Substrate processing apparatus for supplying processing fluid

Abstract

A substrate processing apparatus for supplying a processing fluid can include a supply device configured to supply a coolant for cooling the processing fluid; a cooling container configured to be connected to the supply device and to obtain supply of the coolant from the supply device and to store; a raw material tank configured to store the processing fluid; a storage container at least a part of which is disposed in the cooling container and is connected to the raw material tank, including a first part disposed in the cooling container and elongated in a direction between a lower surface of the cooling container and an upper surface of the cooling container, and a second part connected to the first part and disposed on the upper surface of the cooling container; and a first supply pipe configured to supply the processing fluid from the raw material tank to the storage container. Various embodiments can be present in addition to this.

Description

Technical Field

[0001] This disclosure relates to a substrate processing apparatus for supplying processing fluid. Background Technology

[0002] In substrate processing, processing fluids are used for cleaning and drying the substrate. These fluids possess both liquid and gas properties, effectively removing contaminants from the substrate. Research and development of substrate processing apparatus for supplying processing fluids to the substrate is underway.

[0003] For example, Patent Publication No. 10-2017-0006570 discloses a “substrate processing apparatus using a processing fluid, a substrate processing system including the apparatus, and a substrate processing method using the system”.

[0004] However, the foregoing content should not be construed as the applicant acknowledging it as prior art to the content described in this document, but should be construed as related art only to the utility model described in this document. Utility Model Content

[0005] According to one embodiment, the aim is to provide a substrate processing apparatus for stably supplying processing fluid to a substrate.

[0006] According to one embodiment, the purpose is to provide a substrate processing apparatus that stably supplies processing fluid by means of a sealed structure of a storage container for storing processing fluid.

[0007] The problems to be solved by the substrate processing apparatus according to one embodiment are not limited to those mentioned above, and those skilled in the art can clearly understand other problems not mentioned from the following description.

[0008] In one embodiment, a substrate processing apparatus for supplying processing fluid may include: a supply device configured to supply a coolant for cooling the processing fluid; a cooling container configured to be connected to the supply device and to receive and store the coolant supplied from the supply device; a raw material tank configured to store the processing fluid; a storage container, at least a portion of which is disposed within the cooling container and connected to the raw material tank, including a first portion and a second portion, wherein the first portion is disposed within the cooling container and extends along a direction between the lower surface and the upper surface of the cooling container, and the second portion is connected to the first portion and disposed on the upper surface of the cooling container; and a first supply conduit configured to supply the processing fluid from the raw material tank to the storage container.

[0009] In one embodiment, the supply device may include a pumping section configured to be disposed within the internal space of the supply device and pumping coolant to a cooling container; and a storage section configured to be disposed within the internal space of the supply device and storing the coolant delivered from the cooling container.

[0010] In one embodiment, the substrate processing apparatus may further include one or more temperature sensors configured to be connected to a storage container and to monitor the temperature of the processing fluid stored in the storage container.

[0011] In one embodiment, the temperature sensor may include a first sensor portion configured to be disposed on the upper part of a second portion of the storage container; and a second sensor portion configured to be connected to the first sensor portion and at least a portion thereof passing through the second portion of the storage container and inserted into the first portion of the storage container.

[0012] In one embodiment, a plurality of temperature sensors are provided, and at least two of the temperature sensors have second sensor portions of different lengths from each other.

[0013] In one embodiment, the substrate processing apparatus may further include one or more first sealing members configured to be disposed on the upper surface of the cooling container in contact with the second part of the storage container, and to seal the gap between the cooling container and the second part of the storage container.

[0014] In one embodiment, the substrate processing apparatus may further include one or more second sealing members configured to be disposed on the lower surface of the cooling container in contact with the first part of the storage container, and to seal the gap between the cooling container and the first part.

[0015] In one embodiment, the substrate processing apparatus may further include a second supply conduit configured to be connected to a first portion of the storage container and supply processing fluid to the outside.

[0016] In one embodiment, the substrate processing apparatus may further include a liquid level sensor connected to a cooling container and monitoring the flow pressure of the coolant stored in the cooling container.

[0017] In one embodiment, the processing fluid may be liquefied carbon dioxide (LCO2).

[0018] According to one embodiment, a substrate processing apparatus can provide a cooling system that improves the liquefaction efficiency of the processing fluid during the process of supplying processing fluid to the substrate.

[0019] According to one embodiment, the substrate processing apparatus can provide a structure for sealing a storage container for storing processing fluids.

[0020] According to one embodiment, the substrate processing apparatus may place a temperature sensor on the upper part of the storage container to prevent or reduce excessive liquefaction of the processing fluid in the storage container.

[0021] The effects of the substrate processing apparatus according to one embodiment are not limited to those mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the following description. Attached Figure Description

[0022] The accompanying drawings, which are illustrations of a preferred embodiment of the present invention, together with the detailed description of the invention, serve to further understand the technical concept of this specification. Therefore, they should not be construed as limiting the present invention to the matters described in the drawings.

[0023] Figure 1 This is a diagram illustrating a substrate processing apparatus according to one embodiment.

[0024] Label Explanation

[0025] 10: Substrate processing apparatus

[0026] 100: Supply device

[0027] 101: Pumping Section

[0028] 102: Storage Section

[0029] 110: Cooling container

[0030] 120: Storage container

[0031] 121: Part One

[0032] 122: Part Two

[0033] 130: First Supply Pipeline

[0034] 140: Second Supply Pipeline

[0035] 150, 151, 152: Temperature sensors

[0036] 151a, 152a: First sensor section

[0037] 151b, 152b: Second sensor section

[0038] 160: First sealing component

[0039] 170: Second sealing component

[0040] 180: Raw material tank Detailed Implementation

[0041] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. However, since various modifications can be made to the embodiments, the scope of the patent application is not limited or restricted by these embodiments. Rather, it should be understood that all modifications, equivalents, and even substitutions made to the embodiments are included within the scope of the claims.

[0042] The terminology used in the embodiments is for illustrative purposes only and should not be construed as intended to be limiting. Singular expressions include plural expressions unless the context clearly distinguishes them. In this specification, terms such as "comprising" or "having" should be understood to specify the presence of the features, numbers, steps, operations, constituent elements, components, or combinations thereof described in the specification, and not to preclude the presence or additional possibilities of one or more other features or numbers, steps, operations, constituent elements, components, or combinations thereof.

[0043] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the embodiments pertain. Terms as defined in commonly used dictionaries should be interpreted as having the same meaning as they have in the context of the relevant art, and should not be construed as having an ideal or overly formal meaning unless expressly defined herein.

[0044] Furthermore, when describing the embodiments with reference to the accompanying drawings, regardless of the reference numerals, the same reference numerals are assigned to the same constituent elements, and repeated descriptions are omitted. When describing embodiments, detailed descriptions of related well-known techniques are omitted when it is determined that such detailed descriptions might unnecessarily obscure the essence of the embodiments. Unless explicitly indicated by the relevant context, the singular form of the noun corresponding to an item may include one or more of that item. In this document, phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “at least one of A, B or C” may respectively include any one of the items listed together in the corresponding sentences of these phrases, or all possible combinations thereof.

[0045] Furthermore, when describing the constituent elements of the embodiments, terms such as first, second, A, B, (a), and (b) may be used. These terms are merely for distinguishing the constituent element from other constituent elements and do not limit the nature, order, or steps of the relevant constituent elements. When a constituent element is described as "connected," "combined," or "accessed" to other constituent elements, it should be understood that although the constituent element can be directly connected to or accessed to other constituent elements, there may also be other constituent elements that are "connected," "combined," or "accessed" between the constituent elements.

[0046] In this document, for a given parameter, attribute, or condition, reference terms such as "substantially," "generally," "usually," and "about" may encompass the scope understood by one of ordinary skill in the art, meaning that the parameter, attribute, or condition is met with a small degree of variation within acceptable manufacturing tolerances. For example, for a particular parameter to be "substantially" may mean meeting at least 90%, at least 95%, or at least 99%. Elements included in one embodiment and elements that share common functions are described using the same names in other embodiments. Unless otherwise stated, the descriptions described in any embodiment are applicable to other embodiments, and specific details are omitted where necessary for repetition.

[0047] In the following description, the term "upper part" refers to the +Z direction based on the direction shown in the attached figure, and the term "lower part" refers to the -Z direction, which is opposite to the upper part. However, this is only for ease of explanation. It should be noted that the terms "upper part" and "lower part" are relative concepts. Depending on the direction of observation, "upper part" may also refer to the -Z direction, and "lower part" may also refer to the +Z direction.

[0048] Reference Figure 1 According to one embodiment, the substrate processing apparatus 10 may include a supply device 100 for supplying coolant, a cooling container 110 for receiving coolant from the supply device, a storage container 120 partially disposed within the cooling container 110 for storing processing fluid, a first supply pipe 130 and a second supply pipe 140 for supplying the processing fluid stored in the storage container 120 to the outside, a temperature sensor 150 for monitoring the temperature of the processing fluid stored in the storage container 120, a level sensor for monitoring the flow pressure of coolant stored in the cooling container 110, and a first sealing member 160 and a second sealing member 170 for sealing the gap between the storage container 120 and the cooling container 110.

[0049] In one embodiment, the supply device 100 may supply coolant to the cooling container 110. The supply device 100 may include a pumping section 101 and a storage section 102 disposed within the internal space 100a of the supply device 100. According to one embodiment, the pumping section 101 may pump coolant to the cooling container 110. The pumping section 101 may be disposed within the internal space 100a of the supply device 100. The pumping section 101 disposed within the internal space 100a allows coolant circulation within the internal space 100a of the supply device 100 and helps to ensure the internal area of ​​the supply device 100. By disposing the pumping section 101 within the internal space 100a, the occurrence of a coolant leak can be detected quickly.

[0050] According to one embodiment, the storage section 102 receives coolant transfer from the cooling container 110 and can store the transferred coolant internally. For example, the temperature of the coolant cooling the process fluid in the cooling container 110 may rise, and the heated coolant moves to the storage section 102 of the supply device 100 and is cooled again. In one embodiment, the storage section 102 may be connected to the pumping section 101.

[0051] In one embodiment, cooling container 110 may store coolant supplied from supply device 100. The coolant stored in cooling container 110 may cool the process fluid stored in storage container 120 to maintain its supercritical state. Cooling container 110 may be sealed by a mutually hermetically sealed connection structure of a first portion 121 and a second portion 122 of storage container 120, described later. Sealing the upper surface 110b of cooling container 110 by the second portion 122 of storage container 120 prevents or reduces the evaporation of highly volatile coolant.

[0052] In one embodiment, the storage container 120 may be configured to store a processed fluid. For example, the storage container 120 is connected to a feed tank 180 storing a processed fluid (e.g., carbon dioxide) and can receive a supply of the processed fluid from the feed tank 180. In one embodiment, at least a portion of the storage container 120 may be disposed within a cooling container 110. For example, the storage container 120 may include a first portion 121 disposed within the cooling container 110 and a second portion 122 disposed outside the cooling container 110. The first portion 121 is disposed within the cooling container 110 and may be disposed along the direction between the lower surface 110a and the upper surface 110b of the cooling container 110 (e.g., ...). Figure 1The second portion 122 is formed by extending the first portion 121 along the Z-axis. The second portion 122 can be connected to the first portion 121. The second portion 122 can be disposed on the upper surface 110b of the cooling container 110. For example, at least a portion of the lower surface of the second portion 122 (e.g., the surface facing the Z-axis) is connected to the first portion 121, and the remaining portion of the lower surface of the second portion 122 is disposed on the upper surface 110b of the cooling container 110. The second portion 122 of the storage container 120 is disposed in a form that protrudes outward from the cooling container 110, so that if the storage container 120 is damaged due to external impact or the like, only the second portion 122 needs to be removed to maintain the storage container 120.

[0053] In one embodiment, the second portion 122 is disposed on the upper surface of the first portion 121 (e.g., the surface facing the +Z axis direction) to seal the first portion 121. Processing fluids (e.g., liquefied carbon dioxide (LCO2)) may be stored in the first portion 121 and the second portion 122, respectively. The fluids stored in the first portion 121 and the second portion 122 may initially be in a gaseous state and liquefy after being cooled by a coolant stored in the cooling container 110, thereby maintaining a supercritical state.

[0054] In one embodiment, a first sealing member 160 seals the gap between the cooling container 110 and the second portion 122 of the storage container 120. The first sealing member 160 is disposed at the location where the upper surface 110b of the cooling container 110 contacts the second portion 122 of the storage container 120. The first sealing member 160 provides a sealing force to the cooling container 110. The first sealing member 160 can be formed of various elastic sealing materials such as rubber. The number of first sealing members 160 can be one, two, or more.

[0055] In one embodiment, the second sealing member 170 seals the gap between the cooling container 110 and the first portion 121 of the storage container 120. The second sealing member 170 is disposed at the location where the lower surface 110a of the cooling container 110 contacts the first portion 121 of the storage container 120. The second sealing member 170 provides a sealing force for the cooling container 110. The second sealing member 170 can be formed of various elastic sealing materials such as rubber. The material of the second sealing member 170 can be substantially the same as or different from the material of the first sealing member 160. The number of second sealing members 170 can be one, two, or more.

[0056] In one embodiment, a first supply conduit 130 may be connected to a raw material tank 180. According to one embodiment, the raw material tank 180 may store a substance as a feedstock for the processed fluid. For example, carbon dioxide (CO2) may be stored in the raw material tank 180. The first supply conduit 130 may supply the feedstock (e.g., carbon dioxide) from the raw material tank 180 to a storage container 120. For example, the first supply conduit 130 may be connected to a second portion 122 of the storage container 120. For example, one end of the first supply conduit 130 may be configured to penetrate at least a portion of the second portion 122 of the storage container 120. In another embodiment, the first supply conduit 130 may also supply the processed fluid stored in the storage container 120 to the outside.

[0057] In one embodiment, the second supply conduit 140 can supply processing fluid stored in the storage container 120 to the outside (e.g., a substrate). The second supply conduit 140 may be connected to a first portion 121 of the storage container 120. In another embodiment, the substrate processing apparatus 10 may also obtain processing fluid from the outside and supply it to the storage container 120 via the second supply conduit 140.

[0058] In one embodiment, temperature sensor 150 monitors the temperature of a processed fluid stored in storage container 120. Temperature sensor 150 is connectable to storage container 120. Temperature sensor 150 may include first sensor portions 151a, 152a and second sensor portions 151b, 152b. First sensor portions 151a, 152a are disposed above a second portion 122 of storage container 120. Second sensor portions 151b, 152b are connected to first sensor portions 151a, 152a. At least a portion of the second sensor portions 151b, 152b can pass through the second portion 122 of storage container 120 and be inserted into the first portion 121 of storage container 120. By distributing the first sensor portions 151a, 152a of temperature sensor 150 above the second portion 122 of storage container 120 within cooling container 110, temperature sensor 150 can be removed from cooling container 110 even when cooling container 110 is filled with coolant. In one embodiment, the number of temperature sensors 151 and 152 can be multiple (e.g., 2, 3 or more). The following description will use the case where there are 2 temperature sensors 151 and 152 as an example.

[0059] In one embodiment, the first sensor portions 151a, 152a of a plurality of temperature sensors 151, 152 may be located at substantially the same height above the second portion 122 of the storage container 120. The second sensor portions 151b, 152b of the plurality of temperature sensors 151, 152 may pass through the second portion 122 of the storage container 120 and be inserted into a portion of the first portion 121. The lengths of the respective second sensor portions 151b, 152b of the plurality of temperature sensors 151, 152 (e.g., ...) Figure 1 The lengths in the Z-axis direction can be different. By using second sensor sections 151b and 152b of different lengths, excessive liquefaction of the fluid stored in the storage container 120 can be prevented or reduced.

[0060] In one embodiment, a level sensor (not shown) monitors the flow pressure of the coolant stored inside the cooling container 110. The level sensor may be connected to the cooling container 110. The level sensor can detect potential coolant leakage if the sealing structure of the cooling container 110 is damaged and prevent such leakage from occurring. For example, the level sensor can issue an alarm when the coolant flow pressure drops due to a coolant leak within the cooling container 110.

[0061] As described above, although embodiments have been illustrated with limited figures, those skilled in the art can apply various technical modifications and variations based on the above. For example, appropriate results can be obtained even if the described techniques are performed in a different order than those described, and / or the described system, structure, device, circuit, and other constituent elements are combined or integrated in a different form than those described, or replaced or substituted with other constituent elements or equivalents.

[0062] Therefore, other embodiments, other implementations, and contents equivalent to those in the patent claims also fall within the scope of the claims.

Claims

1. A substrate processing apparatus, comprising a substrate processing apparatus for supplying a processing fluid, characterized in that, include: A supply device configured to supply coolant for cooling the process fluid; A cooling container is configured to be connected to a supply device, and to receive and store coolant from the supply device; Raw material tanks are configured to store the processed fluids; A storage container, at least a portion of which is disposed within a cooling container and connected to a raw material tank, includes a first part and a second part, wherein the first part is disposed within the cooling container and extends along the direction between the lower and upper surfaces of the cooling container, and the second part is connected to the first part and disposed on the upper surface of the cooling container. as well as The first supply pipeline is configured to supply the processing fluid from the raw material tank to the storage container.

2. The substrate processing apparatus according to claim 1, characterized in that, The supply device includes: The pumping section is configured to be disposed within the internal space of the supply device and pumps the coolant to the cooling container; and The storage section is configured to be located within the internal space of the supply device and to store the coolant transferred from the cooling container.

3. The substrate processing apparatus according to claim 1, characterized in that, The substrate processing apparatus also includes one or more temperature sensors configured to be connected to the storage container and to monitor the temperature of the processing fluid stored in the storage container.

4. The substrate processing apparatus according to claim 3, characterized in that, Temperature sensors include: The first sensor portion is configured to be disposed on the upper part of the second portion of the storage container; and The second sensor portion is configured to be connected to the first sensor portion, and at least a portion of it passes through the second portion of the storage container and is inserted into the first portion of the storage container.

5. The substrate processing apparatus according to claim 4, characterized in that, There are multiple temperature sensors. In a plurality of temperature sensors, the lengths of the second sensor portions of at least two temperature sensors are different from each other.

6. The substrate processing apparatus according to claim 1, characterized in that, The substrate processing apparatus also includes one or more first sealing members configured to be disposed on the upper surface of the cooling container in contact with the second part of the storage container, and to seal the gap between the cooling container and the second part of the storage container.

7. The substrate processing apparatus according to claim 1, characterized in that, The substrate processing apparatus also includes one or more second sealing members configured to be disposed on the lower surface of the cooling container in contact with the first part of the storage container, and to seal the gap between the cooling container and the first part.

8. The substrate processing apparatus according to claim 1, characterized in that, The substrate processing apparatus also includes a second supply conduit configured to be connected to a first portion of a storage container and supply processing fluid to the outside.

9. The substrate processing apparatus according to claim 1, characterized in that, The substrate processing apparatus also includes a liquid level sensor connected to a cooling container, which monitors the flow pressure of the coolant stored in the cooling container.

10. The substrate processing apparatus according to claim 1, characterized in that, The fluid being processed is liquefied carbon dioxide (LCO2).

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