Apparatus having optical mechanism

Abstract

The utility model provides a kind of equipment with optical mechanism.The equipment with optical mechanism includes equipment body and shield cover, equipment body has optical mechanism and the component that will produce electromagnetic interference;Shield cover is located on equipment body, and shield cover has at least one component that will produce electromagnetic interference in it;Wherein, shield cover has the heat dissipation hole that communicates inside and outside shield cover.The equipment with optical mechanism can carry out electromagnetic shielding to the component that will produce electromagnetic interference, to control and improve the electromagnetic interference of optical mechanism and improve the light field stability of optical mechanism, and can also take into account the heat dissipation demand of the component that will produce electromagnetic interference, avoid the case that equipment overall stability declines due to the component that will produce electromagnetic interference itself function stability declines, to improve measurement (or detection) precision and efficiency and prolong equipment service life.

Description

Technical Field

[0001] This utility model relates to the field of optical technology, and in particular to a device having an optical mechanism. Background Technology

[0002] To improve measurement (or inspection) accuracy and efficiency, equipment with optical mechanisms, such as wafer 2D (or 3D) measurement (or inspection) equipment, requires high optical field stability. Many factors affect optical field stability, including the inherent characteristics of the optical mechanism, environmental factors (temperature, humidity, air disturbance), and noise interference (dark current noise, electromagnetic interference). Overcoming the inherent characteristics of the optical mechanism is relatively difficult, while environmental factors can be significantly mitigated in cleanrooms. Noise interference, especially electromagnetic interference, can be controlled and improved. For example, equipment with optical mechanisms inevitably uses components that generate electromagnetic interference (such as drivers and switching power supplies). Electromagnetic shielding of these components can improve electromagnetic interference. However, some electromagnetic shielding solutions prioritize maximum shielding effectiveness while neglecting the heat dissipation requirements of components that generate electromagnetic interference (generally, components that generate more electromagnetic interference also generate more heat). This can lead to situations where the equipment's optical field stability is high in the short term, but the components' functional stability decreases due to prolonged exposure to high temperatures, resulting in overall equipment stability decline. This severely impacts measurement (or inspection) accuracy and efficiency, and shortens the equipment's lifespan. Utility Model Content

[0003] This invention provides a device with an optical mechanism that can electromagnetically shield components that generate electromagnetic interference, thereby controlling and improving the electromagnetic interference of the optical mechanism, enhancing the stability of the optical field, and taking into account the heat dissipation requirements of the components that generate electromagnetic interference. This avoids a decrease in the overall stability of the device due to a decrease in the functional stability of the components that generate electromagnetic interference, thereby improving the accuracy and efficiency of measurement (or detection) and extending the service life of the device.

[0004] This utility model provides a device with an optical mechanism, including:

[0005] The device body includes an optical mechanism and components that generate electromagnetic interference; and

[0006] A shielding cover is disposed on the device body, and the shielding cover contains at least one of the components that generate electromagnetic interference;

[0007] The shielding cover has heat dissipation holes that connect the inside and outside of the shielding cover.

[0008] In one embodiment, the device body has a mounting plate for mounting the shield, and the shield connected to the mounting plate has a plurality of spaced heat dissipation areas in the circumferential direction, the heat dissipation area including at least one heat dissipation hole.

[0009] In one embodiment, the shielding cover is square, and all four side walls of the shielding cover in the circumferential direction have the heat dissipation area; and / or

[0010] The heat dissipation holes in the heat dissipation area are arranged in an array of multiple rows and columns. In the direction of arrangement of the shielding cover and the mounting plate, the spacing between adjacent rows of heat dissipation holes is 20-30 mm; and / or

[0011] The heat dissipation hole is an elongated hole extending circumferentially along the shielding cover, with a length of 25-50 mm and a width of 8-10 mm in the arrangement direction of the shielding cover and the mounting plate; and / or

[0012] In the arrangement direction of the shielding cover and the mounting plate, the distance between the heat dissipation hole farthest from the mounting plate and the mounting plate is less than or equal to the distance between the side of the component that will generate electromagnetic interference that is farthest from the mounting plate and the mounting plate.

[0013] In one embodiment, the shielding cover includes a hollow cylinder with openings at both ends and a cap. The two open ends of the hollow cylinder are respectively connected to the device body and the cap, defining the enclosed space. The enclosed space contains at least one component that generates electromagnetic interference, and the heat dissipation hole communicates with the enclosed space.

[0014] In one embodiment, the hollow cylinder is detachably connected to the device body; and / or

[0015] The cap is detachably connected to the hollow cylinder.

[0016] In one embodiment, the hollow cylinder has a first end face near the cap and a second end face opposite to the first end face;

[0017] The first end face has opposing first and second connecting edges, each having at least one inwardly extending portion that fits against the cap, the inwardly extending portion extending toward the inner side of the hollow cylinder, and the cap being fixed to the inwardly extending portion with screws; and / or

[0018] The second end face has a first mounting edge and a second mounting edge, each of which has an inward lug and an outward lug that fits into the device body. The inward lug extends toward the inside of the hollow cylinder, and the outward lug extends toward the outside of the hollow cylinder. The inward lug and the outward lug are respectively fixed to the electrical board with screws.

[0019] In one embodiment, the shielding cover further has a cable outlet communicating with the enclosed space;

[0020] In the arrangement direction of the hollow cylinder and the cap, the outlet is closer to the cap than the heat dissipation hole; and / or

[0021] The outlet is located on the hollow cylinder, and the outlet extends toward the cover and passes through the side where the hollow cylinder is connected to the cover.

[0022] In one embodiment, the device with optical mechanism further includes magnetic rings, each magnetic ring corresponding to a component that generates electromagnetic interference, and a wire of the component that generates electromagnetic interference is wound around the magnetic ring.

[0023] In one embodiment, the number of turns of the wire around the magnetic ring is greater than or equal to 3.

[0024] In one embodiment, the shielding cover is made of stainless steel; and / or

[0025] The components that generate electromagnetic interference are grounded; and / or

[0026] The shield is grounded; and / or

[0027] The device body has an electrical board, on which the components that generate electromagnetic interference are installed, and the shielding cover is disposed on the electrical board; and / or

[0028] The device with optical mechanism is a wafer 2D inspection device, a wafer 3D inspection device, a wafer 2D measurement device, or a wafer 3D measurement device. The components that generate electromagnetic interference in the enclosed space include a switching power supply and a driver.

[0029] In the aforementioned equipment with optical mechanisms, the shielding cover provides Faraday cage-like isolation for components that generate electromagnetic interference (EMI), electromagnetically shielding these components, controlling and mitigating EMI within the optical mechanism, and enhancing the optical field stability of the optical mechanism. Furthermore, the shielding cover has heat dissipation holes, allowing the heat generated by the EMI-generating components within the shielding cover to dissipate. This prevents the components from being exposed to high temperatures for extended periods, which could lead to a decrease in their functional stability and consequently a decrease in the overall stability of the equipment. This, in turn, improves measurement (or detection) accuracy and efficiency, and extends the equipment's lifespan. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the structure of a device with an optical mechanism according to an embodiment of the present invention;

[0031] Figure 2 yes Figure 1 A schematic diagram of the device with an optical mechanism from another perspective;

[0032] Figure 3 yes Figure 2 A partially exploded view of the device with an optical mechanism shown.

[0033] Figure 4 yes Figure 3 A magnified view of point A in the image;

[0034] Figure 5 yes Figure 1 The diagram shows the assembly of the electrical board and shielding cover of the device with the optical mechanism.

[0035] Figure 6 yes Figure 1 A schematic diagram of the structure of the shielding cover for a device with an optical mechanism is shown.

[0036] Figure 7 for Figure 6 The diagram shown is an exploded view of the shielding cover. Detailed Implementation

[0037] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model.

[0038] It should be noted that when a component is said to be "fixed" to another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected" to another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0040] like Figures 1-4 As shown, an embodiment of the present invention provides a device 10 with an optical mechanism. The device 10 includes a device body 200 and a shielding cover 300. The device body 200 has an optical mechanism 210 and components 220 that generate electromagnetic interference. Common electromagnetic interference-generating components 220 include switching power supplies, drivers, encoders, and motors. The shielding cover 300 is disposed on the device body 200. At least one electromagnetic interference-generating component 220 is located within the shielding cover 300. The shielding cover 300 has heat dissipation holes 312 connecting the inside and outside of the shielding cover 300.

[0041] In the aforementioned device 10 with an optical mechanism, the shielding cover 300 provides Faraday cage isolation for the component 220 that generates electromagnetic interference, electromagnetically shields the component 220, controls and improves the electromagnetic interference of the optical mechanism 210, and enhances the optical field stability of the optical mechanism 210. The shielding cover 300 also has heat dissipation holes 312, allowing the heat generated by the component 220 within the shielding cover 300 to dissipate. This prevents the component 220 from being exposed to high temperatures for extended periods, which could lead to a decrease in the stability of the component itself and consequently a decrease in the overall stability of the device 10. This, in turn, improves measurement (or detection) accuracy and efficiency and extends the service life of the device 10.

[0042] In this embodiment, the device 10 with an optical mechanism is a wafer 2D measurement device, a wafer 3D measurement device, a wafer 2D inspection device, or a wafer 3D inspection device. Specifically, it can be a 2D optical microscopic defect inspection device, a triangulation optical measurement device, a 3D optical interferometric profile measurement device, a reflectance spectroscopy film thickness inspection device, a dual-rotation ellipsometer, a confocal microscope, an infrared interferometer, an overlay error measurement device, etc. The components 220 that generate electromagnetic interference within the shielding cover 300 include a switching power supply and drivers. Specifically, in this embodiment, there is one switching power supply located within the shielding cover 300, which provides a 24V low-voltage power supply. The optical mechanism 210 of the wafer 2D (or 3D) measurement (or inspection) device typically includes a vision system capable of moving in the Z-axis direction and an XY motion platform capable of controlling the movement of the vision system in the X and Y axes. Specifically, in this embodiment, there are three drivers located within the shielding cover 300: one driver for the vision system and two drivers for the XY motion platform. It is understood that in other embodiments, the electromagnetic interference-generating component 220 within the shielding cover 300 may also include only a switching power supply or a driver. It is understood that in other embodiments, the electromagnetic interference-generating component 220 within the shielding cover 300 may also include at least one encoder and / or at least one motor. It is understood that in other embodiments, the device 10 with the optical mechanism may also be any other device 10 equipped with an optical mechanism.

[0043] In this embodiment, the device 10 with an optical mechanism is provided with only one shield 300. It will be understood that in other embodiments, the device 10 with an optical mechanism may have at least multiple shields 300.

[0044] In this embodiment, the device body 10 has an electrical board 230 (mounting plate) for mounting a shielding cover 300. Components 220 that generate electromagnetic interference typically need to be connected to the electrical board 230. Placing the shielding cover 300 on the electrical board 230 allows multiple components 220 that generate electromagnetic interference to be located within the same shielding cover 300, thereby reducing the number of shielding covers 300. It is understood that in other embodiments, the shielding cover 300 may also be located on other boards of the device body 200. Specifically, in this embodiment, the components 220 that generate electromagnetic interference are fixed to the electrical board 230 with screws.

[0045] In this embodiment, the shielding cover 300 connected to the mounting plate (electrical board 230) has multiple spaced heat dissipation areas along its circumference. Each heat dissipation area includes at least one heat dissipation hole 312. This facilitates heat dissipation. It is understood that in other embodiments, the heat dissipation holes 312 may also be continuously distributed along the circumference of the shielding cover 300.

[0046] In this embodiment, the shielding cover 300 is square. All four sidewalls of the shielding cover 300, which connect to the mounting plate circumferentially, have heat dissipation areas. This facilitates the fabrication of the shielding cover 300. It is understood that in other embodiments, the shielding cover 300 may also be a regular shape such as a cylinder, or it may be an irregular shape.

[0047] In this embodiment, the heat dissipation holes 312 in the heat dissipation area are arranged in an array of multiple rows and columns. In the arrangement direction of the shielding cover 300 and the mounting plate (electrical plate 230), the spacing between two adjacent rows of heat dissipation holes 312 is 20-30 mm. This not only facilitates heat dissipation but also electromagnetic shielding.

[0048] In this embodiment, the heat dissipation hole 312 is an elongated hole extending circumferentially along the shielding cover 300. The length of the heat dissipation hole 312 is 25-50mm. In the arrangement direction of the shielding cover 300 and the mounting plate (electrical plate 230), the width of the heat dissipation hole 312 is 8-10mm. This not only facilitates heat dissipation but also electromagnetic shielding.

[0049] In this embodiment, in the arrangement direction of the shielding cover 300 and the mounting plate (electrical plate 230), the distance between the heat dissipation hole 312 furthest from the mounting plate (electrical plate 230) and the mounting plate (electrical plate 230) is less than or equal to the distance between the side of the component 220 that will generate electromagnetic interference and the side of the mounting plate (electrical plate 230) furthest from the mounting plate (electrical plate 230). That is, in this embodiment, the heat dissipation hole 312 is located close to the mounting plate (electrical plate 230) and does not protrude beyond the side of the component 220 that will generate electromagnetic interference furthest from the mounting plate (electrical plate 230). This not only facilitates heat dissipation but also electromagnetic shielding.

[0050] In this embodiment, as Figures 5-7 As shown, the shielding cover 300 includes a hollow cylindrical body 310 with openings at both ends and a cover 320. The two open ends of the hollow cylindrical body 310 are respectively connected to the device body 200 (electrical board 230) and the cover 320, defining a closed space. The closed space contains at least one component 220 that generates electromagnetic interference. A heat dissipation hole 312 communicates with the closed space. Thus, the shielding cover 300 requires less material and facilitates the formation of a closed space with a larger effective space ratio. It is understood that in other embodiments, the shielding cover 300 may also include a hollow cylindrical body 310 with openings at both ends and two covers 320, with the two covers 320 respectively located at the two open ends of the hollow cylindrical body 310, defining a closed space. In this case, the component 220 that generates electromagnetic interference located within the shielding cover 300 may be disposed on one of the covers 320 and connected to the electrical board 230 through a hole. It is understood that in other embodiments, the shielding cover 300 may also be a hollow conical structure with one open end and one pointed end.

[0051] In this embodiment, the hollow cylinder 310 is detachably connected to the equipment body 200. This makes it very convenient to install and remove the shielding cover 300 from the equipment body 200, which is beneficial for initial equipment debugging and subsequent equipment maintenance. It is understood that in other embodiments, the hollow cylinder 310 and the equipment body 200 may also be fixedly connected by welding or other methods.

[0052] In this embodiment, the cover 320 and the hollow cylinder 310 are detachably connected. That is, in this embodiment, the shielding cover 300 is a split-type shielding cover 300, employing a split Faraday cage electromagnetic shielding cover 300 that does not affect the heat dissipation of components 220 (drivers, switching power supplies, encoders, motors, etc.) that generate electromagnetic interference. This helps reduce electromagnetic interference to the optical mechanism 210 and improves detection accuracy. It is understood that in other embodiments, the cover 320 and the hollow cylinder 310 can also be fixedly connected by welding or other methods.

[0053] In this embodiment, the shielding cover 300 is made of stainless steel, meaning both the cap 320 and the hollow cylinder 310 are made of stainless steel. Utilizing the characteristics of stainless steel regarding electromagnetic wave reflection and absorption losses, the shielding cover 300 achieves better electromagnetic shielding. It is understood that in other embodiments, the shielding cover 300 may be made of other metals. Specifically, in this embodiment, both the cap 320 and the hollow cylinder 310 are sheet metal parts.

[0054] In this embodiment, the hollow cylinder 310 has a first end face 316 near the cap 320 and a second end face 318 opposite to the first end face 316.

[0055] The first end face 316 has opposing first connecting edges 3162 and second connecting edges 3164. Both the first connecting edges 3162 and second connecting edges 3164 have at least one inwardly extending portion 330 that fits against the cap 320. The inwardly extending portion 330 extends toward the inside of the hollow cylinder 310. The cap 320 is fixed to the inwardly extending portion 330 with screws. This not only facilitates the detachable connection between the cap 320 and the hollow cylinder 310, but also ensures a secure connection between them. It is understood that in other embodiments, the cap 320 and the hollow cylinder 310 can also be detachably connected using snap-fit, interference fit, or other methods. Specifically, in this embodiment, the first connecting edge 3162 and the second connecting edge 3164 are the upper and lower edges of the first end face 316, respectively.

[0056] The second end face 318 has opposing first mounting edges 3182 and second mounting edges 3184. Both the first mounting edge 3182 and the second mounting edge 3184 have outwardly facing lugs 340 and inwardly facing lugs 350 that fit against the electrical board 230. The outwardly facing lugs 340 extend outwards toward the hollow cylinder 310. The inwardly facing lugs 350 extend inwards toward the hollow cylinder 310. The inwardly facing lugs 350 and the outwardly facing lugs 340 are respectively fixed to the device body 200 with screws. This not only facilitates the detachable connection between the hollow cylinder 310 and the device body 200, but also ensures a secure connection between them. It is understood that in other embodiments, the hollow cylinder 310 and the device body 200 can also be detachably connected using snap-fit, interference fit, or other methods. Specifically, in this embodiment, the first mounting edge 3182 and the second mounting edge 3184 are the upper and lower edges of the second end face 318, respectively.

[0057] In this embodiment, the shielding cover 300 also has a cable outlet 314 communicating with the enclosed space. This makes it very convenient for the wires 222 of the component 220 that generates electromagnetic interference to be led out of the shielding cover 300, and the simultaneous provision of the cable outlet 314 and the heat dissipation hole 312 can prevent the wires 222 from interfering with heat dissipation. It is understood that in other embodiments, the wires 222 of the component 220 that generates electromagnetic interference can also be led out of the shielding cover 300 from the heat dissipation hole 312.

[0058] In this embodiment, in the arrangement direction of the hollow cylinder 310 and the cover 320, the cable outlet 314 is closer to the cover 320 than the heat dissipation hole 312. This not only facilitates heat dissipation but also improves electromagnetic shielding.

[0059] In this embodiment, the outlet 314 is located on the hollow cylinder 310, and the outlet 314 extends toward the cover 320 and passes through the side where the hollow cylinder 310 and the cover 320 are connected. This not only facilitates heat dissipation but also electromagnetic shielding and makes it easy to install and remove the wire 222.

[0060] In this embodiment, as Figure 4 As shown, the device 10 with the optical mechanism also includes a magnetic ring 400. Each magnetic ring 400 is correspondingly provided with a component 220 that generates electromagnetic interference. A wire 222 (power line) of the component 220 that generates electromagnetic interference is wound around the magnetic ring 400. In this way, the electromagnetic shielding effect can be optimized.

[0061] In this embodiment, the wire 222 is wound around the magnetic ring 400 at least 3 times. This further optimizes the electromagnetic shielding effect.

[0062] In this embodiment, the component 220 that generates electromagnetic interference is grounded. This further optimizes the electromagnetic shielding effect. In this embodiment, the component 220 that generates electromagnetic interference is connected to the copper busbar of the device body 200 via a grounding wire, thereby achieving grounding. More specifically, the grounding wire is connected to the part where the component 220 that generates electromagnetic interference is screwed onto the electrical board 230.

[0063] In this embodiment, the shielding cover 300 is grounded. This further optimizes the electromagnetic shielding effect. Specifically, in this embodiment, the shielding cover 300 is connected to the copper busbar of the device body 200 via a grounding wire, thereby achieving grounding. More specifically, the grounding wire is connected to the part where the outer lug 340 is fixed to the electrical board 230 with screws.

[0064] The above description is only an optional embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A device having an optical mechanism, characterized in that, include: The device itself has an optical mechanism and components that can generate electromagnetic interference; as well as A shielding cover is disposed on the device body, and the shielding cover contains at least one of the components that generate electromagnetic interference; The shielding cover has heat dissipation holes that connect the inside and outside of the shielding cover.

2. The device with an optical mechanism as described in claim 1, characterized in that, The device body has a mounting plate for mounting the shielding cover. The shielding cover, which is connected to the mounting plate, has multiple spaced heat dissipation areas in its circumferential direction. Each heat dissipation area includes at least one heat dissipation hole.

3. The device with an optical mechanism as described in claim 2, characterized in that, The shielding cover is square, and each of the four circumferential side walls of the shielding cover has a heat dissipation area; and / or The heat dissipation holes in the heat dissipation area are arranged in an array of multiple rows and columns. In the direction of arrangement of the shielding cover and the mounting plate, the spacing between adjacent rows of heat dissipation holes is 20-30 mm; and / or The heat dissipation hole is an elongated hole extending circumferentially along the shielding cover. The length of the heat dissipation hole is 25-50mm, and the width of the heat dissipation hole is 8-10mm in the arrangement direction of the shielding cover and the mounting plate. and / or In the arrangement direction of the shielding cover and the mounting plate, the distance between the heat dissipation hole farthest from the mounting plate and the mounting plate is less than or equal to the distance between the side of the component that will generate electromagnetic interference that is farthest from the mounting plate and the mounting plate.

4. The device with an optical mechanism as described in claim 1, characterized in that, The shielding cover includes a hollow cylinder with openings at both ends and a cover. The two open ends of the hollow cylinder are respectively connected to the device body and the cover, defining a closed space. The closed space contains at least one component that will generate electromagnetic interference, and the heat dissipation hole is connected to the closed space.

5. The device with an optical mechanism as described in claim 4, characterized in that, The hollow cylinder is detachably connected to the equipment body; and / or The cap is detachably connected to the hollow cylinder.

6. The device with an optical mechanism as described in claim 5, characterized in that, The hollow cylinder has a first end face near the cap and a second end face opposite to the first end face; The first end face has opposing first and second connecting edges, each having at least one inwardly extending portion that fits against the cap, the inwardly extending portion extending toward the inner side of the hollow cylinder, and the cap being fixed to the inwardly extending portion with screws; and / or The second end face has a first mounting edge and a second mounting edge, each of which has an inward lug and an outward lug that fits against the device body. The inward lug extends toward the inside of the hollow cylinder, and the outward lug extends toward the outside of the hollow cylinder. The inward lug and the outward lug are respectively fixed to the device body with screws.

7. The device with an optical mechanism as described in claim 4, characterized in that, The shielding cover also has a cable outlet communicating with the enclosed space; In the arrangement direction of the hollow cylinder and the cover, the outlet is closer to the cover than the heat dissipation hole; and / or The outlet is located on the hollow cylinder, and the outlet extends toward the cover and passes through the side where the hollow cylinder is connected to the cover.

8. The device having an optical mechanism as described in claim 1, characterized in that, The device with an optical mechanism further includes a magnetic ring, each magnetic ring being disposed corresponding to a component that generates electromagnetic interference, and a wire of the component that generates electromagnetic interference is wound around the magnetic ring.

9. The device having an optical mechanism as described in claim 8, characterized in that, The number of turns of the wire around the magnetic ring is greater than or equal to 3.

10. The device having an optical mechanism as claimed in claim 1, characterized in that, The shielding cover is made of stainless steel; and / or The components that generate electromagnetic interference are grounded; and / or The shield is grounded; and / or The device body has an electrical board, on which the components that generate electromagnetic interference are installed, and the shielding cover is disposed on the electrical board; and / or The device with optical mechanism is a wafer 2D inspection device, a wafer 3D inspection device, a wafer 2D measurement device, or a wafer 3D measurement device. The components that generate electromagnetic interference within the shielding cover include a switching power supply and a driver.

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