Test device for optical assemblies

Abstract

The embodiment of the present application provides a kind of optical assembly testing device, including base and setting on the base test board installation component, optical assembly installation component, FPC crimping component, the test board installation component is used to install test board;Optical assembly installation component, the optical assembly installation component is used to: install the optical assembly to be measured;And, the direct current DC power supply pin of the optical assembly to be measured is electrically connected with the test board, and limit the movement of the optical assembly to be measured;FPC crimping component, the FPC crimping component is used to the first FPC of the optical assembly to be measured is crimped on the test board to be electrically connected with the test board.Such, can improve the reliability of photoelectric performance test of optical assembly.

Description

Technical Field

[0001] This application relates to the field of electronic technology, and in particular to a testing device for optical components. Background Technology

[0002] Optical components are core devices in optical communication networks. Their optical performance (such as insertion loss, return loss, and optical power stability) directly affects the operating efficiency and reliability of the entire system. Therefore, it is necessary to verify whether their performance meets the standards through optoelectronic performance testing.

[0003] In the photoelectric performance testing of optical components, the DC power supply pins and flexible printed circuit (FPC) of the optical component under test need to be electrically connected to the test board to achieve circuit flow and signal transmission. In related technologies, unstable electrical connections between the DC power supply pins of the optical component or between the FPC and the test board can easily lead to reduced test reliability. Utility Model Content

[0004] This application provides a testing device for optical components, which helps to improve the reliability of photoelectric performance testing of optical components.

[0005] This application provides a testing apparatus for optical components, comprising:

[0006] Base;

[0007] A test board mounting assembly is disposed on the base and is used to mount the test board;

[0008] An optical component mounting assembly is disposed on the base and is used for: mounting the optical component under test; and electrically connecting the DC power supply pin of the optical component under test to the test board, while restricting the movement of the optical component under test;

[0009] A flexible circuit board (FPC) pressing assembly is disposed on the base and is used to press the first FPC of the optical component under test onto the test board for electrical connection with the test board.

[0010] In this embodiment, the testing apparatus for optical components includes a base and a test board mounting assembly, an optical component mounting assembly, and an FPC pressing assembly disposed on the base. The test board mounting assembly is used to mount a test board. The optical component mounting assembly is used to: mount the optical component under test; and electrically connect the DC power supply pin of the optical component under test to the test board, while restricting the movement of the optical component under test. The FPC pressing assembly is used to press a first FPC of the optical component under test onto the test board for electrical connection with the test board. Thus, the optical component mounting assembly can mount the optical component under test and electrically connect the DC power supply pin of the optical component under test to the test board, while restricting the movement of the optical component under test, reducing the risk of alignment misalignment between the DC power supply pin and the test board. Furthermore, pressing the first FPC onto the test board enables a direct electrical connection between the first FPC and the test board, reducing the loss of the test signal between the first FPC and the test board, thereby improving the reliability of the photoelectric performance testing of the optical component. Attached Figure Description

[0011] Figure 1 One of the structural schematic diagrams of an embodiment of the testing apparatus for optical components provided in this application;

[0012] Figure 2 A second schematic diagram of the structure of an embodiment of the testing device for optical components provided in this application;

[0013] Figure 3 An exploded view of an embodiment of the testing apparatus for optical components provided in this application;

[0014] Figure 4 A schematic diagram of the structure of the optoelectronic component mounting assembly in an embodiment of the optical component testing apparatus provided in this application;

[0015] Figure 5 An exploded view of the optoelectronic component mounting assembly in an embodiment of the optical component testing apparatus provided in this application;

[0016] Figure 6 A schematic diagram of the structure of the FPC crimping assembly in an embodiment of the optical component testing apparatus provided in this application;

[0017] Figure 7 An exploded view of the FPC crimping assembly in an embodiment of the optical component testing apparatus provided in this application. Specific Implementation

[0018] To enable those skilled in the art to better understand the technical solutions of this application, the technical solutions provided in this application will be described in detail below with reference to the accompanying drawings.

[0019] Exemplary embodiments will be described more fully below with reference to the accompanying drawings; however, the described exemplary embodiments may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this application will be thorough and complete, and will enable those skilled in the art to fully understand the scope of this application.

[0020] As used herein, the term "and / or" includes any and all combinations of one or more related enumerated purposes.

[0021] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application. As used herein, the singular forms “a” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that when the terms “comprising” and / or “made of” are used in this specification, the presence of a feature, integral, step, operation, element, and / or component is specified, but the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof is not excluded.

[0022] In the following description, references are made to “some embodiments,” which describe a subset of all possible embodiments. However, it is understood that “some embodiments” may be the same subset or different subsets of all possible embodiments and may be combined with each other without conflict.

[0023] Unless otherwise specified, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art. It will also be understood that terms such as those defined in common dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and this application, and will not be interpreted as having an idealized or overly formal meaning, unless expressly so defined in the embodiments of this application.

[0024] During the photoelectric performance testing of optical components, the optical component under test needs to be electrically connected to the test board to enable circuit flow and signal transmission.

[0025] In related technologies, the DC power supply pins of optical components are usually connected to the test board by a crimping method. This involves manually aligning the DC power supply pins with the gold fingers on the test board and then pressing the pins down with a pressure block. However, this method does not completely fix the optical component after manual alignment. During the crimping process, displacement may occur, causing misalignment between the DC power supply pins of the optical component and the gold fingers on the test board. This can lead to test abnormalities or even short circuits on the test board, burning out the components and reducing the reliability of the optoelectronic performance test of the optical component.

[0026] For the FPC of optical components, the electrical connection with the test board is usually achieved by plugging in. That is, the FPC of the optical component is plugged into the connector that is electrically connected to the test board, and the electrical connection between the FPC and the test board is achieved by the springs or probes in the connector. However, this method is only suitable for low-speed testing. For high-speed bandwidth performance testing, the springs will suffer greater wear, resulting in deviation of test results and thus reducing the reliability of the optoelectronic performance test of the optical component.

[0027] Therefore, in related technologies, there is a problem of low testing reliability in the photoelectric performance testing process of optical components.

[0028] Based on this, please refer to Figures 1 to 3 This application provides a testing apparatus for optical components. For example... Figures 1 to 3 As shown, the optical component testing device 100 includes at least a base 110, a test board mounting assembly 120, an optical component mounting assembly 130, and an FPC crimping assembly 140 disposed on the base 110.

[0029] The aforementioned base 110 can be any structure capable of housing the aforementioned test board mounting assembly 120, the aforementioned optical component mounting assembly 130, and the aforementioned FPC pressing assembly 140, and the shape, material, and size of the base 110 can be set according to actual needs. For example, the aforementioned base 110 can be as follows: Figure 1 The two sides shown are rectangular metal or plastic blocks, etc.

[0030] In some embodiments, a plurality of foot pads 150 may be distributed on the side of the base 110 away from the test board mounting assembly 120. The plurality of foot pads 150 can support the base 110 and improve the stability of the base 110.

[0031] The aforementioned foot pads 150 can be any structure capable of supporting the base 110, and the number of foot pads 150 can be set according to actual needs. For example, if the two sides of the base 110 are rectangular, a rubber foot pad can be provided at each of the four corners near the rectangular side.

[0032] The aforementioned test board mounting assembly 120 can be any structure capable of mounting the test board 200, which is used for photoelectric performance testing of optical components. For example, the test board mounting assembly 120 can be a support plate disposed on one side of the base 110 and spaced apart from the base 110. The support plate can be provided with a mounting part (e.g., it can be provided with multiple mounting support columns or snap-fit ​​slots, etc.), and the test board 200 can be detachably connected to the mounting part.

[0033] The aforementioned test board mounting assembly 120 is disposed on the base 110, and can be either fixedly connected to the base 110 or detachably connected. For example, the test board mounting assembly 120 and the base 110 can be detachably connected by bolts.

[0034] The aforementioned optical component mounting assembly 130 can be any structure capable of mounting the optical component under test 300, electrically connecting the DC power supply pin of the mounted optical component under test 300 to the test board 200, and restricting the movement of the optical component under test 300. For example, the optical component mounting assembly 130 can be an optical component mounting block with a mounting slot. The mounting slot has pads, and the pads are electrically connected to the gold fingers on the test board 200 (e.g., through wires or other FPCs). The optical component under test 300 can be snapped into the mounting slot, and the DC power supply pin of the optical component under test 300 is electrically connected to the pads in the mounting slot.

[0035] The aforementioned FPC crimping assembly 140 can be any structure used to crimp the FPC (hereinafter referred to as "first FPC" for easy distinction) of the optical component 300 under test onto the test board 200 for electrical connection with the test board 200, and the FPC crimping assembly 140 can be fixedly connected to the base 110 or detachably connected.

[0036] For example, the FPC crimping assembly 140 may include a crimping block. When the gold fingers of the first FPC are aligned with the corresponding gold fingers on the test board 200, the crimping block may crimp the position of the gold fingers of the first FPC and connect to the base 110 by bolts or the like to limit relative displacement between the first FPC and the test board 200.

[0037] In this embodiment of the application, the optical component testing device 100 includes: a base 110, and a test board mounting assembly 120, an optical component mounting assembly 130, and an FPC pressing assembly 140 disposed on the base 110. The test board mounting assembly 120 is used to mount a test board 200; the optical component mounting assembly 130 is used to: mount the optical component under test 300; and electrically connect the DC power supply pin of the optical component under test 300 to the test board 200, and restrict the movement of the optical component under test 300; the FPC pressing assembly 140 is used to press the first FPC of the optical component under test 300 onto the test board 200 for electrical connection with the test board 200. Thus, the optical component mounting assembly 130 can mount the optical component under test 300 and electrically connect the DC power supply pin of the optical component under test 300 to the test board 200, and restrict the movement of the optical component under test 300, which can reduce the risk of alignment deviation between the DC power supply pin and the test board 200; while the first FPC is pressed onto the test board 200 to realize direct electrical connection between the first FPC and the test board 200, which can reduce the loss of test signal between the first FPC and the test board 200, thereby improving the reliability of the photoelectric performance test of the optical component.

[0038] In some embodiments, please refer to Figure 4 and Figure 5 The aforementioned optical component mounting assembly 130 may include:

[0039] Support block 131, the support block 131 is disposed on the base 110;

[0040] The mounting module is detachably connected to the support block 131 and is used to mount the optical component under test 300 and restrict the movement of the optical component under test 300.

[0041] A power-on module is detachably mounted on the support block 131 and is used to electrically connect the DC power supply pin to the test board 200.

[0042] In this embodiment, the support block 131, the mounting module and the power-on module work together to install the optical component under test 300, restrict the movement of the optical component under test 300, and electrically connect the DC power supply pin to the test board 200.

[0043] The aforementioned support block 131 is disposed on the base 110. The support block 131 can be directly fixed to the base 110 or detachably connected, or it can be connected to the base 110 via other components. Furthermore, the support block 131 can be any structure capable of supporting the aforementioned mounting module and power-on module.

[0044] For example, the support block 131 can be a rectangular metal block, one side of which is detachably connected to the base 110 by screws or the like. The mounting module and the power-on module can also be set on at least one side of the rectangular block by screws or the like.

[0045] The aforementioned mounting module can be any structure capable of mounting the optical component under test 300 and restricting its movement. For example, the mounting module may include a mounting block with multiple pin slots. The pin slots are plated with conductive metal, and each pin slot corresponds to a DC power supply pin on the optical component under test 300. When the optical component under test 300 is placed on the mounting block, each DC power supply pin on the optical component under test 300 is engaged in the corresponding pin slot.

[0046] The aforementioned power-on module can be any component that enables the DC power supply pin to be electrically connected to the test board 200 when the optical component under test 300 is mounted on the mounting module. For example, when the mounting module includes a mounting block and an electric cylinder assembly connected to the mounting block, the power-on module can be an FPC, with one side of the FPC electrically connected to the conductive metal in the multiple pin slots of the mounting block, and the other side electrically connected to the test board 200.

[0047] In some embodiments, the mounting module includes:

[0048] An optical component mounting block 1321 is detachably connected to the support block 131, and the optical component mounting block 1321 is provided with a receiving area 1320, which is used to mount the optical component 300 under test.

[0049] A first limiting part is movably connected to the optical component mounting block 1321, and at least a portion of the first limiting part is located within the receiving area 1320. The first limiting part is used to restrict the movement of the optical component 300 under test within the receiving area 1320.

[0050] In this embodiment, the optical component under test 300 can be installed through the accommodating area 1320 of the optical component mounting block 1321, while the movement of the optical component under test 300 within the accommodating area 1320 is restricted by the first limiting part.

[0051] The aforementioned accommodating region 1320 can be a region capable of accommodating the optical component 300 under test. For example, the accommodating region 1320 can be the region that includes the aforementioned plurality of pin slots.

[0052] The aforementioned first limiting portion can be any area capable of restricting the movement of the optical component 300 to be tested, which is installed within the receiving area 1320. For example, if the receiving area 1320 includes the aforementioned plurality of pin slots, the first limiting portion can be a cylinder assembly that can press the optical component 300 to be tested from top to bottom to prevent the DC power supply pins from moving within the pin slots.

[0053] In some embodiments, the receiving area 1320 is a receiving groove, and the optical component mounting block 1321 includes a first groove wall 1322 and a second groove wall 1323 located on opposite sides of the receiving groove;

[0054] The first limiting part may include:

[0055] Limiting block 1324, the limiting block 1324 is movably disposed within the receiving groove;

[0056] An elastic element (not shown) is disposed between the first groove wall 1322 and the limiting block 1324. The elastic element is used to provide elastic force to the limiting block 1324 in the direction of the second groove wall 1323, so as to limit the optical component 300 under test between the limiting block 1324 and the second groove wall 1323.

[0057] In this embodiment, when the optical component mounting block 1321 includes a first groove wall 1322 and a second groove wall 1323 located on opposite sides of the receiving groove, the limiting block 1324 can be provided with elastic force in the direction of the second groove wall 1323 by the elastic member, so as to limit the optical component 300 under test between the limiting block 1324 and the second groove wall 1323.

[0058] For example, when the light component to be tested 300 is not installed in the receiving slot, the limit block 1324 can be pressed by the finger to move towards the first slot wall 1322 to compress the elastic element. After the light component to be tested 300 is placed in the receiving slot, the pressure on the limit block 1324 is released. At this time, the elastic element drives the limit block 1324 to push the light component to be tested 300 towards the second slot wall 1323 until the light component to be tested 300 is locked between the limit block 1324 and the second slot wall 1323, and the elastic element provides elastic force to the limit block 1324 in the direction of the second slot wall 1323.

[0059] The aforementioned elastic element can be any component capable of providing elastic force, such as a spring, a sheet, or an elastic rubber component.

[0060] It should be noted that the aforementioned optical component mounting block 1321 located in the mounting groove may only have a first groove wall 1322 and a second groove wall 1323, that is, the other two sides of the mounting groove are open; or, the optical component mounting block 1321 may also include two other groove walls, and the mounting groove is formed by the two groove walls and the first groove wall 1322 and the second groove wall 1323.

[0061] In some embodiments, the first limiting portion may further include:

[0062] A push-pull rod 1325 passes through the first groove wall 1322 and is connected to the limiting block 1324. At least a portion of the push-pull rod 1325 extends out of the first groove wall 1322 on the side away from the second groove wall 1323. The push-pull rod 1325 is used to drive the limiting block 1324 to move within the receiving groove.

[0063] In this embodiment, by setting a push-pull rod 1325 that can drive the limiting block 1324 to move in the receiving groove, the limiting block 1324 can be moved by the push-pull rod 1325, thereby increasing the distance between the limiting block 1324 and the second groove wall 1323 when installing the optical component 300 to be tested, thus making it easier to install the optical component 300 to be tested.

[0064] In some embodiments, the first limiting portion may further include:

[0065] At least one positioning pin 1326 is arranged around the push-pull rod 1325 and passes through the first groove wall 1322 to connect with the limiting block 1324, and at least a portion of each positioning pin 1326 extends out of the first groove wall 1322 on the side away from the second groove wall 1323.

[0066] In this embodiment, by setting at least one positioning pin 1326 connected to the limiting block 1324 around the push-pull rod 1325, the push-pull rod 1325 can be positioned, thus preventing directional deviation during the movement of the limiting block 1324 driven by the push-pull rod 1325.

[0067] The aforementioned at least one locating pin 1326 may be provided as a single locating pin 1326, or multiple locating pins 1326 may be provided. For example, two locating pins 1326 may be provided opposite to each other around the push-pull rod 1325.

[0068] In some embodiments, the optical component under test 300 is provided with at least one set of DC power supply pin groups, and each set of DC power supply pin groups includes the DC power supply pins;

[0069] The power-on module includes:

[0070] At least one set of electronic modules, and the at least one set of electronic modules corresponds to the at least one set of DC power supply pin groups, each of the electronic modules being used to electrically connect the corresponding DC power supply pin group to the test board 200;

[0071] The second limiting part is detachably connected to the support block 131. The at least one set of electronic modules is movably disposed on the second limiting part and is used to restrict the movement of the at least one electronic module.

[0072] In this embodiment, each DC power supply pin group of the optical component under test 300 can be electrically connected to the test board 200 through at least one set of electronic modules, and the movement of the at least one electronic module can be restricted by the second limiting part, thereby ensuring the stability of the contact between the at least one set of electronic modules and the at least one set of DC power supply pin groups, and ensuring the reliability of the test process.

[0073] The aforementioned electron-adding module can be any module capable of achieving pin electrical connection with the corresponding DC power supply pin group. For example, when the aforementioned optical component mounting block 1321 includes the aforementioned first slot wall 1322 and second slot wall 1323, the optical component mounting block 1321 may also include partially hollowed-out third and fourth slot walls, and the optical component under test 300 includes two DC power supply pin groups. When the optical component under test 300 is mounted in the receiving slot, the two DC power supply pin groups extend into the hollowed-out areas of the third and fourth slot walls, respectively. The electron-adding module may include two electron-adding modules, each of which may include at least one probe, a probe mounting plate fixedly connected to the at least one probe, and an FPC electrically connected to the probe mounting plate and the test board 200. At least one probe of each of the two electron-adding modules moves through the third and fourth slot walls and is electrically connected to the corresponding DC power supply pin group.

[0074] The aforementioned second limiting part can be any structure that, when at least one set of electronic modules is electrically connected to the corresponding DC power supply pin group of the test board 200, restricts the movement of the at least one set of electronic modules to ensure stable contact between the electronic modules and the DC power supply pin group. For example, if the aforementioned optical component mounting block 1321 also includes the aforementioned third groove wall and the aforementioned fourth groove wall, the second limiting part can include two spring pieces disposed on at least one of the first groove wall 1322, the second groove wall 1323, the third groove wall, and the fourth groove wall. Each spring piece is used to press against the probe mounting plate to provide a pressing force between the probe and the corresponding DC power supply pin.

[0075] In some embodiments, the added electronics module includes:

[0076] A probe mounting block 1331 is movably disposed on the second limiting part;

[0077] A transition printed circuit board 1332 is attached to the first side of the probe mounting block 1331, and the transition printed circuit board 1332 is used for electrical connection with the test board 200.

[0078] Probe 1333 is connected to the mounting block, and the first end of the probe 1333 passes through the mounting block and is electrically connected to the adapter printed circuit board 1332. The second end of the probe 1333 is located on the second side of the probe mounting block 1331, which is opposite to the first side. The second end of the probe 1333 is used to contact the DC power supply pin of the corresponding DC power supply pin group.

[0079] In this embodiment, the stability of the electrical connection between the DC power supply pin group and the test board 200 can be further improved by the cooperative connection between the probe mounting block 1331, the adapter printed circuit board 1332, the probe 1333 and the second FPC.

[0080] For example, after the optical component 300 under test is mounted on the optical component mounting block 1321, the probe mounting block 1331 and the adapter printed circuit board 1332 can be moved so that the probe 1333 contacts the corresponding DC power supply pin, and the second limiting component can restrict the movement of the probe mounting block 1331.

[0081] The aforementioned adapter printed circuit board 1332 is electrically connected to the test board 200. The optical component testing device 100 may also include a second FPC. One end of the second FPC is electrically connected to the adapter printed circuit board 1332, and the other end of the second FPC is used to be electrically connected to the test board 200.

[0082] In some embodiments, the second limiting portion includes:

[0083] The slide rail 1334 is detachably connected to the support block 131;

[0084] At least one sliding block 1335 is slidably connected to the slide rail 1334, and the at least one sliding block 1335 is correspondingly connected to the at least one set of electronic modules.

[0085] A first driving unit 1336 is connected to the at least one sliding block 1335, and the first driving unit 1336 is used to drive the at least one sliding block 1335 to slide along the slide rail 1334.

[0086] In this embodiment, the first driving unit 1336 can drive at least one sliding block 1335 to move along the slide rail 1334, thereby driving at least one set of electronic modules to move, so that the electronic modules can electrically connect the corresponding DC power supply pin group to the test board 200. When the first driving unit 1336 stops driving the slide rail 1334 to move, the slider remains stationary on the slide rail 1334, thereby making the electronic modules unable to move. This facilitates the electronic modules to electrically connect the corresponding DC power supply pin group to the test board 200, and also restricts the movement of the electronic modules when the driving is stopped.

[0087] The aforementioned first driving unit 1336 can be any component capable of driving the sliding block 1335 to move on the slide rail 1334. For example, the first driving unit 1336 can include at least one first micro lead screw motor, which is correspondingly arranged with at least one sliding block 1335, and each first micro lead screw motor is used to drive the corresponding sliding block 1335 to slide.

[0088] Alternatively, the first drive unit 1336 may include at least one first cylinder, which is correspondingly connected to the at least one sliding block 1335.

[0089] In the case where the second limiting part includes the first driving part 1336, the test device 100 may also include a pressure regulating valve and a first air valve. The first air valve cooperates with the pressure regulating valve to control the working state of the first driving part 1336, and the first air valve may be disposed on the base 110.

[0090] The at least one sliding block 1335 is connected to the at least one set of electronic modules. In the case where the electronic module includes a probe mounting block 1331, the probe mounting block 1331 may be directly mounted on the sliding block 1335. Alternatively, the second limiting part may also include a probe mounting block adapter block 1337, and the probe mounting block 1331 may be mounted on the sliding block 1335 through the adapter block.

[0091] In some embodiments, please refer to Figure 6 and Figure 7 The aforementioned FPC crimping assembly 140 includes:

[0092] Support part 141, which is detachably connected to the base 110;

[0093] FPC crimping part 142 is used to crimp the first FPC of the optical component under test 300 onto the test board 200 for electrical connection with the test board 200.

[0094] The second drive unit 143 is detachably connected to the support unit 141 and the FPC crimping unit 142, and is used to drive the FPC crimping unit 142 to move in the direction toward the test board mounting assembly 120.

[0095] In this embodiment, the FPC pressing part 142 can be driven to move in the direction toward the test board mounting assembly 120 by the second driving part 143 installed on the support part 141, thereby enabling the FPC pressing part 142 to press the first FPC onto the test board 200, and when the second driving part 143 stops driving, the FPC pressing part 142 stops moving, thus achieving the pressing stability of the FPC pressing part 142 on the first FPC.

[0096] The second drive unit 143 described above can be any component capable of driving the FPC crimping part 142 to move in the direction toward the test board mounting assembly 120. For example, the second drive unit 143 can include a second miniature lead screw motor connected to the FPC crimping part 142, with the lead screw of the second miniature lead screw motor extending in the direction toward the test board 200, and the second miniature lead screw motor used to drive the FPC crimping part 142 to move in the direction toward the test board mounting assembly 120.

[0097] Alternatively, the second drive unit 143 may include a second cylinder, which is fixedly connected to the support unit 141 and the FPC crimping unit 142.

[0098] In the case where the FPC crimping assembly 140 includes a second drive unit 143, the test device 100 may also include a second air valve, which cooperates with a pressure regulating valve to control the working state of the second drive unit 143, and the second air valve may be disposed on the base 110.

[0099] The aforementioned FPC crimping part 142 can be a single unit, for example, the FPC crimping part 142 is an FPC crimping block; or it can be composed of multiple parts. For example, when the second drive part 143 includes a second cylinder, the FPC crimping part 142 can include a cylinder mounting adapter plate 1421, a test pressure seat 1422 and a test pressure block 1423 that are detachably connected in sequence, and the cylinder mounting adapter plate 1421 is detachably connected to the second cylinder.

[0100] In some embodiments, the FPC crimping assembly 140 may include:

[0101] The camera mounting part 144 is detachably connected to the support part 141, and the camera mounting part 144 is used to mount the surveillance camera 400.

[0102] In this embodiment, a monitoring camera 400 can be installed through the camera mounting part 144, thereby facilitating monitoring during the testing process through the monitoring camera 400.

[0103] It should be noted that the aforementioned surveillance camera 400 can be connected to a monitor, etc., to facilitate monitoring. Of course, the surveillance camera 400 can also be used during testing, and observation can be conducted by the human eye; this is not a limitation.

[0104] It should be noted that the aforementioned second drive unit 143 and camera mounting unit 144 may be directly and detachably connected to the support unit 141; or, the FPC crimping assembly 140 may also include a mounting assembly for mounting the camera mounting unit 144 and the second drive unit 143. For example, if the second drive unit 143 includes a second cylinder, the FPC crimping assembly 140 may also include a cylinder mounting block 1452 and a camera mounting adapter block 1451 detachably connected to the support unit 141. The cylinder mounting block 1452 is detachably connected to the second cylinder, and the camera mounting adapter block 1451 is detachably connected to the camera mounting unit 144.

[0105] In some embodiments, the testing apparatus 100 for the optical components further includes:

[0106] A position adjustment component is disposed on the base 110, and at least one of the test board mounting component 120 and the optical component mounting component 130 is disposed on the position adjustment component. The position adjustment component is used to adjust the position of at least one of the test board mounting component 120 and the optical component mounting component 130 so that the first FPC of the optical component under test 300 is electrically connected to the test board 200.

[0107] In this embodiment, the position adjustment component can be used to conveniently adjust the position of at least one of the test board mounting component 120 and the optical component mounting component 130 during the test, so that the first FPC of the optical component 300 under test is electrically connected to the test board 200.

[0108] The aforementioned adjustment of the position of at least one of the test board mounting assembly 120 and the optical component mounting assembly 130 can achieve positional changes in any direction. Specifically, it can achieve positional adjustments in the XYZ directions, as well as rotation around the Z-axis, etc.

[0109] The aforementioned position adjustment component can be any component capable of adjusting the position of at least one of the test board mounting component 120 and the optical component mounting component 130, and the position adjustment component can be equipped with only the test board mounting component 120 or the optical component mounting component 130.

[0110] For example, the position adjustment component may be a slide mechanism comprising an XY-axis slide (used to adjust the movement of the corresponding component along the XY plane), a Z-axis slide (used to adjust the movement of the corresponding component along the Z-axis), and a U-axis slide (used to adjust the rotation of the corresponding component around the Z-axis) stacked on top of each other, and the slide mechanism is disposed between the base 110 and the test board mounting assembly 120, or between the base 110 and the optical component mounting assembly 130.

[0111] In some embodiments, the position adjustment component includes:

[0112] A first adjustment component 160 is disposed between the base 110 and the test board mounting component 120, and the first adjustment component 160 is used to drive the test board mounting component 120 to move in a first direction, the first direction being a direction perpendicular to a first side of the test board mounting component 120, the first side being used to mount the test board 200.

[0113] The second adjustment component 170 and the third adjustment component 180 are stacked between the base 110 and the optical component mounting assembly 130. The second adjustment component 170 is used to drive the optical component mounting assembly 130 to move in a plane parallel to the first side, and the third adjustment component 180 is used to drive the optical component mounting assembly 130 to rotate in a plane parallel to the first side.

[0114] In this embodiment, a first adjustment component 160 can be provided between the base 110 and the test board mounting assembly 120, and a second adjustment component 170 and a third adjustment component 180 can be provided between the base 110 and the optical component mounting assembly 130, thereby enabling the adjustment of the positions of the test mounting assembly and the optical component mounting assembly 130 respectively.

[0115] For example, the Z-axis slide can be positioned between the base 110 and the test board mounting assembly 120, while the XY-axis slide and U-axis slide, which are stacked on top of each other, can be positioned between the base 110 and the optical component mounting assembly 130.

[0116] To facilitate understanding of the optical component testing apparatus 100 in the embodiments of this application, several application examples of the optical component testing apparatus 100 are provided below:

[0117] like Figure 1 and Figure 2As shown, the test fixture includes a base 110 assembly (i.e., including base 110 and test board mounting assembly 120), a BOX limiting assembly (i.e., optical component mounting assembly 130), and an FPC crimping assembly 140 assembly (i.e., FPC crimping assembly 140).

[0118] like Figure 3 As shown, the base 110 is placed at the bottom layer, and four rubber feet 150 are installed on the bottom surface at the four corners for elevation. The middle part of the base 110 is secured and locked with a heightening adapter block 190 by pins and screws. The Z-axis slide (i.e., the first adjustment component 160) and the test board 200 mounting block (i.e., the test board mounting component 120) are sequentially mounted on the Z-axis slide. The test board 200 mounting block can fix and support the test board 200, while the Z-axis slide is used to adjust the overall height of the test board 200 to adapt to different bending degrees of the FPC to ensure the crimping quality of the FPC. The U-axis slide (i.e., the third adjustment component 180), the XY-axis slide (i.e., the second adjustment component 170), and the BOX limiting component assembly are sequentially stacked on the base 110. These components can be used to adjust the XY position and U angle of the product under test to align the FPC (i.e., the first FPC) on the product with the pads of the test board 200. The right side of the base 110 is equipped with a crimping cylinder mounting block (i.e., support 141) from the FPC crimping assembly 140, used to fix and install the crimping cylinder (i.e., second drive 143) and camera mounting block from the FPC crimping assembly 140. The base 110 is equipped with the pressure regulating valve, the first air valve, and the second air valve, which can control the air pressure and on / off state of the probe power module (i.e., power module) and the FPC crimping assembly 140.

[0119] Figure 4 and Figure 5In this design, the central suction platform support block 131 (i.e., support block 131) is mounted on the XY-axis slide table, on which the BOX limiting block (i.e., optical component mounting block 1321) and the slide rail 1334 equipped with a parallel slide rail 1334 cylinder (i.e., first drive unit 1336) are fixedly mounted. The BOX limiting block is used to place the product to be tested (i.e., the optical component 300 to be tested); it has an opening and is equipped with the push-pull rod 1325, positioning pin 1326, spring (i.e., elastic element) and pressure block (i.e., limiting block 1324), which can apply pressure to the product to be tested to fix the product. Two sets of probe power modules are mounted on the slide rail 1334, consisting of a probe 1333 adapter board, a probe mounting block 1331, an adapter printed circuit board 1332, and a Po-go pin probe 1333. The probe 1333 is mounted on the probe mounting block 1331, with one end connected to the pad of the adapter printed circuit board 1332, and the other end can be fixed to the pin pad on the side of the product under test by the movement of the cylinder, so that the pad of the product and the adapter printed circuit board 1332 can achieve signal connection. A flexible cable (i.e., the second FPC) is soldered to the outside of the adapter printed circuit board 1332, and the flexible cable is then connected to the test board 200.

[0120] Figure 6 and Figure 7 In the FPC crimping assembly 140, the crimping cylinder (i.e., the second drive unit 143) is fixed to the top of the crimping cylinder mounting block via the cylinder mounting block. Its bottom is locked to the cylinder mounting adapter plate for mounting the test pressure seat. The test pressure block protrudes from the opening of the test pressure seat and contains a spring for elastic contact during crimping. The camera mounting adapter block and camera mounting block are fixedly mounted next to the cylinder mounting block. Together, they suspend and fix the monitoring camera 400, allowing signals to be output to the display screen to show the real-time positions of the FPC and test board 200 pads, assisting in aligning the FPC gold fingers with the test board 200 pads.

[0121] Specific instructions for using the tooling:

[0122] Pull the push-pull rod 1325 by hand, place the product under test into the slot of the BOX limit block, and then release the push-pull rod 1325 so that the limit block 1324 presses and fixes the product under test; open the first air valve, and the cylinder of the parallel slide rail 1334 will drive the probe 1333 assembly to move inward, so that the probe 1333 presses onto the pads at the root of the pins on both sides of the product under test.

[0123] The real-time status of the gold finger pads of the FPC and test board 200 is observed in real time through the images brought out by the monitoring camera 400. The Z-axis slide is adjusted so that the pre-bent FPC pad area and the surface of the test board 200 are at the same height and can be attached together, with no FPC suspended or warped. The XY-axis slide and U-axis slide are adjusted. After the FPC pads are aligned with the gold finger pads of the test board 200, the second air valve is opened, the pressing cylinder moves downward, and the test pressure block will press the FPC so that its pads are tightly attached to the gold fingers of the test board 200 to achieve conductivity.

[0124] After the test is completed, first close the first and second air valves, then pull the push-pull rod 1325 to remove the product to be tested from the slot of the BOX limit block.

[0125] It should be understood that in this application, "at least one (item)" means one or more, and "more than" means two or more. "And / or" is used to describe the relationship between related objects, indicating that three relationships can exist. For example, "A and / or B" can represent three cases: only A exists, only B exists, and both A and B exist simultaneously, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one (item) of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one (item) of a, b, or c can represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be single or multiple.

[0126] The above description, with reference to the accompanying drawings, illustrates some embodiments of this application, but does not limit the scope of the invention. Any modifications, equivalent substitutions, and improvements made by those skilled in the art without departing from the scope and spirit of this invention should be considered within the scope of this application.

Claims

1. A testing apparatus for optical components, comprising: Base; A test board mounting assembly is disposed on the base and is used to mount the test board; An optical component mounting assembly is disposed on the base and is used for: mounting the optical component under test; and electrically connecting the DC power supply pin of the optical component under test to the test board, while restricting the movement of the optical component under test; A flexible circuit board (FPC) pressing assembly is disposed on the base and is used to press the first FPC of the optical component under test onto the test board for electrical connection with the test board.

2. The testing apparatus according to claim 1, characterized in that, The optical component mounting assembly includes: A support block, which is disposed on the base; The mounting module is detachably connected to the support block and is used to mount the optical component under test and restrict the movement of the optical component under test. A power-on module, which is detachably mounted on the support block, is used to electrically connect the DC power supply pin to the test board.

3. The testing apparatus according to claim 2, characterized in that, The installation module includes: An optical component mounting block is detachably connected to the support block, and the optical component mounting block is provided with a receiving area for mounting the optical component under test. A first limiting part is movably connected to the optical component mounting block, and at least a portion of the first limiting part is located within the accommodating area. The first limiting part is used to restrict the movement of the optical component under test within the accommodating area.

4. The testing apparatus according to claim 3, characterized in that, The receiving area is a receiving groove, and the optical component mounting block includes a first groove wall and a second groove wall located on opposite sides of the receiving groove; The first limiting part includes: A limiting block, wherein the limiting block is movably disposed within the receiving groove; An elastic element is disposed between the first groove wall and the limiting block. The elastic element is used to provide elastic force to the limiting block in the direction of the second groove wall, so as to limit the optical component under test between the limiting block and the second groove wall.

5. The testing apparatus according to claim 4, characterized in that, The first limiting part further includes: A push-pull rod passes through the first groove wall and is connected to the limiting block, and at least a portion of the push-pull rod extends out of the first groove wall on the side away from the second groove wall, and the push-pull rod is used to drive the limiting block to move within the receiving groove; At least one locating pin is provided around the push-pull rod and passes through the first groove wall to connect with the limiting block, and at least a portion of each locating pin extends out of the first groove wall on the side away from the second groove wall.

6. The testing apparatus according to claim 2, characterized in that, The optical component under test is provided with at least one set of DC power supply pin groups, and each set of DC power supply pin groups includes the DC power supply pins. The power-on module includes: At least one set of electronic modules, and the at least one set of electronic modules corresponds to the at least one set of DC power supply pin groups, each of the electronic modules being used to electrically connect the corresponding DC power supply pin group to the test board; The second limiting part is detachably connected to the support block, and the at least one set of electronic modules is movably disposed on the second limiting part, and is used to restrict the movement of the at least one electronic module.

7. The testing apparatus according to claim 6, characterized in that, The added electronic module includes: A probe mounting block, wherein the probe mounting block is movably disposed on the second limiting part; An adapter printed circuit board is attached to the first side of the probe mounting block and is used for electrical connection with the test board. The probe is connected to the mounting block, and the first end of the probe passes through the mounting block and is electrically connected to the adapter printed circuit board. The second end of the probe is located on a second side of the probe mounting block opposite to the first side, and the second end of the probe is used to contact the DC power supply pin of the corresponding DC power supply pin group.

8. The testing apparatus according to claim 6, characterized in that, The second limiting part includes: A slide rail, which is detachably connected to the support block; At least one sliding block is slidably connected to the slide rail, and the at least one sliding block is correspondingly connected to the at least one set of electronic modules; A first driving unit is connected to the at least one sliding block, and the first driving unit is used to drive the at least one sliding block to slide along the slide rail.

9. The testing apparatus according to claim 1, characterized in that, The FPC crimping assembly includes: The support portion is detachably connected to the base; FPC crimping section, used to crimp the first FPC of the optical component under test onto the test board for electrical connection with the test board; The second driving unit is detachably connected to the support unit and the FPC pressing unit, and is used to drive the FPC pressing unit to move in the direction toward the test board mounting assembly.

10. The testing apparatus according to claim 1, characterized in that, The testing apparatus for the optical components also includes: A position adjustment component is disposed on the base, and at least one of the test board mounting component and the optical component mounting component is disposed on the position adjustment component. The position adjustment component is used to adjust the position of at least one of the test board mounting component and the optical component mounting component so that the first FPC of the optical component under test is electrically connected to the test board.

11. The testing apparatus according to claim 10, characterized in that, The position adjustment component includes: A first adjustment component is disposed between the base and the test board mounting component, and the first adjustment component is used to drive the test board mounting component to move in a first direction, the first direction being a direction perpendicular to a first side of the test board mounting component, the first side being used to mount the test board. The second adjustment component and the third adjustment component are stacked between the base and the optical component mounting component. The second adjustment component is used to drive the optical component mounting component to move in a plane parallel to the first side, and the third adjustment component is used to drive the optical component mounting component to rotate in a plane parallel to the first side.

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