A gas uniform structure

Abstract

The utility model discloses a kind of uniform gas structures, comprising: uniform gas body, welding piece and positioning connecting piece, the outer periphery of uniform gas body is connected with welding piece, positioning connecting piece is connected with welding piece, wherein, the thermal conductivity of welding piece is lower than the thermal conductivity of uniform gas body. By implementing the uniform gas structure of the utility model can realize both can adapt to high-temperature working environment, and can effectively protect not being affected by high temperature the key high-temperature components of its sealing performance, it is crucial to improve the overall performance and reliability of semiconductor equipment.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a gas uniformity structure. Background Technology

[0002] In semiconductor manufacturing processes, many critical steps require operation at high temperatures, typically between 400 and 500 degrees Celsius. However, operating under such conditions presents significant challenges to equipment materials and design. For example, sealing rings, a common sealing component, are widely used in various industrial equipment to ensure system airtightness. But in semiconductor process equipment, especially in high-temperature environments, traditional sealing ring materials often cannot withstand such high temperatures; their maximum temperature resistance is usually no more than 300 degrees Celsius. Once this temperature limit is exceeded, the sealing ring may carbonize, losing its sealing performance and leading to equipment failure or even damage.

[0003] Furthermore, key components for gas distribution, such as dome-shaped gas distribution rings and gas distribution discs, not only need to withstand high temperatures but also must ensure uniform distribution and stable flow when in direct contact with the process gas. This means that these components themselves also need to be heated to correspondingly high temperatures to ensure the efficiency and quality of the entire process. However, how to maintain the airtightness of the entire system under such high-temperature conditions, especially protecting the sealing rings from damage, has become a pressing technical challenge.

[0004] Therefore, designing a new structure that can adapt to high-temperature working environments while effectively protecting key high-temperature components from having their sealing performance affected by high temperatures is crucial for improving the overall performance and reliability of semiconductor devices. Utility Model Content

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide a uniform gas structure.

[0006] To solve the above-mentioned technical problems, the purpose of this utility model is achieved through the following technical solution: providing a gas uniform structure, including: a gas uniform body, a welded component, and a positioning connector, wherein the outer periphery of the gas uniform body is connected to the welded component, and the positioning connector is connected to the welded component, wherein the thermal conductivity of the welded component is lower than that of the gas uniform body.

[0007] The further technical solution is as follows: the welded component includes a welding plate.

[0008] The further technical solution is that the thickness of the welding plate is 1mm to 5mm.

[0009] The further technical solution is that the thermal conductivity of the welding plate is 8W / m·K to 12W / m·K.

[0010] The further technical solution is that the material of the welding plate is C-276 alloy.

[0011] The further technical solution is as follows: the gas-uniform body includes a dome-shaped gas-uniform ring.

[0012] A further technical solution is to weld the welded component to the outer side of the dome-shaped gas-distributing ring.

[0013] The further technical solution is as follows: the gas equalization body includes a gas equalization disk.

[0014] A further technical solution is to weld the welded component to the outer side of the gas distribution plate.

[0015] The further technical solution is that the materials of the positioning connector and the gas uniform structure are Ni 200, respectively.

[0016] The advantages of this invention compared to existing technologies are as follows: By connecting a welded component with a lower thermal conductivity than the gas-coating body to the outer periphery of the gas-coating body and connecting it to the welded component via a positioning connector, this invention achieves adaptability to high-temperature operating environments and effective protection for critical high-temperature components. Specifically, the welded component with low thermal conductivity acts as a heat insulation layer, reducing heat diffusion from the gas-coating body to the outside, thereby lowering the surface temperature of the entire structure, especially the operating temperature of the sealing components, and avoiding carbonization or other failure modes caused by high temperatures. This design not only ensures the reliability of the sealing performance but also improves the overall performance and stability of the semiconductor device by reducing the heat load on surrounding components, which is crucial for ensuring the long-term reliable operation of the equipment under extreme conditions.

[0017] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A schematic diagram of a gas-uniform structure provided in an embodiment of this utility model;

[0020] Figure 2 A schematic diagram of the use of a gas-uniform structure provided in an embodiment of this utility model;

[0021] Figure 3 A schematic diagram of a gas-uniform structure provided in another embodiment of this utility model;

[0022] Explanation of the markings in the image:

[0023] 10. Dome-shaped gas equalization ring; 20. Welded parts; 30. Positioning connectors; 40. Sealing ring; 50. Gas equalization disc. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0025] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0026] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0027] It should also be further understood that the term "and / or" as used in this specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0028] In the high-temperature process environment of semiconductor manufacturing, typically between 400 and 500 degrees Celsius, equipment materials and designs face severe challenges. In particular, traditional sealing rings 40, whose maximum temperature resistance does not exceed 300 degrees Celsius, are prone to carbonization and failure in this environment, resulting in damage to system sealing and equipment performance. At the same time, key gas distribution components such as the dome gas distribution ring 10 and the gas distribution disk 50 not only need to withstand high temperatures to ensure the uniform distribution and stable flow of process gases, but also need to solve the technical challenge of how to maintain the efficient operation of the entire system while protecting the sealing rings 40 from damage.

[0029] Therefore, this utility model provides a gas uniform structure that can adapt to high-temperature working environments and effectively protect key high-temperature components from having their sealing performance affected by high temperatures, which is crucial for improving the overall performance and reliability of semiconductor equipment.

[0030] Specifically, this structure connects the gas distribution body (e.g., the dome-shaped gas distribution ring 10 or the gas distribution disk 50) and the positioning connector 30 using a welded component 20 with low thermal conductivity (such as a welded plate made of C-276 alloy) to achieve both high-temperature operating environment adaptability and sealing performance. Specifically, the design of the welded component 20 slows down the rate of heat transfer to the sealing components, avoiding the carbonization failure of traditional materials at high temperatures, thereby ensuring the airtightness of the system and the overall performance and reliability of the equipment. Furthermore, the use of Ni200 material as the material for the positioning connector 30 and the gas distribution structure further enhances its high-temperature resistance and structural stability, providing reliable protection for high-temperature processes in semiconductor manufacturing.

[0031] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0032] Please see Figure 1 A gas-uniform structure includes: a gas-uniform body, a welded component 20, and a positioning connector 30. The outer periphery of the gas-uniform body is connected to the welded component 20, and the positioning connector 30 is connected to the welded component 20. The thermal conductivity of the welded component 20 is lower than that of the gas-uniform body, so as to slow down heat transfer.

[0033] Welded component 20 includes a welding plate.

[0034] The thickness of the welding plate is 1mm to 5mm.

[0035] The thermal conductivity of the welded plate ranges from 8 W / m·K to 12 W / m·K.

[0036] The welding plate is made of C-276 alloy.

[0037] The positioning connector 30 and the air distribution structure are made of Ni 200, respectively.

[0038] The gas equalization body can be a dome gas equalization ring 10 (Dome) or a gas equalization disk 50, made of Ni200 material to improve heat conduction efficiency, so that the Dome or gas equalization disk 50 can quickly and uniformly reach the required working temperature.

[0039] The weldment 20 includes a weld plate with a thickness of 1 mm to 5 mm, made of C-276 alloy, and having a low thermal conductivity of 8 W / m·K to 12 W / m·K. This design helps to slow down the rate at which heat is transferred to external components, thereby protecting the seal 40 from carbonization failure due to high temperatures.

[0040] The positioning connector 30 is also made of Ni200 material. It is welded to the welding plate via its upper lugs and then positioned and connected to other components. This design not only enhances the stability of the overall structure but also reduces the impact of high temperatures on other parts.

[0041] The original design using a single Ni200 material could cause the temperature of the entire Dome or gas distribution plate 50 to rise to between 200-500℃ after heating, leading to problems such as carbonization of the sealing ring 40 at high temperatures. By introducing a C-276 alloy with a lower thermal conductivity as the welding plate material and controlling its thickness, the rate at which heat is transferred from the gas distribution body to the outside can be effectively reduced, thus preventing the sealing ring 40 from failing due to high temperatures.

[0042] In practice, this method ensures that heat is not easily conducted from the gas-bearing body to external components, which greatly improves the stability and durability of the system, especially for temperature-sensitive components.

[0043] In summary, this innovative gas uniformity structure design, through optimized material selection and structural design, successfully solved the problem of easy carbonization of the sealing ring 40 under high temperature conditions, while improving the overall performance and stability of the machine.

[0044] In one embodiment, please refer to Figure 1 and Figure 2 The gas-equalizing body includes a dome-shaped gas-equalizing ring 10.

[0045] In one embodiment, please refer to Figure 1 and Figure 2 The outer side of the dome-shaped gas equalization ring 10 is welded with the welded component 20.

[0046] Specifically, the gas distribution body is made of Ni200 material because Ni200 has excellent thermal conductivity, which can help the dome gas distribution ring 10 reach the required operating temperature quickly and evenly.

[0047] By introducing a welding plate made of C-276 alloy with a low thermal conductivity (1 mm to 5 mm thick), heat transfer to the outside is reduced, protecting surrounding components from high temperatures.

[0048] The typical thermal conductivity of C-276 alloy is between approximately 8 W / m·K and 12 W / m·K, which is significantly lower than that of Ni200, thus effectively reducing the rate at which heat is transferred from the dome gas distribution ring 10 to the external components.

[0049] The dome-shaped gas distribution ring 10 itself continues to use Ni200 material to ensure efficient heat conduction.

[0050] The outer side is welded with a C-276 alloy welding plate, which is fixed to the periphery by welding technology to form a heat insulation layer.

[0051] The original design of the positioning connector 30 directly connecting to the main body has been modified to first weld it to the welding plate, and then make positioning connections with other components such as the cavity. This design can further reduce the risk of heat transfer to other components.

[0052] In the original design, because the entire dome-shaped gas distribution ring 10 was made of Ni200 material with high thermal conductivity, the surface temperature of the dome-shaped gas distribution ring 10 might rise to the range of 200℃ to 500℃ during heating. This caused the sealing ring 40 (such as the O-ring) to carbonize and fail at high temperatures. Figure 2 As shown, by adding a layer of C-276 alloy welding plate with low thermal conductivity to the outside of the dome gas distribution ring 10, the impact of heat on external components, especially the temperature-sensitive sealing ring 40, is effectively reduced, thus solving the problem.

[0053] In summary, this innovative design not only improves the stability of the system but also extends the service life of various components, including the sealing ring 40, making it more suitable for high-temperature process applications.

[0054] Among them, such as Figure 2 As shown, a heating plate is placed on the upper end of the dome-shaped gas distribution ring 10, and a sealing ring 40 is provided on the positioning connection plate.

[0055] In another embodiment, please refer to Figure 3 The aforementioned gas equalization body includes a gas equalization disk 50.

[0056] In another embodiment, please refer to Figure 3 The aforementioned gas distribution plate 50 is welded to the outer side of the welded component 20.

[0057] The gas distribution plate 50 is a key component used to evenly distribute gas flow or heat. In the original design, the entire gas distribution plate 50 was made of Ni200 material, which has good thermal conductivity, but also causes the overall temperature to rise to the range of 200°C to 500°C during the heating process. This caused problems such as carbonization of the sealing ring 40 at high temperatures.

[0058] In this embodiment, the aim is to solve the above problems by introducing a combination structure of two weldable materials, while maintaining the characteristics of efficient heat conduction.

[0059] The gas distribution plate 50 still uses Ni200 material to ensure high heat conduction efficiency, so that the surface of the gas distribution plate 50 can quickly and evenly reach the required working temperature.

[0060] A material with low thermal conductivity (such as C-276 alloy) is selected, with a typical thermal conductivity between approximately 8 W / m·K and 12 W / m·K, significantly lower than that of Ni200 (approximately 70 to 91 W / m·K). This material will be fabricated into a thin plate with a thickness of 1 mm to 5 mm and welded to the outside of the gas distribution plate 50.

[0061] The heat distribution plate 50, as the main component, is directly responsible for heat transfer and distribution. It is connected to other components by welding to ensure the stability of the entire structure.

[0062] The newly added low thermal conductivity welding plate is welded to the outside to form a heat insulation layer, reducing heat transfer outwards. The specific thickness of the plate is adjusted according to actual needs, generally between 1mm and 5mm.

[0063] In the original design, the positioning connector 30 was directly connected to the gas equalization plate 50. In this embodiment, the positioning connector 30 will first be welded to the welding plate, and then positioned and connected to other components. This method not only reduces the transfer of heat from the gas equalization plate 50 to the positioning connector 30 and other components, but also improves the stability and durability of the entire structure.

[0064] In the original design, the entire gas distribution plate 50 was made of Ni200 material with high thermal conductivity, which caused the surface temperature to become too high during heating, resulting in carbonization failure of the sealing ring 40 located on the positioning connector 30. The new design effectively reduces the rate of heat transfer to external components by adding a thin plate with low thermal conductivity, protecting the temperature-sensitive sealing ring 40 and other components from high temperatures.

[0065] By welding a thin plate with low thermal conductivity to the outside, heat can be effectively blocked from spreading outward, reducing the impact on the surrounding environment and components. The positioning connector 30 is welded to the welding plate rather than directly connected to the main body, further reducing the possibility of heat transfer through the metal connector, thus protecting other components from high-temperature damage.

[0066] By reducing heat transfer, the operating temperature of the sealing ring 40 is lowered, preventing carbonization caused by high temperatures. Selecting a suitable sealing material (such as a high-temperature resistant sealing ring 40 material) also enhances its durability under high-temperature conditions. This not only solves the carbonization problem of the sealing ring 40 caused by high temperatures in the original design but also improves the overall performance and reliability of the system.

[0067] The aforementioned gas-uniform structure achieves adaptability to high-temperature operating environments and effective protection of critical high-temperature components by connecting a welded component 20 with a lower thermal conductivity than the gas-uniform body to the outer periphery of the gas-uniform body and connecting it to the welded component 20 via a positioning connector 30. Specifically, the low thermal conductivity welded component 20 acts as a heat insulation layer, reducing heat diffusion from the gas-uniform body to the outside, thereby lowering the surface temperature of the entire structure, especially the operating temperature of the sealing components, and avoiding carbonization or other failure modes caused by high temperatures. This design not only ensures the reliability of the sealing performance but also improves the overall performance and stability of the semiconductor device by reducing the heat load on surrounding components, which is crucial for ensuring the long-term reliable operation of the equipment under extreme conditions.

[0068] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A gas-uniform structure, characterized in that, include: The gas-uniform body, the welded component, and the positioning connector are provided. The outer periphery of the gas-uniform body is connected to the welded component, and the positioning connector is connected to the welded component. The thermal conductivity of the welded component is lower than that of the gas-uniform body.

2. The gas-uniform structure according to claim 1, characterized in that, The welded component includes a welding plate.

3. The gas-uniform structure according to claim 2, characterized in that, The thickness of the welding plate is 1 mm to 5 mm.

4. The gas-uniform structure according to claim 2, characterized in that, The thermal conductivity of the welded plate is 8 W / m·K to 12 W / m·K.

5. The gas-uniform structure according to claim 2, characterized in that, The welding plate is made of C-276 alloy.

6. A gas-uniform structure according to any one of claims 1 to 5, characterized in that, The gas-uniform body includes a dome-shaped gas-uniform ring.

7. A gas-uniform structure according to claim 6, characterized in that, The welded component is welded to the outer side of the dome-shaped gas-distributing ring.

8. A gas-uniform structure according to any one of claims 1 to 5, characterized in that, The gas equalization body includes a gas equalization disk.

9. A gas-uniform structure according to claim 8, characterized in that, The welded component is welded to the outer side of the gas distribution plate.

10. A gas-uniform structure according to any one of claims 1 to 5, characterized in that, The positioning connector and the gas-uniform structure are made of Ni 200.

Images