A low stray inductance high current output interface and board

Abstract

The application discloses a low-stray inductance large-current output interface and a board card. The output interface comprises a PCB board, a positive conductor block arranged on one side of the PCB board, and a negative conductor block arranged on the other side of the PCB board. The positive conductor block and the negative conductor block at least partially overlap in the orthographic projection on the PCB board. The welding ends of the positive conductor block and the negative conductor block respectively comprise at least one welding terminal for electrically connecting with the internal circuit of the PCB board. The interface ends of the positive conductor block and the negative conductor block are arranged close to the edge position of the PCB board and are respectively provided with a plurality of connecting holes for connecting male pins. The positive conductor block and the negative conductor block are respectively provided with a step part parallel to the plane of the PCB board. The step part is arranged close to the welding terminal. The space formed by the step part and the PCB board is used for mounting a current probe. The application can solve the problems of high stray inductance, insufficient current-carrying capacity and poor safety in the prior art.

Description

Technical Field

[0001] This application relates to the field of power device testing technology, specifically to a low stray inductance high current output interface and board. Background Technology

[0002] Since the 1970s, semiconductor power devices have experienced rapid development and have become a core component of various power electronic systems worldwide. Currently, the development of power semiconductor devices is continuously advancing towards higher power, higher voltage, higher efficiency, and higher switching frequencies. In high-power power electronic devices, traditional high-current interface terminals generally suffer from large parasitic inductance and uneven current distribution, which can easily cause voltage overshoot at the moment of switching device turn-off, thus threatening the safe operation of the switching device.

[0003] Existing high-current output interfaces still face problems such as high stray inductance, insufficient current carrying capacity, and poor safety. Therefore, under the premise of being compatible with the existing interface layout, how to design a high-current output interface structure with low stray inductance and high current carrying capacity to effectively suppress voltage overshoot and improve the safety and stability of semiconductor testing has become a key technical problem that urgently needs to be solved. Utility Model Content

[0004] In view of this, the main objective of this application is to provide a low stray inductance, high current output interface, which helps to solve the problems of high stray inductance, insufficient current carrying capacity and poor safety in the prior art.

[0005] This application provides a low stray inductance, high current output interface, which includes:

[0006] A PCB board; a positive conductor block disposed on one side of the PCB board; a negative conductor block disposed on the other side of the PCB board, the orthographic projections of the positive and negative conductor blocks on the PCB board at least partially overlap; the soldering ends of the positive and negative conductor blocks each include at least one soldering terminal for electrical connection with the internal circuitry of the PCB board, the interface ends of the positive and negative conductor blocks are disposed near the edge of the PCB board and are each provided with multiple connection holes for connecting male pins; the positive and negative conductor blocks are each provided with a stepped portion parallel to the plane of the PCB board, the space formed by the stepped portion and the PCB board is used to install a current probe, wherein the stepped portion is disposed near the soldering terminal.

[0007] As shown above, the overall structure of this low stray inductance high current output interface consists of a positive conductor block, a PCB board, and a negative conductor block from top to bottom. The positive and negative conductor blocks are connected to the PCB board via solder terminals and are placed on opposite sides of the PCB board, allowing compatibility with older versions of the output interface. The positive and negative conductor blocks form a stacked structure, making the current loops run in opposite parallel directions, reducing the loop area, and thus reducing the stray inductance of the busbar formed by the positive conductor block, PCB board, and negative conductor block. At least one solder terminal has a stronger current carrying capacity and a larger cross-sectional area. The stepped design allows the current probe to pass through and surround the solder terminal, facilitating the testing of the overall current of the PCB board. The stepped design also avoids adding extra structures to the PCB board, thus avoiding the introduction of additional stray inductance and further reducing the system's stray inductance.

[0008] Optionally, the soldering terminal is a raised structure provided on the positive conductor block and the negative conductor block and facing one side of the PCB board. A through hole matching the raised structure is provided at the corresponding position on the PCB board. The raised structure is inserted into the through hole to be fixed to the PCB board.

[0009] As shown above, the soldering terminal has a raised structure. The raised structure is inserted into the through hole and extends to the other side of the PCB board. It is fastened to the through hole on the PCB board by soldering and is electrically connected to the internal circuit of the PCB board to achieve mechanical fixation and electrical conduction. Among these, the soldering method is preferred, with better fixation effect. Compared with the surface mount method, it has greater fixation strength and stronger resistance to insertion and extraction forces.

[0010] Optionally, a crown spring hole structure is provided inside the connecting hole.

[0011] As shown above, a crown spring hole is installed inside the connection hole, which can be compatible with banana plugs or male connectors, increasing the current carrying capacity and meeting the needs of larger current measurement; the size of the PCB board and the position of the banana plug or male connector are fixed, ensuring good compatibility.

[0012] Optionally, the main body parts of the positive conductor block and the negative conductor block have the same shape and size and are completely overlapped.

[0013] As shown above, the main body of the positive and negative conductor blocks is set as a rectangle, which results in better overlap and smaller parasitic inductance.

[0014] Optionally, the low stray inductance high current output interface also includes:

[0015] An insulating shell is provided on the outside of the positive conductor block, the negative conductor block and the PCB board. The insulating shell has an opening at the position corresponding to the connection hole to allow the male pin to pass through.

[0016] The interface ends of the positive conductor block and the negative conductor block are respectively provided with first mounting holes, and the main body parts of the positive conductor block and the negative conductor block are respectively provided with second mounting holes. The first mounting holes and the second mounting holes are used to assemble the insulating shell.

[0017] As shown above, the mounting holes are for fixing the insulating shell, and it is secured with insulating screws; by setting up the insulating shell, the safe use of this low stray inductance high current output interface can be ensured; the insulating shell has an opening that allows the male pin to pass through, in order to ensure operational safety.

[0018] Optionally, the main body of the positive conductor block and the negative conductor block is provided with a foolproof boss.

[0019] As described above, the design of the foolproof boss can prevent incorrect assembly of the positive and negative terminals, and when the foolproof boss is set on the side surface of the conductor block facing the PCB board, it can also provide a positioning function.

[0020] Optionally, the connection holes on the positive conductor block correspond one-to-one with the connection holes on the negative conductor block, and their orthogonal projections on the PCB board overlap.

[0021] Therefore, the smaller the distance between the connection holes on the sides of the positive and negative conductor blocks for inserting male pins, the better. The connection holes on the positive and negative conductor blocks should correspond one-to-one and completely overlap in the direction perpendicular to the PCB board. Compared with the staggered setting, the parasitic inductance is smaller, which is a more preferred setting.

[0022] Optionally, the positive and negative conductor blocks are made of copper and their surfaces are silver-plated.

[0023] As shown above, copper has good electrical conductivity. Silver plating on the surfaces of the positive and negative conductor blocks can prevent copper oxidation. Compared to gold plating, it is less expensive, and compared to nickel plating, it has better conductivity during welding.

[0024] This application also provides a board for a semiconductor testing device, wherein the board integrates a low stray inductance high current output interface as described in any of the above claims.

[0025] As shown above, the board integrates a low stray inductance, high current output interface for inserting the test head upwards and connecting it to the test head board to achieve power output and signal transmission.

[0026] Optionally, branch output interfaces are provided on the board at both ends of the low stray inductance high current output interface.

[0027] Therefore, the branch output interface can be used as a branch routing channel for output signals.

[0028] In summary, the low stray inductance high-current output interface provided in this application includes a PCB board, a positive conductor block disposed on the front side of the PCB board, and a negative conductor block disposed on the back side of the PCB board. The orthogonal projections of the positive and negative conductor blocks on the PCB board at least partially overlap, preferably the main bodies of the positive and negative conductor blocks completely overlap. Setting the main body of the conductor block as a rectangle improves the overlap and reduces parasitic inductance. The distance between the connection holes for inserting male pins on the sides of the positive and negative conductor blocks should be as small as possible. The connection holes on the positive and negative conductor blocks correspond one-to-one. Complete overlap in the vertical direction of the PCB results in lower parasitic inductance. Solder terminals are provided on the positive and negative conductor blocks for electrical connection to internal PCB circuitry. These terminals can be raised structures, fixed to corresponding through-holes on the PCB by soldering, or they can be sheet-like structures, secured to the corresponding through-holes on the PCB by screws. Soldering is preferred for its better fixing effect and greater strength compared to surface-mount technology, offering stronger resistance to insertion and extraction forces. Preferably, two solder terminals are provided for increased current carrying capacity and horizontal... The cross-sectional area is larger; the positive and negative conductor blocks also have stepped sections roughly parallel to the plane of the PCB board for mounting current probes, thus avoiding the introduction of additional stray inductance by adding extra structures to the PCB board; the positive and negative conductor blocks are preferably made of copper, more preferably, with a silver plating layer on the outside of the copper; the internal parts of the connection holes of the positive and negative conductor blocks are made of brass or copper, and the surfaces of the positive and negative conductor blocks are silver-plated to prevent copper oxidation, which is less expensive than gold plating and has better solder conductivity than nickel plating; the connection holes of the positive and negative conductor blocks are fitted with crown spring holes to accommodate banana plugs. Preferably, each conductor block has six connection holes on its side, which increases the current carrying capacity to meet the needs of larger current measurements. Furthermore, the PCB board size and the position of the banana plug or male connector are fixed, resulting in better compatibility. The positive and negative conductor blocks also have anti-foolproof protrusions to prevent incorrect installation and to serve a positioning function. Conductive holes are also provided on the PCB board at its edge, serving as branches for the output interface and allowing for use with other test items. This low stray inductance, high-current output interface is also encased in an insulating shell to ensure safe operation. Attached Figure Description

[0029] The various technical features of this application and their relationships will be further explained below with reference to the accompanying drawings. The drawings are exemplary; some technical features are not shown to scale, and some drawings may omit technical features commonly used in the art to which this application pertains that are not essential for understanding and implementing this application, or additionally show technical features that are not essential for understanding and implementing this application. In other words, the combination of various technical features shown in the drawings is not intended to limit this application. Furthermore, throughout this application, the same reference numerals refer to the same things. Specific descriptions of the drawings are as follows:

[0030] Figure 1 This is a front view of a specific embodiment of a low stray inductance high current output interface in this application;

[0031] Figure 2 This is a top view of a specific embodiment of a low stray inductance high current output interface in this application;

[0032] Figures 3a-3c This is a structural diagram of the positive or negative conductor block in this application;

[0033] Figure 4 This is a structural diagram of the crown spring hole in this application;

[0034] Figure 5 This is a top view of another specific embodiment of a low stray inductance high current output interface in this application;

[0035] Figure 6 This is a structural diagram of another specific embodiment of a low stray inductance high current output interface in this application;

[0036] Figure 7 This is a front view of another specific embodiment of a low stray inductance high current output interface in this application.

[0037] Explanation of reference numerals in the attached figures

[0038] 1-Positive conductor block, 101-Welding terminal, 102-Step portion, 103-Anti-foolproof boss, 104-Connecting hole, 105-First mounting hole, 106-Second mounting hole, 2-Negative conductor block, 3-PCB board, 301-Conductive hole.

[0039] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0040] The preferred embodiments of this application will now be described in detail with reference to the accompanying drawings, so that the advantages and features of this application can be more easily understood by those skilled in the art, thereby providing a clearer and more definite definition of the scope of protection of this application.

[0041] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0042] It should be noted that in the description herein, the terms "middle," "front," "back," "top," "bottom," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0043] Furthermore, the terms "installation," "setup," "equipped with," "connection," "linked," "socketed," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection; they can refer to a direct connection, or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0044] It should be noted that in the field of printed circuit boards (PCBs), the side of a PCB typically used for mounting components is called the front layer (i.e., the top layer), also known as the component side; the side opposite the front layer, which is usually used for contact with solder, is called the bottom layer, also known as the solder side. In this application, for ease of description, the front and bottom layers can be used to describe this embodiment.

[0045] To clearly illustrate the implementation of this application, the structures shown in the accompanying drawings are merely illustrative of preferred embodiments of this application and are not intended to limit the technical solutions of this application. Some details (such as specific dimensions, shapes, or connection methods) may be simplified or omitted, and should not be presumed to be an undue limitation on the scope of protection of this application. For the omitted parts or details that are not precisely represented, those skilled in the art can understand and implement them based on the content of this application and conventional technical means.

[0046] The purpose of this application is to overcome the shortcomings of existing technologies and provide a low-stray-inductance, high-current output interface. By integrating the output interface, the current distribution is more uniform, the spacing between the PN output interfaces is shortened, the current loop area is reduced, and the contact area between the output interface and the male connector is increased, thereby reducing stray inductance. Currently, the parasitic inductance level of industry output interfaces is around 20nH, while the parasitic inductance of the newly designed interface in this application can reach less than 5nH. This reduces the overall system stray inductance, suppresses voltage overshoot under high power conditions, ensures that the device under test is not easily damaged, and further improves the stability and safety of the test.

[0047] Because chips are now more powerful and have higher current-carrying capacity, testing equipment also needs to meet new requirements. Existing customers want to be compatible with early boards such as THB (Test Head Board) and have compatible output interface positions, while improving current-carrying capacity and other indicators.

[0048] In this application, the design of the stacked structure and soldered terminals can reduce parasitic inductance. Replacing the individual banana plugs with a single copper block, i.e., a positive conductor block and a negative conductor block, provides better current sharing. Furthermore, these blocks are positioned on both sides of the PCB board, forming a stacked structure that ensures the current loops are antiparallel, thus reducing parasitic inductance. Simulations predict that the parasitic inductance can be reduced to within 5nH.

[0049] The probe can be fixed by the stepped design of the positive and negative conductor blocks, eliminating the need to cut grooves on the PCB board and solder copper sheets to fix the probe. This avoids generating additional parasitic inductance. The structural design is both functional and reduces the parasitic inductance of the system (parasitic inductance is a key indicator; excessive parasitic inductance may damage the device under test and the equipment, and the device will generate a high spike when it is turned off. This design structure can improve safety).

[0050] This application integrates the output interface design, and the output interface is compatible with the plug position, increasing the current carrying capacity. The number of male pins is increased to match the number of male pins, and the male pins are upgraded (custom-made, smooth-surfaced male pins, which can also be used with older male pins) and the output interface structure are improved. The output interface adopts a structure combining a copper block and a crown spring hole, increasing the current carrying capacity and enabling it to handle 18kA pulse current.

[0051] The technical solutions of this application and how they solve the aforementioned technical problems will be described in detail below with specific embodiments. The specific embodiments described below can be combined with each other to form new embodiments. The same or similar ideas or processes described in one embodiment may not be repeated in other embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0052] This application provides a low stray inductance, high current output interface, such as... Figure 1-2 as well as Figure 5-7 As shown, it includes: a PCB board 3; a positive conductor block 1 disposed on one side of the PCB board 3; a negative conductor block 2 disposed on the other side of the PCB board 3, the orthographic projections of the positive conductor block 1 and the negative conductor block 2 on the PCB board 3 at least partially overlap; the soldering ends of the positive conductor block 1 and the negative conductor block 2 each include at least one soldering terminal 101 for electrical connection with the internal circuitry of the PCB board 3, the interface ends of the positive conductor block 1 and the negative conductor block 2 are disposed near the edge of the PCB board 3, and are respectively provided with a plurality of connection holes 104 for connecting male pins; the positive conductor block 1 and the negative conductor block 2 are respectively provided with a step portion 102 parallel to the plane of the PCB board 3, the space formed by the step portion 102 and the PCB board 3 is used to install a current probe, wherein the step portion 102 is disposed near the soldering terminal 101.

[0053] Specifically, the overall structure of this low stray inductance high current output interface consists of a positive conductor block 1, a PCB board 3, and a negative conductor block 2 from top to bottom. The positive conductor block 1 and the negative conductor block 2 are connected to the PCB board 3 via solder terminals and are placed on opposite sides of the PCB board 3, respectively, which is compatible with the output interface positions of the customer's old version. The positive conductor block 1 and the negative conductor block 2 can form a stacked structure, making the current loop run in opposite parallel directions, reducing the loop area, thereby reducing the stray inductance of the busbar formed by the positive conductor block 1, the PCB board 3, and the negative conductor block 2. At least one solder terminal has a stronger current carrying capacity and a larger cross-sectional area. The stepped design can avoid adding extra structures to the PCB board 3, thereby avoiding the introduction of additional stray inductance and further reducing the stray inductance of the system.

[0054] The positive conductor block 1 and the negative conductor block 2 are respectively provided with stepped portions 102 parallel to the plane of the PCB board 3, such as... Figures 3a-3cAs shown, the main body of the positive conductor block 1 and the negative conductor block 2 is rectangular. On the positive conductor block 1 or the negative conductor block 2, adjacent to the welding terminal 101, that is, at the edge of the main body of the positive conductor block 1 or the negative conductor block 2, a long strip-shaped notch is cut along its width. The step portion 102 formed by the long strip-shaped notch has two mutually perpendicular surfaces. One surface is parallel to the surface on the positive conductor block 1 or the negative conductor block 2 where the anti-foolproof protrusion 103 is provided, and the other surface is parallel to the surface on the positive conductor block 1 or the negative conductor block 2 where the connection hole 104 is provided. When the positive conductor block 1 or the negative conductor block 2 is welded to the PCB board 3 through the welding terminal, the step portion 102 and the PCB board 3 form a rectangular slot with an opening facing the welding terminal 101. That is, one surface of the step portion 102 is parallel to the plane of the PCB board 3, and the other surface of the step portion 102 is perpendicular to the plane of the PCB board 3.

[0055] In another specific embodiment of this application, such as Figure 5-6 As shown, the positive conductor block 1 and the negative conductor block 2 are generally shaped like a cleaver, with one side shaped like a handle and the other side shaped like a blade. A slot is provided below the protruding part of the blade-shaped section; this slot is used to install a current probe, which is equivalent to including, for example, [the following is a description of a cleaver]. Figure 1 -3. The stepped portion 102 in the embodiment described. Figure 6 The step portion 102 shown is arranged parallel to the plane of the PCB board. It can be understood that the step portion 102 is the top wall of the aforementioned slot away from the PCB board 3, and the top wall extends in a direction parallel to the plane of the PCB board 3. Figure 6 The welding terminal of the negative conductor block 2 shown is located at Figure 6 At point N, the step portion 102 is positioned close to the welding terminal located at point N. Figure 6 The solder terminal 101 located at point P is the positive conductor block 1 located on the side of the PCB board closest to the paper surface. Figure 6 The protruding structure (not shown) on the PCB board 3 allows the solder terminal 101 to pass through the through hole corresponding to point P on the PCB board 3 for fixation. The above-described current probe can be installed by passing through... Figure 6 The space formed by the stepped portion 102 and the PCB board, that is, through the above-mentioned slot, is set around the solder terminal 101 at point P. This setting makes current testing more convenient.

[0056] Furthermore, PCB board 3 has opposing front and back sides, and its edge area has multiple through holes for electrical connections and mechanical fixation. The size and interface position design of PCB board 3 are compatible with the installation layout of early boards in existing THB (Test Head Board) systems, ensuring interoperability between new and old equipment.

[0057] Furthermore, the positive conductor block 1 is disposed on the front side of the PCB board 3, and the negative conductor block 2 is disposed on the back side of the PCB board 3. Both the positive conductor block 1 and the negative conductor block 2 are integrally formed rectangular copper blocks with identical shapes and dimensions, and their orthogonal projections on the PCB board 3 completely overlap, forming an upper and lower stacked structure. This stacked structure causes the forward current and return current to run in opposite parallel directions, significantly reducing the current loop area and thus effectively reducing the overall stray inductance. Simulation verification shows that the parasitic inductance of this structure can be controlled within 5nH, far lower than the approximately 20nH level of the traditional banana plug structure.

[0058] Optionally, the welding terminal is a raised structure provided on the positive conductor block 1 and the negative conductor block 2 and facing the PCB board 3. A through hole matching the raised structure is provided at the corresponding position on the PCB board 3. The raised structure is inserted into the through hole to be fixed with the PCB board 3.

[0059] Specifically, the welding terminal is a raised structure that is inserted into the through hole and extends to the other side of the PCB board 3. It is then fastened to the through hole on the PCB board 3 by welding and electrically connected to the internal circuit of the PCB board 3 to achieve mechanical fixation and electrical conduction. Among these, the welding method is preferred, as it provides better fixation and greater fixation strength compared to the surface mount method, and is more resistant to insertion and extraction forces.

[0060] In one specific embodiment, the soldering terminal can be a raised structure, which is fastened to the through hole on the PCB board 3 by soldering and electrically connected to the internal circuitry of the PCB board 3; the soldering terminal can also be a sheet structure, which is fastened to the through hole on the PCB board 3 by screws. Among these, the soldering method is more preferred, as it provides better fixing effect and greater fixing strength and resistance to insertion and extraction forces compared to surface mount technology.

[0061] When the soldering terminals adopt a sheet-like structure, i.e., a sheet-like metal arm, it is fastened to the positive and negative conductor blocks by screws passing through the through holes of PCB board 3, achieving mechanical fixation and electrical conduction. This solution is suitable for scenarios with special restrictions on the soldering process.

[0062] Preferably, two welding terminals are provided, which have stronger current carrying capacity and larger cross-sectional area. Considering factors such as withstand voltage, electrical clearance, creepage capability, and current, two welding terminals are the most effective.

[0063] In one specific embodiment, the positive conductor block 1 is provided with two protruding welding terminals, and the negative conductor block 2 is also provided with two protruding welding terminals. The PCB board 3 has four through holes arranged side-by-side, corresponding to the four welding terminals, wherein the positive and negative terminals are arranged alternately, as shown below. Figure 2As shown, P (Positive) represents the positive electrode and N (Negative) represents the negative electrode. The two solder terminals on the positive electrode conductor block 1 and the two solder terminals on the negative electrode conductor block 2 are arranged alternately on the through holes on the front and back sides of the PCB board 3.

[0064] Optionally, a crown spring hole structure is provided inside the connecting hole 104.

[0065] Specifically, a crown spring hole is installed inside the connecting hole 104, such as... Figure 4 In the illustrated embodiment, the crown spring hole structure has a spring-loaded hole with threads. This crown spring hole structure is compatible with banana plugs, increasing current carrying capacity and meeting the needs of larger current measurements. The dimensions of the PCB board 3 and the position of the banana plug or male connector are fixed, ensuring good compatibility.

[0066] In such Figure 5-7 In the specific embodiment shown, the connection hole 104 on the positive conductor block 1 is staggered from the connection hole 104 on the negative conductor block 2. For example... Figure 5-6 As shown, the positive conductor block 1 and the negative conductor block 2 are generally shaped like a cleaver. One side of the positive conductor block 1 and the negative conductor block 2 is shaped like a handle, and the other side is shaped like a blade. A welding terminal 101 is provided on the protruding part of the blade-shaped part. The welding terminals 101 of the positive conductor block 1 and the negative conductor block 2 are staggered on the PCB board 3. The blade-shaped protruding parts of the positive conductor block 1 and the negative conductor block 2 do not overlap, and the welding terminals 101 are staggered and do not overlap. The orthographic projections of the handle-shaped part and the parallel part of the positive conductor block 1 and the negative conductor block 2 on the PCB board 3 overlap. Therefore, the connection holes 104 of the positive conductor block 1 and the negative conductor block 2 are also staggered (see...). Figure 7 ).

[0067] Optionally, the main bodies of the positive conductor block 1 and the negative conductor block 2 have the same shape and size and are completely overlapped.

[0068] Specifically, the main bodies of the positive conductor block 1 and the negative conductor block 2 are set as rectangles, which have better overlap and smaller parasitic inductance.

[0069] Preferably, the connection hole 104 on the positive conductor block 1 corresponds one-to-one with the connection hole 104 on the negative conductor block 2, and their orthogonal projections on the PCB board 3 overlap.

[0070] Specifically, the smaller the distance between the connection holes on the sides of the positive and negative conductor blocks for inserting male pins, the better. The connection holes on the positive and negative conductor blocks correspond one-to-one and completely overlap in the direction perpendicular to the PCB board 3. Compared with the staggered setting, its parasitic inductance is smaller, which is a more preferred setting.

[0071] As shown above, designing the main body of the positive and negative conductor blocks as rectangular results in better overlap and lower parasitic inductance compared to a knife-shaped conductor block. The smaller the distance between the connection holes 104 for inserting the male pins on the sides of the positive and negative conductor blocks, the better. Figure 1 In the middle, the upper and lower connecting holes 104 correspond one-to-one and completely overlap in the direction perpendicular to the PCB board 3. Compared with the staggered setting of connecting holes, its parasitic inductance is smaller and more preferred.

[0072] Optionally, the main body of the positive conductor block 1 and the negative conductor block 2 is provided with a foolproof protrusion 103.

[0073] Specifically, the design of the foolproof boss 103 is designed to prevent incorrect assembly of the positive and negative terminals, and when the foolproof boss is positioned on the side of the conductor block facing the PCB board, it also provides a positioning function. For example... Figure 3a As shown, there are two anti-foolproof bosses 103.

[0074] Optionally, the low stray inductance high current output interface further includes: an insulating shell, which is disposed outside the positive conductor block 1, the negative conductor block 2 and the PCB board 3, and the insulating shell has an opening at the position corresponding to the connection hole 104 to allow the male pin to pass through; the interface ends of the positive conductor block 1 and the negative conductor block 2 are respectively provided with a first mounting hole 105, and the main body of the positive conductor block 1 and the negative conductor block 2 are respectively provided with a second mounting hole 106, the first mounting hole 105 and the second mounting hole 106 are used to assemble the insulating shell.

[0075] Specifically, the mounting holes are for securing the insulating shell, which is then secured with insulating screws. The insulating shell ensures the safe use of this low stray inductance, high current output interface. The insulating shell has an opening that allows the male pin to pass through, ensuring operational safety.

[0076] In such Figures 3a-3c In the specific embodiment shown, the main body portions of the positive conductor block 1 and the negative conductor block 2 are respectively provided with second mounting holes 106. The number of second mounting holes 106 can be one or two. The second mounting holes 106 can be smooth through holes or threaded holes. The first mounting holes 105 are vertically disposed on the interface ends of the positive and negative conductor blocks, and the second mounting holes 106 are vertically disposed on the main body portions of the positive and negative conductor blocks. The first mounting holes 105 and the second mounting holes 106 are spatially perpendicular. There are two first mounting holes 105, located on both sides of the interface ends of the positive and negative conductor blocks, respectively. The second mounting hole 106 is located between the two anti-foolproof bosses 103.

[0077] In such Figure 7In the specific embodiment shown, the sides of the positive electrode conductor block 1 and the negative electrode conductor block 2 that are provided with the connection hole 104 are also provided with first mounting holes 105 at intervals to install the insulating shell. Figure 7 The first mounting holes 105 in the upper and lower parts are staggered to ensure a stable installation of the insulating shell. Figure 7 A second mounting hole 106 may be provided on the positive conductor block 1 and the negative conductor block 2, or it may not be provided. Figure 7 The second mounting hole 106 is not provided.

[0078] Optionally, the positive conductor block 1 and the negative conductor block 2 are made of copper and their surfaces are plated with silver.

[0079] Specifically, copper has good electrical conductivity. The surfaces of the positive conductor block 1 and the negative conductor block 2 are plated with silver to prevent copper oxidation. This method is cheaper than gold plating and has better solder conductivity than nickel plating.

[0080] Preferably, the positive conductor block 1 and the negative conductor block 2 are made of brass; although theoretically, copper has better conductivity, it is softer and more difficult to machine when adding a spring inside the crown spring hole. The surfaces of the positive conductor block 1 and the negative conductor block 2 are silver-plated to prevent copper oxidation and scratches on the copper layer.

[0081] Furthermore, both the positive electrode conductor block 1 and the negative electrode conductor block 2 are made of brass, with a silver plating layer thickness of 3–5 μm. The silver plating effectively prevents copper oxidation and improves the conductivity of the contact surface.

[0082] Optionally, in the positive conductor block 1 and the negative conductor block 2, the number of connection holes 104 on each interface end is not less than 6.

[0083] Specifically, each conductor block is provided with no less than 6 connection holes to increase the number of contact points, improve the current carrying capacity, and meet the requirements of 18kA pulse current testing.

[0084] It should be noted that the number of connection holes 104 can be adjusted according to the actual current requirements. For example, in small and medium current applications, it can be set to 4 on each side, while still maintaining good current sharing and low contact resistance.

[0085] Figures 3a-3c The structure of either the positive conductor block 1 or the negative conductor block 2 in one specific embodiment is shown.

[0086] The positive conductor block 1 and the negative conductor block 2 have soldering ends near the center of the PCB board 3. These soldering ends have two soldering terminals 101 facing the PCB board 3. Matching through holes are formed at corresponding positions on the PCB board 3. The soldering terminals 101 are inserted into the through holes and partially protrude to the other side of the PCB board 3, where they are securely connected to the internal circuitry of the PCB board 3 via reflow soldering or manual soldering. The two soldering terminals 101, employing a dual-pin design, ensure sufficient current-carrying cross-sectional area while also considering electrical clearance, creepage distance, and mechanical strength, making it superior to single-pin or multi-pin designs.

[0087] The positive conductor block 1 and the negative conductor block 2 have an interface end near the edge of the PCB board 3. This interface end has six horizontally arranged connection holes 104 for inserting male pins. Each connection hole 104 contains a crown spring structure with multi-lobed elastic contact pieces, which can form multi-point contact with the male pin, significantly increasing the contact area, improving conductivity reliability, and being compatible with standard banana plugs. This design allows the output interface to withstand pulse currents up to 18kA, meeting the testing requirements of high-power semiconductor devices.

[0088] Furthermore, the interface between the positive conductor block 1 and the negative conductor block 2 is provided with a stepped portion 102 that is approximately parallel to the plane of the PCB board 3. This stepped portion 102 can be used to clamp and fix the current probe, enabling real-time monitoring of the output current during testing. This integrated design avoids the problem of increased parasitic inductance caused by additional slots and soldering of copper sheets on the PCB board 3, which helps maintain the low stray inductance characteristics of the system.

[0089] To prevent incorrect assembly of the positive and negative conductor blocks, this embodiment provides two anti-misfit bosses 103 on both the positive conductor block 1 and the negative conductor block 2 (see [link]). Figures 3a-3c The foolproof boss 103 allows only the positive and negative conductor blocks to be installed in the only correct direction, and also has a positioning function, improving assembly efficiency and reliability.

[0090] In addition, the low stray inductance, high-current output interface also includes an insulating shell (not shown), which is made of high-temperature resistant engineering plastic and covers the outer periphery of the positive conductor block 1, the negative conductor block 2, and the PCB board 3. The insulating shell is fixed in place by insulating screws through mounting holes provided on the positive and negative conductor blocks. The insulating shell has openings at the corresponding connection holes to allow male pins to pass through, which ensures the safety of operators and prevents foreign objects from entering and causing short circuits.

[0091] This application also provides a board for semiconductor testing equipment, wherein the board integrates a low stray inductance high current output interface as described in any of the above claims, for insertion upwards and through a TIB board (Test Interface Board, TIB) and docking with a THB board (Test Head Board, THB) to realize power output and signal transmission, and can also be used to provide stable, safe and low noise power output in high current pulse testing.

[0092] Optionally, branch output interfaces are provided on the board at both ends of the low stray inductance high current output interface.

[0093] Specifically, the branch output interface can be used as a branch routing channel for output signals.

[0094] Furthermore, conductive vias 301 are also provided on the edge area of ​​the PCB board. Figure 2 The PL and NL labels in the text are related to... Figure 5-6 The PL and NL designations in the diagram both represent conductive via 301. Conductive via 301 is located at both ends of the low stray inductance high current output interface. Branch output interfaces are soldered onto conductive via 301, which can be used as branch traces for the output signals of the main output path. They can be used for other test items without affecting the low stray inductance performance of the main power path.

[0095] Application scenarios: This low stray inductance, high current output interface is located on the board and is used inside the test head of semiconductor test equipment, for example, when the board is inserted upwards into the test head, passing through the TIB board to interface with the THB board.

[0096] In summary, the low stray inductance high current output interface provided in this application includes a PCB board, a positive conductor block disposed on the front side of the PCB board, and a negative conductor block disposed on the back side of the PCB board. The orthogonal projections of the positive and negative conductor blocks on the PCB board at least partially overlap, preferably the main bodies of the positive and negative conductor blocks completely overlap. Setting the main body of the conductor block as a rectangle improves the overlap and reduces parasitic inductance. The distance between the connection holes for inserting male pins on the sides of the positive and negative conductor blocks should be as small as possible, and the connection holes on the positive and negative conductor blocks correspond one-to-one. The conductors completely overlap in the direction perpendicular to the PCB board, resulting in lower parasitic inductance. Soldering terminals are provided on the positive and negative conductor blocks for electrical connection to internal circuitry on the PCB board. These terminals can be raised structures, fixed to corresponding through-holes on the PCB board by soldering, or they can be sheet-like structures, secured to the corresponding through-holes on the PCB board with screws. Soldering is preferred due to its better fixing effect and greater strength compared to surface-mount technology, providing stronger resistance to insertion and extraction forces. Preferably, two soldering terminals are provided for increased current carrying capacity. The cross-sectional area is larger; the positive and negative conductor blocks also have stepped sections roughly parallel to the plane of the PCB board for mounting current probes, thus avoiding the introduction of additional stray inductance by adding extra structures to the PCB board; the positive and negative conductor blocks are preferably made of copper, more preferably, with a silver plating layer on the outside of the copper; the internal parts of the connection holes of the positive and negative conductor blocks are made of brass or copper, and the surfaces of the positive and negative conductor blocks are silver-plated to prevent copper oxidation, which is cheaper than gold plating and has better solder conductivity than nickel plating; crown spring holes are installed in the connection holes of the positive and negative conductor blocks to accommodate banana plugs. Preferably, each conductor block has six connection holes on its side, which increases the current carrying capacity to meet the needs of larger current measurements. Furthermore, the PCB board size and the position of the banana plug or male connector are fixed, resulting in better compatibility. The positive and negative conductor blocks also have anti-foolproof protrusions to prevent incorrect installation and to serve a positioning function. Conductive holes are also provided on the PCB board at its edge, serving as branches for the output interface and allowing for use with other test items. This low stray inductance, high-current output interface is also encased in an insulating shell to ensure safe operation.

[0097] Unless otherwise defined, all technical and scientific terms used throughout this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. In case of any inconsistency, the meaning as stated in this application or derived from the content described herein shall prevail. Furthermore, the terminology used in this description is for the purpose of describing embodiments of this application only and is not intended to limit this application.

[0098] Note that the above are merely preferred embodiments and the technical principles employed in this application. Those skilled in the art will understand that this application is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of this application. Therefore, although this application has been described in detail through the above embodiments, this application is not limited to the above embodiments. Many other equivalent embodiments may be included without departing from the technical concept of this application, all of which fall within the scope of protection of this application.

[0099] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A low stray inductance, high current output interface, characterized in that, include: PCB board; A positive conductor block is disposed on one side of the PCB board; A negative conductor block is disposed on the other side of the PCB board, and the positive conductor block and the negative conductor block have at least partial overlap in their orthogonal projections on the PCB board; The welding ends of the positive conductor block and the negative conductor block each include at least one welding terminal for electrical connection with the internal circuitry of the PCB board. The interface ends of the positive conductor block and the negative conductor block are located near the edge of the PCB board and are each provided with multiple connection holes for connecting male pins. The positive conductor block and the negative conductor block are respectively provided with stepped portions parallel to the plane of the PCB board. The space formed by the stepped portions and the PCB board is used to install current probes, wherein the stepped portions are located close to the soldering terminals.

2. The low stray inductance high current output interface according to claim 1, characterized in that, The welding terminal is a raised structure provided on the positive conductor block and the negative conductor block and facing the PCB board. A through hole matching the raised structure is provided at a corresponding position on the PCB board. The raised structure is inserted into the through hole to fix it to the PCB board.

3. The low stray inductance, high current output interface according to claim 1, characterized in that, The connecting hole is provided with a crown spring hole structure.

4. The low stray inductance high current output interface according to claim 1, characterized in that, The positive electrode conductor block and the negative electrode conductor block have at least partial overlap in their orthogonal projections on the PCB board, including: The main body of the positive conductor block and the negative conductor block have the same shape and size, and are completely overlapped.

5. The low stray inductance high current output interface according to claim 4, characterized in that, Also includes: An insulating shell is provided on the outside of the positive conductor block, the negative conductor block and the PCB board, and the insulating shell has an opening at the position corresponding to the connection hole to allow the male pin to pass through; The interface ends of the positive conductor block and the negative conductor block are respectively provided with first mounting holes, and the main body portions of the positive conductor block and the negative conductor block are respectively provided with second mounting holes. The first mounting holes and the second mounting holes are used to assemble the insulating shell.

6. The low stray inductance high current output interface according to claim 4, characterized in that, The main body of the positive electrode conductor block and the negative electrode conductor block are provided with anti-foolproof protrusions.

7. The low stray inductance high current output interface according to claim 1, characterized in that, The connection holes on the positive conductor block correspond one-to-one with the connection holes on the negative conductor block, and their orthogonal projections on the PCB board overlap.

8. The low stray inductance high current output interface according to claim 1, characterized in that, The positive electrode conductor block and the negative electrode conductor block are made of copper and their surfaces are plated with silver.

9. A circuit board for a semiconductor testing device, characterized in that, The board integrates a low stray inductance, high current output interface as described in any one of claims 1-8.

10. The circuit board for a semiconductor testing device according to claim 9, characterized in that, On the board, branch output interfaces are respectively provided at both ends of the low stray inductance high current output interface.

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