Automatic soldering test assembly line for electronic components

Abstract

The utility model relates to automatic technology field especially electronic component automatic soldering tin test assembly line, including the soldering tin unit, test unit, assembly unit and glue pouring unit connected in proper order, soldering tin unit is used for carrying out soldering tin to electronic component, and the soldering tin unit is provided with soldering tin transfer mechanism between test unit, to be used for the electronic component after soldering tin is transferred to test unit, test unit is used for carrying out function test to the electronic component after soldering tin, and test unit delivers the good product electronic component after test to assembly unit, and assembly unit is used for carrying out assembly shell to electronic component, and the electronic component after the shell after assembly is placed on glue pouring unit, and glue pouring unit is used for carrying out glue pouring to the shell of electronic component. The utility model carries out a series of automation to electric reactor, from soldering tin, detects to shell, and places the plate and finally glue pouring, realizes the production of full automation, saves manpower and material resources, and production efficiency is high.

Description

Technical Field

[0001] This utility model relates to the field of automation technology, and in particular to an automatic soldering test assembly line for electronic components. Background Technology

[0002] In the existing reactor production process, the soldering process is mainly used to achieve electrical connections between the various internal components of the reactor. This is typically done manually using soldering equipment, which is not only inefficient but also susceptible to variations in solder joint quality due to operator skill and work conditions. The testing phase involves inspecting various performance indicators of the soldered reactors, such as inductance and resistance values. This is also mostly done manually, placing each reactor individually onto testing equipment, a tedious process prone to omissions. The casing assembly process aims to provide physical protection and installation support for the reactor. Currently, this also relies on manual assembly of the casing components to the reactor body, making it difficult to guarantee assembly consistency and accuracy. The potting process is designed to further protect the internal components of the reactor from external environmental interference.

[0003] Because these processes are carried out independently and lack an effective automated connection mechanism, the entire production process involves a significant amount of manual handling and waiting time, which greatly limits the improvement of production efficiency. It also increases production costs and product quality instability, making it difficult to meet the demands of modern industry for efficient, stable, and large-scale production of reactors. Therefore, new improvements are needed to the existing automation of reactor production. Utility Model Content

[0004] To solve the above problems, this utility model implements a series of automation measures on the reactor, from soldering and testing to casing, tray placement and final potting, realizing fully automated production, saving manpower and material resources, improving automation effect, and creating a high-efficiency automated soldering, testing and assembly line for electronic components.

[0005] The technical solution adopted by this utility model is: an automatic soldering test assembly line for electronic components, comprising a soldering unit, a testing unit, an assembly unit, and a potting unit connected in sequence. The soldering unit is used to solder electronic components. A solder transfer mechanism is provided between the soldering unit and the testing unit to transfer the soldered electronic components toward the testing unit. The testing unit is used to perform functional tests on the soldered electronic components. The testing unit delivers the tested, good electronic components to the assembly unit. The assembly unit is used to assemble the electronic components into housings and then places the assembled electronic components into a tray on the potting unit. The potting unit is used to pot the housings of the electronic components with adhesive.

[0006] A further improvement to the above scheme is that the soldering unit includes a feeding mechanism, a solder picking mechanism, a fluxing mechanism, and a soldering mechanism. The feeding mechanism is equipped with a feeding carrier for fixing electronic components and transporting them to a designated position. The solder picking mechanism is used to pick up electronic components from the feeding carrier and transport them between the fluxing mechanism, the soldering mechanism, and the solder transfer mechanism. The fluxing mechanism is used to replenish flux to the parts of the electronic components that require soldering. The soldering mechanism is used to solder the electronic components. After soldering is completed, the solder picking mechanism places the electronic components into the solder transfer mechanism for transfer and collection. The solder transfer mechanism, the fluxing mechanism, and the soldering mechanism are arranged sequentially along the first direction of the frame. The solder picking mechanism picks up the electronic components and then places them into the solder transfer mechanism after passing them sequentially through the fluxing mechanism and the soldering mechanism.

[0007] A further improvement to the above solution is that the feeding mechanism includes a feeding transmission module, the feeding carrier is mounted on the feeding transmission module, the feeding transmission module is used to drive the feeding carrier to reciprocate between the feeding station and the picking station, and the solder picking mechanism is used to pick up the electronic components on the feeding carrier at the picking station; the feeding carrier is provided with multiple feeding slots to simultaneously place multiple electronic components.

[0008] A further improvement to the above solution is that the solder feeding mechanism includes a transmission gantry, a feeding and transfer module, a feeding and lifting module, and a gripping module. The transmission gantry is located on both sides of the fluxing mechanism, the soldering mechanism, and the solder transfer mechanism. The feeding and transfer module is mounted on the transmission gantry and is used to drive the feeding and lifting module and the gripping module between the feeding mechanism, the fluxing mechanism, the soldering mechanism, and the solder transfer mechanism. The gripping module is mounted on the feeding and lifting module, and multiple gripping modules are provided. This system simultaneously grasps multiple electronic components. The material handling and transfer module is a combination of belt drive and guide rail drive, while the material lifting module is a combination of lead screw and guide rod. The grasping module includes a grasping cylinder and a clamping claw. The grasping cylinder drives the clamping claw to grasp the electronic components. The material lifting module is equipped with a flipping module, which drives the grasping module to flip. The grasping module and the flipping module are equipped with protective covers to withstand the high temperature of the soldering mechanism.

[0009] A further improvement to the above solution is that the fluxing mechanism includes a flux support and a flux tank disposed on the flux support. The flux tank is used to contain flux for immersion of the electronic component soldering position in flux. The soldering mechanism includes a solder base, a solder tank, a scraper module, and a dross tank. The solder tank is disposed on the solder base and contains multiple heating elements for heating the solder material in the solder tank. The dross tank is located on one side of the solder tank. The scraper module is used to scrape the dross in the solder tank towards the dross tank. The scraper module includes a scraper support, a scraper lifting cylinder, a scraper driving cylinder, and a scraper plate. The scraper support is disposed on one side of the frame. The scraper lifting cylinder is disposed on the scraper support. The scraper driving cylinder is disposed on the scraper lifting cylinder. The scraper plate is disposed on the scraper driving cylinder to achieve lifting and unidirectional reciprocating scraping.

[0010] A further improvement to the above solution is that it also includes a slag brushing mechanism, which includes a slag receiving cavity, a slag brush roller, and a slag drive motor. The slag drive motor is used to drive the slag brush roller to rotate in the slag receiving cavity. The solder picking mechanism is used to pick up the soldered electronic components and place them on the slag brush roller to brush off the slag, so as to remove the slag present in the soldered part.

[0011] A further improvement to the above scheme is that the test unit includes a withstand voltage test mechanism, a test transfer mechanism, an interlayer test mechanism, and a comprehensive test mechanism. The withstand voltage test mechanism is used to pick up the electronic component from the solder transfer mechanism and position it to perform a withstand voltage test on the electronic component. After completion, the component is transferred to the interlayer test mechanism and the comprehensive test mechanism in sequence for testing.

[0012] A further improvement to the above solution is that the withstand voltage testing mechanism includes a withstand voltage testing material handling module, a withstand voltage testing module, and a withstand voltage defect sorting module. The withstand voltage testing material handling module is used to pick up electronic components from the solder transfer mechanism and transfer them to the withstand voltage testing module. The withstand voltage testing module includes a withstand voltage testing bracket, a withstand voltage testing lifting cylinder, a withstand voltage testing probe, a withstand voltage wire clamping drive cylinder, and a withstand voltage clamping plate, which are arranged opposite each other on both sides of the withstand voltage testing bracket. The withstand voltage testing lifting cylinder is mounted on the withstand voltage testing bracket, and the withstand voltage testing probe is mounted on the drive end of the withstand voltage testing lifting cylinder. The withstand voltage testing bracket has a withstand voltage testing slot above the withstand voltage testing probe. The withstand voltage testing material handling module picks up the electronic components and places them on the withstand voltage testing slot. The withstand voltage testing probe is used to contact the solder part of the electronic components and conduct a conductive withstand voltage test. During the test, the withstand voltage wire clamping drive cylinder is used to drive the withstand voltage clamping plate to clamp and fix the connecting wires of the electronic components to prevent the connecting wires from shaking.

[0013] A further improvement to the above solution is that the pressure resistance test material handling module includes a pressure resistance material handling transmission module, a pressure resistance material handling lifting cylinder, and a pressure resistance gripping cylinder. The pressure resistance material handling lifting cylinder is mounted on the pressure resistance material handling transmission module, and the pressure resistance gripping cylinder is mounted on the pressure resistance material handling lifting cylinder for gripping electronic components. The pressure resistance defect sorting module is a conveying module and is located on one side of the pressure resistance test module.

[0014] A further improvement to the above solution is that the test transfer mechanism includes a test transfer transmission module and a test transfer picking module. The test transfer transmission module is used to receive electronic components after testing by the withstand voltage testing mechanism and transfer the electronic components toward the interlayer testing mechanism. The test transfer picking module includes a transfer traversing module and three sets of transfer gripping cylinders. The transfer traversing module is used to drive the three sets of transfer gripping cylinders to alternately move between the test transfer transmission module, the interlayer testing mechanism, and the integrated testing mechanism.

[0015] A further improvement to the above solution is that the interlayer testing mechanism includes an interlayer testing module and an interlayer defect sorting module. The interlayer testing module includes an interlayer testing bracket, an interlayer testing lifting cylinder, an interlayer testing probe, an interlayer wire clamping drive cylinder, and an interlayer clamping plate, which are arranged opposite each other on both sides of the interlayer testing bracket. The interlayer testing lifting cylinder is mounted on the interlayer testing bracket, and the interlayer testing probe is mounted on the drive end of the interlayer testing lifting cylinder. An interlayer testing slot is provided above the interlayer testing probe on the interlayer testing bracket. The testing transfer mechanism picks up the electronic component and places it on the interlayer testing slot. The interlayer testing probe is used to contact the solder part of the electronic component and conduct conductive interlayer testing. During the test, the interlayer wire clamping drive cylinder is used to drive the interlayer clamping plate to clamp and fix the connecting wire of the electronic component to prevent the connecting wire from shaking. The interlayer defect sorting module is a conveying module and is located on one side of the interlayer testing module.

[0016] A further improvement to the above solution is that the integrated testing mechanism includes an integrated testing module and an integrated defect sorting module. The integrated testing module includes an integrated testing bracket, an integrated testing lifting cylinder, an integrated testing probe, an integrated wire clamping drive cylinder, and an integrated clamping plate, which are arranged opposite each other on both sides of the integrated testing bracket. The integrated testing lifting cylinder is mounted on the integrated testing bracket, and the integrated testing probe is mounted on the drive end of the integrated testing lifting cylinder. An integrated testing slot is provided above the integrated testing probe on the integrated testing bracket. The testing transfer mechanism picks up electronic components and places them onto the integrated testing slot. The integrated testing probe is used to contact the solder part of the electronic components and conduct conductive integrated testing. During the testing process, the integrated wire clamping drive cylinder is used to drive the integrated clamping plate to clamp and fix the connecting wires of the electronic components to prevent the connecting wires from shaking. The integrated defect sorting module is a conveying module and is located on one side of the integrated testing module.

[0017] A further improvement to the above solution is that the assembly unit includes a feeding mechanism, a shell feeding mechanism, a marking mechanism, a pre-assembly mechanism, a transfer mechanism, a pressing mechanism, and a tray-stacking mechanism. The pre-assembly mechanism includes a pre-assembly rotating module, a rotating substrate, and two sets of pre-assembly clamping modules. The rotating substrate is disposed on the pre-assembly rotating module, and the two sets of pre-assembly clamping modules are disposed opposite each other on both sides of the rotating substrate. The shell feeding mechanism is used to feed shells toward the pre-assembly clamping modules. The pre-assembly rotating module is used to drive the rotating substrate to rotate the pre-assembly clamping modules. The feeding mechanism is used to receive and transfer electronic components from the testing unit to the shells on the pre-assembly clamping modules. The marking mechanism is used to mark the shells of the shell feeding mechanism. The transfer mechanism is used to grab the shells after the electronic components are assembled and transfer them sequentially to the pre-assembly clamping module, the pressing mechanism, and the tray-stacking mechanism. The pressing mechanism is used to press and fix the electronic components inside the shells. The tray-stacking mechanism is used to tray the shells containing the electronic components. The potting unit is used to pot the electronic components after they are trayed.

[0018] A further improvement to the above solution is that the shell feeding mechanism includes a direct vibration feeding track, a shell feeding gripping module, and a coding and positioning module; the direct vibration feeding track is used for direct vibration feeding of the shell, the shell feeding gripping module is used to grip the shell from the direct vibration feeding track and move it sequentially to the coding and positioning module and the pre-assembly clamping module, and the coding mechanism includes a laser coding machine for laser coding the shell on the coding and positioning module;

[0019] A further improvement to the above solution is that a housing positioning seat is provided at the front end of the direct vibration feeding track for positioning the housing at the front end. The housing feeding gripping module includes a housing gripping transmission module, a housing gripping lifting module, and a housing gripping module. Two sets of housing gripping modules are provided and are set on the housing gripping lifting module. The housing gripping lifting module is set on the housing gripping transmission module. The housing gripping module is used to grip the housing from the housing positioning seat and alternately place it in the coding positioning module and the pre-assembly clamping module.

[0020] The beneficial effects of this utility model are:

[0021] Compared with existing reactor manufacturing methods, this invention achieves fully automated production by implementing a series of automation processes on the reactor, from soldering and testing to casing, tray placement, and final potting. This saves manpower and resources, improves automation efficiency, and increases production efficiency.

[0022] By setting up independent soldering and testing units and connecting them with a solder transfer mechanism, efficient collaboration between the soldering process and each testing process is achieved. This ensures that after soldering, the reactors are quickly and accurately transported to the testing stage, avoiding component damage and inefficiency that may occur with manual handling. The withstand voltage testing mechanism can directly pick up reactors from the solder transfer mechanism for positioning testing. Its precise picking and positioning capabilities effectively ensure the accuracy of the test points, thus obtaining reliable withstand voltage test results. This is crucial for assessing the reactor's ability to withstand voltage in actual operation, helping to screen out products with substandard withstand voltage performance in advance. The testing transfer mechanism can systematically transfer reactors to the interlayer testing mechanism and the comprehensive testing mechanism. Interlayer testing can meticulously examine the electrical performance between the layers inside the reactor, while comprehensive testing can comprehensively evaluate its overall performance indicators. This step-by-step and comprehensive testing process greatly improves the accuracy and completeness of testing the soldering quality and electrical performance of reactors, effectively ensuring the quality of reactors leaving the factory, reducing the risk of subsequent failures due to soldering or performance defects, and improving the reliability and stability of the entire production process.

[0023] The soldering unit achieves full automation of reactor soldering operations through key technologies such as efficient material feeding, precise material handling, reliable fluxing, stable soldering, and automated material collection. This significantly improves production efficiency, soldering quality, and product reliability, providing strong technical support and assurance for the reactor manufacturing industry. A modular layout integrates material feeding, fluxing, soldering, and material collection into a single work unit, employing a linear process flow design to effectively shorten material transfer distances. This enables automated continuous operation of the reactor soldering process. The material feeding carrier precisely fixes and transports the reactor, while the material handling mechanism quickly and accurately transfers materials between different mechanisms, greatly reducing the time spent on manual operations and significantly improving production efficiency compared to traditional manual soldering methods. The fluxing mechanism evenly replenishes flux to the solderable parts of the reactor, ensuring good wetting during the soldering process. Combined with the precise soldering operation of the soldering mechanism, this results in full, firm, and smooth solder joints, effectively avoiding quality problems such as cold solder joints and incomplete soldering, greatly improving the quality stability of reactor soldering and ensuring the reliability of product electrical performance. The entire soldering process is highly automated, reducing reliance on a large number of manual laborers. Only a small number of personnel are needed for equipment monitoring and simple maintenance, which significantly reduces labor costs and also reduces the risk of quality fluctuations caused by factors such as human operator fatigue. Attached Figure Description

[0024] Figure 1 This is a three-dimensional schematic diagram of the automatic welding, testing and assembly line for electronic components according to this utility model;

[0025] Figure 2 for Figure 1 Top view of an automated soldering, testing and assembly line for electronic components in China;

[0026] Figure 3 This is a three-dimensional schematic diagram of the soldering unit and the testing unit of this utility model;

[0027] Figure 4 for Figure 1 Top view of the soldering unit and testing unit;

[0028] Figure 5 This is a three-dimensional schematic diagram of the soldering unit of this utility model;

[0029] Figure 6 for Figure 5 A partial structural diagram of the soldering unit;

[0030] Figure 7 for Figure 5 A three-dimensional schematic diagram of the material handling mechanism of the soldering unit;

[0031] Figure 8 for Figure 5 A three-dimensional schematic diagram of the material handling mechanism of the soldering unit from another perspective;

[0032] Figure 9 This is a three-dimensional schematic diagram of the test unit of this utility model;

[0033] Figure 10 for Figure 9 A schematic diagram of the structure of the test unit in the middle;

[0034] Figure 11 for Figure 10 Enlarged diagram of point A in the diagram;

[0035] Figure 12 for Figure 10 Enlarged diagram of point B in the diagram;

[0036] Figure 13 for Figure 10 Enlarged diagram of point C in the diagram;

[0037] Figure 14 This is a three-dimensional schematic diagram of the assembly unit of this utility model;

[0038] Figure 15 This is a three-dimensional schematic diagram of the assembly unit structure of this utility model;

[0039] Figure 16 This is a three-dimensional schematic diagram of the assembly unit structure of this utility model.

[0040] Explanation of reference numerals in the attached drawings: Soldering unit 10, testing unit 20, assembly unit 30, potting unit 40, solder transfer mechanism 50;

[0041] 1. Feeding mechanism; 11. Feeding carrier; 12. Feeding transmission module; 2. Picking mechanism; 21. Transmission gantry; 22. Picking and transferring module; 23. Picking and lifting module; 24. Gripping module; 241. Gripping cylinder; 242. Clamping claw; 25. Tilting module; 3. Soldering assist mechanism; 31. Soldering assist bracket; 32. Soldering tank; 4. Soldering mechanism; 41. Soldering base; 42. Soldering tank; 421. Heating element; 43. Solder scraping module; 431. Solder scraping support; 432. Solder scraping lifting cylinder; 433. Solder scraping drive cylinder; 434. Solder scraping plate; 44. Solder dross tank; 5. Solder dross brushing mechanism; 51. Solder dross receiving cavity; 52. Solder dross brushing roller; 53. Solder dross drive motor.

[0042] 6. Pressure testing mechanism; 61. Pressure testing material handling module; 611. Pressure handling transmission module; 612. Pressure handling lifting cylinder; 613. Pressure handling gripping cylinder; 62. Pressure testing module; 621. Pressure testing bracket; 6211. Pressure testing slot; 622. Pressure testing lifting cylinder; 623. Pressure testing probe; 624. Pressure handling wire clamping drive cylinder; 625. Pressure handling clamping plate; 63. Pressure-resistant defective sorting module; 7. Test transfer mechanism; 71. Test transfer transmission module; 72. Test transfer material handling module; 721. Transfer lateral movement module; 73. Three sets of transfer gripping cylinders. 22. Interlayer testing mechanism; 8. Interlayer testing module; 81. Interlayer testing bracket; 811. Interlayer testing slot; 8111. Interlayer testing lifting cylinder; 812. Interlayer testing probe; 813. Interlayer wire clamping drive cylinder; 814. Interlayer clamping plate; 815. Interlayer defective sorting module; 82. Comprehensive testing mechanism; 9. Comprehensive testing module; 91. Comprehensive testing bracket; 911. Comprehensive testing slot; 9111. Comprehensive testing lifting cylinder; 912. Comprehensive testing probe; 913. Comprehensive wire clamping drive cylinder; 914. Comprehensive clamping plate; 915. Comprehensive defective sorting module; 92.

[0043] Feeding mechanism 301, outer shell feeding mechanism 302, direct vibration feeding track 3021, outer shell feeding gripping module 3022, coding and positioning module 3023, outer shell positioning seat 3024, outer shell gripping transmission module 3025, outer shell gripping lifting module 3026, outer shell gripping module 3027, pre-assembly mechanism 303, pre-assembly rotating module 3031, rotating base plate 3032, pre-assembly clamping module 3033, transfer mechanism 304, pressing mechanism 305, tray mechanism 306, coding mechanism 307. Detailed Implementation

[0044] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model.

[0045] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0047] like Figures 1 to 16 As shown, in one embodiment of this utility model, an automated soldering testing and assembly line for electronic components is provided, comprising a soldering unit 10, a testing unit 20, an assembly unit 30, and a potting unit 40 connected in sequence. The soldering unit 10 is used to solder electronic components. A solder transfer mechanism 50 is provided between the soldering unit 10 and the testing unit 20 to transfer the soldered electronic components toward the testing unit 20. The testing unit 20 is used to perform functional testing on the soldered electronic components. The testing unit 20 delivers the tested, good electronic components to the assembly unit 30. The assembly unit 30 is used to assemble the electronic components into housings and then places the assembled electronic components onto a tray in the potting unit 40. The potting unit 40 is used to pot the housings of the electronic components with adhesive. This embodiment achieves fully automated production by implementing a series of automation steps on the reactor, from soldering and testing to housing assembly, tray placement, and final potting, saving manpower and resources, improving automation efficiency, and achieving high production efficiency. The system integrates four core process units: soldering, testing, assembly, and potting. It adopts a serial assembly line layout and uses a multi-axis transfer mechanism to achieve seamless process connection. A dedicated transfer mechanism is set between the soldering unit 10 and the testing unit 20 to effectively avoid solder joint damage caused by manual intervention. The testing unit 20 uses an automatic sorting mechanism to accurately sort good products, ensuring the pass rate of inputs in subsequent assembly stages.

[0048] See Figures 5-8As shown, the soldering unit 10 includes a feeding mechanism 1, a picking mechanism 2, a fluxing mechanism 3, and a soldering mechanism 4. The feeding mechanism 1 is equipped with a feeding carrier 11 for fixing electronic components and transporting them to a designated position. The picking mechanism 2 is used to pick up electronic components on the feeding carrier 11 and transport them between the fluxing mechanism 3, the soldering mechanism 4, and the solder transfer mechanism 30. The fluxing mechanism 3 is used to replenish flux to the parts of the electronic components that need soldering. The soldering mechanism 4 is used to solder the electronic components. After soldering is completed, the picking mechanism 2 places the electronic components into the solder transfer mechanism 30 for transfer and collection. The solder transfer mechanism 30, the fluxing mechanism 3, and the soldering mechanism 4 are arranged sequentially along the first direction of the frame. The picking mechanism 2 picks up the electronic components and then places them into the solder transfer mechanism 30 after passing them sequentially through the fluxing mechanism 3 and the soldering mechanism 4. In this embodiment, the soldering unit 10 achieves full automation of reactor soldering operations through key technologies such as efficient material feeding, precise material handling, reliable fluxing, stable soldering, and automated material collection. This significantly improves production efficiency, welding quality, and product reliability, providing strong technical support and assurance for the reactor manufacturing industry. By integrating material feeding, fluxing, soldering, and material collection into the same work unit through a modular layout and adopting a linear process flow design, the material transfer distance is effectively shortened. This enables automated continuous operation of the reactor soldering process. The feeding carrier 11 can precisely fix and transport the reactor, while the material handling mechanism 2 quickly and accurately transfers materials between mechanisms, greatly reducing the time spent on manual operations. Compared to traditional manual soldering methods, production efficiency is significantly improved. The fluxing mechanism 3 evenly replenishes flux to the solderable parts of the reactor, ensuring good wetting during the soldering process. Combined with the precise soldering operation of the soldering mechanism 4, this results in full, strong, and smooth solder joints, effectively avoiding quality problems such as cold solder joints and missed solder joints. This greatly improves the quality stability of reactor soldering and ensures the reliability of the product's electrical performance. The entire soldering process is highly automated, reducing reliance on a large amount of manual labor. Only a small number of personnel are needed for equipment monitoring and simple maintenance, significantly reducing labor costs and minimizing the risk of quality fluctuations caused by factors such as human operator fatigue.

[0049] The loading mechanism 1 includes a loading transmission module 12, on which a loading carrier 11 is mounted. The loading transmission module 12 drives the loading carrier 11 to reciprocate between the loading station and the unloading station. The unloading mechanism 2 is used to pick up electronic components from the loading carrier 11 at the unloading station. The loading carrier 11 is provided with multiple feeding slots to simultaneously hold multiple electronic components. In this embodiment, the loading transmission module 12 drives the loading carrier 11, which has multiple feeding slots, to reciprocate between specific loading and unloading stations, achieving an efficient and stable loading process. Multiple feeding slots can simultaneously hold multiple electronic components, greatly increasing the number of components loaded in a single operation, effectively reducing the time spent on frequent loading operations, and improving overall production efficiency. The unloading mechanism 2 accurately picks up electronic components from the loading carrier 11 at the unloading station, with close cooperation, further ensuring that subsequent soldering processes can be carried out in an orderly and uninterrupted manner. This makes the soldering process of reactors smoother and helps to improve the stability of solder quality, reducing the probability of solder defects caused by factors such as untimely feeding or inaccurate material handling.

[0050] See Figures 7-8As shown, the material handling mechanism 2 includes a transmission gantry frame 21, a material handling and transfer module 22, a material handling and lifting module 23, and a gripping module 24. The transmission gantry frame 21 is located on both sides of the fluxing mechanism 3, the soldering mechanism 4, and the solder transfer mechanism 30. The material handling and transfer module 22 is mounted on the transmission gantry frame 21 and is used to drive the material handling and lifting module 23 and the gripping module 24 between the loading mechanism 1, the fluxing mechanism 3, the soldering mechanism 4, and the solder transfer mechanism 30. The gripping module 24 is mounted on the material handling and lifting module 23. There are multiple sets of modules, each capable of simultaneously gripping multiple electronic components. The material handling and transfer module 22 is a combination of belt drive and guide rail drive, while the material handling and lifting module 23 is a combination of lead screw and guide rod. The gripping module 24 includes a gripping cylinder 241 and a clamping claw 242. The gripping cylinder 241 drives the clamping claw 242 to grip the electronic components. In this embodiment, the design of the transmission gantry 21 combined with the material handling and transfer module 22 enables the material handling and lifting module 23 and the gripping module 24 to transmit precisely and efficiently between different mechanisms. The material handling and transfer module 22, which combines belt drive and guide rail drive, ensures both smooth transmission and rapid and accurate position transfer, effectively reducing shaking and deviation during transmission. This ensures that the electronic components required by the reactor can accurately reach each workstation, such as fluxing and soldering, thereby improving overall production efficiency. The gripping module 24 drives the gripping claw 242 to perform gripping actions through the gripping cylinder 241. Multiple gripping modules 24 can grip multiple electronic components at the same time, which is extremely advantageous for the batch processing of electronic components often required in reactor soldering production. It greatly shortens the gripping time and ensures the stability of the gripping, preventing electronic components from falling or shifting during the transfer process.

[0051] The material handling lifting module 23 is equipped with a flipping module 25, which drives the gripping module 24 to flip. Both the gripping module 24 and the flipping module 25 are protected by a protective cover to withstand the high temperature of the soldering mechanism 4. In this embodiment, the soldering mechanism 4 generates high temperatures during operation, and the protective cover effectively blocks the impact of this high temperature on the internal modules and the gripped electronic components. On the one hand, this avoids the potential decrease in accuracy of the gripping module 24 due to high temperatures, ensuring the accuracy of each gripping and placement of reactor components and guaranteeing the precision of the solder joints. On the other hand, it also prevents damage to the mechanical structure and electrical components of the flipping module 25 caused by high temperatures, maintaining its stable and reliable operating performance. This significantly reduces the reactor soldering defect rate caused by equipment failure or inaccuracy, improving overall production efficiency and product quality.

[0052] The fluxing mechanism 3 includes a flux support 31 and a flux tank 32 disposed on the flux support 31. The flux tank 32 is used to hold flux for immersion of flux into the soldering position of electronic components. The soldering mechanism 4 includes a solder base 41, a solder tank 42, a solder scraper 43, and a solder dross tank 44. The solder tank 42 is disposed on the solder base 41 and contains multiple heating elements 421 for heating the solder in the solder tank 42. The solder dross tank 44 is located on one side of the solder tank 42. The solder scraping module 43 is used to scrape the solder dross in the solder bath 42 towards the solder dross tank 44. The solder scraping module 43 includes a solder scraping bracket 431, a solder scraping lifting cylinder 432, a solder scraping driving cylinder 433, and a solder scraping plate 434. The solder scraping bracket 431 is disposed on one side of the frame, the solder scraping lifting cylinder 432 is disposed on the solder scraping bracket 431, the solder scraping driving cylinder 433 is disposed on the solder scraping lifting cylinder 432, and the solder scraping plate 434 is disposed on the solder scraping driving cylinder 433, so as to realize lifting and unidirectional reciprocating transmission for solder scraping. In this embodiment, the flux bracket 31 provides a stable support for the flux bath 32, ensuring that it can maintain an accurate position during soldering operations. The flux contained in the flux bath 32 can effectively remove oxides and other impurities from the soldering parts when the electronic components of the reactor are immersed in it, greatly improving the wettability and solderability of the solder. This allows the solder to adhere more evenly and firmly to the corresponding soldering points of the reactor, ensuring the stability and reliability of the soldering quality. Multiple heating elements 421521 installed within the solder bath 4252 can precisely and efficiently heat the solder, ensuring it remains at a suitable soldering temperature. This is crucial for forming high-quality solder joints required for reactor soldering and effectively avoids problems such as cold solder joints caused by uneven or insufficient temperature. The solder scraper module 4353, through the coordinated operation of the solder scraper bracket 431, the solder scraper lifting cylinder 432, the solder scraper drive cylinder 433, and the solder scraper plate 434, can promptly and accurately scrape out the solder dross from the solder bath 42 and guide it to the solder dross tray 44. During reactor soldering operations, the purity of the solder in the solder bath 42 can be maintained at all times, ensuring uniform solder quality for each soldering operation. This guarantees the consistency and stability of each solder joint, significantly improving the overall quality and production efficiency of reactor soldering.

[0053] The system also includes a dross brushing mechanism 5, which comprises a dross collection cavity 51, a dross brush roller 52, and a dross drive motor 53. The dross drive motor 53 drives the dross brush roller 52 to rotate within the dross collection cavity 51. The material handling mechanism 2 picks up the soldered electronic components and places them onto the dross brush roller 52 for dross brushing, thereby removing dross from the soldered portion. In this embodiment, by setting up a dedicated dross collection cavity 51, the dross cleaned up during the dross brushing process can be effectively collected, preventing it from scattering inside the equipment or on the workbench, maintaining a clean working environment, and preventing dross from interfering with or damaging other components. Driven by the dross drive motor 53, the dross brush roller 52 rotates stably within the dross collection cavity 51. Combined with the material handling mechanism 2, it precisely picks up the soldered electronic components and places them onto the brush roller for dross brushing, efficiently and accurately removing dross from the soldered portion of the reactor. This ensures the quality of the reactor solder connection, improves the stability and reliability of the electrical connection, and reduces the potential electrical faults such as short circuits caused by solder residue.

[0054] The testing unit 20 includes a withstand voltage testing mechanism 6, a test transfer mechanism 7, an interlayer testing mechanism 8, and a comprehensive testing mechanism 9. The withstand voltage testing mechanism 6 picks up electronic components from the solder transfer mechanism 30 and positions them for withstand voltage testing. After completion, the components are sequentially transferred to the interlayer testing mechanism and the comprehensive testing mechanism 9 via the test transfer mechanism 7 for further testing. This embodiment achieves efficient collaboration between the soldering process and each testing process by setting up an independent soldering unit 10 and connecting them with the solder transfer mechanism 30. This ensures that components are quickly and accurately transported to the testing stage after soldering, avoiding component damage and inefficiency that may occur with manual handling. The withstand voltage testing mechanism 6 can directly pick up reactors from the solder transfer mechanism 30 for positioning testing. Its precise picking and positioning capabilities effectively ensure the accuracy of the test points, thus obtaining reliable withstand voltage test results. This is crucial for assessing the reactor's ability to withstand voltage in actual operation and helps to screen out products with substandard withstand voltage performance in advance. The test transfer mechanism 7 can systematically transfer the reactors sequentially to the interlayer test mechanism 8 and the comprehensive test mechanism 9. Interlayer testing can meticulously examine the electrical performance between the various layers within the reactor, while comprehensive testing can comprehensively evaluate its overall performance indicators. This step-by-step and comprehensive testing process greatly improves the accuracy and completeness of testing the solder quality and electrical performance of the reactors, effectively ensuring the quality of the reactors leaving the factory, reducing the risk of subsequent failures due to soldering or performance defects, and enhancing the reliability and stability of the entire production process.

[0055] See Figures 9-13As shown, the withstand voltage testing mechanism 6 includes a withstand voltage testing pick-up module 61, a withstand voltage testing module 62, and a withstand voltage defect sorting module 63. The withstand voltage testing pick-up module 61 is used to pick up electronic components from the solder transfer mechanism 30 and transfer them to the withstand voltage testing module 62. The withstand voltage testing module 62 includes a withstand voltage testing bracket 621, a withstand voltage testing lifting cylinder 622, a withstand voltage testing probe 623, a withstand voltage wire clamping drive cylinder 624, and a withstand voltage clamping plate 625, which are arranged opposite each other on both sides of the withstand voltage testing bracket 621. The withstand voltage testing lifting cylinder 622 is mounted on the withstand voltage testing bracket 621, and the withstand voltage testing probe 623 is mounted on the drive end of the withstand voltage testing lifting cylinder 622. The withstand voltage testing bracket 621 is located at the withstand voltage testing probe 623. A withstand voltage test tank 6211 is provided above the reactor. The withstand voltage test pick-up module 61 picks up the electronic components and places them onto the withstand voltage test tank 6211. The withstand voltage test probe 623 is used to contact the solder part of the electronic components and conduct a conductive withstand voltage test. During the test, the withstand voltage wire clamping drive cylinder 624 is used to drive the withstand voltage clamping plate 625 to clamp and fix the connecting wires of the electronic components to prevent the connecting wires from shaking. In this embodiment, the withstand voltage test pick-up module 61 can accurately and efficiently pick up the electronic components required by the reactor from the solder transfer mechanism 30 and transfer them accurately to the withstand voltage test module 62, ensuring the continuity and accuracy of the test process, greatly improving the overall efficiency of the test link, and reducing the errors and delays that may be caused by manual operation. The withstand voltage test module 62 can stably push the withstand voltage test probe 623 through the withstand voltage test lifting cylinder 622, so that it accurately contacts the solder part of the electronic components, realizing a reliable conductive withstand voltage test, and effectively detecting possible defects in the withstand voltage of the solder part. The withstand voltage test slot 6211 located above provides a suitable placement position for electronic components, further ensuring the stability of the test. During the test, the withstand voltage clamping drive cylinder 624 drives the withstand voltage clamping plate 625 to clamp and fix the connecting wires of the electronic components, preventing the connecting wires from shaking and avoiding inaccurate test data or misjudgments that may be caused by shaking, making the test results more reliable and accurate.

[0056] The withstand pressure test material handling module 61 includes a withstand pressure material handling transmission module 611, a withstand pressure material handling lifting cylinder 612, and a withstand pressure gripping cylinder 613. The withstand pressure material handling lifting cylinder 612 is mounted on the withstand pressure material handling transmission module 611, and the withstand pressure gripping cylinder 613 is mounted on the withstand pressure material handling lifting cylinder 612 for gripping electronic components. The withstand pressure defect sorting module 63 is a conveying module located on one side of the withstand pressure test module 62. In this embodiment, the withstand pressure test material handling module 61 achieves precise and efficient material handling operations through its reasonable structural design. The withstand pressure material handling transmission module 611 provides a stable and reliable horizontal displacement transmission basis for the overall material handling action, ensuring accurate arrival at the position of the electronic component to be gripped. The withstand pressure material handling lifting cylinder 612 can flexibly control the gripping height and accurately position electronic components placed on different levels, cooperating with the withstand pressure material handling transmission module 611 to achieve precise material handling actions in three-dimensional space. The withstand voltage gripping cylinder 613, with its stable gripping force, can firmly grip the relevant electronic components of the reactor, ensuring that the components will not accidentally fall off during subsequent testing and transportation, thereby improving the continuity and accuracy of the entire testing process. The withstand voltage defect sorting module 63, as a conveying module, is located on one side of the withstand voltage testing module 62. After the withstand voltage test is completed, it can quickly and orderly separate and transport the electronic components with defective test results from the main testing process, preventing defective products from being mixed into subsequent processes.

[0057] See Figure 11 As shown, the test transfer mechanism 7 includes a test transfer transmission module 71 and a test transfer picking module 72. The test transfer transmission module 71 is used to receive electronic components tested by the withstand voltage testing mechanism 6 and transfer the electronic components towards the interlayer testing mechanism 8. The test transfer picking module 72 includes a transfer traversing module 721 and three sets of transfer gripping cylinders 722. The transfer traversing module 721 is used to drive the three sets of transfer gripping cylinders 722 to alternately move between the test transfer transmission module 71, the interlayer testing mechanism 8, and the integrated testing mechanism 9. In this embodiment, the test transfer transmission module 71 can accurately and efficiently receive electronic components that have completed the withstand voltage testing mechanism 6, ensuring the continuity of component flow, effectively avoiding errors and delays that may be caused by manual transfer, and providing a stable supply of components for subsequent testing stages. The transfer traverse module 721 in the test transfer and material handling module 72 drives three sets of transfer gripping cylinders 722 to alternately move between the test transfer transmission module 71, the interlayer test mechanism 8, and the integrated test mechanism 9, enabling rapid and accurate switching of electronic components between different test stages. This significantly improves test efficiency, reduces the overall test cycle, and ensures that each electronic component can complete various tests in an orderly manner according to the established process.

[0058] See Figure 12As shown, the interlayer testing mechanism 8 includes an interlayer testing module 81 and an interlayer defect sorting module 82. The interlayer testing module 81 includes an interlayer testing bracket 811, an interlayer testing lifting cylinder 812, an interlayer testing probe 813, an interlayer wire clamping drive cylinder 814, and an interlayer clamping plate 815, which are arranged opposite each other on both sides of the interlayer testing bracket 811. The interlayer testing lifting cylinder 812 is mounted on the interlayer testing bracket 811, and the interlayer testing probe 813 is mounted on the drive end of the interlayer testing lifting cylinder 812. The interlayer testing bracket 811... An interlayer test slot 8111 is positioned above the interlayer test probe 813. The test transfer mechanism 7 picks up and places the electronic component onto the interlayer test slot 8111. The interlayer test probe 813 contacts the solder portion of the electronic component and performs conductive interlayer testing. During the test, the interlayer wire clamping drive cylinder 814 drives the interlayer clamping plate 815 to clamp and fix the connecting wires of the electronic component, preventing the connecting wires from shaking. Specifically, the interlayer defect sorting module 82 is a conveying module located on one side of the interlayer test module 81. In this embodiment, the interlayer test module 81 precisely drives the interlayer test probe 813 through the interlayer test lifting cylinder 812, enabling precise contact with the solder portion of the reactor electronic component, achieving stable and reliable conductive interlayer testing, and effectively ensuring the accuracy of the test data. The interlayer test slot 8111 provides a suitable placement position for the electronic component, facilitating standardized test operations. The interlayer clamping drive cylinder 814 drives the interlayer clamping plate 815 to clamp and fix the electronic component connecting wires, greatly avoiding interference caused by the shaking of the connecting wires during testing, ensuring the stability of the testing environment, and further improving the reliability of the test results. Meanwhile, the interlayer defect sorting module 82, located on one side, serves as a conveying module, which can quickly and efficiently sort and convey the detected defective reactor electronic components after the interlayer test is completed, achieving seamless integration of the testing and sorting processes.

[0059] See Figure 13As shown, the integrated testing mechanism 9 includes an integrated testing module 91 and an integrated defect sorting module 92. The integrated testing module 91 includes an integrated testing bracket 911, an integrated testing lifting cylinder 912, an integrated testing probe 913, an integrated wire clamping drive cylinder 914, and an integrated clamping plate 915, which are arranged opposite each other on both sides of the integrated testing bracket 911. The integrated testing lifting cylinder 912 is mounted on the integrated testing bracket 911, and the integrated testing probe 913 is mounted on the drive end of the integrated testing lifting cylinder 912. The integrated testing bracket 911... A comprehensive test slot 9111 is positioned above the comprehensive test probe 913. The test transfer mechanism 7 picks up and places electronic components onto the comprehensive test slot 9111. The comprehensive test probe 913 is used to contact the solder portion of the electronic components and perform conductive comprehensive testing. During the test, the comprehensive wire clamping drive cylinder 914 drives the comprehensive clamping plate 915 to clamp and fix the connecting wires of the electronic components, preventing the connecting wires from shaking. Specifically, the comprehensive defect sorting module 92 is a conveying module located on one side of the comprehensive test module 91. In this embodiment, the comprehensive test module 91 achieves an efficient and accurate testing process through the reasonable layout of its components. The comprehensive test lifting cylinder 912 can stably push the comprehensive test probe 913 to accurately contact the solder portion of the reactor, ensuring the reliability of the conductive comprehensive test and providing a basis for accurately judging the solder quality. The setting of the comprehensive test slot 9111, in conjunction with the test transfer mechanism 7, ensures that the electronic components are picked up and placed in an orderly manner, improving the overall testing efficiency. The integrated defect sorting module 92 can promptly and conveniently transport and divert reactors that have been determined to be defective after testing, thus achieving rapid separation of defective and qualified products.

[0060] See Figures 14-16As shown, the assembly unit 30 includes a feeding mechanism 301, a shell feeding mechanism 302, a marking mechanism 307, a pre-assembly mechanism 303, a transfer mechanism 304, a pressing mechanism 305, and a tray-mounting mechanism 306. The pre-assembly mechanism 303 includes a pre-assembly rotating module 3031, a rotating substrate 3032, and two sets of pre-assembly clamping modules 3033. The rotating substrate 3032 is disposed on the pre-assembly rotating module 3031, and the two sets of pre-assembly clamping modules 3033 are disposed opposite to each other on both sides of the rotating substrate 3032. The shell feeding mechanism 302 is used to feed the shell towards the pre-assembly clamping module 3033. The pre-assembly rotating module 3031 is used to drive the rotating substrate 3032 to rotate the pre-assembly clamping module 3033. The feeding mechanism 301 is used to feed electronic components from the test... Unit 20 receives and transfers the housing onto the pre-assembly clamping module 3033; the marking mechanism 307 is used to mark the housing of the housing feeding mechanism 302; the transfer mechanism 304 is used to grab the housing after assembling electronic components and sequentially transfer it to the pre-assembly clamping module 3033, the pressing mechanism 305, and the tray-sanding mechanism 306. The pressing mechanism 305 is used to press and fix the electronic components inside the housing, and the tray-sanding mechanism 306 is used to tray the housing containing the electronic components; the potting unit 40 is used to pot the electronic components after tray-sanding. In this embodiment, in the production of reactors, through the coordinated operation of the pre-assembly rotating module 3031, the rotating substrate 3032, and the two sets of pre-assembly clamping modules 3033, the preliminary assembly of electronic components and housings can be accurately achieved. The housing feeding mechanism 302 provides stable feeding, and the feeding mechanism 301 accurately feeds the electronic components into the housing. The precise cooperation greatly improves the assembly accuracy and reduces assembly errors that may be caused by manual operation. The coding mechanism 307 marks the casing, which greatly facilitates the quality control and subsequent traceability of the reactor. During the production process, each casing has a unique identifier, which makes it easy to quickly and accurately locate the specific product during subsequent testing, use, and troubleshooting of potential quality problems. This enables precise quality control and accountability, ensuring the stability and reliability of the reactor product quality.

[0061] The outer shell feeding mechanism 302 includes a direct vibration feeding track 3021, an outer shell feeding gripping module 3022, and a coding and positioning module 3023. The direct vibration feeding track 3021 is used for direct vibration feeding of the outer shell. The outer shell feeding gripping module 3022 is used to grip the outer shell from the direct vibration feeding track 3021 and move it sequentially to the coding and positioning module 3023 and the pre-assembly clamping module 3033. The coding mechanism 307 includes a laser coding machine for laser coding the outer shell on the coding and positioning module 3023. In this embodiment, the direct vibration feeding track 3021 can ensure stable and orderly direct vibration feeding of the outer shell, ensuring the continuity and accuracy of the feeding, and effectively avoiding production interruptions caused by poor feeding. The outer casing feeding and gripping module 3022 can accurately grip the outer casing and move it precisely to the coding and positioning module 3023 and the pre-assembly clamping module 3033, greatly improving the accuracy and efficiency of material transfer and reducing errors that may be caused by human operation. Coding is performed on the outer casing on the coding and positioning module 3023 using a laser coding machine. This method features clear and durable coding, accurately leaving high-quality marking information at designated locations on the outer casing. The high coding speed meets the needs of efficient production and also facilitates subsequent traceability and management of electronic component outer casings.

[0062] The front end of the direct vibration feeding track 3021 is provided with a shell positioning seat 3024 for positioning the shell at the front end. The shell feeding gripping module 3022 includes a shell gripping transmission module 3025, a shell gripping lifting module 3026, and a shell gripping module 3027. Two sets of shell gripping modules 3027 are provided and are disposed on the shell gripping lifting module 3026. The shell gripping lifting module 3026 is disposed on the shell gripping transmission module 3025. The shell gripping module 3027 is used to grip the shell from the shell positioning seat 3024 and alternately place it in the marking positioning module 3023 and the pre-assembly clamping module 3033 in sequence. In this embodiment, the shell feeding gripping module 3022, including the shell gripping transmission module 3025, the shell gripping lifting module 3026, and the two sets of shell gripping modules 3027, works together to make the gripping action efficient and stable. The housing gripping and lifting module 3026 can flexibly adjust the gripping height to adapt to different situations, while the two sets of housing gripping modules 3027 mounted on it can work alternately. In actual application to electronic component housing assembly and potting equipment, it can ensure that the housing is accurately gripped from the housing positioning seat 3024 and placed in an orderly and alternating manner on the coding positioning module 3023 and the pre-assembly clamping module 3033.

[0063] The above embodiments only illustrate several implementation methods of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. An automated soldering testing and assembly line for electronic components, characterized in that: The device includes a soldering unit, a testing unit, an assembly unit, and a potting unit connected in sequence. The soldering unit is used to solder electronic components. A solder transfer mechanism is provided between the soldering unit and the testing unit to transfer the soldered electronic components toward the testing unit. The testing unit is used to perform functional tests on the soldered electronic components. The testing unit delivers the tested, good electronic components to the assembly unit. The assembly unit is used to assemble the electronic components into housings and then places the assembled electronic components onto a tray on the potting unit. The potting unit is used to pot the housings of the electronic components with adhesive.

2. The automated soldering test and assembly line for electronic components according to claim 1, characterized in that: The soldering unit includes a feeding mechanism, a solder picking mechanism, a fluxing mechanism, and a soldering mechanism. The feeding mechanism is equipped with a feeding carrier for fixing electronic components and transporting them to a designated position. The solder picking mechanism is used to pick up electronic components from the feeding carrier and move them between the fluxing mechanism, the soldering mechanism, and the solder transfer mechanism. The fluxing mechanism is used to add flux to the parts of the electronic components that require soldering. The soldering mechanism is used to solder the electronic components. After soldering is completed, the solder picking mechanism places the electronic components into the solder transfer mechanism for transfer and collection. The solder transfer mechanism, the fluxing mechanism, and the soldering mechanism are arranged sequentially along the first direction of the frame. The solder picking mechanism picks up electronic components and then places them into the solder transfer mechanism after passing them through the fluxing mechanism and the soldering mechanism.

3. The automated soldering test and assembly line for electronic components according to claim 2, characterized in that: The feeding mechanism includes a feeding transmission module, and the feeding carrier is mounted on the feeding transmission module. The feeding transmission module is used to drive the feeding carrier to reciprocate between the feeding station and the picking station. The solder picking mechanism is used to pick up electronic components from the feeding carrier at the picking station. The feeding carrier is provided with multiple feeding slots to simultaneously place multiple electronic components.

4. The automated soldering test and assembly line for electronic components according to claim 2, characterized in that: The solder feeding mechanism includes a transmission gantry, a feeding and transfer module, a feeding and lifting module, and a gripping module. The transmission gantry is located on both sides of the fluxing mechanism, the soldering mechanism, and the solder transfer mechanism. The feeding and transfer module is mounted on the transmission gantry and is used to drive the feeding and lifting module and the gripping module between the feeding mechanism, the fluxing mechanism, the soldering mechanism, and the solder transfer mechanism. The gripping module is mounted on the feeding and lifting module, and multiple gripping modules are provided to simultaneously grip multiple electronic components. The feeding and transfer module is a transmission module combining belt drive and guide rail drive, and the feeding and lifting module is a transmission module combining a lead screw and a guide rod. The gripping module includes a gripping cylinder and a clamping claw. The gripping cylinder is used to drive the clamping claw to grip the electronic components. A flipping module is provided on the feeding and lifting module, and the flipping module is used to drive the gripping module to flip. The gripping module and the flipping module are equipped with protective covers to cope with the high temperature of the soldering mechanism.

5. The automated soldering test and assembly line for electronic components according to claim 2, characterized in that: The fluxing mechanism includes a flux support and a flux tank mounted on the flux support. The flux tank is used to hold flux for immersion of the electronic component soldering position. The soldering mechanism includes a solder base, a solder tank, a scraper module, and a dross tank. The solder tank is mounted on the solder base and contains multiple heating elements to heat the solder material. The dross tank is located on one side of the solder tank. The scraper module is used to scrape the dross from the solder tank towards the dross tank. The scraper module includes a scraper support, a scraper lifting cylinder, a scraper driving cylinder, and a scraper plate. The scraper support is mounted on one side of the frame. The scraper lifting cylinder is mounted on the scraper support. The scraper driving cylinder is mounted on the scraper lifting cylinder. The scraper plate is mounted on the scraper driving cylinder to achieve lifting and unidirectional reciprocating scraping.

6. The automated soldering test and assembly line for electronic components according to any one of claims 2 to 5, characterized in that: It also includes a slag brushing mechanism, which includes a slag receiving cavity, a slag brush roller, and a slag drive motor. The slag drive motor is used to drive the slag brush roller to rotate in the slag receiving cavity. The solder picking mechanism is used to pick up the soldered electronic components and place them on the slag brush roller to brush off the slag, so as to remove the slag present in the soldered part.

7. The automated soldering test and assembly line for electronic components according to claim 1, characterized in that: The testing unit includes a withstand voltage testing mechanism, a test transfer mechanism, an interlayer testing mechanism, and a comprehensive testing mechanism. The withstand voltage testing mechanism is used to pick up electronic components from the solder transfer mechanism and position them to perform withstand voltage testing. After completion, the components are sequentially transferred to the interlayer testing mechanism and the comprehensive testing mechanism for testing.

8. The automated soldering test and assembly line for electronic components according to claim 7, characterized in that: The withstand voltage testing mechanism includes a withstand voltage testing material handling module, a withstand voltage testing module, and a withstand voltage defect sorting module. The withstand voltage testing material handling module is used to pick up electronic components from the solder transfer mechanism and transfer them to the withstand voltage testing module. The withstand voltage testing module includes a withstand voltage testing bracket, a withstand voltage testing lifting cylinder, a withstand voltage testing probe, a withstand voltage wire clamping drive cylinder, and a withstand voltage clamping plate, which are arranged opposite each other on both sides of the withstand voltage testing bracket. The withstand voltage testing lifting cylinder is mounted on the withstand voltage testing bracket, and the withstand voltage testing probe is mounted on the drive end of the withstand voltage testing lifting cylinder. The withstand voltage testing bracket has a withstand voltage testing slot above the withstand voltage testing probe. The withstand voltage testing material handling module picks up the electronic components and places them on the withstand voltage testing slot. The withstand voltage testing probe is used to contact the solder part of the electronic components and conduct a conductive withstand voltage test. During the test, the withstand voltage wire clamping drive cylinder is used to drive the withstand voltage clamping plate to clamp and fix the connecting wires of the electronic components to prevent the connecting wires from shaking. The withstand pressure test material handling module includes a withstand pressure material handling transmission module, a withstand pressure material handling lifting cylinder, and a withstand pressure gripping cylinder. The withstand pressure material handling lifting cylinder is mounted on the withstand pressure material handling transmission module, and the withstand pressure gripping cylinder is mounted on the withstand pressure material handling lifting cylinder for gripping electronic components. The withstand pressure defect sorting module is a conveying module and is located on one side of the withstand pressure test module.

9. The automated soldering test and assembly line for electronic components according to claim 7, characterized in that: The test transfer mechanism includes a test transfer transmission module and a test transfer material picking module. The test transfer transmission module is used to receive electronic components after being tested by the withstand voltage test mechanism and transfer the electronic components toward the interlayer test mechanism. The test transfer and material handling module includes a transfer traverse module and three sets of transfer gripping cylinders. The transfer traverse module is used to drive the three sets of transfer gripping cylinders to alternately move between the test transfer transmission module, the interlayer test mechanism and the integrated test mechanism. The interlayer testing mechanism includes an interlayer testing module and an interlayer defect sorting module. The interlayer testing module includes an interlayer testing bracket, an interlayer testing lifting cylinder, an interlayer testing probe, an interlayer wire clamping drive cylinder, and an interlayer clamping plate, which are arranged opposite each other on both sides of the interlayer testing bracket. The interlayer testing lifting cylinder is mounted on the interlayer testing bracket, and the interlayer testing probe is mounted on the drive end of the interlayer testing lifting cylinder. An interlayer testing slot is provided above the interlayer testing probe on the interlayer testing bracket. The testing transfer mechanism picks up electronic components and places them on the interlayer testing slot. The interlayer testing probe is used to contact the solder part of the electronic component and conduct conductive interlayer testing. During the test, the interlayer wire clamping drive cylinder is used to drive the interlayer clamping plate to clamp and fix the connecting wires of the electronic component to prevent the connecting wires from shaking. The interlayer defect sorting module is a conveying module and is located on one side of the interlayer testing module; The integrated testing mechanism includes an integrated testing module and an integrated defect sorting module. The integrated testing module includes an integrated testing bracket, an integrated testing lifting cylinder, an integrated testing probe, an integrated wire clamping drive cylinder, and an integrated clamping plate, all positioned opposite each other on either side of the integrated testing bracket. The integrated testing lifting cylinder is mounted on the integrated testing bracket, and the integrated testing probe is mounted on the drive end of the integrated testing lifting cylinder. The integrated testing bracket has an integrated testing slot located above the integrated testing probe. The testing transfer mechanism picks up electronic components and places them onto the integrated testing slot. The integrated testing probe is used to contact the solder portion of the electronic components and conduct conductive integrated testing. During the testing process, the integrated wire clamping drive cylinder drives the integrated clamping plate to clamp and fix the connecting wires of the electronic components, preventing the connecting wires from shaking. The integrated defect sorting module is a conveying module and is located on one side of the integrated testing module.

10. The automated soldering test and assembly line for electronic components according to claim 1, characterized in that: The assembly unit includes a feeding mechanism, a shell feeding mechanism, a marking mechanism, a pre-assembly mechanism, a transfer mechanism, a pressing mechanism, and a tray-stacking mechanism. The pre-assembly mechanism includes a pre-assembly rotating module, a rotating substrate, and two sets of pre-assembly clamping modules. The rotating substrate is mounted on the pre-assembly rotating module, and the two sets of pre-assembly clamping modules are positioned opposite each other on both sides of the rotating substrate. The shell feeding mechanism feeds shells toward the pre-assembly clamping modules. The pre-assembly rotating module drives the rotating substrate to rotate the pre-assembly clamping modules. The feeding mechanism receives and transfers electronic components from the testing unit into the shells on the pre-assembly clamping modules. The marking mechanism marks the shells from the shell feeding mechanism. The transfer mechanism picks up the shells after electronic component assembly and sequentially transfers them to the pre-assembly clamping modules, the pressing mechanism, and the tray-stacking mechanism. The pressing mechanism presses and fixes the electronic components inside the shells. The tray-stacking mechanism places the shells containing the electronic components onto a tray. The potting unit pots the potted electronic components after they have been placed on the tray. The outer shell feeding mechanism includes a direct vibration feeding track, an outer shell feeding gripping module, and a coding and positioning module; the direct vibration feeding track is used for direct vibration feeding of the outer shell, the outer shell feeding gripping module is used to grip the outer shell from the direct vibration feeding track and move it sequentially to the coding and positioning module and the pre-assembly clamping module, and the coding mechanism includes a laser coding machine for laser coding the outer shell on the coding and positioning module; The front end of the linear vibratory feeding track is provided with a shell positioning seat for positioning the shell at the front end. The shell feeding gripping module includes a shell gripping transmission module, a shell gripping lifting module, and a shell gripping module. Two sets of shell gripping modules are provided and are set on the shell gripping lifting module. The shell gripping lifting module is set on the shell gripping transmission module. The shell gripping module is used to grip the shell from the shell positioning seat and alternately place it in the coding positioning module and the pre-assembly clamping module.

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