A method, device and system for multi-point temperature correction of an array induction logging tool

Abstract

This invention provides a method, apparatus, and system for multi-point temperature correction of an array induction logging tool. The method includes: acquiring measurement signals from the array induction logging tool during temperature changes, the measurement signals being detected by a preset number of temperature sensors; constructing a temperature coefficient matrix for each temperature sensor based on the measurement signal, resulting in a preset number of temperature coefficient matrices; calculating a temperature correction coefficient matrix based on each temperature coefficient matrix; acquiring actual measurement signals from the array induction logging tool downhole, and performing temperature correction on the measured signals based on the temperature correction coefficient matrix. The multi-point temperature correction method for an array induction logging tool provided by this invention can calculate the temperature correction coefficient matrix based on the actual measurement signals and correct the measured signals based on the temperature correction coefficient matrix, thus avoiding errors caused by formation temperature changes and improving the accuracy and reliability of the array induction logging tool.

Description

Technical Field

[0001] This application relates to the field of logging equipment technology, and in particular to a multi-point temperature correction method, device and system for an array induction logging tool. Background Technology

[0002] Array induction logging tools can measure formation conductivity based on the principle of electromagnetic induction. Formation conductivity can be used to further quantitatively determine the invasion characteristics of the formation, provide a two-dimensional image of the formation, and determine the formation's oil saturation parameters. When the array induction logging tool is running, it emits an electromagnetic field around the wellbore via a transmitting coil. The formation responds to the electromagnetic field by generating an induced electromotive force (EMF). The receiving coil receives the induced EMF from the secondary field, and the formation conductivity is then calculated through calibration.

[0003] The direct-drive storage array induction logging tool uses a five-array coil probe to measure the electrical conductivity of complex formations downhole. Logging instruments typically operate in extremely high-temperature and high-pressure environments downhole. For example, during logging in deep wells above 3000 meters, the well temperature can change from ambient surface temperature to over 100°C. This temperature variation causes the measured data to deviate from the actual values, significantly affecting the stability, reliability, and quality of the logging curves.

[0004] The temperature effects on array induction logging tools are mainly due to circuit temperature drift and coil system temperature drift, as well as other complex influences.

[0005] Circuit temperature drift includes nonlinear temperature drift caused by high temperatures affecting electronic components such as resistors, capacitors, inductors, operational amplifiers, and filters. This type of temperature drift can affect the switching resistance of the circuit, the gain of the operational amplifier, and the filtering effect of the filter, thus affecting the accuracy of the final measurement results.

[0006] Coil system temperature drift mainly refers to the impact of thermal expansion of various components in the coil system probe, leading to changes in coil geometry and conductivity, on the measurement signal. A coil system probe includes a fiberglass mandrel, coil system, inner and outer shielding layers, various wiring components, a fiberglass shell, and an oil balance sub-section, among other components. The coil is fixed to the mandrel, which is immersed in silicone oil within the fiberglass cylinder. When the temperature changes, both the fiberglass mandrel and the coil expand, causing changes in the coil geometry and conductivity. Coil system temperature drift particularly affects the accuracy of the array induction sub-array. Summary of the Invention

[0007] This application relates to a multi-point temperature correction method, device, and system for an array induction logging tool, which can improve the accuracy and reliability of the array induction logging tool.

[0008] The technical solution is as follows:

[0009] On the one hand, a multi-point temperature correction method for an array induction logging tool is provided, the method comprising:

[0010] The array induction logging tool acquires measurement signals when the temperature changes, and the measurement signals are detected by a preset number of temperature sensors;

[0011] For each temperature sensor, a temperature coefficient matrix is ​​constructed based on the measurement signal, resulting in a preset number of temperature coefficient matrices;

[0012] Calculate the temperature correction coefficient matrix based on each of the aforementioned temperature coefficient matrices;

[0013] The measured signal of the array induction logging tool downhole is acquired, and the measured signal is temperature corrected based on the temperature correction coefficient matrix.

[0014] In some embodiments, the measurement signal includes a temperature rise measurement signal and a temperature fall measurement signal; acquiring the measurement signal of the array induction logging tool when the temperature changes includes:

[0015] The array induction logging tool is heated according to a preset heating rate, and the heating measurement signal during the heating process is acquired.

[0016] The array induction logging tool is cooled according to a preset cooling rate, and cooling measurement signals are acquired during the cooling process.

[0017] In some embodiments, the preset heating rate and the preset cooling rate are the same;

[0018] The step of heating the array induction logging tool according to a preset heating rate includes:

[0019] The temperature of the array induction logging instrument is raised from the initial room temperature to the preset target temperature according to the preset heating rate.

[0020] The step of cooling the array induction logging tool according to a preset cooling rate includes:

[0021] The temperature of the array induction logging instrument is reduced to room temperature according to the target temperature and the preset cooling rate.

[0022] In some embodiments, constructing a temperature coefficient matrix for each temperature sensor based on the measurement signal includes:

[0023] A linear expression for temperature is constructed based on the measured signal;

[0024] The temperature coefficient matrix is ​​constructed based on the linear temperature expression.

[0025] In some embodiments, the temperature linear expression includes:

[0026]

[0027] Where, Δσ T For changes in ambient temperature, T A T represents the measured temperature value on temperature sensor A. AB denoted as temperature difference between temperature sensor A and temperature sensor B; a0, a1, a2, a3, b1, b3, c1, and c3 are temperature correction coefficients; temperature sensor A can be any temperature sensor, and temperature sensor B can be any temperature sensor other than temperature sensor A.

[0028] In some embodiments, the temperature coefficient matrix includes:

[0029]

[0030] Where, Δσ Tm Let T be the m-th ambient temperature change value. mA Let [a0 a1…c3] be the m-th measured temperature value on temperature sensor A. T This is the temperature correction coefficient matrix.

[0031] In some embodiments, calculating the temperature correction coefficient matrix based on each of the temperature coefficient matrices includes:

[0032] The temperature correction coefficient matrix is ​​calculated based on each of the temperature coefficient matrices using numerical analysis.

[0033] On the other hand, a multi-point temperature correction device for an array induction logging tool is provided, the device comprising:

[0034] The measurement signal acquisition module is used to acquire the measurement signal of the array induction logging tool when the temperature changes. The measurement signal is detected by a preset number of temperature sensors.

[0035] The temperature coefficient matrix construction module is used to construct a temperature coefficient matrix for each temperature sensor based on the measurement signal, thereby obtaining a preset number of temperature coefficient matrices;

[0036] The solver module is used to calculate the temperature correction coefficient matrix based on each of the temperature coefficient matrices.

[0037] The calibration module is used to acquire the measured signal of the array induction logging tool downhole and perform temperature calibration on the measured signal based on the temperature calibration coefficient matrix.

[0038] In some embodiments, the measurement signal includes a temperature rise measurement signal and a temperature drop measurement signal;

[0039] The measurement signal acquisition module is specifically used for:

[0040] The array induction logging tool is heated according to a preset heating rate, and the heating measurement signal during the heating process is acquired.

[0041] The array induction logging tool is cooled according to a preset cooling rate, and cooling measurement signals are acquired during the cooling process.

[0042] In some embodiments, the preset heating rate and the cooling rate are the same;

[0043] The step of heating the array induction logging tool according to a preset heating rate includes:

[0044] The temperature of the array induction logging instrument is raised from the initial room temperature to the preset target temperature according to the preset heating rate.

[0045] The step of cooling the array induction logging tool according to a preset cooling rate includes:

[0046] The temperature of the array induction logging instrument is reduced to room temperature according to the target temperature and the preset cooling rate.

[0047] In some embodiments, the temperature coefficient matrix construction module is specifically used for:

[0048] A linear expression for temperature is constructed based on the measured signal;

[0049] The temperature coefficient matrix is ​​constructed based on the linear temperature expression.

[0050] The linear expression for temperature includes:

[0051]

[0052] Where, Δσ T For changes in ambient temperature, T A T represents the measured temperature value on temperature sensor A. AB denoted as temperature difference between temperature sensor A and temperature sensor B; a0, a1, a2, a3, b1, b3, c1, and c3 are temperature correction coefficients; temperature sensor A can be any temperature sensor, and temperature sensor B can be any temperature sensor other than temperature sensor A.

[0053] The temperature coefficient matrix includes:

[0054]

[0055] Where, Δσ Tm Let T be the m-th ambient temperature change value. mA Let [a0 a1…c3] be the m-th measured temperature value on temperature sensor A. T This is the temperature correction coefficient matrix.

[0056] In some embodiments, the solver module is specifically used for:

[0057] The temperature correction coefficients are calculated using numerical analysis based on each of the temperature coefficient matrices.

[0058] On the other hand, a computer device is provided, which includes a processor and a memory. The memory stores at least one instruction, at least one program, code set, or instruction set. The processor can load and execute at least one instruction, at least one program, code set, or instruction set to implement the above-mentioned multi-point temperature correction method for array induction logging tools.

[0059] On the other hand, a multi-point temperature correction system for an array induction logging tool is provided, including:

[0060] Heating and cooling equipment, a preset number of temperature sensors, a bracket, and the computer equipment described above;

[0061] The computer device is communicatively connected to the heating and cooling device and the temperature sensor, respectively.

[0062] The heating and cooling equipment is used to heat up and cool down the array induction logging tool to be calibrated.

[0063] The temperature sensor is used to acquire the measurement signal of the array induction logging tool and send the measurement signal to the computer device;

[0064] The bracket is used to support the array induction logging tool, so that the distance between the array induction logging tool and the ground is greater than a preset lower limit value.

[0065] On the other hand, a computer-readable storage medium is provided, which stores at least one instruction, at least one program, code set or instruction set, and a processor can load and execute at least one instruction, at least one program, code set or instruction set to implement the above-mentioned multi-point temperature correction method for array induction logging tools.

[0066] On the other hand, a computer program product or computer program is provided, the computer program product or computer program including computer program instructions stored in a computer-readable storage medium. A processor reads the computer instructions from the computer-readable storage medium and executes the computer instructions, causing the computer device to perform the aforementioned array induction logging tool multi-point temperature correction method.

[0067] The beneficial effects of the technical solution provided in this application include at least the following: This invention provides a multi-point temperature correction method for an array induction logging tool, comprising: acquiring measurement signals of the array induction logging tool during temperature changes, wherein the measurement signals are detected by a preset number of temperature sensors; for each temperature sensor, constructing a temperature coefficient matrix based on the measurement signal to obtain a preset number of temperature coefficient matrices; calculating a temperature correction coefficient matrix based on each temperature coefficient matrix; acquiring the measured signals of the array induction logging tool downhole, and performing temperature correction on the measured signals based on the temperature correction coefficient matrix. The multi-point temperature correction method for an array induction logging tool provided by this invention can calculate the temperature correction coefficient matrix based on the actual measurement signals and correct the measured signals based on the temperature correction coefficient matrix, thus avoiding errors caused by formation temperature changes and improving the accuracy and reliability of the array induction logging tool. Attached Figure Description

[0068] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0069] Figure 1 The illustration shows an experimental scenario of a multi-point temperature correction method for an array induction logging tool provided in an exemplary embodiment of this application;

[0070] Figure 2 This invention provides a schematic diagram of the coil system structure of a multi-point temperature correction method for an array induction logging tool according to an exemplary embodiment of this application.

[0071] Figure 3 This illustration shows a schematic diagram of the sensor installation position in a multi-point temperature correction method for an array induction logging tool provided in an exemplary embodiment of this application;

[0072] Figure 4 This illustration shows a schematic diagram of the implementation process of a multi-point temperature correction method for an array induction logging tool provided in an exemplary embodiment of this application;

[0073] Figure 5 This illustration shows an application effect diagram of a multi-point temperature correction method for an array induction logging tool provided in an exemplary embodiment of this application;

[0074] Figure 6 This illustration shows another application effect of a multi-point temperature correction method for an array induction logging tool provided in an exemplary embodiment of this application;

[0075] Figure 7This illustration shows a schematic diagram of the software interface for an array induction logging tool multi-point temperature correction method provided in an exemplary embodiment of this application;

[0076] Figure 8 This application shows a structural diagram of a multi-point temperature correction device for an array induction logging tool provided in an exemplary embodiment;

[0077] Figure 9 This illustration shows a schematic diagram of the structure of a computer device for a multi-point temperature correction method for an array induction logging tool provided in an exemplary embodiment of this application. Detailed Implementation

[0078] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0079] Example 1

[0080] Figure 1 The diagram illustrates an experimental scenario of the multi-point temperature correction method for an array induction logging tool according to an exemplary embodiment of the present invention.

[0081] See Figure 1 The hardware required for the experiment includes a non-inductive heating chamber, a heating voltage regulator, an automatic heating controller, heating wires, and connectors. Additionally, it includes terminal equipment such as a computer or processor for data processing and calculation, and a high-precision temperature sensor for acquiring temperature data.

[0082] The above-mentioned non-inductive heating box, heating pressure regulator, and automatic heating controller can realize automatic heating and temperature control, and adjust the temperature change rate of the array induction logging tool according to actual needs to ensure the stability and reliability of experimental data.

[0083] Specifically, the array induction logging tool is placed in a non-inductive heating box, which is a non-inductive liquid heating system. It mainly consists of heating equipment and acquisition control processing software, realizing automatic control of heating, cooling, and temperature adjustment, and completing timed data recording of heating and cooling.

[0084] The computer equipment is used to analyze and process the acquired experimental measurement data in order to realize the multi-point temperature compensation method of the array induction logging tool provided by the present invention.

[0085] In a specific example, the multi-point temperature compensation method of the array induction logging tool provided in the embodiments of the present invention is integrated into the data processing software. The data processing software can realize functions such as engineering value calculation, data acquisition point recording, graphic drawing, wellbore correction parameter calculation, and resistivity value calculation.

[0086] In a specific example, the experimental environment needs to be set up to collect measurement data during the heating and cooling process.

[0087] First, no metal objects or tools and equipment containing metal objects should be placed within 10 meters of the experimental environment, and the roof should also be made of wood to avoid interference from ferromagnetic materials.

[0088] Furthermore, the non-contact heating box needs to be supported by a wooden frame at a height of more than 1.5 meters above the ground, and a deep pit with a depth of 3 meters below the ground is required, with the surface of the pit covered with wooden flooring.

[0089] In addition, electromagnetic interference from external 20Hz frequency bands should be avoided within the test site area.

[0090] Furthermore, to avoid instability in measurement values ​​due to environmental changes, environmental conditions should be avoided during the equipment heating process.

[0091] During the test, the fully assembled array induction logging system was placed in a non-inductive heating system to reduce the impact of the environment on the instrument's baseline values ​​and the measurement lag caused by improper heating methods.

[0092] Figure 2 A schematic diagram of the coil system arrangement in an array induction logging tool according to an exemplary embodiment of the present invention is shown.

[0093] See Figure 2 In a specific example, the high-temperature and high-pressure array induction logging tool coil system includes five 3-coil subarrays, each of which includes one transmitting coil and two receiving coils. T represents the transmitting coil, R1, R2, R3, R4, and R5 represent the five receiving coils, and B1, B2, B3, B4, and B5 represent the five shielding coils.

[0094] Figure 3 A schematic diagram of the layout of a multi-point temperature sensor in an exemplary embodiment of the present invention is shown.

[0095] See Figure 3 The array induction logging tool includes multiple high-precision temperature sensors, which are respectively installed in the wiring slots of the internal skeleton of the five coil sub-arrays to measure the temperature changes of the array induction logging tool at different depths.

[0096] Figure 3 In the diagram, 1 is the subarray receiving coil, 2 is the subarray shielding coil, 3 is the subarray transmitting coil, and 4 is the temperature sensor.

[0097] Optionally, the number of temperature sensors in the wiring slots of the internal skeleton of the coil system subarray is 5.

[0098] In addition, temperature sensors with the same signal are also installed on the signal acquisition circuit and the signal processing channel circuit to measure the temperature change of the circuit board.

[0099] Based on the above experimental system, the temperature correction coefficient of the array induction logging tool provided in the embodiments of the present invention can be calculated to realize the temperature correction of the array induction logging tool.

[0100] Example 2:

[0101] The multi-point temperature correction method for array induction logging tools provided in this invention can calculate the temperature correction coefficient based on experimentally measured temperature data, and then perform temperature correction on the array induction logging tool based on the temperature correction coefficient.

[0102] Figure 4 A flowchart of a multi-point temperature correction method for an array induction logging tool provided in an exemplary embodiment of this application is shown.

[0103] See Figure 4 The multi-point temperature correction method for array induction logging tools provided in this application may include steps 101 to 104.

[0104] Step 101: Acquire the measurement signal of the array induction logging tool when the temperature changes. The measurement signal is obtained by a preset number of temperature sensors.

[0105] In some embodiments, the measurement signal includes a temperature rise measurement signal and a temperature drop measurement signal.

[0106] Step 101 may include:

[0107] The array induction logging tool is heated according to a preset heating rate, and the heating measurement signal is acquired during the heating process.

[0108] The array induction logging tool cools down according to a preset cooling rate, and the cooling measurement signal is acquired during the cooling process.

[0109] In some embodiments, the preset heating rate and the preset cooling rate are the same;

[0110] The step of heating the array induction logging tool according to a preset heating rate includes:

[0111] The temperature of the array induction logging instrument is raised from the initial room temperature to the preset target temperature according to the preset heating rate.

[0112] The step of cooling the array induction logging tool according to a preset cooling rate includes:

[0113] The temperature of the array induction logging instrument is reduced to room temperature according to the target temperature and the preset cooling rate.

[0114] Step 102: For each temperature sensor, construct a temperature coefficient matrix based on the measurement signal to obtain a preset number of temperature coefficient matrices.

[0115] In the following embodiments, for each temperature sensor, a temperature coefficient matrix is ​​constructed based on the measurement signal, including:

[0116] A linear expression for temperature is constructed based on the measured signal.

[0117] In some embodiments, the measurement signals include temperature change values, absolute temperature values, temperature change rates, temperature gradients, temperature differences, etc.

[0118] During the actual heating or cooling process of the array induction logging tool in downhole operation, different organisms and cooling rates will generate different temperature differences at the top, bottom, surface, and interior of the well, affecting the measurement results of the array induction logging tool. In order to perform comprehensive and accurate temperature correction, it is necessary to obtain comprehensive measurement signals to accurately reflect the changes in ambient temperature and instrument temperature.

[0119] Specifically, the linear expression for temperature includes:

[0120]

[0121] Where, Δσ T For changes in ambient temperature, T A T represents the measured temperature value on temperature sensor A. AB denoted as temperature difference between temperature sensor A and temperature sensor B; a0, a1, a2, a3, b1, b3, c1, and c3 are temperature correction coefficients; temperature sensor A can be any temperature sensor, and temperature sensor B can be any temperature sensor other than temperature sensor A.

[0122] The temperature coefficient matrix is ​​constructed based on the linear temperature expression.

[0123] Specifically, the temperature coefficient matrix includes:

[0124]

[0125] Where, Δσ Tm Let T be the m-th ambient temperature change value. mA Let [a0 a1…c3] be the m-th measured temperature value on temperature sensor A. T This is the temperature correction coefficient matrix.

[0126] Step 103: Calculate the temperature correction coefficient matrix based on each of the temperature coefficient matrices.

[0127] In some embodiments, step 103 includes:

[0128] The temperature correction coefficient matrix is ​​calculated based on each of the temperature coefficient matrices using numerical analysis.

[0129] Step 104: Obtain the measured signal of the array induction logging tool downhole, and perform temperature correction on the measured signal based on the temperature correction coefficient matrix.

[0130] Specifically, the temperature correction coefficient matrix is ​​constructed as a parameter file. When the instrument is performing field logging, this correction coefficient can be used to perform real-time temperature correction on the logging data, thereby achieving multi-point temperature compensation of the array induction logging tool's measurement signal.

[0131] In some embodiments, the above methods are integrated into logging software. When applied, the actual logging measurements are input into the logging software for temperature correction calculation, thereby reducing instrument deviation and improving the reliability of the array induction logging tool.

[0132] The multi-point temperature correction method for array induction logging tools provided in this invention is based on complete temperature rise and fall data. It constructs multiple temperature coefficient matrices based on multi-point temperature sensor measurement data, calculates temperature correction coefficient matrices from these matrices, and then corrects the test data based on these coefficient matrices. The correction coefficient matrix calculated in this invention conforms to the actual conditions of array induction logging tools, effectively avoiding errors caused by temperature drift, improving the accuracy and reliability of array induction logging tools, and demonstrating strong adaptability and ease of implementation.

[0133] Example 3

[0134] Taking an actual experimental process as an example, this paper further illustrates the implementation process and effect of the array induction logging tool temperature correction method provided in this application.

[0135] First, set up the necessary experimental site and hardware / software equipment for testing.

[0136] In a specific example, see Figure 1 The hardware required for the experiment includes a non-inductive heating chamber, a heating voltage regulator, an automatic heating controller, heating wires, and connectors. Additionally, it includes terminal equipment such as a computer or processor for data processing and calculation, and a high-precision temperature sensor for acquiring temperature data.

[0137] The above-mentioned non-inductive heating box, heating pressure regulator, and automatic heating controller can realize automatic heating and temperature control, and adjust the temperature change rate of the array induction logging tool according to actual needs to ensure the stability and reliability of experimental data.

[0138] Specifically, the array induction logging tool is placed in a non-inductive heating box, which is a non-inductive liquid heating system. It mainly consists of heating equipment and acquisition control processing software, realizing automatic control of heating, cooling, and temperature adjustment, and completing timed data recording of heating and cooling.

[0139] The computer equipment is used to analyze and process the acquired experimental measurement data in order to realize the multi-point temperature compensation method of the array induction logging tool provided by the present invention.

[0140] In a specific example, the multi-point temperature compensation method of the array induction logging tool provided in the embodiments of the present invention is integrated into the data processing software. The data processing software can realize functions such as engineering value calculation, data acquisition point recording, graphic drawing, wellbore correction parameter calculation, and resistivity value calculation.

[0141] In a specific example, the experimental environment needs to be set up to collect measurement data during the heating and cooling process.

[0142] First, no metal objects or tools and equipment containing metal objects should be placed within 10 meters of the experimental environment, and the roof should also be made of wood to avoid interference from ferromagnetic materials.

[0143] Furthermore, the non-contact heating box needs to be supported by a wooden frame at a height of more than 1.5 meters above the ground, and a deep pit with a depth of 3 meters below the ground is required, with the surface of the pit covered with wooden flooring.

[0144] In addition, electromagnetic interference from external 20Hz frequency bands must be strictly avoided within the test site area.

[0145] Furthermore, to avoid instability in measurement values ​​due to environmental changes, environmental conditions should be avoided during the equipment heating process.

[0146] During the test, the fully assembled array induction logging system was placed in a non-inductive heating system to reduce the impact of the environment on the instrument's baseline values ​​and the measurement lag caused by improper heating methods.

[0147] See Figure 2 In a specific example, the high-temperature and high-pressure array induction logging tool coil system consists of five 3-coil subarrays, each consisting of one transmitting coil and two receiving coils. T represents the transmitting coil, R1, R2, R3, R4, and R5 represent the five receiving coils, and B1, B2, B3, B4, and B5 represent the five shielding coils.

[0148] See Figure 3 The array induction logging tool includes multiple high-precision temperature sensors, which are respectively installed in the wiring slots of the internal skeleton of the five coil sub-arrays to measure the temperature changes of the array induction logging tool at different depths.

[0149] Figure 3 In the diagram, 1 is the subarray receiving coil, 2 is the subarray shielding coil, 3 is the subarray transmitting coil, and 4 is the temperature sensor.

[0150] Optionally, the number of sensors in the wiring slots of the internal skeleton of the coil system subarray is 5.

[0151] In addition, temperature sensors with the same signal are also installed on the signal acquisition circuit and the signal processing channel circuit to measure the temperature change of the circuit board.

[0152] Once the experimental equipment and environment are set up, the experiment can be conducted to calculate the temperature correction coefficient matrix.

[0153] See Figure 4 The multi-point temperature correction method for array induction logging tools provided in this application may include steps 101 to 104.

[0154] Step 101: Acquire the measurement signal of the array induction logging tool when the temperature changes. The measurement signal is obtained by a preset number of temperature sensors.

[0155] In some embodiments, the measurement signal includes a temperature rise measurement signal and a temperature drop measurement signal.

[0156] Step 101 may include:

[0157] The array induction logging tool is heated according to a preset heating rate, and the heating measurement signal is acquired during the heating process.

[0158] The array induction logging tool cools down according to a preset cooling rate, and the cooling measurement signal is acquired during the cooling process.

[0159] In some embodiments, the preset heating rate and the cooling rate are the same;

[0160] The step of heating the array induction logging tool according to a preset heating rate includes:

[0161] The temperature of the array induction logging instrument is raised from the initial room temperature to the preset target temperature according to the preset heating rate.

[0162] The step of cooling the array induction logging tool according to a preset cooling rate includes:

[0163] The temperature of the array induction logging instrument is reduced to room temperature according to the target temperature and the preset cooling rate.

[0164] In a specific example, the preset heating rate includes 1℃ / min, and the preset cooling rate includes 1℃ / min.

[0165] The array induction logging tool is heated according to a preset heating rate, including:

[0166] The temperature of the array induction logging instrument is raised to 200°C from the initial room temperature according to the preset heating rate.

[0167] The array induction logging tool is cooled according to a preset cooling rate, including:

[0168] The temperature of the array induction logging instrument is reduced to room temperature at a preset cooling rate from 200°C.

[0169] Step 102: For each temperature sensor, construct a temperature coefficient matrix based on the measurement signal to obtain a preset number of temperature coefficient matrices.

[0170] In the following embodiments, for each temperature sensor, a temperature coefficient matrix is ​​constructed based on the measurement signal, including:

[0171] A linear expression for temperature is constructed based on the measured signal.

[0172] In some embodiments, the measurement signals include temperature change values, absolute temperature values, temperature change rates, temperature gradients, temperature differences, etc.

[0173] During the actual heating or cooling process of the array induction logging tool in downhole operation, different organisms and cooling rates will generate different temperature differences at the top, bottom, surface, and interior of the well, affecting the measurement results of the array induction logging tool. In order to perform comprehensive and accurate temperature correction, it is necessary to obtain comprehensive measurement signals to accurately reflect the changes in ambient temperature and instrument temperature.

[0174] Specifically, the linear expression for temperature includes:

[0175]

[0176] Where, Δσ T For changes in ambient temperature, T A T represents the measured temperature value on temperature sensor A. AB t represents the temperature difference between temperature sensor A and temperature sensor B; a0, a1, a2, a3, b1, b3, c1, and c3 are temperature correction coefficients; temperature sensor A is any temperature sensor, temperature sensor B is any temperature sensor other than temperature sensor A, and t is time.

[0177] The temperature coefficient matrix is ​​constructed based on the linear temperature expression.

[0178] Specifically, the temperature coefficient matrix includes:

[0179]

[0180] Where, Δσ Tm Let T be the m-th ambient temperature change value. mA Let [a0 a1…c3] be the m-th measured temperature value on temperature sensor A. T This is the temperature correction coefficient matrix.

[0181] Step 103: Calculate the temperature correction coefficient matrix based on each of the temperature coefficient matrices.

[0182] In some embodiments, step 103 includes:

[0183] The temperature correction coefficient matrix is ​​calculated based on each of the temperature coefficient matrices using numerical analysis.

[0184] Step 104: Obtain the measured signal of the array induction logging tool downhole, and perform temperature correction on the measured signal based on the temperature correction coefficient matrix.

[0185] Specifically, the temperature correction coefficient matrix is ​​constructed as a parameter file. When the instrument is performing field logging, this correction coefficient can be used to perform real-time temperature correction on the logging data, thereby achieving multi-point temperature compensation of the array induction logging tool's measurement signal.

[0186] In some embodiments, the above methods are integrated into logging software. When applied, the actual logging measurements are input into the logging software for temperature correction calculation, thereby reducing instrument deviation and improving the reliability of the array induction logging tool.

[0187] Figure 5 The diagram illustrates the effect of the multi-point file correction method for array induction logging tools provided in this embodiment of the invention.

[0188] Figure 5 middle, Figure 5 In the diagram, the solid line represents the original conductivity curve, the dashed line represents the conductivity curve after temperature correction, the lower set of curves represents the heating process curve, and the upper set of curves represents the cooling process curve.

[0189] Depend on Figure 5 It can be seen that the multi-point temperature correction method for array induction logging tools provided in this embodiment of the invention can perform temperature correction on the formation conductivity detected by the array induction logging tool.

[0190] Figure 6 This diagram illustrates another effect of the multi-point temperature correction method for array induction logging tools provided in this embodiment of the invention.

[0191] Figure 6 In the figure, the curve represents the conductivity correction baseline value provided in the embodiment of the present invention, the upper curve represents the correction baseline value during the cooling process, and the lower curve represents the correction baseline value during the heating process.

[0192] See Figure 6 The calibrated instrument measurement baseline values ​​meet actual needs and can avoid errors in the array induction logging tool caused by temperature changes.

[0193] The multi-point temperature correction method for array induction logging tools provided in this invention can keep the data error after correction within ±1 mS / m, prevent errors caused by temperature deviation in the measured values ​​during high-temperature logging, enable array induction logging tools to obtain better logging results in high-temperature and high-pressure wells and high-resistivity formations, and improve the reliability and accuracy of the instrument.

[0194] Example 4

[0195] Figure 7 This diagram illustrates the software interface of the multi-point temperature correction method for array induction logging tools provided in this embodiment of the invention.

[0196] In a specific example, the heating device is used to realize the automatic control of the heating process, and the data acquisition and processing software is used to complete the data recording and temperature compensation correction calculation process.

[0197] Specifically, the software provided in this embodiment of the invention can be used for engineering value calculation, data acquisition point recording, line graph-K plotting, wellbore correction parameter calculation, resistivity value calculation, etc. It can acquire the required data for processing and calculation based on auxiliary tools such as coil subarray transmitter and receiver signal acquisition systems, temperature control systems, automatic recording systems, and historical data management systems.

[0198] Optionally, the software operating frequency provided in the embodiments of the present invention may include 10KHz, 20KHz, 40KHz, as in Embodiment 5.

[0199] Figure 8 A schematic diagram of the multi-point temperature correction device for an array induction logging tool is shown. See also... Figure 8 The array induction logging tool multi-point temperature correction device provided in this embodiment of the invention may include modules 201 to 204.

[0200] The measurement signal acquisition module 201 is used to acquire the measurement signal of the array induction logging tool when the temperature changes. The measurement signal is detected by a preset number of temperature sensors.

[0201] The temperature coefficient matrix construction module 202 is used to construct a temperature coefficient matrix for each temperature sensor based on the measurement signal, thereby obtaining a preset number of temperature coefficient matrices;

[0202] Solver module 203 is used to calculate the temperature correction coefficient matrix based on each of the temperature coefficient matrices;

[0203] The calibration module 204 is used to acquire the measured signal of the array induction logging tool downhole and perform temperature correction on the measured signal based on the temperature correction coefficient matrix.

[0204] In some embodiments, the measurement signal includes a temperature rise measurement signal and a temperature drop measurement signal;

[0205] The measurement signal acquisition module 201 is specifically used for:

[0206] The array induction logging tool is heated according to a preset heating rate, and the heating measurement signal during the heating process is acquired.

[0207] The array induction logging tool cools down according to a preset cooling rate, and the cooling measurement signal is acquired during the cooling process.

[0208] In some embodiments, the preset heating rate and the preset cooling rate are the same;

[0209] The step of heating the array induction logging tool according to a preset heating rate includes:

[0210] The temperature of the array induction logging instrument is raised from the initial room temperature to the preset target temperature according to the preset heating rate.

[0211] The step of cooling the array induction logging tool according to a preset cooling rate includes:

[0212] The temperature of the array induction logging instrument is reduced to room temperature according to the target temperature and the preset cooling rate.

[0213] In some embodiments, the temperature coefficient matrix construction module 202 is specifically used for:

[0214] A linear expression for temperature is constructed based on the measured signal;

[0215] The temperature coefficient matrix is ​​constructed based on the linear temperature expression.

[0216] The linear expression for temperature includes:

[0217]

[0218] Where, Δσ T For changes in ambient temperature, T A T represents the measured temperature value on temperature sensor A. AB denoted as temperature difference between temperature sensor A and temperature sensor B; a0, a1, a2, a3, b1, b3, c1, and c3 are temperature correction coefficients; temperature sensor A can be any temperature sensor, and temperature sensor B can be any temperature sensor other than temperature sensor A.

[0219] The temperature coefficient matrix includes:

[0220]

[0221] Where, Δσ Tm Let T be the m-th ambient temperature change value. mA Let [a0 a1…c3] be the m-th measured temperature value on temperature sensor A. T This is the temperature correction coefficient matrix.

[0222] In some embodiments, the solving module 203 is specifically used for:

[0223] The temperature correction coefficients are calculated using numerical analysis based on each of the temperature coefficient matrices.

[0224] The multi-point temperature correction device for array induction logging tools provided in this invention can calculate the temperature correction coefficient based on the actual measurement signal and correct the measured signal based on the temperature correction coefficient, thereby avoiding errors caused by formation temperature changes and improving the accuracy and reliability of array induction logging tools.

[0225] It should be noted that the array induction logging tool multi-point temperature correction device provided in the above embodiments is only an example of the division of the above functional modules. In actual applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the equipment can be divided into different functional modules to complete all or part of the functions described above.

[0226] Example 6

[0227] Figure 9 This illustration shows a schematic diagram of a computer device for a multi-point temperature correction method for an array induction logging tool provided in an exemplary embodiment of this application. The computer device includes:

[0228] The processor 301 includes one or more processing cores. The processor 301 executes various functional applications and data processing by running software programs and modules.

[0229] The receiver 302 and transmitter 303 can be implemented as a communication component, which can be a communication chip. Optionally, this communication component can include signal transmission functionality. That is, the transmitter 303 can be used to transmit control signals to the image acquisition device and the scanning device, and the receiver 302 can be used to receive corresponding feedback commands.

[0230] The memory 304 is connected to the processor 301 via the bus 305.

[0231] The memory 304 can be used to store at least one instruction, and the processor 301 is used to execute the at least one instruction to implement steps 101 to 104 in the above method embodiments.

[0232] Step 101: Acquire the measurement signal of the array induction logging tool when the temperature changes. The measurement signal is obtained by a preset number of temperature sensors.

[0233] In some embodiments, the measurement signal includes a temperature rise measurement signal and a temperature drop measurement signal.

[0234] Step 101 may include:

[0235] The array induction logging tool is heated according to a preset heating rate, and the heating measurement signal is acquired during the heating process.

[0236] The array induction logging tool cools down according to a preset cooling rate, and the cooling measurement signal is acquired during the cooling process.

[0237] In some embodiments, the preset heating rate and the preset cooling rate are the same;

[0238] The step of heating the array induction logging tool according to a preset heating rate includes:

[0239] The temperature of the array induction logging instrument is raised from the initial room temperature to the preset target temperature according to the preset heating rate.

[0240] The step of cooling the array induction logging tool according to a preset cooling rate includes:

[0241] The temperature of the array induction logging instrument is reduced to room temperature according to the target temperature and the preset cooling rate.

[0242] Step 102: For each temperature sensor, construct a temperature coefficient matrix based on the measurement signal to obtain a preset number of temperature coefficient matrices.

[0243] In the following embodiments, for each temperature sensor, a temperature coefficient matrix is ​​constructed based on the measurement signal, including:

[0244] A linear expression for temperature is constructed based on the measured signal.

[0245] In some embodiments, the measurement signals include temperature change values, absolute temperature values, temperature change rates, temperature gradients, temperature differences, etc.

[0246] During the actual heating or cooling process of the array induction logging tool in downhole operation, different organisms and cooling rates will generate different temperature differences at the top, bottom, surface, and interior of the well, affecting the measurement results of the array induction logging tool. In order to perform comprehensive and accurate temperature correction, it is necessary to obtain comprehensive measurement signals to accurately reflect the changes in ambient temperature and instrument temperature.

[0247] Step 103: Calculate the temperature correction coefficient matrix based on each of the temperature coefficient matrices.

[0248] In some embodiments, step 103 includes:

[0249] The temperature correction coefficient matrix is ​​calculated based on each of the temperature coefficient matrices using numerical analysis.

[0250] Step 104: Obtain the measured signal of the array induction logging tool downhole, and perform temperature correction on the measured signal based on the temperature correction coefficient matrix.

[0251] Example 7

[0252] This application also provides a multi-point temperature correction system for an array induction logging tool, including:

[0253] Heating and cooling equipment, a preset number of temperature sensors, a bracket, and the computer equipment described above;

[0254] The computer device is communicatively connected to the heating and cooling device and the temperature sensor, respectively.

[0255] The heating and cooling equipment is used to heat up and cool down the array induction logging tool to be calibrated.

[0256] The temperature sensor is used to acquire the measurement signal of the array induction logging tool and send the measurement signal to the computer device;

[0257] The bracket is used to support the array induction logging tool, so that the distance between the array induction logging tool and the ground is greater than a preset lower limit value.

[0258] Example 8

[0259] This application also provides a computer-readable storage medium storing at least one instruction, at least one program, code set, or instruction set, which can be loaded and executed by a processor to implement steps 101 to 104 of the above-described array induction logging tool multi-point temperature correction method.

[0260] Example 9

[0261] This application also provides a computer program product or computer program that includes computer instructions stored in a computer-readable storage medium. A processor of a computer device reads the computer instructions from the computer-readable storage medium and executes the computer instructions, causing the computer device to perform the multi-point temperature correction method for the array induction logging tool described in any of the above embodiments.

[0262] Optionally, the computer-readable storage medium may include: read-only memory (ROM), random access memory (RAM), solid-state drives (SSDs), or optical discs, etc. The random access memory may include resistive random access memory (ReRAM) and dynamic random access memory (DRAM). The sequence numbers of the embodiments described above are for descriptive purposes only and do not represent the superiority or inferiority of the implementation.

[0263] Those skilled in the art will understand that all or part of the steps of the above embodiments can be implemented by hardware or by a program instructing related hardware. The program can be stored in a computer-readable storage medium, such as a read-only memory, a disk, or an optical disk.

[0264] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0265] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0266] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0267] In the embodiments provided by this invention, it should be understood that the disclosed apparatus / terminal devices and methods can be implemented in other ways. For example, the apparatus / terminal device embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices or units may be electrical, mechanical, or other forms.

[0268] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0269] Furthermore, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0270] If the integrated module / unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments of the present invention can also be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when executed by a processor, it can implement the steps of the various method embodiments described above. The above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A multi-point temperature correction method for an array induction logging tool, characterized in that, The method includes: The array induction logging tool acquires measurement signals when the temperature changes, and the measurement signals are detected by a preset number of temperature sensors; For each temperature sensor, a temperature coefficient matrix is ​​constructed based on the measurement signal, resulting in a preset number of temperature coefficient matrices; Calculate the temperature correction coefficient matrix based on each of the aforementioned temperature coefficient matrices; Acquire the measured signal of the array induction logging tool downhole, and perform temperature correction on the measured signal based on the temperature correction coefficient matrix; The measurement signals include heating measurement signals and cooling measurement signals; acquiring the measurement signals of the array induction logging tool during temperature changes includes: The array induction logging tool is heated according to a preset heating rate, and the heating measurement signal during the heating process is acquired. The array induction logging instrument is cooled according to a preset cooling rate, and cooling measurement signals are acquired during the cooling process. For each temperature sensor, a temperature coefficient matrix is ​​constructed based on the measurement signal, including: A linear expression for temperature is constructed based on the measured signal; Construct the temperature coefficient matrix based on the aforementioned linear temperature expression; The linear expression for temperature includes: in, Due to changes in ambient temperature, The measured temperature value on temperature sensor A. denoted as temperature difference between temperature sensor A and temperature sensor B; a0, a1, a2, a3, b1, b3, c1, and c3 are temperature correction coefficients; temperature sensor A can be any temperature sensor, and temperature sensor B can be any temperature sensor other than temperature sensor A.

2. The method according to claim 1, characterized in that, The preset heating rate and the preset cooling rate are the same; The step of heating the array induction logging tool according to a preset heating rate includes: The temperature of the array induction logging instrument is raised from the initial room temperature to the preset target temperature according to the preset heating rate. The step of cooling the array induction logging tool according to a preset cooling rate includes: The temperature of the array induction logging instrument is reduced to room temperature according to the target temperature and the preset cooling rate.

3. The method according to claim 1, characterized in that, The temperature coefficient matrix includes: in, Let m be the m-th ambient temperature change value. For the m-th measured temperature value on temperature sensor A, [ … T is the temperature correction coefficient matrix.

4. The method according to claim 1, characterized in that, The calculation of the temperature correction coefficient matrix based on each of the temperature coefficient matrices includes: The temperature correction coefficient matrix is ​​calculated based on each of the temperature coefficient matrices using numerical analysis.

5. A multi-point temperature correction device for an array induction logging tool used to implement the multi-point temperature correction method for any one of claims 1-4, characterized in that, The device includes: The measurement signal acquisition module is used to acquire the measurement signal of the array induction logging tool when the temperature changes. The measurement signal is detected by a preset number of temperature sensors. The temperature coefficient matrix construction module is used to construct a temperature coefficient matrix for each temperature sensor based on the measurement signal, thereby obtaining a preset number of temperature coefficient matrices; The solver module is used to calculate the temperature correction coefficient matrix based on each of the temperature coefficient matrices. The calibration module is used to acquire the measured signal of the array induction logging tool downhole and perform temperature calibration on the measured signal based on the temperature calibration coefficient matrix.

6. A computer device, characterized in that, The computer device includes a processor and a memory, wherein the memory stores at least one instruction, at least one program, code set, or instruction set, and the at least one instruction, at least one program, code set, or instruction set is loaded and executed by the processor to implement the multi-point temperature correction method for array induction logging tools as described in any one of claims 1 to 4.

7. A multi-point temperature correction system for an array induction logging tool, characterized in that, include: The heating and cooling device, a preset number of temperature sensors, a bracket, and the computer equipment as described in claim 6; The computer device is communicatively connected to the heating and cooling device and the temperature sensor, respectively. The heating and cooling equipment is used to heat up and cool down the array induction logging tool to be calibrated. The temperature sensor is used to acquire the measurement signal of the array induction logging tool and send the measurement signal to the computer device; The bracket is used to support the array induction logging tool, so that the distance between the array induction logging tool and the ground is greater than a preset lower limit value.

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