of the screw caused by vibration, improve the stability of long-term use, and the washer can distribute the pressure to prevent the screw from directly pressing the aluminum plate or motherboard and deforming. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0016] Figure 2 This is a schematic diagram of the substrate structure in this utility model;
[0017] Figure 3 This is a bottom view of the thermal conductive component in this utility model.
[0018] Figure 4 This is a top view of the heat-conducting component in this utility model.
[0019] Figure 5 This is a schematic diagram of the fastening assembly in this utility model;
[0020] Figure 6 This is a schematic diagram of the heat dissipation component in this utility model.
[0021] The numbers on the map are:
[0022] 1. Substrate; 2. Thermal conductive components; 3. Fastening components; 4. Heat dissipation components;
[0023] 101. Aluminum plate; 102. Fixing groove; 103. Mounting groove one; 104. Mounting groove two; 105. Mounting hole;
[0024] 201. Copper plate; 202. Thermal grease; 203. First heat pipe; 204. First opening; 205. Second heat pipe; 206. Second opening;
[0025] 301. Screw body; 302. Nut; 303. Cross groove; 304. Threaded rod; 305. Spring; 306. Groove; 307. Washer;
[0026] 401. Heat dissipation fins; 402. Through slot. Detailed Implementation
[0027] The following description is intended to disclose the present invention so that those skilled in the art can implement it. The preferred embodiments described below are merely examples, and other obvious variations will occur to those skilled in the art.
[0028] Reference Figure 1-2 As shown, a heat sink for a computer motherboard includes a base plate 1, a heat-conducting component 2, a fastening component 3, and a heat-dissipating component 4. The heat-conducting component 2, the fastening component 3, and the heat-dissipating component 4 are all disposed on the base plate 1. The base plate 1 includes an aluminum plate 101. A fixing groove 102 is provided at the lower end of the aluminum plate 101, and two sets of mounting grooves 103 and 104 are provided at the upper end of the aluminum plate 101.
[0029] Reference Figure 2-4As shown, specifically in this embodiment, the heat-conducting component 2 includes a copper plate 201, a first heat pipe 203, and a second heat pipe 205. The copper plate 201 is fixedly installed inside the fixing groove 102. The first heat pipe 203 and the second heat pipe 205 are each provided in two sets. The two sets of first heat pipes 203 are respectively fixedly installed in the first mounting groove 103, and the two sets of second heat pipes 205 are respectively fixedly installed in the second mounting groove 104.
[0030] Furthermore, by embedding a highly thermally conductive copper plate 201 on the base aluminum plate 101, the lower end of the copper plate 201 is used to contact the CPU, thereby absorbing the heat of the CPU. The first heat pipe 203 and the second heat pipe 205 are fixedly installed in the mounting slot 103 and the mounting slot 104 connected to the fixing slot 102 at the upper end of the aluminum plate 101, respectively. The heat of the copper plate 201 is quickly and evenly conducted to the entire aluminum plate 101 through the first heat pipe 203 and the second heat pipe 205, thereby enhancing the heat storage function of the heat sink.
[0031] Reference Figure 2 As shown, specifically, in this embodiment, the two sets of mounting grooves 103 and 104 are symmetrically arranged about the central axis of the aluminum plate 101, and the mounting grooves 103 and 104 are connected to the fixing groove 102 on the lower side.
[0032] Furthermore, both mounting slot 103 and mounting slot 2104 are connected to the lower fixing slot 102, thereby connecting the embedded first heat pipe 203 and second heat pipe 205 to the copper plate 201. This effectively increases the contact area and efficiency of heat transfer from the heat source (copper plate 201) to the heat dissipation body (aluminum plate 101), and the heat from the copper plate 201 can be quickly and evenly transferred to the entire aluminum plate 101 through the first heat pipe 203 and second heat pipe 205.
[0033] Reference Figure 2-4 As shown, specifically in this embodiment, the lower end of the copper plate 201 is coated with thermal grease 202, and the two sets of first heat pipes 203 each have a first opening 204 at their opposite ends, and the two sets of second heat pipes 205 each have a second opening 206 at their opposite ends.
[0034] Furthermore: Thermal grease 202 is applied to the copper plate 201 to reduce thermal resistance, so that the small gap between the copper plate 201 and the CPU can be filled by the thermal grease 202, thereby improving the effect and efficiency of the copper plate 201 in absorbing the heat of the CPU.
[0035] The first opening 204 and the second opening 206 facilitate the removal of the heat pipe from the aluminum plate 101 for easy replacement.
[0036] Reference Figure 2As shown, specifically in this embodiment, the outer side of the mounting groove 104 is provided with a number of mounting holes 105 opened on the aluminum plate 101, and fastening components 3 are provided inside the mounting holes 105.
[0037] Reference Figure 5 As shown, specifically in this embodiment, the fastening component 3 includes a screw body 301 disposed in the mounting hole 105, a nut 302 fixedly connected to the top of the screw body 301, a cross groove 303 provided on the nut 302, and a threaded rod 304 fixedly connected to the lower end of the screw body 301; a spring 305 is sleeved on the outer side of the screw body 301, the two ends of the spring 305 abutting against the nut 302 and the inner wall of the mounting hole 105 respectively, a groove 306 is provided at the lower end of the screw body 301, a washer 307 is engaged inside the groove 306, and the upper end of the washer 307 abuts against the lower end of the aluminum plate 101.
[0038] Furthermore: By aligning the mounting holes 105 on the aluminum plate 101 with the mounting holes on the chip, and rotating the nut 302, the threaded rod 304 at the lower end is inserted into the mounting hole on the chip to complete the overall installation. At this time, the spring 305 sleeved on the outside of the screw body 301 is in a compressed state, and the washer 307 is stuck in the groove 306 at the lower end of the screw body 301 and abuts against the lower surface of the aluminum plate 101, so that the spring 305 provides a constant and adaptive downward pressure, which can compensate for the slight height difference between the motherboard, the CPU top cover, and the heat sink base plate 1 or the deformation after long-term use, ensuring that the copper plate 201 and the CPU top cover are always in close contact and maintain good heat conduction. At the same time, the preload of the spring 305 can effectively resist the loosening of the screw caused by vibration and improve the stability of long-term use. The washer 307 can distribute the pressure and prevent the screw from directly pressing the aluminum plate or the motherboard to deform.
[0039] Reference Figure 6 As shown, specifically, in this embodiment, the heat dissipation component 4 includes multiple sets of heat dissipation fins 401 fixedly mounted on the aluminum plate 101, and each heat dissipation fin 401 has a through groove 402 at the position corresponding to the fastening component 3.
[0040] Furthermore, the first heat pipe 203 and the second heat pipe 205 can immediately transfer heat to the entire heat sink fin 401, and then the forced convection created by the computer's built-in fan will dissipate the heat. At the same time, the through slot is a partial opening, only allowing space for the screws, maximizing the integrity of the fins and the heat dissipation area at that location, without sacrificing the heat dissipation area, and ensuring stable heat dissipation performance.
[0041] The working principle of this utility model is as follows: During installation, thermal grease 202 is applied to the bottom of the copper plate 201, and then the mounting hole 105 on the aluminum plate 101 is aligned with the mounting hole on the chip. Then, the nut 302 is rotated so that the threaded rod 304 at the lower end is inserted into the mounting hole on the chip to complete the overall installation.
[0042] When the CPU is working, a highly thermally conductive copper plate 201 is embedded in the base aluminum plate 101. The lower end of the copper plate 201 contacts the top of the CPU, thus absorbing the CPU's heat. A first heat pipe 203 and a second heat pipe 205 are fixedly installed in mounting slots 103 and 104 at the upper end of the aluminum plate 101, respectively. Both mounting slots 103 and 104 are connected to the lower fixing slot 102, allowing the embedded first heat pipe 203 and second heat pipe 205 to connect with the copper plate 201. This effectively increases the contact area and efficiency of heat transfer from the heat source (copper plate 201) to the heat sink (aluminum plate 101). Furthermore, the heat from the copper plate 201 can be quickly and evenly transferred to the entire aluminum plate 101 through the first heat pipe 203 and second heat pipe 205, effectively enhancing the heat storage function of the heat sink.
[0043] At the same time, the heat can be immediately transferred to the entire heat sink 401 through the first heat pipe 203 and the second heat pipe 205, and then the heat is dissipated through the forced convection created by the computer's built-in fan.
[0044] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.
Claims
1. A heatsink for a computer motherboard, characterized in that, The device includes a substrate (1), a heat-conducting component (2), a fastening component (3), and a heat dissipation component (4). The heat-conducting component (2), the fastening component (3), and the heat dissipation component (4) are all disposed on the substrate (1). The substrate (1) includes an aluminum plate (101). A fixing groove (102) is provided at the lower end of the aluminum plate (101), and two sets of mounting grooves (103 and 104) are provided at the upper end of the aluminum plate (101). The heat-conducting component (2) includes a copper plate (201), a first heat pipe (203), and a second heat pipe (205). The copper plate (201) is fixedly installed inside the fixing groove (102). The first heat pipe (203) and the second heat pipe (205) are each provided in two sets. The two sets of the first heat pipe (203) are respectively fixedly installed in the first mounting groove (103), and the two sets of the second heat pipe (205) are respectively fixedly installed in the second mounting groove (104).
2. The heat sink for a computer motherboard according to claim 1, characterized in that: Both sets of mounting groove one (103) and both sets of mounting groove two (104) are symmetrically arranged about the central axis of the aluminum plate (101), and both mounting groove one (103) and mounting groove two (104) are connected to the fixing groove (102) on the lower side.
3. The heat sink for a computer motherboard according to claim 1, characterized in that: The lower end of the copper plate (201) is coated with thermal grease (202), and the two sets of first heat pipes (203) have a first opening (204) at the opposite end, and the two sets of second heat pipes (205) have a second opening (206) at the opposite end.
4. The heat sink for a computer motherboard according to claim 1, characterized in that: The outer side of the second mounting groove (104) is provided with a number of mounting holes (105) opened on the aluminum plate (101), and each mounting hole (105) is provided with a fastening component (3).
5. The heat sink for a computer motherboard according to claim 4, characterized in that: The fastening assembly (3) includes a screw body (301) disposed in the mounting hole (105), a nut (302) is fixedly connected to the top end of the screw body (301), a cross groove (303) is provided on the nut (302), and a threaded rod (304) is fixedly connected to the lower end of the screw body (301). A spring (305) is sleeved on the outside of the screw body (301). The two ends of the spring (305) abut against the inner wall of the nut (302) and the mounting hole (105), respectively. A groove (306) is provided at the lower end of the screw body (301). A washer (307) is engaged inside the groove (306). The upper end of the washer (307) abuts against the lower end of the aluminum plate (101).
6. The heat sink for a computer motherboard according to claim 1, characterized in that: The heat dissipation assembly (4) includes multiple sets of heat dissipation fins (401) fixedly mounted on an aluminum plate (101), and each heat dissipation fin (401) has a through groove (402) at a position corresponding to the fastening assembly (3).