Packaging structure of optical sensor and electronic device

CN224698210UActive Publication Date: 2026-08-28GUANGDONG GUOFENG SEMICON CO LTD
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Patent Information

Application Number
CN202522287863.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-10-29
Publication Date
2026-08-28
Estimated Expiration
2035-10-29

AI Technical Summary

Technical Problem

[0004]有鉴于此，本申请实施例提供一种光学传感器的封装结构及电子设备，可以有效解决现有技术中DIP封装器件带来的印刷电路板整体尺寸较大，且生产效率低等问题

Benefits of technology

本申请的光学传感器的封装结构包括：光学传感器芯片、引线框架和盖体；光学传感器芯片通过第一介质层固定于引线框架的基岛上，光学传感器芯片的各个引脚通过键合线与引线框架的管脚组对应管脚的第一端连接；管脚组的第二端自引线框架的侧面伸出并向外弯折，形成海鸥翼形引脚；引线框架上设置有第一凹槽，盖体嵌设于第一凹槽内。本申请通过将光学传感器芯片经第一介质层固定于引线框架的基岛上，并利用键合线实现芯片引脚与管脚组的电连接，配合海鸥翼形引脚的设计，不仅实现了传感器的稳定电气连接与机械支撑，还实现了SOP封装，具有较小的封装尺寸和优良的表面贴装兼容性，有利于在印刷电路板上的自动化焊接与空间节省，提升了组装效率和产品可靠性；同时，利用引线框架形成第一凹槽并嵌设盖体，既保护了光学传感器芯片上方的光敏区域，确保光线的有效透过，又提升了引线框架与盖体之间的结合密封性，有效防止外界环境对芯片造成污染或损伤，提高了器件的光学性能稳定性、环境适应性和长期可靠性。

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Abstract

The application relates to the technical field of sensor packaging, and discloses a packaging structure of an optical sensor and electronic equipment, wherein the packaging structure of the optical sensor comprises an optical sensor chip, a lead frame and a cover body; the optical sensor chip is fixed on a base island of the lead frame through a first medium layer, and each pin of the optical sensor chip is connected with a first end of a corresponding pin of a pin group of the lead frame through a bonding wire; a second end of the pin group is bent outward from a side surface of the lead frame, and forms a seagull wing-shaped pin; a first groove is arranged on the lead frame, and the cover body is embedded in the first groove. The application realizes SOP packaging, ensures effective light transmission through the cover body, and improves the reliability of the device.
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Claims

1. A packaging structure for an optical sensor, characterized in that, include: Optical sensor chip, lead frame, and cover; The optical sensor chip is fixed to the base island of the lead frame through a first dielectric layer, and each pin of the optical sensor chip is connected to the first end of the corresponding pin of the lead frame through a bonding wire. The second end of the pin group extends from the side of the lead frame and bends outward to form a gull-wing shaped pin; The lead frame is provided with a first groove, and the cover is embedded in the first groove.

2. The packaging structure of the optical sensor according to claim 1, characterized in that, The outer contour of the cover is adapted to the shape of the inner wall of the first groove.

3. The packaging structure of the optical sensor according to claim 1, characterized in that, The upper surface of the lead frame is flush with the upper surface of the cover.

4. The packaging structure of the optical sensor according to claim 1, characterized in that, The cover has an opening.

5. The packaging structure of the optical sensor according to claim 4, characterized in that, The vertical projection of the opening covers the photosensitive area of ​​the optical sensor chip.

6. The packaging structure of the optical sensor according to claim 1, characterized in that, The encapsulation structure further includes a second dielectric layer, and the cover is fixed in the first groove through the second dielectric layer.

7. The packaging structure of the optical sensor according to claim 4, characterized in that, The encapsulation structure further includes a thin film layer that covers the opening of the cover.

8. The packaging structure of the optical sensor according to claim 7, characterized in that, A second groove is provided at the edge of the upper surface of the cover.

9. The packaging structure of the optical sensor according to claim 1, characterized in that, The pin group includes 8 pins.

10. An electronic device, characterized in that, The electronic device includes the packaging structure of the optical sensor as described in any one of claims 1-9.