A copper-aluminum composite water-cooled laser shell and semiconductor laser

Abstract

The utility model relates to industrial laser technology field especially, relates to a copper aluminium composite water -cooling laser shell and semiconductor laser, the shell includes aluminium shell, copper plate, heat dissipation runner, liquid inlet and liquid outlet, the copper plate adopts split type structure, and the positioning groove of aluminium shell is embedded one -to -one and fixedly connected, can reduce internal hollowing problem, and the copper plate is fixed and is integrated with aluminium shell machining to reduce the light deviation that may be caused in subsequent assembly link, the heat dissipation runner is close to copper plate setting, and the liquid inlet, liquid outlet are staggered distribution in aluminium shell bottom, realize uniform heat dissipation. Semiconductor laser still contains integrated output head and temperature sensor. Through copper aluminium composite structure, balance heat dissipation efficiency and cost, avoid aluminium copper electrochemistry reaction, solve the existing structure power limited, the problem of easy corrosion, adapt high power demand, improve equipment stability.

Description

Technical Field

[0001] This utility model relates to the field of industrial laser technology, specifically to a copper-aluminum composite water-cooled laser housing and a semiconductor laser. Background Technology

[0002] Semiconductor lasers generate significant heat during operation, and their heat dissipation performance directly determines their power and stability. However, existing housings and heat dissipation structures have obvious defects:

[0003] (1) Copper structure without water cooling: It relies on the heat dissipation of copper itself, which has limited capacity and cannot meet the high power requirements. It is only suitable for low power scenarios.

[0004] (2) Copper structure with water flow: Although it enhances heat dissipation, when it comes into contact with the aluminum water-cooled plate commonly used in the system, it is prone to electrochemical reaction in the coolant environment, which leads to corrosion and leakage of the aluminum water-cooled plate, increasing maintenance costs and safety hazards.

[0005] (3) Aluminum structure for water circulation: It can avoid electrochemical reactions and has a lower cost, but the thermal conductivity of aluminum is much lower than that of copper, resulting in poor heat dissipation efficiency and limiting power increase.

[0006] Furthermore, the high cost of copper hinders its market adoption. In summary, existing solutions struggle to balance high heat dissipation, corrosion resistance, and low cost, necessitating the development of novel casing structures to address these issues. Utility Model Content

[0007] The purpose of this invention is to provide a copper-aluminum composite water-cooled laser housing and a semiconductor laser to solve the problems mentioned in the background art.

[0008] To achieve the above objectives, this utility model provides the following technical solution: a copper-aluminum composite water-cooled laser housing, comprising:

[0009] Aluminum casing;

[0010] Copper plates, fixed inside the aluminum casing, are used to mount components that generate a lot of heat;

[0011] Several heat dissipation channels are arranged inside the aluminum housing along the length of the aluminum housing and are located inside the aluminum housing near the copper plate;

[0012] The inlet is used to introduce coolant into the heat dissipation channel.

[0013] The outlet is used to drain the coolant that has been used for heat exchange inside the heat dissipation channel.

[0014] Furthermore, several of the heat dissipation channels are respectively distributed below and on the sides of the copper plate.

[0015] Furthermore, multiple liquid inlets and multiple liquid outlets are provided.

[0016] Furthermore, each of the liquid inlets and liquid outlets corresponds to one or more of the heat dissipation channels.

[0017] Furthermore, the liquid inlets and outlets corresponding to adjacent heat dissipation channels are staggered to ensure that the temperature is consistent at both ends of the aluminum casing.

[0018] Furthermore, the aluminum shell has a positioning groove inside that is compatible with the copper plate. The copper plate is embedded in the positioning groove and welded to the aluminum shell for fixation.

[0019] Furthermore, the copper plate has a split structure.

[0020] This utility model also provides a semiconductor laser, including the copper-aluminum composite water-cooled laser housing as described above.

[0021] Furthermore, it also includes an output head disposed on the outer wall of the aluminum housing, the output head being an integral structure with the aluminum housing.

[0022] Furthermore, it also includes a temperature sensor for detecting the temperature of the aluminum casing.

[0023] Compared with the prior art, the beneficial effects of this utility model are:

[0024] (1) The copper-aluminum composite structure is adopted, which uses copper plates to keep the heat dissipation and aluminum shells to reduce costs, which is conducive to marketization;

[0025] (2) The aluminum shell is equipped with heat dissipation channels to avoid electrochemical reaction corrosion and water leakage, reduce maintenance and failure, and improve equipment stability and lifespan. At the same time, the heat dissipation channels are set close to the copper plate, which can efficiently remove heat, adapt to high power requirements, and meet the needs of multiple fields of application.

[0026] (3) The use of split copper plates can reduce the problem of internal voids. The inlet and outlet of the flow channel are staggered to ensure that the temperature at both ends of the shell is consistent, the heat dissipation is uniform, and it is compatible with lasers of different specifications.

[0027] (4) The output head and aluminum shell are integrated into one piece, which reduces looseness and errors during assembly and facilitates heat dissipation. Attached Figure Description

[0028] Figure 1 This is a partial cross-sectional view of Embodiment 1 of the present invention;

[0029] Figure 2 This is a schematic diagram of the bottom three-dimensional structure of Embodiment 1 of this utility model;

[0030] Figure 3 This is an exploded view of Embodiment 1 of the present invention;

[0031] Figure 4 This is a schematic diagram of the bottom three-dimensional structure of Embodiment 2 of this utility model.

[0032] In the diagram: 1. Aluminum casing; 101. Positioning groove; 2. Copper plate; 3. Heat dissipation channel; 4. Liquid inlet; 5. Liquid outlet; 6. Output head. Detailed Implementation

[0033] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0034] Example 1, please refer to Figure 1-3 One embodiment of this utility model is a copper-aluminum composite water-cooled laser housing, comprising: an aluminum housing 1, a copper plate 2, a heat dissipation channel 3, a liquid inlet 4, and a liquid outlet 5.

[0035] In this embodiment, the aluminum shell 1 is a rectangular structure with an open top, and a top cover (not shown in the figure) can be detachably fixed to its top. Using aluminum to make the shell can effectively reduce the overall manufacturing cost, while also taking into account the requirement of lightweight structure.

[0036] The copper plate 2 is fixed inside the aluminum shell 1. Its high thermal conductivity allows for the installation of heat-generating devices such as semiconductor chips, collimating lenses, and reflectors, enabling rapid heat dissipation and ensuring stable operation. To reduce internal voids, the copper plate 2 employs a split structure. In this embodiment, the copper plate 2 is divided into six identical plate-like structures. The aluminum shell 1 has corresponding and compatible positioning grooves 101 inside each of the split copper plates 2. After the multiple copper plates 2 are embedded into the positioning grooves 101, they are then welded to the aluminum shell 1. During manufacturing, the copper plates 2 and aluminum shell 1 are welded together before being processed as a single unit, effectively reducing optical deviations that may occur during subsequent assembly and ensuring stable laser optical performance. It should be noted that the specific structures inside the aluminum shell 1 and on the copper plate 2 are existing technologies and will not be described in detail here.

[0037] Several heat dissipation channels 3 are arranged inside the aluminum housing 1 along the length of the aluminum housing 1 and are located inside the aluminum housing 1 near the copper plate 2. Specifically, they are distributed below and on the side of the copper plate 2. The dense heat dissipation channels 3 can quickly absorb the heat generated by the copper plate 2 and the devices above it.

[0038] The inlet 4 is used to introduce coolant into the heat dissipation channel 3, and the outlet 5 is used to discharge the coolant after heat exchange inside the heat dissipation channel 3. The inlet 4 and outlet 5 are respectively located at the bottom of the aluminum shell 1 along the height direction of the aluminum shell 1 and are connected to the heat dissipation channel 3. Figure 2As shown, in this embodiment, multiple inlets 4 and outlets 5 are provided, with multiple inlets 4 located on the same side and multiple outlets 5 located on the other side of the aluminum casing 1. Regarding the correspondence between the heat dissipation channels 3 and the inlets and outlets, a single inlet 4 can simultaneously introduce coolant into one or more heat dissipation channels 3, and a single outlet 5 can simultaneously discharge coolant from one or more heat dissipation channels 3. During operation, the coolant enters the heat dissipation channel 3 through the inlet 4, exchanges heat, and is discharged through the outlet 5, effectively removing the heat generated by the devices mounted on the copper plate 2 during operation and ensuring stable laser operation.

[0039] Based on the same inventive concept, this embodiment also proposes a semiconductor laser, including the aforementioned copper-aluminum composite water-cooled laser housing. It should be noted that the semiconductor chips, optical components, and other parts installed inside the semiconductor laser are all existing technologies and will not be described in detail here.

[0040] In addition, the semiconductor laser also includes an output head 6 disposed on the outer wall of the aluminum housing 1, which integrates an end cap for laser output. Unlike existing technologies where the output head is typically bolted to the housing, in this embodiment, the output head 6 and the aluminum housing 1 are designed as a single unit. This not only reduces loosening and errors during assembly but also facilitates heat dissipation, effectively ensuring laser output stability. To facilitate real-time monitoring of the laser's operating temperature, the semiconductor laser is also equipped with a temperature sensor to detect the temperature of the aluminum housing 1, allowing for timely adjustments to the heat dissipation strategy and preventing damage to the device due to abnormal temperatures.

[0041] Example 2, please refer to Figure 4 The difference between this embodiment and embodiment 1 is that the liquid inlet 4 and liquid outlet 5 corresponding to the adjacent heat dissipation channels 3 are staggered. That is, the two adjacent liquid inlets 4 are located on both sides of the bottom length of the aluminum shell 1, and the two adjacent liquid outlets 5 are also located on both sides of the bottom length of the aluminum shell 1. During operation, coolant can be introduced into both ends of the aluminum shell 1 in the length direction at the same time to ensure that the temperature at both ends of the aluminum shell 1 is consistent and to avoid local overheating affecting the performance of the device.

[0042] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "setting" should be interpreted broadly. For example, they can refer to fixed connections or detachable connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. Furthermore, in the description of this utility model, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0043] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A copper-aluminum composite water-cooled laser housing, characterized in that... ,include: Aluminum casing (1); A copper plate (2) is fixed inside the aluminum casing (1) and is used to install devices that generate a lot of heat. Several heat dissipation channels (3) are arranged inside the aluminum shell (1) along the length direction of the aluminum shell (1) and are located inside the aluminum shell (1) near the copper plate (2); The inlet (4) is used to introduce coolant into the heat dissipation channel (3); The outlet (5) is used to discharge the coolant after heat exchange inside the heat dissipation channel (3).

2. The copper-aluminum composite water-cooled laser housing according to claim 1, characterized in that: Several heat dissipation channels (3) are respectively distributed below and on the side of the copper plate (2).

3. The copper-aluminum composite water-cooled laser housing according to claim 1, characterized in that: Both the liquid inlet (4) and the liquid outlet (5) are provided with multiple outlets.

4. The copper-aluminum composite water-cooled laser housing according to claim 3, characterized in that: Each of the liquid inlets (4) and the liquid outlets (5) corresponds to one or more of the heat dissipation channels (3).

5. The copper-aluminum composite water-cooled laser housing according to claim 3, characterized in that: The liquid inlet (4) and liquid outlet (5) of adjacent heat dissipation channels (3) are staggered to ensure that the temperature at both ends of the aluminum shell (1) is consistent.

6. The copper-aluminum composite water-cooled laser housing according to claim 1, characterized in that: The aluminum shell (1) has a positioning groove (101) that is compatible with the copper plate (2) inside. The copper plate (2) is embedded in the positioning groove (101) and welded to the aluminum shell (1).

7. The copper-aluminum composite water-cooled laser housing according to claim 1, characterized in that: The copper plate (2) has a split structure.

8. A semiconductor laser, characterized in that: Includes the copper-aluminum composite water-cooled laser housing as described in any one of claims 1-7.

9. The semiconductor laser according to claim 8, characterized in that: It also includes an output head (6) disposed on the outer side wall of the aluminum shell (1), wherein the output head (6) and the aluminum shell (1) are an integral structure.

10. The semiconductor laser according to claim 8, characterized in that: It also includes a temperature sensor for detecting the temperature of the aluminum casing (1).

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