Semiconductor solder filling apparatus

Abstract

The utility model provides a kind of semiconductor solder filling device belongs to semiconductor technical field, including processing box, the outside of the processing box is provided with cooling assembly for the quick cooling of semiconductor, the inside of the processing box is provided with clamping semiconductor and facilitating solder filling clamping assembly.The utility model is provided with cooling assembly, when using, air cooler will outside air be sucked in and be cooled to form cool wind, and the cool wind is transported into cooling box by transport pipe, by the angle of baffle, the flow direction and distribution of cool wind can be effectively controlled, so that the cool wind is evenly blown to the semiconductor that completes solder filling in processing box, to speed up the heat loss of semiconductor surface, realize the effect of rapid cooling, reduce the temperature of semiconductor to safety range in shorter time, effectively shorten production cycle, improve overall production efficiency.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and more specifically, to a semiconductor solder filling device. Background Technology

[0002] Semiconductors are special materials that can be precisely controlled in various ways to achieve conductivity or non-conductivity. In the semiconductor manufacturing process, solder filling is a key step in the packaging process. The main function of solder is to connect the chip to the substrate, ensuring the transmission of electrical signals and heat dissipation performance. Solder not only needs to have good conductivity, but also needs to have a high melting point, excellent mechanical strength and chemical stability to meet the usage requirements in various working environments.

[0003] The existing technology still has the following drawbacks: (1) After the semiconductor solder is filled, the time required for natural cooling is long, making it difficult to reduce the temperature of the semiconductor to a safe range in a short time. This will not only significantly extend the production cycle and reduce production efficiency, but may also have a potential adverse effect on the performance and structural stability of the semiconductor due to the long-term high temperature state.

[0004] (2) Existing devices lack effective clamping devices, and semiconductors are prone to displacement during solder filling, affecting the filling quality. To address this, a semiconductor solder filling device is proposed. Utility Model Content

[0005] The purpose of this invention is to address the problem that after semiconductor solder filling, the natural cooling time is too long, making it difficult to reduce the semiconductor temperature to a safe range in a short time. This not only significantly extends the production cycle and reduces production efficiency, but may also have potential adverse effects on the performance and structural stability of the semiconductor due to prolonged high temperature. The invention provides a semiconductor solder filling device to solve the problems mentioned in the background art.

[0006] To achieve the above-mentioned objectives, this utility model provides the following technical solution: The present invention is as follows: a semiconductor solder filling device, including a processing box, wherein the outside of the processing box is provided with a cooling component for rapidly cooling the semiconductor, and the inside of the processing box is provided with a clamping component for clamping the semiconductor to facilitate solder filling; The cooling assembly includes a cooler fan fixedly installed on the outer wall of the processing chamber. A transport pipe is installed at the output end of the cooler fan, and a cooling box is fixedly connected to the other end of the transport pipe. The cooling box is bolted to one side of the processing chamber and extends into the interior of the processing chamber. Multiple sets of guide plates are rotatably connected to the inner side wall of the cooling box.

[0007] As a preferred technical solution of this utility model, the clamping assembly includes a base plate slidably connected to the inner side wall of the processing box. Two sets of guide strips are symmetrically bolted to the top of the base plate. A movable seat is slidably connected to each of the two sets of guide strips. A wedge block is bolted to the top of the movable seat. A driving component is fixedly connected to one side of the movable seat, and a transmission component is bolted to the other side of the movable seat. Two sets of heating plates are symmetrically bolted to the base plate. The movable seat is located between the two sets of heating plates, and the top of the heating plate and the top of the movable seat are at the same horizontal plane.

[0008] As a preferred technical solution of this utility model, the driving component includes a support plate symmetrically bolted to the top of the base plate, and a telescopic cylinder is fixedly installed at the other end of the support plate. The telescopic cylinder is located above two sets of guide bars, and the output end of the telescopic cylinder is bolted to the side wall of the movable seat.

[0009] As a preferred technical solution of this utility model, the transmission component includes a column bolted to the top of the base plate, the column being located between two sets of guide bars, a gear being rotatably connected to the column, and a rack being bolted to one side of the movable seat, the rack meshing with the gear.

[0010] As a preferred technical solution of this utility model, two sets of protrusions are fixedly connected to the bottom of the base plate, and a sliding groove is opened on the inner bottom wall of the processing box corresponding to the protrusions. A sealing door is hinged to one side of the processing box, and the sealing door is located on one side of the base plate.

[0011] As a preferred technical solution of this utility model, a filling gun is bolted to the inner top wall of the processing box, and the filling gun is located above the two sets of hot plates.

[0012] As a preferred technical solution of this utility model, an observation plate is embedded in the side wall of the processing box, and a sealing strip is bonded to the connection between the observation plate and the processing box.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: 1. With the cooling components in place, the air cooler draws in outside air and cools it to form cold air. The cold air is then transported to the cooling box through a conveyor pipe. By adjusting the angle of the guide plate, the direction and distribution of the cold air can be effectively controlled, allowing the cold air to be blown evenly onto the semiconductors that have been filled with solder in the processing box. This accelerates the dissipation of heat from the semiconductor surface, achieving a rapid cooling effect. The semiconductor temperature is reduced to a safe range in a shorter time, effectively shortening the production cycle and improving overall production efficiency. 2. With the clamping assembly in place, the semiconductor to be processed is first placed on top of two sets of hot plates. Then, the driving component drives the connected moving base to slide along a set of guide bars. Through the transmission component, when one set of moving bases starts to move under the action of the driving component, the power is transmitted to the other set of moving bases through the transmission component, so that the two sets of moving bases can move synchronously. At this time, the wedge block also moves with the moving base, finally clamping the semiconductor and ensuring that the semiconductor remains fixed during the subsequent solder filling process. The hot plates generate heat, which can be evenly transferred to the clamped semiconductor, so that the semiconductor reaches a suitable temperature, which is convenient for solder filling. Attached Figure Description

[0014] Figure 1 One of the structural schematic diagrams of the semiconductor solder filling device provided by this utility model; Figure 2 A second schematic diagram of the semiconductor solder filling device provided by this utility model; Figure 3 A side view of the semiconductor solder filling device provided by this utility model; Figure 4 A side view of the semiconductor solder filling device provided by this utility model; Figure 5 A cross-sectional structural schematic diagram of the semiconductor solder filling device provided by this utility model; Figure 6 A schematic diagram of the clamping component structure of the semiconductor solder filling device provided by this utility model.

[0015] The diagram shows: 1. Processing box; 2. Cooling assembly; 201. Air cooler; 202. Transport pipe; 203. Cooling box; 204. Guide plate; 3. Clamping assembly; 301. Base plate; 302. Guide bar; 303. Moving seat; 304. Wedge block; 305. Drive component; 3051. Support plate; 3052. Telescopic cylinder; 306. Transmission component; 3061. Column; 3062. Gear; 3063. Rack; 307. Hot plate; 4. Sealing door; 5. Filling gun; 6. Observation plate. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model.

[0017] Therefore, the following detailed description of the embodiments of this utility model is not intended to limit the scope of the claimed utility model, but merely to illustrate some embodiments of the utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0018] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0019] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0020] like Figure 1 As shown, this embodiment proposes a semiconductor solder filling device, including a processing box 1. The outside of the processing box 1 is provided with a cooling component 2 for rapidly cooling the semiconductor, and the inside of the processing box 1 is provided with a clamping component 3 for clamping the semiconductor to facilitate solder filling. like Figure 2 and Figure 4 As shown, the cooling assembly 2 includes a cooler 201 fixedly installed on the outer wall of the processing chamber 1. A transport pipe 202 is installed at the output end of the cooler 201, and a cooling box 203 is fixedly connected to the other end of the transport pipe 202. The cooling box 203 is bolted to one side of the processing chamber 1 and extends into the interior of the processing chamber 1. Multiple sets of guide plates 204 are rotatably connected to the inner wall of the cooling box 203. In use, the cooler 201 draws in outside air and cools it to form cold air. The cold air is then transported to the cooling box 203 through the transport pipe 202. By reasonably adjusting the angle of the guide plates 204, the flow direction and distribution of the cold air can be effectively controlled, allowing the cold air to be evenly blown onto the semiconductors that have completed solder filling inside the processing chamber 1. This accelerates the dissipation of heat from the semiconductor surface, achieving a rapid cooling effect. The semiconductor temperature is reduced to a safe range in a shorter time, effectively shortening the production cycle and improving overall production efficiency.

[0021] like Figure 3 and Figure 4As shown, the clamping assembly 3 includes a base plate 301 that is slidably connected to the inner wall of the processing box 1. Two sets of guide bars 302 are symmetrically bolted to the top of the base plate 301. Movable seats 303 are slidably connected to both sets of guide bars 302. A wedge block 304 is bolted to the top of the movable seat 303. A driving member 305 is fixedly connected to one side of the movable seat 303. A transmission member 306 is bolted to the other side of the movable seat 303. Two sets of hot plates 307 are symmetrically bolted to the base plate 301. The movable seat 303 is located between the two sets of hot plates 307. The top of the hot plates 307 and the top of the movable seat 303 are at the same horizontal plane. In use, the semiconductor to be processed is first placed on top of the two sets of hot plates 307. Then, the driving component 305 drives the connected moving seat 303 to slide along a set of guide bars 302. Through the transmission component 306, when one set of moving seats 303 starts to move under the action of the driving component 305, the power is transmitted to the other set of moving seats 303 through the transmission component 306, so that the two sets of moving seats 303 can move synchronously. At this time, the wedge block 304 also moves with the moving seat 303, finally clamping the semiconductor and ensuring that the semiconductor remains fixed during the subsequent solder filling process. The hot plate 307 generates heat, which can be evenly transferred to the clamped semiconductor to make the semiconductor reach a suitable temperature, which is convenient for solder filling.

[0022] like Figure 5 and Figure 6 As shown, the driving component 305 includes a support plate 3051 symmetrically bolted to the top of the base plate 301. A telescopic cylinder 3052 is fixedly mounted on the other end of the support plate 3051. The telescopic cylinder 3052 is located above the two sets of guide bars 302, and the output end of the telescopic cylinder 3052 is bolted to the side wall of the movable seat 303. In use, when the output end of the telescopic cylinder 3052 extends, it pushes the movable seat 303 to move along the guide bars 302 towards the semiconductor. When the output end of the telescopic cylinder 3052 retracts, it pulls the movable seat 303 to move along the guide bars 302 away from the semiconductor.

[0023] like Figure 5 and Figure 6 As shown, the transmission component 306 includes a column 3061 bolted to the top of the base plate 301. The column 3061 is located between two sets of guide bars 302. A gear 3062 is rotatably connected to the column 3061. A rack 3063 is bolted to one side of the movable seat 303, and the rack 3063 meshes with the gear 3062. While the movable seat 303 moves, the rack 3063 moves synchronously with the movable seat 303. Since the gear 3062 is simultaneously meshed with the rack 3063 on the other set of movable seats 303, the movement of one set of movable seats 303 will drive the other set of movable seats 303 to move synchronously in the opposite direction, which facilitates the clamping of semiconductors.

[0024] like Figure 4 As shown, two sets of protrusions are fixedly connected to the bottom of the base plate 301. The inner bottom wall of the processing box 1 has a sliding groove corresponding to the protrusions. A sealing door 4 is hinged to one side of the processing box 1, and the sealing door 4 is located on one side of the base plate 301. In use, the sealing door 4 is opened, the base plate 301 is pulled out, the semiconductor is fixedly clamped between the two sets of moving seats 303, and then the sealing door 4 is closed to perform semiconductor solder filling operation.

[0025] like Figure 4 As shown, a filler gun 5 is bolted to the inner top wall of the processing box 1, and the filler gun 5 is located above the two sets of hot plates 307. The filler gun 5, located above the two sets of hot plates 307, can directly and accurately spray solder onto the semiconductor to the parts that need to be filled with solder, and complete the solder filling work in a short time.

[0026] like Figure 4 As shown, an observation panel 6 is embedded in the side wall of the processing box 1, and a sealing strip is bonded to the connection between the observation panel 6 and the processing box 1. The operator can clearly see the working conditions inside the processing box 1 through the observation panel 6 without opening the processing box 1. The sealing strip can prevent external air, moisture, etc. from entering the processing box 1.

[0027] Specifically, when using this semiconductor solder filling device: (e.g.) Figure 2 and Figure 4 As shown, the semiconductor to be processed is first placed on top of two sets of hot plates 307. Then, the driving component 305 drives the connected movable seat 303 to slide along a set of guide bars 302. Through the transmission component 306, when one set of movable seats 303 starts to move under the action of the driving component 305, the power is transmitted to the other set of movable seats 303 through the transmission component 306, so that the two sets of movable seats 303 can move synchronously. At this time, the wedge block 304 also moves with the movable seat 303, finally clamping the semiconductor and ensuring that the semiconductor remains fixed during the subsequent solder filling process. The hot plates 307 generate heat, and the heat generated can be evenly distributed. The heat is evenly transferred to the clamped semiconductor, bringing it to a suitable temperature for solder filling. After filling, the cooler 201 draws in outside air and cools it to form cold air. The cold air is then transported to the cooling box 203 through the transport pipe 202. By adjusting the angle of the guide plate 204, the direction and distribution of the cold air can be effectively controlled, ensuring that the cold air is evenly blown onto the semiconductor in the processing box 1 after solder filling. This accelerates the dissipation of heat from the semiconductor surface, achieving rapid cooling and reducing the semiconductor temperature to a safe range in a shorter time. This effectively shortens the production cycle and improves overall production efficiency.

[0028] All technical features in this embodiment can be freely combined according to actual needs.

[0029] The above embodiments are preferred implementations of this utility model. In addition, this utility model can also be implemented in other ways. Any obvious substitutions without departing from the concept of this technical solution are within the protection scope of this utility model.

Claims

1. A semiconductor solder filling device, comprising a processing box (1), characterized in that, The processing box (1) is provided with a cooling component (2) for rapid cooling of semiconductors on the outside, and a clamping component (3) for clamping semiconductors to facilitate solder filling is provided inside the processing box (1). The cooling assembly (2) includes a cooler (201) fixedly installed on the outer wall of the processing box (1). A transport pipe (202) is installed at the output end of the cooler (201). A cooling box (203) is fixedly connected to the other end of the transport pipe (202). The cooling box (203) is bolted to one side of the processing box (1) and extends into the interior of the processing box (1). Multiple sets of guide plates (204) are rotatably connected to the inner side wall of the cooling box (203).

2. The semiconductor solder filling device according to claim 1, characterized in that, The clamping assembly (3) includes a base plate (301) slidably connected to the inner wall of the processing box (1). Two sets of guide strips (302) are symmetrically bolted to the top of the base plate (301). A movable seat (303) is slidably connected to each of the two sets of guide strips (302). A wedge block (304) is bolted to the top of the movable seat (303). A driving member (305) is fixedly connected to one side of the movable seat (303). A transmission member (306) is bolted to the other side of the movable seat (303). Two sets of hot plates (307) are symmetrically bolted to the base plate (301). The movable seat (303) is located between the two sets of hot plates (307). The top of the hot plate (307) and the top of the movable seat (303) are on the same horizontal plane.

3. A semiconductor solder filling device according to claim 2, characterized in that, The drive unit (305) includes a support plate (3051) symmetrically bolted to the top of the base plate (301). A telescopic cylinder (3052) is fixedly installed at the other end of the support plate (3051). The telescopic cylinder (3052) is located above two sets of guide bars (302). The output end of the telescopic cylinder (3052) is bolted to the side wall of the movable seat (303).

4. A semiconductor solder filling device according to claim 2, characterized in that, The transmission component (306) includes a column (3061) bolted to the top of the base plate (301), the column (3061) being located between two sets of guide bars (302), a gear (3062) being rotatably connected to the column (3061), and a rack (3063) bolted to one side of the movable seat (303), the rack (3063) meshing with the gear (3062).

5. A semiconductor solder filling device according to claim 2, characterized in that, Two sets of protrusions are fixedly connected to the bottom of the base plate (301). The inner bottom wall of the processing box (1) is provided with a sliding groove corresponding to the protrusions. A sealing door (4) is hinged to one side of the processing box (1). The sealing door (4) is located on one side of the base plate (301).

6. A semiconductor solder filling device according to claim 1, characterized in that, A filling gun (5) is bolted to the inner top wall of the processing box (1), and the filling gun (5) is located above the two sets of hot plates (307).

7. A semiconductor solder filling device according to claim 1, characterized in that, The side wall of the processing box (1) is fitted with an observation plate (6), and a sealing strip is bonded to the connection between the observation plate (6) and the processing box (1).

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