Substrate table grounding structure and semiconductor production apparatus
By setting a second grounding component at the bottom of the substrate stage and a first grounding component inside the lifting shaft, combined with an insulating plate and multiple grounding plates, stable grounding of the substrate stage is achieved, solving the problems of high material requirements and dust generation associated with traditional grounding methods, and improving processing quality and equipment safety.
Patent Information
- Application Number
- CN202521794452.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-21
- Publication Date
- 2026-08-25
- Estimated Expiration
- 2035-08-21
AI Technical Summary
In existing technologies, the grounding strip of the substrate stage needs to be bent frequently, which requires high-quality materials, occupies space, and easily generates dust, affecting the quality of semiconductor production.
A second grounding component is installed at the bottom of the substrate lifting platform, and a first grounding component is installed inside the lifting shaft. The two are fixedly connected to achieve grounding of the substrate platform to avoid bending. An insulating plate is used to isolate the potential difference, and static charge is discharged through multiple grounding plates and grounding plate structures.
It solves the problems of high material requirements, limited number of bending cycles, and dust generation, improves processing quality, frees up space under the substrate stage, and ensures the safety and stability of the equipment.
Smart Images
Figure CN224683389U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of semiconductor manufacturing equipment technology, specifically relating to a substrate grounding structure and semiconductor manufacturing equipment. Background Technology
[0002] Plasma is an electrically neutral gas composed of free electrons, positive ions, and neutral particles, and it has wide applications in scientific research, industry, and many other fields. Radio frequency (RF) power supplies, as a highly efficient energy source, are often used to generate plasma. Specifically, radio frequency chemical vapor deposition (RFCVD) is a technique that uses RF plasma to activate gas-phase reactions for thin film deposition; it belongs to the vapor deposition methods within the field of materials engineering. It uses an RF electromagnetic field to ionize the reactant gas, generating plasma, lowering the chemical reaction barrier, and allowing the deposition process to occur on the substrate surface.
[0003] To prevent data loss or equipment malfunction due to static charge accumulation on the substrate stage, a grounding path is provided to guide RF power away from the process chamber and to reduce the occurrence of arcing within the process chamber. In existing technologies, a flexible grounding strip (conductive strip) is placed below the substrate stage (at the end furthest from the target) to guide static charge away. However, this solution has the following drawbacks:
[0004] 1. Because the substrate stage needs to be raised and lowered frequently during operation, the grounding strip needs to be bent each time, which requires high-quality materials and has a limit on the number of times it can be raised and lowered.
[0005] 2. Sufficient installation space needs to be reserved below the substrate stage for installing the grounding strip and for bending the grounding strip, which will occupy the bottom space of the substrate stage;
[0006] 3. Frequent bending of the grounding strip can easily lead to dust generation, which is detrimental to particle requirements in semiconductor production. Utility Model Content
[0007] The present invention aims to at least solve one of the aforementioned technical problems existing in the prior art. To this end, in a first aspect, the present invention provides a substrate grounding structure that can overcome the shortcomings of traditional grounding methods.
[0008] Secondly, this utility model proposes a semiconductor manufacturing equipment that applies the above-mentioned substrate grounding structure.
[0009] According to the first aspect of the present invention, the substrate grounding structure includes:
[0010] Substrate lifting platform;
[0011] A lifting shaft is connected to the center of the bottom of the substrate lifting platform;
[0012] A first grounding component is disposed within the lifting shaft;
[0013] The second grounding component is disposed at the bottom of the substrate lifting platform and connected to the first grounding component.
[0014] The substrate grounding structure according to the embodiments of the present invention has at least the following beneficial effects:
[0015] The substrate stage grounding structure of this embodiment uses a second grounding component at the bottom of the substrate lifting stage and a first grounding component inside the lifting shaft. The second grounding component is connected to the first grounding component to ground the substrate lifting stage. Compared to traditional structures, since the lifting shaft and the substrate lifting stage remain relatively fixed, the first and second grounding components also maintain a relatively fixed connection, eliminating the need for bending as the substrate lifting stage moves. This solves the problems of high material requirements and limitations on the number of bends, while also avoiding dust generation and improving processing quality. Furthermore, the first grounding component is located inside the lifting shaft, avoiding occupying the space below the substrate lifting stage. The first and second grounding components can be connected as close as possible to the upper end of the lifting shaft, further freeing up space below the substrate lifting stage and addressing the space constraints of traditional structures.
[0016] According to some embodiments of this utility model, the substrate lifting platform is connected to an RF power supply, and an insulating plate is provided between the second grounding component and the substrate lifting platform for separation.
[0017] According to some embodiments of this utility model, the insulating plate is a quartz structure.
[0018] According to some embodiments of the present invention, the second grounding component includes a grounding plate, which is disposed around the bottom and outer periphery of the substrate lifting platform.
[0019] According to some embodiments of the present invention, the second grounding assembly further includes a plurality of grounding plates, which are distributed around the lifting shaft on the lower end face of the grounding plate. The grounding plates extend radially along the lifting shaft, and the resistance of the grounding plates is less than the resistance of the grounding plate.
[0020] According to some embodiments of this utility model, an extension is provided between two adjacent grounding plates for mutual connection, and the extension is made of the same material as the grounding plate.
[0021] According to some embodiments of this utility model, the interior of the lifting shaft defines an installation channel, the first grounding component is disposed within the installation channel, and the second grounding component further includes:
[0022] The first connecting part is fixedly disposed on the lifting shaft and extends from the outside of the lifting shaft through the side wall of the lifting shaft into the mounting channel. One end of the first connecting part located in the mounting channel is connected to the first grounding component.
[0023] The second connection part is connected between the first connection part and the grounding piece.
[0024] According to some embodiments of this utility model, the lifting shaft is configured as a hollow structure, and the substrate stage grounding structure is coaxially provided with an insulating sleeve inside the hollow lifting shaft. An installation channel is defined between the outer side of the insulating sleeve and the inner sidewall of the lifting shaft, and the first grounding component is disposed in the installation channel.
[0025] According to some embodiments of the present invention, the first grounding component and the lifting shaft are connected as an integral structure, and the second grounding component is connected to the lifting shaft.
[0026] The semiconductor manufacturing equipment according to the second aspect of the present invention includes a substrate grounding structure of any of the above-described structures.
[0027] The semiconductor manufacturing equipment according to the embodiments of the present invention has at least the following beneficial effects:
[0028] The semiconductor manufacturing equipment of this embodiment, by applying the aforementioned substrate stage grounding structure, can solve the problems of high material requirements and limitations on the number of bending cycles in traditional structures, while also avoiding dust problems and improving processing quality. Furthermore, it can free up space under the substrate lifting platform, addressing the space constraints of traditional structures.
[0029] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and some of these additional aspects and advantages will become apparent from the description or may be learned by practice of the invention. Attached Figure Description
[0030] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:
[0031] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0032] Figure 2 This is a schematic diagram of the first type of substrate grounding structure in this utility model;
[0033] Figure 3 for Figure 2 A magnified view of a portion of the structure shown;
[0034] Figure 4This is a schematic diagram of the second structure of the substrate grounding structure in this utility model;
[0035] Figure 5 This is a schematic diagram of a grounding plate and grounding sheet. Detailed Implementation
[0036] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.
[0037] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0038] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.
[0039] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.
[0040] In the description of this utility model, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0041] Plasma is an electrically neutral gas composed of free electrons, positive ions, and neutral particles, and it has wide applications in scientific research, industry, and many other fields. Radio frequency (RF) power supplies, as a highly efficient energy source, are often used to generate plasma. Specifically, radio frequency chemical vapor deposition (RFCVD) is a technique that uses RF plasma to activate gas-phase reactions for thin film deposition; it belongs to the vapor deposition methods within the field of materials engineering. It uses an RF electromagnetic field to ionize the reactant gas, generating plasma, lowering the chemical reaction barrier, and allowing the deposition process to occur on the substrate surface.
[0042] To prevent data loss or equipment malfunction due to static charge accumulation on the substrate stage, a grounding path is provided to guide RF power away from the process chamber and to reduce the occurrence of arcing within the process chamber. In existing technologies, a flexible grounding strip (conductive strip) is placed below the substrate stage (at the end furthest from the target) to guide static charge away. However, this solution has the following drawbacks:
[0043] 1. Because the substrate stage needs to be raised and lowered frequently during operation, the grounding strip needs to be bent each time, which requires high-quality materials and has a limit on the number of times it can be raised and lowered.
[0044] 2. Sufficient installation space needs to be reserved below the substrate stage for installing the grounding strip and for bending the grounding strip, which will occupy the bottom space of the substrate stage;
[0045] 3. Frequent bending of the grounding strip can easily lead to dust generation, which is detrimental to particle requirements in semiconductor production.
[0046] Therefore, this utility model provides a substrate grounding structure that can solve the shortcomings of traditional grounding methods.
[0047] Reference Figures 1 to 5 This utility model provides a substrate stage grounding structure, including a substrate lifting platform 100, a lifting shaft 200, a first grounding component 400, and a second grounding component 300. The substrate lifting platform 100 supports the substrate, and the lifting shaft 200 is connected to the bottom center of the substrate lifting platform 100 to drive the substrate lifting platform 100 to rise and fall together. The lifting shaft 200 internally defines an installation channel 201, which is connected to the outside. It should be noted that the substrate lifting platform 100 and the lifting shaft 200 are generally mounted on a vacuum chamber and sealed to maintain the vacuum level inside the vacuum chamber. In this embodiment, the installation channel 201 is connected to the outside of the vacuum chamber.
[0048] The first grounding component 400 is disposed within the mounting channel 201, extends along the mounting channel 201, and is grounded. The second grounding component 300 is disposed at the bottom of the substrate lifting platform 100 and passes through the lifting shaft 200 to connect to the first grounding component 400. It is understood that both the first grounding component 400 and the second grounding component 300 are conductive structures used to ground the substrate lifting platform 100 and guide static charges away from the substrate lifting platform 100.
[0049] The substrate stage grounding structure of this embodiment uses a second grounding component 300 at the bottom of the substrate lifting stage 100 and a first grounding component 400 inside the lifting shaft 200. The second grounding component 300 is connected to the first grounding component 400 to ground the substrate lifting stage 100. Compared to traditional structures, since the lifting shaft 200 and the substrate lifting stage 100 remain relatively fixed, the first grounding component 400 and the second grounding component 300 also maintain a relatively fixed connection. They do not need to bend as the substrate lifting stage 100 rises and falls, solving the problems of high material requirements and limitations on the number of bends. This also avoids dust generation and improves processing quality. Furthermore, the first grounding component 400 is built into the lifting shaft 200, so it does not occupy the space below the substrate lifting stage 100. The first grounding component 400 and the second grounding component 300 can be connected as close as possible to the upper end of the lifting shaft 200, further freeing up space below the substrate lifting stage 100 and solving the space constraints of traditional structures.
[0050] It can be further understood that, in this embodiment, by leading the first grounding component 400 out from the inside of the lifting shaft 200, there is no need to open holes in the vacuum cavity to install the grounding structure, which helps to ensure the vacuum level of the applied vacuum cavity.
[0051] Reference Figures 2 to 4 In some embodiments of this utility model, the substrate lifting platform 100 is connected to an RF power supply, and an insulating plate 101 is provided between the second grounding component 300 and the substrate lifting platform 100 for separation. Since the substrate lifting platform 100 requires RF power to generate plasma, a potential difference exists between the substrate lifting platform 100 and the second grounding component 300. This embodiment, by providing the insulating plate 101, effectively isolates the substrate lifting platform 100 and the second grounding component 300, preventing voltage breakdown and arcing due to the potential difference. Therefore, it effectively ensures the safety and stability of the equipment.
[0052] In some embodiments of this utility model, the insulating plate 101 is a quartz structure, such as a quartz ceramic plate.
[0053] Reference Figures 2 to 5In some embodiments of this utility model, the second grounding component 300 includes a grounding plate 301, which is disposed around the bottom and outer periphery of the substrate lifting platform 100 to ensure that the static charge accumulated on the substrate lifting platform 100 is guided away in a timely manner. It is understood that the grounding plate 301 is a single plate structure, extending from the bottom of the substrate lifting platform 100 to its outer periphery, and is an electrically conductive structure. This embodiment, by covering the grounding plate 301, utilizes it as a carrier for static charge accumulation. Through the connection between the first grounding component 400 and the second grounding component 300, the static charge can be guided away in a timely manner, effectively and promptly solving the electrostatic problem on the substrate lifting platform 100.
[0054] Reference Figure 2 , Figure 3 and Figure 5 In some embodiments of this utility model, the second grounding assembly 300 further includes a plurality of grounding plates 302, which are distributed around the lifting shaft 200 on the lower end face of the grounding plate 301. The grounding plates 302 extend radially along the lifting shaft 200. The resistance of the grounding plates 302 is less than the resistance of the grounding plate 301. It is understood that if the grounding plate 301 is large in size, setting the grounding plate 301 to a structure with good conductivity will increase the overall production cost. In this embodiment, by further setting grounding plates 302 with better conductivity on the lower end face of the grounding plate 301, the material requirements of the grounding plate 301 can be reduced, while ensuring good electrostatic discharge performance.
[0055] Specifically, the grounding plate 301 can be made of aluminum or stainless steel, and the grounding plate 302 can be made of copper. Although the resistance of aluminum and stainless steel is much greater than that of copper, the cost is lower. Furthermore, since multiple grounding plates 302 are arranged around the lifting shaft 200 and extend radially along the shaft, they can act on the entire area of the grounding plate 301, quickly discharging the charge on the grounding plate 301 to ground, preventing the accumulation of static charge in localized areas due to excessive distance from the grounding plate 302.
[0056] In this embodiment, the grounding plate 302 can be fixed by means of screw installation, welding, inlay, etc., as long as the grounding plate 302 is in contact with the grounding plate 301.
[0057] Understandably, if the grounding plate 301 has good conductivity, then the grounding piece 302 may not be necessary to control production costs.
[0058] Reference Figure 5In some embodiments of this utility model, an extension portion 3021 is provided between two adjacent grounding plates 302 for interconnection, and the extension portion 3021 is made of the same material as the grounding plate 302. Using the structure of this embodiment, all the grounding plates 302 are connected by the extension portion 3021 to form a whole, facilitating connection with the first grounding assembly 400, eliminating the need for separate connections between each grounding plate 302 and the first grounding assembly 400.
[0059] Combination Figure 5 As shown, in some embodiments, all the grounding plates 302 and extensions 3021 are connected as a single structure. The extension 3021 forms a ring structure coaxially distributed with the lifting shaft 200, and the grounding plates 302 radiate from the outer periphery of the ring structure and extend to the edge of the grounding plate 301.
[0060] Reference Figure 3 In some embodiments of this utility model, the second grounding assembly 300 further includes a first connecting portion 303 and a second connecting portion 304. Specifically, the first connecting portion 303 is fixedly mounted on the lifting shaft 200 by welding or embedding. The first connecting portion 303 extends from the outside of the lifting shaft 200 through the side wall of the lifting shaft 200 into the mounting channel 201, thereby connecting the first grounding assembly 400 through one end of the first connecting portion 303 located in the mounting channel 201. The second connecting portion 304 connects the first connecting portion 303 and the grounding plate 302.
[0061] In this embodiment, the first connecting part 303 is fixedly mounted on the lifting shaft 200, which does not affect the airtightness of the inner and outer sides of the lifting shaft 200, and can effectively realize the connection between the second grounding component 300 and the external ground. Furthermore, the second connecting part 304 is used to connect the first connecting part 303 and the grounding plate 302, which conveniently avoids the connection position between the lifting shaft 200 and the substrate lifting platform 100, thus avoiding interference.
[0062] In some embodiments, the first connecting part 303 and the second connecting part 304 are both made of copper to cooperate with the grounding plate 302 to quickly conduct the charge to the ground.
[0063] It is understood that the first connecting part 303 in this embodiment is mainly for passing through the lifting shaft 200, and the second connecting part 304 is used for the connection between the grounding piece 302 and the first connecting part 303. In practical applications, the two can be set as an integral structure.
[0064] Reference Figure 3In some embodiments of this utility model, the lifting shaft 200 is configured as a hollow structure. An insulating sleeve 202 is coaxially disposed within the hollow interior of the lifting shaft 200, and an installation channel 201 is defined between the outer side of the insulating sleeve 202 and the inner sidewall of the lifting shaft 200. The insulating sleeve 202 can be used to house RF power supplies, cooling inlets, etc. By utilizing the hollow interior of the lifting shaft 200 to form the installation channel 201, the structural design of the lifting shaft 200 can be simplified. Furthermore, the installation channel 201 can be directly connected to the external atmosphere without the need for sealing, simplifying the internal structure of the lifting shaft 200 and reducing the internal vacuum requirements.
[0065] Reference Figure 3 In some embodiments, the first grounding component 400 is provided with a connecting copper plate 401. One end of the connecting copper plate 401 is connected to the first connecting part 303, and the other end extends from inside the lifting shaft 200 to the outside and is grounded.
[0066] Reference Figure 4 In some embodiments of this utility model, the first grounding component 400 and the lifting shaft 200 are connected as a single unit, and the second grounding component 300 is connected to the lifting shaft 200. It can be understood that, with the structural configuration of this embodiment, the lifting shaft 200 is used as a conductor for the second grounding component 300 to conduct electricity.
[0067] An embodiment of this utility model also proposes a semiconductor manufacturing equipment, including a substrate grounding structure of any of the above structures.
[0068] It is understood that the semiconductor manufacturing equipment of this embodiment, by applying the above-described substrate stage grounding structure, can solve the problems of high material requirements and limited bending times in traditional structures, while also avoiding dust problems and improving processing quality. Furthermore, it can free up space below the substrate lifting stage 100, addressing the space constraints of traditional structures.
[0069] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof can be combined with each other unless otherwise specified.
Claims
1. A substrate stage grounding structure, characterized in that, include: Substrate lifting platform; A lifting shaft is connected to the center of the bottom of the substrate lifting platform; A first grounding component is disposed within the lifting shaft; The second grounding component is disposed at the bottom of the substrate lifting platform and connected to the first grounding component.
2. The substrate stage grounding structure according to claim 1, characterized in that, The substrate lifting platform is connected to an RF power supply, and an insulating plate is provided between the second grounding component and the substrate lifting platform for separation.
3. The substrate stage grounding structure according to claim 2, characterized in that, The insulating plate is of quartz structure.
4. The substrate stage grounding structure according to claim 1, characterized in that, The second grounding component includes a grounding plate, which is disposed around the bottom and outer periphery of the substrate lifting platform.
5. The substrate stage grounding structure according to claim 4, characterized in that, The second grounding assembly further includes a plurality of grounding plates, which are distributed around the lifting shaft on the lower end face of the grounding plate. The grounding plates extend radially along the lifting shaft, and the resistance of the grounding plates is less than the resistance of the grounding plate.
6. The substrate stage grounding structure according to claim 5, characterized in that, An extension is provided between two adjacent grounding plates for interconnection, and the extension is made of the same material as the grounding plate.
7. The substrate stage grounding structure according to claim 5, characterized in that, The lifting shaft internally defines an installation channel, the first grounding component is disposed within the installation channel, and the second grounding component further includes: The first connecting part is fixedly disposed on the lifting shaft and extends from the outside of the lifting shaft through the side wall of the lifting shaft into the mounting channel. One end of the first connecting part located in the mounting channel is connected to the first grounding component. The second connection part is connected between the first connection part and the grounding piece.
8. The substrate stage grounding structure according to claim 1, characterized in that, The lifting shaft is configured as a hollow structure. The substrate stage grounding structure is coaxially provided with an insulating sleeve inside the hollow lifting shaft. An installation channel is defined between the outer side of the insulating sleeve and the inner sidewall of the lifting shaft. The first grounding component is disposed in the installation channel.
9. The substrate stage grounding structure according to claim 1, characterized in that, The first grounding component is integrated with the lifting shaft, and the second grounding component is connected to the lifting shaft.
10. A semiconductor manufacturing apparatus, characterized in that, Includes the substrate grounding structure as described in any one of claims 1 to 9.