Laser cutting apparatus and machining device

CN224688183UActive Publication Date: 2026-08-28SHENZHEN LEIWO AUTOMATION TECH CO LTD
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Patent Information

Application Number
CN202521866215.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-08-29
Publication Date
2026-08-28
Estimated Expiration
2035-08-29

AI Technical Summary

Technical Problem

但是,由于检测光路与工作平台不垂直,因此会导致检测到的物体投影发生变形,水平方向的投影产生压缩,从而使得检测到的切割位置与实际切割位置之间在水平方向存在偏差,进而影响了加工精度

Benefits of technology

[0033]本实用新型的技术方案通过在工作平台设置第一支撑座,并让激光机构和检测机构滑动设置在第一支撑座上,激光机构发出的第一路径激光和检测结构的检测光路呈夹角设置,同时第一路径激光经反射形成第二路径激光,第二路径激光和检测光路同轴设置,如此使得检测机构检测的切割位置与激光机构的实际切割位置重合,从而避免了误差。并且,检测光路沿垂直于工作平台所在平面的方向延伸,避免了检测时水平方向的投影发生变形,进一步保证了检测机构检测的切割位置与激光机构的实际切割位置重合,避免产生偏差,从而提升了加工精度。

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Abstract

The utility model discloses a kind of laser cutting device and processing equipment, it is related to automatic processing technical field, wherein, laser cutting device includes work platform, first support seat, laser mechanism and detection mechanism, first support seat is located in work platform, and it is set along first direction;Detection mechanism slidingly is located in first support seat, for forming the detection light path of detection cutting position, detection light path extends along the direction perpendicular to the plane where work platform is located;Laser mechanism slidingly is located in first support seat, and it is set apart with detection mechanism, laser mechanism is used to send cutting laser;Cutting laser has first path laser and second path laser, first path laser is sent from cutting mechanism, and it is set with detection light path at angle, first path laser reflection forms second path laser, second path laser is coaxially set with detection light path.The utility model aims to guarantee that the cutting position detected by detection mechanism coincides with the actual cutting position of laser mechanism, to improve processing quality.
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