A heat dissipation structure compatible with air cooling and liquid cooling and an inverter

Abstract

The utility model discloses a compatible heat radiation structure and inverter of air cooling and liquid cooling relates to heat radiation technical field, and the compatible heat radiation structure of air cooling and liquid cooling includes: box body and the circuit board of setting in the box body is equipped with two radiators, and two radiators are respectively established in the both sides of circuit board, and the radiator includes: heat dissipation base plate, and the inside interval of heat dissipation base plate sets up several heat dissipation fins, and forms the sealed flow channel for passing through heat exchange medium between two adjacent heat dissipation fins, drive assembly, drive assembly sets up the first end of heat dissipation base plate, and drive assembly is used for driving heat exchange medium from the first end of sealed flow channel flows to the second end of sealed flow channel, to absorb the heat of heat dissipation base plate. The above-mentioned compatible heat radiation structure of air cooling and liquid cooling solves the technical problem that the existing heat radiation structure is usually based on different platform development for the two kinds of heat dissipation modes, cannot be compatible with two kinds of heat dissipation mode, and the equipment development and maintenance cost is higher.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and in particular to a heat dissipation structure and inverter compatible with both air cooling and liquid cooling. Background Technology

[0002] Currently, the heat generation problem of power electronic equipment is becoming increasingly serious with the increase in equipment power density. Traditional heat dissipation methods often use active heat dissipation such as air cooling or water cooling. The basic principle of these two heat dissipation methods is to use fluid flow to carry away the heat generated by the device through forced convection heat transfer.

[0003] Existing heat dissipation structures are typically developed on different platforms to address these two cooling methods, resulting in incompatibility and high equipment development and maintenance costs. Therefore, this paper proposes a heat dissipation structure and inverter compatible with both air cooling and liquid cooling to solve the aforementioned problems. Utility Model Content

[0004] The purpose of this invention is to provide a heat dissipation structure and inverter that are compatible with both air cooling and liquid cooling, solving the technical problem that existing heat dissipation structures are usually developed on different platforms for these two heat dissipation methods, and cannot be compatible with both heat dissipation methods, resulting in high equipment development and maintenance costs.

[0005] To achieve the above objectives, this utility model provides a heat dissipation structure and inverter compatible with both air cooling and liquid cooling. The heat dissipation structure compatible with both air cooling and liquid cooling includes:

[0006] The heat sink is provided in two, and the two heat sinks are respectively disposed on both sides of the circuit board. The heat sink includes a heat sink base plate, and a plurality of heat sink fins are arranged at intervals inside the heat sink base plate. A sealed flow channel for the passage of heat exchange medium is formed between two adjacent heat sink fins.

[0007] A driving assembly is disposed at the first end of the sealed flow channel. The driving assembly is used to drive the heat exchange medium to flow from the first end of the sealed flow channel to the second end of the sealed flow channel to absorb the heat of the heat dissipation substrate.

[0008] Preferably, the drive component includes a centrifugal fan, wherein the two exhaust ports of the centrifugal fan are respectively connected to the first end of the corresponding sealed flow channel.

[0009] Preferably, the centrifugal fan includes: a housing, two air guide channels symmetrically arranged inside the housing, a fan blade at the first end of each air guide channel, and air intakes on both sides of the housing, with each air intake corresponding to one of the fan blades.

[0010] Preferably, each of the air guide channels is provided with an exhaust port at its second end, and an air guide structure is provided at the exhaust port location, wherein the air guide structure is a plurality of ventilation holes arranged in an array.

[0011] Preferably, an air inlet section cover is provided at the first end of the heat dissipation substrate, and air inlets are provided on both sides of the air inlet section cover. The centrifugal fan is located inside the air inlet section cover, and the air intake of the centrifugal fan faces the air inlet.

[0012] Preferably, an air outlet section cover is provided at the second end of the heat dissipation substrate, and an air outlet is provided at the end of the air outlet section cover, with the air outlet facing the second end of the sealed flow channel.

[0013] Preferably, the driving component includes:

[0014] The liquid inlet component has an internal liquid inlet pipe. The first end of the liquid inlet pipe is connected to the water outlet of the water-cooled unit, and the second end of the liquid inlet pipe is connected to the first end of the sealed flow channel.

[0015] The liquid outlet component has an internal liquid outlet pipe. The first end of the liquid outlet pipe is connected to the water inlet of the water-cooled unit, and the second end of the liquid outlet pipe is connected to the second end of the sealed flow channel.

[0016] Preferably, a liquid inlet section cover is provided at the first end of the heat dissipation substrate, and the liquid inlet section cover is located on the outside of the liquid inlet component.

[0017] Preferably, a liquid outlet section cover is provided at the second end of the heat dissipation substrate, and the liquid outlet section cover is located on the outside of the liquid outlet component.

[0018] An inverter comprising a heat dissipation structure compatible with both air cooling and liquid cooling as described in any of the preceding claims.

[0019] Compared with the aforementioned background technology, the heat dissipation structure compatible with both air cooling and liquid cooling provided by this utility model has the following beneficial effects:

[0020] (1) This utility model is designed for two different types of heat exchange media, liquid and gas. A corresponding driving component is set at the first end of the heat dissipation substrate to drive one of the heat exchange media, so that the two different types of heat exchange media, liquid and gas, can pass through the sealed flow channel. According to different heat dissipation requirements, the two heat dissipation methods of air cooling or liquid cooling can be switched. Moreover, there is no need to set up separate air cooling channels and liquid cooling channels, which greatly reduces the equipment development and maintenance costs.

[0021] (2) In this utility model, the heat inside the box is transferred to the heat exchange substrate by heat transfer. When the heat exchange medium passes through the sealed flow channel, it absorbs the heat of the heat dissipation substrate by heat transfer, thereby achieving the purpose of heat dissipation and cooling inside the box, effectively improving the operating environment of various devices inside the box. Moreover, by increasing the heat exchange area between the heat exchange medium and the heat dissipation substrate through the heat dissipation fins, the heat dissipation efficiency inside the box is further accelerated. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0023] Figure 1 This is a three-dimensional structural diagram of the inverter provided in the first embodiment of the present invention;

[0024] Figure 2 This is an exploded view of the inverter provided in the first embodiment of the present invention;

[0025] Figure 3 This is a cross-sectional schematic diagram of the inverter provided in the first embodiment of the present invention;

[0026] Figure 4 This is an internal schematic diagram of the inverter provided in the first embodiment of the present invention;

[0027] Figure 5 This is a perspective structural view of the radiator provided in the first embodiment of the present invention;

[0028] Figure 6 This is a plan view of the heat sink provided in the first embodiment of the present invention;

[0029] Figure 7 An exploded view of the centrifugal fan provided in the first embodiment of this utility model;

[0030] Figure 8 This is a cross-sectional schematic diagram of the inverter provided in the second embodiment of the present invention;

[0031] Figure 9 This is an exploded view of the inverter provided in the second embodiment of the present invention;

[0032] Figure 10 This is an internal schematic diagram of the inverter provided in the second embodiment of the present invention.

[0033] Specifically, 1-box; 2-circuit board; 201-first heating element; 202-second heating element; 3-heat sink; 301-heat sink substrate; 302-heat sink fins; 303-sealed flow channel; 4-centrifugal fan; 401-shell; 402-fan blade; 403-air guide channel; 404-air intake; 405-air guide structure; 5-air exhaust port; 6-inlet section cover; 601-air inlet; 7-outlet section cover; 701-outlet; 8-liquid inlet component; 801-liquid inlet pipe; 9-liquid outlet component; 901-liquid outlet pipe; 10-liquid inlet section cover; 11-liquid outlet section cover. Detailed Implementation

[0034] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0035] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0036] like Figure 1 , Figure 2 , Figure 5 , Figure 8 and Figure 9 As shown, to achieve the above objectives, this utility model provides a heat dissipation structure compatible with both air cooling and liquid cooling, including: two heat sinks 3 respectively disposed on both sides of a circuit board 2, wherein the circuit board 2 is disposed inside a housing 1. By disposing of heat sinks 3 on both sides of the circuit board 2, the heat exchange area between the heat sinks 3 and the interior of the housing 1 is increased, effectively improving the cooling effect inside the housing 1; at the same time, it can save space layout dimensions inside the housing 1, thereby reducing the overall size of the housing 1, improving integration, and meeting the requirements of inverter miniaturization and integration.

[0037] like Figure 2 and Figure 9 As shown, it should be noted that a first heating element 201 and a second heating element 202 are provided inside the housing 1. The first heating element 201 and the second heating element 202 are located on the upper and lower sides of the circuit board 2, respectively. One heat sink 3 is set close to the first heating element 201, and the other heat sink 3 is set close to the second heating element 202, so that the two heat sinks 3 can achieve the best heat dissipation effect on the corresponding first heating element 201 or second heating element 202.

[0038] like Figure 5 and Figure 6 As shown, the heat sink 3 includes a heat dissipation substrate 301. The two ends of the heat dissipation substrate 301 are sealed to the two ends of the housing 1 by welding or bolting. A plurality of heat dissipation fins 302 are spaced apart inside the heat dissipation substrate 301. These fins are parallel to each other and extend along the length of the heat dissipation substrate 301. A sealed flow channel 303 is formed between adjacent heat dissipation fins 302 for the passage of the heat exchange medium. Heat inside the housing 1 is transferred to the heat exchange substrate by heat transfer. The heat exchange medium absorbs heat from the heat dissipation substrate 301 by heat transfer when passing through the sealed flow channel 303, achieving the purpose of cooling the interior of the housing 1 and effectively improving the operating environment of the various components inside the housing 1. Furthermore, the heat dissipation fins 302 further increase the heat exchange area between the heat exchange medium and the heat dissipation substrate 301, further accelerating the heat dissipation efficiency inside the housing 1.

[0039] like Figure 3 and Figure 4 As shown, a drive component is provided at the right end of the sealed flow channel 303. This drive component drives the heat exchange medium from the right end to the left end of the sealed flow channel 303 to absorb heat from the heat dissipation substrate 301. Simultaneously, corresponding drive components are provided at the right end of the heat dissipation substrate 301 for both liquid and gas heat exchange media, driving one of the media. This allows both types of heat exchange media to pass through the sealed flow channel 303, enabling switching between air cooling and liquid cooling without the need for separate air cooling and liquid cooling channels, significantly reducing equipment development and maintenance costs. It should be noted that air cooling is suitable for low-power equipment, while liquid cooling is suitable for high-power equipment.

[0040] In use, the heat inside the housing 1 is transferred to the heat exchange substrate by heat transfer. The control drive component drives the lower temperature heat exchange medium to flow out through the sealed flow channel 303. When the lower temperature heat exchange medium passes through the sealed flow channel 303, it absorbs the heat of the heat dissipation substrate 301 by heat transfer. According to different heat dissipation requirements, the corresponding drive component is switched to drive one of the heat exchange media in liquid and gas, so that one of the heat exchange media in liquid and gas can pass through the sealed flow channel 303 to achieve the purpose of heat dissipation and cooling inside the housing 1.

[0041] like Figure 2 As shown, in the first embodiment of this utility model, the driving component includes a centrifugal fan 4, and the two exhaust ports 5 of the centrifugal fan 4 are respectively connected to the right end of the corresponding sealed flow channel 303. The centrifugal fan 4 provides high-speed airflow into the sealed flow channel 303 to achieve the purpose of heat dissipation of the heat dissipation substrate 301.

[0042] Optionally, the heat dissipation fins 302 are set with high density, and the high air pressure of the centrifugal fan 4 is utilized to combine the centrifugal fan 4 with the high-density finned heat sink 3, which effectively improves the heat dissipation effect inside the casing 1.

[0043] like Figure 7 As shown, in some specific embodiments, the centrifugal fan 4 includes: a housing 401, two air guide channels 403 are symmetrically arranged inside the housing 401, a fan blade 402 is provided at the right end of each air guide channel 403, and air intakes 404 are respectively provided on both sides of the housing 401. The air intakes 404 correspond one-to-one with the fan blades 402. During the operation of the centrifugal fan 4, the gas outside the housing 1 enters the air guide channel 403 through the air intake 404, and is further transported to the sealed flow channel 303 through the exhaust port 5.

[0044] Optionally, each air duct 403 is provided with an exhaust port 5 at its left end, and an air guide structure 405 is provided at the exhaust port 5. The air guide structure 405 consists of several ventilation holes arranged in an array. The air ducts arranged in an array ensure that the airflow discharged from the exhaust port 5 flows out evenly, so that the heat exchange substrate 301 can exchange heat with the gas as evenly as possible, thereby improving the heat dissipation effect of the heat dissipation substrate 301.

[0045] like Figure 2 As shown, in some specific embodiments, an air inlet section cover 6 is provided at the right end of the heat dissipation substrate 301. The left end of the air inlet section cover 6 is sealed to the right end of the housing 1. The centrifugal fan 4 is located inside the air inlet section cover 6, which provides a certain degree of protection for the centrifugal fan 4. At the same time, air inlets 601 are provided on both sides of the air inlet section cover 6. The air intake 404 of the centrifugal fan 4 faces the air inlet 601. When the centrifugal fan 4 is working, the gas enters from the air inlet 601, flows radially out along the fan blades 402 to the exhaust port 5, and blows directly from the exhaust port 5 to the left end of the sealed flow channel 303. Compared with axial fans, centrifugal fans 4 can reduce the overall size of the air inlet section cover 6 while ensuring sufficient ventilation area and wind speed, achieving a more compact inverter structure design and further realizing the requirements of inverter miniaturization and integration.

[0046] In some specific embodiments, an air outlet section cover 7 is provided at the left end of the heat dissipation substrate 301. The right end of the air outlet section cover 7 is sealed to the left end of the housing 1. An air outlet 701 is provided at the end of the air outlet section cover 7. The air outlet 701 faces the left end of the sealed flow channel 303 to ensure that the airflow discharged from the left end of the sealed flow channel 303 can be quickly discharged from the air outlet 701, so as to ensure the flow speed of the gas in the sealed flow channel 303 and ensure the heat dissipation effect of the heat dissipation substrate 301.

[0047] like Figure 3As shown, the working principle of the first embodiment is as follows: the centrifugal fan 4 is started, and the centrifugal fan 4 draws in the lower temperature gas outside the box 1 through the air inlet 601, and delivers the lower temperature gas to the corresponding sealed flow channel 303 through the air outlet 5. The lower temperature gas flows from the right end of the sealed flow channel 303 to the left end of the sealed flow channel 303. At this time, the lower temperature gas directly exchanges heat with the heat dissipation substrate 301, and at the same time, the lower temperature gas indirectly exchanges heat with the heat dissipation substrate 301 through the heat dissipation fins 302, absorbing the heat of the heat dissipation substrate 301. The heat dissipation substrate 301 and the heat inside the box 1 exchange heat by heat transfer, so as to achieve the purpose of cooling down the inside of the box 1.

[0048] like Figure 8 , Figure 9 and Figure 10 As shown, in the second embodiment of this utility model, the driving assembly includes: an inlet component 8 and an outlet component 9. The inlet component 8 has an inlet pipe 801 internally, with its left end connected to the right end of the sealed flow channel 303. The outlet component 9 has an outlet pipe 901 internally, with its right end connected to the left end of the sealed flow channel 303. A water-cooled unit is also included, with its inlet end connected to the left end of the outlet pipe 901 and its outlet end connected to the right end of the inlet pipe 801, forming a water-cooling circuit. A lower-temperature liquid is transported through the inlet component 8 to the left end of the sealed flow channel 303 by a water-cooled unit, and then flows from the right end of the sealed flow channel 303 to the outlet component 9. The outlet component 9 transports the heat exchange medium, after heat exchange, back to the water-cooled unit. The heat exchange medium is then cooled to the set temperature again by the water-cooled unit and transported back to the sealed flow channel 303 from the outlet of the water-cooled unit through the inlet component 8. It should be noted that the heat exchange medium in liquid state is preferably 50% ethylene glycol coolant, but other liquid states of heat exchange medium are also possible.

[0049] In some specific embodiments, a liquid inlet section cover 10 is provided at the left end of the heat dissipation substrate 301. The left end of the liquid inlet section cover 10 is sealed to the right end of the housing 1. The liquid inlet section cover 10 is located outside the liquid inlet component 8, and can provide a certain degree of protection for the liquid inlet component 8. At the same time, a liquid outlet section cover 11 is provided at the right end of the heat dissipation substrate 301. The right end of the liquid outlet section cover 11 is sealed to the left end of the housing 1. The liquid outlet section cover 11 is located outside the liquid outlet component 9, and can provide a certain degree of protection for the liquid outlet component 9.

[0050] like Figure 10As shown, the working principle of the second embodiment is as follows: the lower temperature liquid in the control drive liquid inlet pipe 801 is transported to the corresponding sealed flow channel 303 through the liquid inlet component 8. The lower temperature liquid flows from the right end of the sealed flow channel 303 to the left end of the sealed flow channel 303. At this time, the lower temperature liquid directly exchanges heat with the heat dissipation substrate 301. At the same time, the lower temperature liquid indirectly exchanges heat with the heat dissipation substrate 301 through the heat dissipation fins 302, absorbing the heat of the heat dissipation substrate 301. The heat dissipation substrate 301 and the heat inside the box 1 exchange heat by heat transfer, so as to achieve the purpose of heat dissipation and cooling of the inside of the box 1.

[0051] In addition to the heat dissipation structure that is compatible with both air cooling and liquid cooling as described above, this utility model also provides an inverter that includes the heat dissipation structure that is compatible with both air cooling and liquid cooling disclosed in the above embodiments. For the structure of other parts of the inverter, please refer to the prior art, which will not be repeated here.

[0052] In summary, for two different types of heat exchange media, liquid and gas, a corresponding driving component is set at one end of the heat dissipation substrate 301, so that both types of heat exchange media can pass through the sealed flow channel 303. According to different heat dissipation requirements, the two heat dissipation methods of air cooling or liquid cooling can be switched, and there is no need to set up separate air cooling channels and liquid cooling channels, which greatly reduces the equipment development and maintenance costs.

[0053] It should be noted that in this specification, relational terms such as first and second are used only to distinguish one entity from several other entities, and do not necessarily require or imply any such actual relationship or order between these entities.

[0054] This article uses specific examples to illustrate the principles and implementation methods of this utility model. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made to this utility model without departing from the principles of this utility model, and these improvements and modifications also fall within the protection scope of this utility model.

Claims

1. A heat dissipation structure compatible with both air cooling and liquid cooling, characterized in that, include: The heat sink is provided in two, and the two heat sinks are respectively disposed on both sides of the circuit board. The heat sink includes a heat sink base plate, and a plurality of heat sink fins are arranged at intervals inside the heat sink base plate. A sealed flow channel for the passage of heat exchange medium is formed between two adjacent heat sink fins. A driving assembly is disposed at the first end of the sealed flow channel. The driving assembly is used to drive the heat exchange medium to flow from the first end of the sealed flow channel to the second end of the sealed flow channel to absorb the heat of the heat dissipation substrate.

2. The heat dissipation structure compatible with both air cooling and liquid cooling according to claim 1, characterized in that, The drive component includes a centrifugal fan, wherein the two exhaust ports of the centrifugal fan are respectively connected to the first end of the corresponding sealed flow channel.

3. The heat dissipation structure compatible with both air cooling and liquid cooling according to claim 2, characterized in that, The centrifugal fan includes: a housing, two air guide channels symmetrically arranged inside the housing, a fan blade at the first end of each air guide channel, and air inlets on both sides of the housing, with each air inlet corresponding to one of the fan blades.

4. The heat dissipation structure compatible with both air cooling and liquid cooling according to claim 3, characterized in that, Each of the air guide channels is provided with an exhaust port at its second end, and an air guide structure is provided at the exhaust port location. The air guide structure consists of a plurality of ventilation holes arranged in an array.

5. A heat dissipation structure compatible with both air cooling and liquid cooling according to claim 2, characterized in that, The first end of the heat dissipation substrate is provided with an air inlet section cover, and air inlets are respectively provided on both sides of the air inlet section cover. The centrifugal fan is located inside the air inlet section cover, and the air intake of the centrifugal fan faces the air inlet.

6. A heat dissipation structure compatible with both air cooling and liquid cooling according to claim 5, characterized in that, The second end of the heat dissipation substrate is provided with an air outlet section cover, and the end of the air outlet section cover is provided with an air outlet, which faces the second end of the sealed flow channel.

7. A heat dissipation structure compatible with both air cooling and liquid cooling according to claim 1, characterized in that, The driving component includes: The liquid inlet component has an internal liquid inlet pipe. The first end of the liquid inlet pipe is connected to the water outlet of the water-cooled unit, and the second end of the liquid inlet pipe is connected to the first end of the sealed flow channel. The liquid outlet component has an internal liquid outlet pipe. The first end of the liquid outlet pipe is connected to the water inlet of the water-cooled unit, and the second end of the liquid outlet pipe is connected to the second end of the sealed flow channel.

8. A heat dissipation structure compatible with both air cooling and liquid cooling according to claim 7, characterized in that, The first end of the heat dissipation substrate is provided with a liquid inlet section cover, which is located on the outside of the liquid inlet component.

9. A heat dissipation structure compatible with both air cooling and liquid cooling according to claim 8, characterized in that, A liquid outlet section cover is provided at the second end of the heat dissipation substrate, and the liquid outlet section cover is located on the outside of the liquid outlet component.

10. An inverter, characterized in that, The heat dissipation structure includes any one of claims 1-9 above and is compatible with both air cooling and liquid cooling.

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