Glass-based multilayer circuit touchpad module
By using a glass-based multilayer circuit structure, eliminating the need for adhesive backing and layer-by-layer bonding, and employing conductive holes and refined processes to form the circuit layers, the problems of large thickness and warping deformation of the touchpad module are solved, achieving both thinness and improved stability.
Patent Information
- Application Number
- CN202521884783.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-02
- Publication Date
- 2026-08-25
- Estimated Expiration
- 2035-09-02
AI Technical Summary
Existing touchpad modules are too thick and prone to warping and deformation, which affects the demand for thinner and lighter designs. In addition, poor adhesive bonding leads to signal interference and quality problems.
The glass-based multilayer circuit structure is adopted, with N layers of barrier circuit layers being laid sequentially overlapping between the cover glass assembly and the solder resist layer. Electrical connection is achieved through conductive holes, eliminating the need for adhesive backing and layer-by-layer bonding. The conductive and circuit layers are formed using printing, magnetron sputtering, and electroplating processes to ensure interlayer stability.
This achieves a thinner and lighter touchpad module, avoids warping and deformation, improves stability and signal transmission efficiency, reduces signal interference, and enhances touch sensitivity and reliability.
Smart Images
Figure CN224684424U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of computer technology, and in particular to a glass-based multilayer circuit touch panel module. Background Technology
[0002] Laptops have become an indispensable part of people's daily work and life. The touchpad module, as a convenient component of laptops, allows users to interact with the system through finger swipes and clicks. As people increasingly demand thinner and lighter laptops, touchpad modules also require thinner and lighter designs. The basic structure of a common touchpad module solution consists of a cover glass + adhesive backing + PCBA (printed circuit board assembly). This stacked structure accounts for most of the module's thickness, and currently, thicknesses are often [missing information].
[0003] 1.3-1.5mm.
[0004] The basic structure of existing modules consists of a cover glass, adhesive backing, and a PCBA. The cover glass is typically around 0.7mm thick. Since it primarily serves as the surface for direct user touch and appearance, and provides most of the module's strength support and protection, there is limited room for thinning. The adhesive backing, acting as the bonding layer between the glass and the PCBA, is typically 0.1mm thick. During assembly, poor adhesion is common, such as insufficient or excessive adhesive, leading to module separation. Air bubbles in the bonding can cause issues like poor touch line marking. The PCBA, as the carrier of the module's electronic components, is currently typically around 0.5mm thick in industry-standard thin and light designs. However, thin PCBAs are prone to irregular warping and deformation. On one hand, during bonding with the cover glass and adhesive backing, a deformed PCBA can lead to misalignment and poor bonding quality. On the other hand, a deformed PCBA can cause uneven stress, resulting in module warping and deformation.
[0005] Therefore, it is necessary to propose a glass-based multilayer circuit touch panel module to optimize the thickness of the touch panel module, making its structure thinner and lighter and avoiding warping and deformation. Utility Model Content
[0006] To address the aforementioned issues, this invention proposes a glass-based multilayer circuit touch panel module to optimize the thickness of the touch panel module, making its structure thinner and lighter while avoiding warping and deformation.
[0007] This utility model is achieved through the following technical solution:
[0008] This utility model proposes a glass-based multilayer circuit touch panel module, including a cover glass assembly, a barrier circuit layer, and a solder resist layer. The cover glass assembly, the barrier circuit layer, and the solder resist layer are sequentially overlapped. There are N layers of the barrier circuit layer between the cover glass assembly and the solder resist layer. Each barrier circuit layer includes a barrier layer and a circuit layer overlapping the bottom surface of the barrier layer. The first barrier layer is laid on the bottom surface of the cover glass assembly, and the solder resist layer is overlapped on the bottom surface of the last circuit layer. N is a positive integer and is greater than 0.
[0009] Furthermore, when N≥2, the barrier layer between every two circuit layers is provided with a conductive hole, and each circuit layer forms an electrical connection through the conductive hole.
[0010] Furthermore, the circuit layer includes a conductive layer and a circuit layer, with the circuit layer overlapping the conductive layer, and the circuit layer having a circuit structure for implementing touch functionality.
[0011] Furthermore, the bottom surface of the cover glass assembly is provided with the barrier layer by printing, the bottom surface of the barrier layer is provided with the conductive layer by magnetron sputtering, the bottom surface of the conductive layer is provided with the circuit layer by electroplating, and the bottom surface of the circuit layer is provided with the solder resist layer by printing.
[0012] Furthermore, when N=2, the two barrier layers are a first insulating layer and a second insulating layer, and the two circuit layers include a first conductive layer, a first circuit layer, a second conductive layer, and a second circuit layer. The bottom of the cover glass assembly has a first insulating layer formed by printing. The bottom of the first insulating layer has a first conductive layer formed by magnetron sputtering. The bottom of the first conductive layer has a first circuit layer formed by electroplating. The bottom of the first circuit layer has a second insulating layer formed by printing. The bottom of the second insulating layer has a second conductive layer formed by magnetron sputtering. The bottom of the second conductive layer has a second circuit layer formed by printing. The second circuit layer is electrically connected to the first circuit layer. The bottom of the second circuit layer has a solder resist layer formed by printing.
[0013] Furthermore, the cover glass assembly includes a tempered glass layer, the bottom of which has an ink layer printed on it, and the bottom of which has a first insulating layer printed on it.
[0014] Furthermore, the thickness of the tempered glass layer is c, where 0 < c ≤ 0.7 mm.
[0015] Furthermore, the thickness of both the first circuit layer and the second circuit layer is 1 to 20 μm.
[0016] Furthermore, the thickness of both the first insulating layer and the second insulating layer is 10–50 μm.
[0017] Furthermore, the thickness of the first conductive layer is 15–35 μm.
[0018] The beneficial effects of this utility model are:
[0019] This utility model proposes a glass-based multilayer circuit touch panel module, in which a cover glass assembly, a barrier circuit layer, and a solder resist layer are sequentially overlapped. There are N barrier circuit layers between the cover glass assembly and the solder resist layer. Each barrier circuit layer includes a barrier layer and a circuit layer that is overlapped on the bottom surface of the barrier layer. The first barrier layer is laid on the bottom surface of the cover glass assembly, and the solder resist layer is overlapped on the bottom surface of the last circuit layer. By using the laying method, there is no need to use adhesive to bond each layer, which improves the fixing force between layers, makes the stability between layers high, and greatly reduces the thickness of each layer, thus reducing the overall thickness of the touch panel module.
[0020] In summary, this glass-based multilayer circuit touch panel module can effectively optimize the thickness of the touch panel module, making its structure thinner and lighter, avoiding warping and deformation, and improving overall stability. Attached Figure Description
[0021] Figure 1 This is an exploded view of the glass-based multilayer circuit touch panel module of this utility model.
[0022] Figure 2 This is an exploded view of the glass-based multilayer circuit touch panel module of this utility model when N=2.
[0023] Figure 3 This is a flowchart illustrating the fabrication method of the glass-based multilayer circuit touch panel module of this utility model.
[0024] Figure 4 This is a flowchart of the glass-based multilayer circuit touch panel module preparation method of this utility model when N=2.
[0025] The attached figures are labeled as follows:
[0026] Cover glass assembly 1, tempered glass layer 11, ink layer 12;
[0027] Blocking circuit layer 2;
[0028] Circuit layer 201, first conductive layer 22, first line layer 23, second conductive layer 25, second line layer 26;
[0029] Barrier layer 202, first insulating layer 21, second insulating layer 24, conductive hole 241, solder resist layer 27. Detailed Implementation
[0030] To more clearly and completely illustrate the technical solution of this utility model, the following description, in conjunction with the accompanying drawings, will provide further details.
[0031] Please refer to Figures 1-2 This utility model proposes a glass-based multilayer circuit touch panel module, including a cover glass assembly 1, a barrier circuit layer 2, and a solder resist layer 27. The cover glass assembly 1, the barrier circuit layer 2, and the solder resist layer 27 are sequentially overlapped. There are N layers of barrier circuit layers 2 between the cover glass assembly 1 and the solder resist layer 27. The barrier circuit layer 2 includes a barrier layer 202 and a circuit layer 201 overlapped on the bottom surface of the barrier layer 202. The first barrier layer 202 is laid on the bottom surface of the cover glass assembly 1, and the solder resist layer 27 is overlapped on the bottom surface of the last circuit layer 201. N is a positive integer and is greater than 0.
[0032] In this embodiment, the cover glass assembly 1, the N-layer barrier circuit layer 2, and the solder resist layer 27 are sequentially overlapped. The thickness of the solder resist layer 27 can be controlled between 10 and 50 μm. The solder resist layer 27 can be used to cover copper lines that do not need to be soldered, preventing negative situations such as short circuits, oxidation, and mechanical damage during subsequent electronic component soldering. In this way, there is no need to use adhesive to bond layer by layer, and the thickness of each layer is greatly reduced, thus reducing the overall thickness of the touch panel module. By adopting the laying method, there is no need to use adhesive to bond layer by layer, and the thickness of each layer is greatly reduced. Through the above-mentioned stacked design, the cover glass assembly 1 can be directly used as a substrate for circuit layout, reducing the thickness of the adhesive layer and PCBA board, effectively reducing the original 1.3 mm touch module thickness to 0.9 mm or less, and reducing the overall thickness of the touch panel module.
[0033] In this embodiment, when N≥2, a conductive hole 241 is provided in the barrier layer 202 between every two circuit layers 201, and each circuit layer 201 forms an electrical connection through the conductive hole 241. In order to ensure that the circuit layers 201 of adjacent layers can form an electrical connection, the conductive hole 241 is provided as a filling area of conductive material. When laying the next circuit layer 201, the laying material of the next circuit layer 201 will directly fill into the conductive hole 241, so that the circuit layer 201 of the previous layer forms an electrical connection with the circuit layer 201 of the next layer.
[0034] In this embodiment, the circuit layer 201 includes a conductive layer 22A and a circuit layer 23A. The circuit layer 23A is stacked on the conductive layer 22A and has a circuit structure for implementing touch function. The conductive layer 22A can improve current carrying capacity and mechanical strength, and provides an etching basis for transferring patterns to the circuit layer 23A. The circuit layer 23A is a circuit formed on the basis of the conductive layer 22A, which greatly reduces the thickness between layers.
[0035] In this embodiment, a barrier layer 202 is printed on the bottom surface of the cover glass assembly 1. A conductive layer 22A is formed on the bottom surface of the barrier layer 202 by magnetron sputtering. A circuit layer 23A is formed on the bottom surface of the conductive layer 22A by electroplating. A solder resist layer 27 is printed on the bottom surface of the circuit layer 23A. The printed barrier layer 202 provides sufficient mechanical support for the subsequent electroplating of the conductive layer 22A and the circuit layer 23A, and isolates the circuit from interference by external conductive media. Simultaneously, it also prevents the subsequent electroplating of the conductive layer 22A and the circuit layer 23A from affecting the ink color on the bottom of the cover glass assembly 1. To mitigate interference, the conductive layer 22A can be formed using magnetron sputtering to create a high-purity copper layer. This allows for precise control of the copper layer's thickness and uniformity, resulting in strong adhesion between the conductive layer 22A and the barrier layer 202. The circuit layer 23A can be thickened by electroplating, improving its current carrying capacity and mechanical strength, and providing an etching basis for circuit pattern transfer. The circuit pattern is transferred to the electroplated conductive layer 22A through photolithography-exposure-development-etching to form the circuit layer 23A. This process reduces the thickness between layers while simultaneously forming an effective circuit and improving the stability between layers.
[0036] In this embodiment, when N=2, the two barrier layers 202 are a first insulating layer 21 and a second insulating layer 24, and the two circuit layers 201 include a first conductive layer 22, a first circuit layer 23, a second conductive layer 25, and a second circuit layer 26. The bottom of the cover glass assembly 1 is provided with the first insulating layer 21 by printing. The bottom of the first insulating layer 21 is provided with the first conductive layer 22 by magnetron sputtering. The bottom of the first conductive layer 22 is provided with the first circuit layer 23 by electroplating. The bottom of the first circuit layer 23 is provided with the second insulating layer 24 by printing. The bottom of the second insulating layer 24 is provided with the second conductive layer 25 by magnetron sputtering. The bottom of the second conductive layer 25 is provided with the second circuit layer 26 by printing. The second circuit layer 26 is electrically connected to the first circuit layer 23. The bottom of the second circuit layer 26 is provided with a solder resist layer 27 by printing.
[0037] In this embodiment, taking a two-layer circuit layer 201 as an example, during the actual stacking, a first insulating layer 21 is directly printed on the bottom of the cover glass assembly 1. The printed first insulating layer 21 can provide sufficient mechanical support for the subsequent electroplating of the first conductive layer 22 and the first circuit layer 23, and isolate the circuit from interference by the external conductive medium. At the same time, it can also avoid interference of the subsequent electroplating of the first conductive layer 22 and the first circuit layer 23 on the ink color at the bottom of the cover glass assembly 1. Then, the first conductive layer 22 is formed directly on the bottom of the first insulating layer 21 by magnetron sputtering. The thickness of the first conductive layer 22 can be controlled between 15 and 35 μm. The first conductive layer 22 can provide a support for the subsequent electroplated copper-formed first circuit layer 23. The surface provides the conductive foundation for the printed circuit, laying the basis for subsequent photolithography and etching processes to form circuit patterns. It also provides a certain mechanical support. Moreover, large-area magnetron sputtering can form a high-purity copper layer, allowing for precise control of the copper layer thickness and uniformity, and ensuring strong adhesion to the surface of the first insulating layer 21. Then, the first circuit layer 23 is directly electroplated at the bottom of the first conductive layer 22. Here, copper electroplating by chemical deposition can thicken the first conductive layer 22, improving its current carrying capacity and mechanical strength, and providing an etching basis for pattern transfer. Then, through photolithography and etching steps, the first conductive layer 22 is photolithographically and etched to transfer the circuit pattern onto the first conductive layer 22, i.e., the inner copper layer of the cover glass assembly 1. This forms the basis for laying out the inner layer circuitry and implementing touch functionality. Then, a second insulating layer 24 is printed directly on the bottom of the first circuit layer 23. The second insulating layer 24 isolates the inner and outer layer circuits, i.e., isolates the first circuit layer 23 from the second circuit layer 26, preventing short circuits and signal interference. It also provides sufficient mechanical support to lay the foundation for subsequent multilayer circuitry. Next, a second conductive layer 25 is formed directly on the bottom of the second insulating layer 24 by magnetron sputtering. The thickness of the second conductive layer 25 can be controlled between 13 and 35 μm. The second conductive layer 25 provides an adhesion surface for the subsequent electroplated copper-formed second circuit layer 26, thus providing the conductive foundation for the printed circuit and laying the foundation for subsequent photolithography and etching processes to form the circuit pattern. It also provides certain mechanical support. Moreover, large-area magnetron sputtering can form a high-purity copper layer, allowing for precise control of the copper layer thickness and uniformity. It has strong adhesion to the surface of the second insulating layer 24. Then, the second circuit layer 26 is directly printed at the bottom of the second conductive layer 25, making the second circuit layer 26 electrically connected to the first circuit layer 23. Through chemical deposition electroplating of copper, the second conductive layer 25 can be thickened. At the same time, the reserved holes in the second insulating layer 24 are electroplated with copper to achieve the conductive connection between the upper and lower circuits. This forms an electrical connection between the first circuit layer 23 and the second circuit layer 26, and provides an etching basis for the transfer of the circuit pattern. Through photolithography etching, the circuit pattern is transferred to the outer copper layer of the cover glass assembly 1.This lays the foundation for the outer circuitry and touch functionality. The second circuit layer 26 is successfully laid, and then a solder mask layer 27 is directly printed on the bottom of the second circuit layer 26. The thickness of the solder mask layer 27 can be controlled between 10 and 50 μm. The solder mask layer 27 can cover copper lines that do not require soldering, preventing short circuits, oxidation, and mechanical damage during subsequent electronic component soldering. This eliminates the need for adhesive backing for layer-by-layer bonding and significantly reduces the thickness of each layer, thus reducing the overall thickness of the touchpad module. Through the above-mentioned stacked design, the cover glass assembly 1 can be directly used as the substrate for circuit layout, reducing the thickness of the adhesive layer and PCBA board. This allows the original 1.3 mm thickness of the touch module to be reduced to 0.9 mm or less. Simultaneously, it eliminates the need for adhesive backing for layer-by-layer bonding. The adhesive backing layer effectively avoids interference with the signal during touch, improving the signal-to-noise ratio. Furthermore, the overall module thinning reduces the pressure transmission path, improves signal transmission efficiency, and reduces mechanical interference during touch. When the user interacts with the cover glass assembly 1, the pressure changes generated are directly transmitted to the multi-layer circuitry (first circuit layer 23, second circuit layer 26), resulting in capacitance changes. These capacitance changes determine the touch coordinates and corresponding commands, effectively improving touch sensitivity. The multi-layer circuitry and cover glass assembly 1 are bonded using screen printing and chemical deposition. The surfaces of each layer adhere to each other through chemical bonding and diffusion, resulting in strong adhesion, high locking properties, and extremely high reliability, effectively avoiding the risk of adhesive failure associated with existing adhesive backing solutions.
[0038] The glass-based multilayer circuit touch panel module described above adopts a double-layer circuit design, which is one example of this utility model. Depending on the circuit laying requirements of different touch modules, circuit layers 201 of any level, such as 4 or 8 layers, can be stacked cyclically below the second circuit layer 26, while the last layer is always the solder mask layer 27.
[0039] In this embodiment, the cover glass assembly includes a tempered glass layer 11. An ink layer 12 is printed on the bottom of the tempered glass layer 11, and a first insulating layer 21 is printed on the bottom of the ink layer 12. The thickness of the tempered glass layer 11 is c, where 0 < c ≤ 0.7 mm. The tempered glass layer 11 is preferably made of sodium-calcium, medium-aluminum, or high-aluminum substrate glass, with a preferred thickness of 0.7 mm. Alternatively, the tempered glass layer 11 can preferably be made of a glass substrate of 0.6 mm or less. During the manufacturing process of the tempered glass layer 11, it is preferable to use a large sheet of glass substrate for AG (anti-glare) and chemical strengthening treatment. Specific dimensions can be referenced from the process dimensions of PCB (printed circuit board), preferably 457 mm x 610 mm or 457 mm x 610 mm. The 610mm diameter and large glass substrate improve the production efficiency of the subsequent printed circuit, reduce the number of board changes, and facilitate the control of the thickness and uniformity of the copper plating on the entire surface. The specific tempering process of the tempered glass layer 11 is AG treatment-cleaning-chemical strengthening-cleaning to obtain the tempered glass layer 11. As the substrate of the printed circuit of this utility model, the tempered glass layer 11 provides mechanical support for the subsequent layer stacking and the strength support for the entire touch module, and also provides a smooth tactile experience. The ink layer 12 is printed on the non-touch surface using screen printing on the basis of the tempered glass layer 11. By printing the ink layer 12, the desired appearance color of the touch module is revealed through the ink color substrate. Printing the ink substrate of the tempered glass layer 11 on the non-touch surface in advance can improve the tactile feel of the touch surface. At the same time, the appearance color of the ink layer 12 will not be caused by frequent touch during use.
[0040] In this embodiment, the materials of the first insulating layer 21 and the second insulating layer 24 are any one of polyamide, polyester, polytetrafluoroethylene, polydimethylsilane, oxide ceramic material, and nitride ceramic. While providing insulation, they can also effectively provide mechanical support for subsequent circuit printing and isolate the circuit from interference by external conductive media.
[0041] In this embodiment, the thickness of the first insulating layer 21 and the second insulating layer 24 is 10-50 μm, which reduces the overall thickness of the touch module while ensuring sufficient mechanical support and insulation.
[0042] In this embodiment, the first conductive layer 22, the first circuit layer 23, the second conductive layer 25, and the second circuit layer 26 are all made of copper. The first conductive layer 22 and the second conductive layer 25 are formed by magnetron sputtering of copper atoms, and the first circuit layer 23 and the second circuit layer 26 are formed by electroplating.
[0043] In this embodiment, the thickness of the first circuit layer 23 and the second circuit layer 26 is 1 to 20 μm, which greatly reduces the overall thickness of the touch module while providing effective conductivity.
[0044] In this embodiment, a conductive hole 241 is provided on the second insulating layer 24. The inner wall of the conductive hole is electroplated to make the second circuit layer 26 electrically connected to the first circuit layer 25. The conductive hole 241 is formed by laser drilling in the second insulating layer 24. When laying the second circuit layer 26, copper can be electroplated by chemical deposition to thicken the second conductive layer 25. At the same time, the conductive hole 241 on the second insulating layer 24 is also electroplated with copper, so that the hole wall of the conductive hole 241 is also electroplated with copper, realizing the conductive connection between the upper and lower circuits, that is, the first circuit layer 23 and the second circuit layer 26 are electrically connected.
[0045] If a layer design with N≥3 is adopted, the conductive hole 241 will be opened on the insulating layer between the cover glass assembly 1 and the solder resist layer 27, so that multiple circuit layers 201 can form electrical connections as required.
[0046] Please refer to Figure 3 This utility model also proposes a method for manufacturing a glass-based multilayer circuit touch panel module, which includes the following steps:
[0047] S1: An insulating material is used to form a barrier layer 202 at the bottom of the cover glass assembly 1 by screen printing or inkjet printing. Depending on the type of insulating material of the barrier layer 202, it is cured at room temperature or baked at high temperature.
[0048] S2: Based on the barrier layer 202, a circuit layer 201 is formed, wherein copper atoms are uniformly sputtered and deposited on the barrier layer 202 by magnetron sputtering to form a conductive layer 22A in the circuit layer 201, and then fixed by high-temperature baking.
[0049] S3: Based on the conductive layer 22A, copper atoms are deposited on the conductive layer 22A by chemical reduction through electroplating. The inner circuit pattern of the touch module is transferred to the electroplated conductive layer 22A by photolithography-exposure-development-etching to form the circuit layer 23A in the circuit layer.
[0050] S4: On the circuit layer 23A, solder resist ink is screen-printed onto the circuit layer 23A. Through exposure-development-etching, the copper lines that do not need to be soldered are protected against soldering, forming a solder resist layer 27.
[0051] In this embodiment, when N=1, an insulating material is used to form a barrier layer 202 at the bottom of the cover glass assembly 1 by screen printing or inkjet printing. Depending on the type of insulating material used in the barrier layer 202, it is cured at room temperature or baked at high temperature. A circuit layer 201 is then formed on top of the barrier layer 202. Copper atoms are uniformly sputtered and deposited onto the barrier layer 202 using magnetron sputtering to form a conductive layer 22A in the circuit layer 201. The magnetron sputtering method ensures that the conductive layer 22A is uniformly deposited. The distribution is then fixed by high-temperature baking; based on the conductive layer 22A, copper atoms are deposited on the conductive layer 22A by chemical reduction through electroplating; the inner layer circuit pattern of the touch module is transferred to the electroplated conductive layer 22A by photolithography-exposure-development-etching to form the circuit layer 23A in the circuit layer; on the circuit layer 23A, solder resist ink is screen printed onto the circuit layer 23A, and the copper lines that do not need to be soldered are protected by solder resist through exposure-development-etching to form the solder resist layer 27.
[0052] Furthermore, when N≥2, the process includes the following steps before forming the solder resist layer 27:
[0053] S5: The insulating material is used to form a second insulating layer 24 by means of screen printing or inkjet printing, and the second insulating layer 24 is cured at room temperature or baked at high temperature according to the type of insulating material.
[0054] S6: Conductive holes 241 are opened on the second insulating layer 24 by laser; copper atoms are uniformly sputtered and deposited on the second insulating layer 24 by magnetron sputtering to form the second conductive layer 25, and then fixed by high-temperature baking.
[0055] S7: Based on the second conductive layer 25, copper atoms are deposited on the second conductive layer 25 by chemical reduction through electroplating. The inner circuit pattern of the touch module is transferred to the electroplated second conductive layer 25 by photolithography-exposure-development-etching to form the second circuit layer 26.
[0056] S8: Repeat steps S5-S7, repeating N-2 times.
[0057] In this embodiment, an insulating material is used to form a barrier layer 202 at the bottom of the cover glass assembly 1 by screen printing or inkjet printing. Depending on the type of insulating material in the barrier layer 202, it is cured at room temperature or baked at high temperature. A circuit layer 201 is formed on top of the barrier layer 202. Copper atoms are uniformly sputtered and deposited on the barrier layer 202 by magnetron sputtering to form a conductive layer 22A in the circuit layer 201. Magnetron sputtering ensures uniform distribution of the conductive layer 22A, which is then baked at high temperature. On top of the conductive layer 22A, copper atoms are chemically reduced and deposited on the conductive layer 22A by copper electroplating. The inner circuit pattern of the touch module is transferred to the electroplated conductive layer 22A by photolithography-exposure-development-etching to form a circuit layer 23A in the circuit layer. A second insulating layer 24 is formed by screen printing or inkjet printing of insulating material. The second insulating layer 24 is then cured at room temperature or baked at high temperature depending on its insulating properties. The material is cured at room temperature or baked at high temperature for fixation. Conductive holes 241 are opened on the second insulating layer 24 by laser. Copper atoms are uniformly sputtered and deposited on the second insulating layer 24 by magnetron sputtering to form the second conductive layer 25, and then baked at high temperature for fixation. Based on the second conductive layer 25, copper atoms are chemically reduced and deposited on the second conductive layer 25 by electroplating. The inner circuit pattern of the touch module is transferred to the electroplated second conductive layer 25 by photolithography-exposure-development-etching to form the second circuit layer 26. Steps S5-S7 are repeated for N-2 times. For example, if N=4, steps S5-S7 are repeated twice before proceeding to the next step. Solder resist ink is screen-printed onto the circuit layer 23A. Through exposure-development-etching, the copper lines that do not need to be soldered are protected against soldering to form the solder resist layer 27.
[0058] Please refer to Figure 4In this embodiment, when N=2, the process involves a large glass substrate AG and chemical strengthening, followed by printing glass substrate ink, printing a first insulating layer, magnetron sputtering a first conductive layer, electroplating a first conductive layer, photo-etching a first circuit layer, printing a second insulating layer, laser drilling, magnetron sputtering a second conductive layer, electroplating a second conductive layer, photo-etching a second circuit layer, printing a solder resist layer, and then cutting the large substrate into smaller pieces using CNC machining. Specifically, the tempered glass layer 11 is preferably made of soda-lime, medium-aluminum, or high-aluminum glass substrates, with a preferred thickness of 0.7mm. Alternatively, the tempered glass layer 11 can preferably be made of glass substrates with a thickness of 0.6mm or less. During the fabrication of the tempered glass layer 11, it is preferable to use a large glass substrate for AG (anti-glare) and chemical strengthening treatment. The specific dimensions can be referenced from the PCB (printed circuit board) process dimensions, preferably 457mm x 610mm or 457mm x The 610mm diameter, large glass substrate can improve the production efficiency of the subsequent printed circuit, reduce the number of board changes, and facilitate the control of the thickness and uniformity of the subsequent whole-surface electroplated copper. The specific tempering process of the tempered glass layer 11 is AG treatment-cleaning-chemical strengthening-cleaning to obtain the tempered glass layer 11. The tempered glass layer 11 serves as the substrate of the printed circuit of this utility model, providing mechanical support for the subsequent layer stacking and strength support for the entire touch module, and also providing a smooth tactile experience. The ink layer 12 is printed on the non-touch surface using screen printing based on the tempered glass layer 11. The first insulating layer 21 is printed directly on the bottom of the cover glass assembly 1, that is, directly on the ink layer 12 at the bottom of the tempered glass layer 11. Then, depending on the type of insulating material, it is cured at room temperature or baked at high temperature. Then, the first conductive layer 22 is formed directly on the bottom of the first insulating layer 21 by magnetron sputtering, and then baked at high temperature. Electroplating is performed on the bottom of the conductive layer 22. The circuit pattern of the inner layer of the touch module is transferred to the electroplated first conductive layer 22 through photolithography-exposure-development-etching to form the first circuit layer 23. Then, the second insulating layer 24 is directly printed on the bottom of the first circuit layer 23. Depending on the type of insulating material, it is cured at room temperature or baked at high temperature. Then, the second conductive layer 25 is formed on the bottom of the second insulating layer 24 by magnetron sputtering. Then, it is baked at high temperature. Then, electroplating is performed on the bottom of the second conductive layer 25. The circuit pattern of the inner layer of the touch module is transferred to the electroplated second conductive layer 25 through photolithography-exposure-development-etching to form the second circuit layer 26. The shape of the second insulating layer 24 can be left with a channel to avoid the second circuit layer 24, so that the second circuit layer 26 and the first circuit layer 23 can be electrically connected during electroplating. Alternatively, conductive holes 241 can be opened on the second insulating layer 24 by laser. The conductive holes 241 are opened at the positions where the first circuit layer 23 and the second circuit layer 26 need to be electrically connected.During the laying of the second circuit layer 26, copper is electroplated by chemical deposition to thicken the second conductive layer 25. At the same time, the conductive holes 241 on the second insulating layer 24 are also electroplated with copper, so that the walls of the conductive holes 241 are also electroplated with copper, realizing the conductive connection between the upper and lower circuits, that is, forming an electrical connection between the first circuit layer 23 and the second circuit layer 26. Then, solder resist ink is screen-printed onto the second circuit layer 26. Through exposure-development-etching, the copper lines that do not need to be soldered are protected with solder resist, forming a solder resist layer 27. After the solder resist layer 27 is completed, a multilayer circuit glass substrate is obtained, which improves the fixing force between layers and makes the stability between layers high. Then, the large multilayer circuit glass substrate is cut into small substrates required for the module by slicing. Then, the small glass substrates are ground and precision carved by CNC (numerical control machining) to meet the appearance and size requirements of the final product.
[0059] Using the above preparation method, the PCB circuit can be directly integrated onto the cover glass assembly 1, thereby reducing the main structure of the touch module to 0.9mm or less;
[0060] In summary, this glass-based multilayer circuit touch panel module can effectively optimize the thickness of the touch panel module, making its structure thinner and lighter, avoiding warping and deformation, and improving overall stability.
[0061] The glass-based multilayer circuit touch panel module described above adopts a double-layer circuit design, which is one example contained in this utility model. According to the circuit laying requirements of different touch modules, circuit layers 201 of any level, such as 4 layers or 8 layers, can be stacked cyclically below the second circuit layer 26. The last layer is always the solder mask layer 27. That is, the glass-based multilayer circuit touch panel module prepared by the above preparation method is within the protection scope of this utility model.
[0062] Of course, there may be other implementations of this utility model. Based on this implementation, other implementations obtained by those skilled in the art without any creative effort are all within the scope of protection of this utility model.
Claims
1. A glass-based multilayer circuit touch panel module, characterized in that, The device includes a cover glass assembly, a barrier circuit layer, and a solder resist layer, which are sequentially overlapped. There are N layers of the barrier circuit layer between the cover glass assembly and the solder resist layer. Each barrier circuit layer includes a barrier layer and a circuit layer overlapping the bottom surface of the barrier layer. The first barrier layer is laid on the bottom surface of the cover glass assembly, and the solder resist layer overlaps the bottom surface of the last circuit layer. N is a positive integer and greater than 0.
2. The glass-based multilayer circuit touch panel module according to claim 1, characterized in that, When N≥2, the barrier layer between every two circuit layers is provided with a conductive hole, and each circuit layer forms an electrical connection through the conductive hole.
3. The glass-based multilayer circuit touch panel module according to claim 1, characterized in that, The circuit layer includes a conductive layer and a circuit layer, with the circuit layer overlapping the conductive layer, and the circuit layer having a circuit structure for implementing touch functionality.
4. The glass-based multilayer circuit touch panel module according to claim 3, characterized in that, The barrier layer is printed on the bottom surface of the cover glass assembly, the conductive layer is formed by magnetron sputtering on the bottom surface of the barrier layer, the circuit layer is formed by electroplating on the bottom surface of the conductive layer, and the solder resist layer is printed on the bottom surface of the circuit layer.
5. The glass-based multilayer circuit touch panel module according to claim 1, characterized in that, When N=2, the two barrier layers are a first insulating layer and a second insulating layer, and the two circuit layers include a first conductive layer, a first circuit layer, a second conductive layer, and a second circuit layer. The bottom of the cover glass assembly has a first insulating layer formed by printing. The bottom of the first insulating layer has a first conductive layer formed by magnetron sputtering. The bottom of the first conductive layer has a first circuit layer formed by electroplating. The bottom of the first circuit layer has a second insulating layer formed by printing. The bottom of the second insulating layer has a second conductive layer formed by magnetron sputtering. The bottom of the second conductive layer has a second circuit layer formed by printing. The second circuit layer is electrically connected to the first circuit layer. The bottom of the second circuit layer has a solder resist layer formed by printing.
6. The glass-based multilayer circuit touch panel module according to claim 5, characterized in that, The cover glass assembly includes a tempered glass layer, the bottom of which has an ink layer printed on it, and the bottom of which has a first insulating layer printed on it.
7. The glass-based multilayer circuit touch panel module according to claim 6, characterized in that, The thickness of the tempered glass layer is c, where 0 < c ≤ 0.7 mm.
8. The glass-based multilayer circuit touch panel module according to claim 5, characterized in that, The thickness of both the first and second circuit layers is 1–20 μm.
9. The glass-based multilayer circuit touch panel module according to claim 5, characterized in that, The thickness of both the first insulating layer and the second insulating layer is 10-50 μm.
10. The glass-based multilayer circuit touch panel module according to claim 5, characterized in that, The thickness of the first conductive layer is 15–35 μm.