A highly integrated thermal management bus assembly and a battery cell structure

Abstract

This utility model discloses a highly integrated thermal management bus assembly and a battery cell structure. The bus is installed inside the membrane structure. A plurality of thermally conductive fixing components are mounted on the surface of the liquid cooling plate, and these components pass through the membrane structure. The positive and negative output terminals of the module are respectively installed at both ends of the liquid cooling plate, and the connecting pieces for both the positive and negative output terminals are connected in series with the bus. By applying this utility model, a highly integrated thermal management bus assembly and a battery cell structure are provided. This device integrates the bus and liquid cooling plate into one unit, reducing the number of module parts and improving production efficiency. It also adds thermally conductive fixing components, which have excellent strength, enabling rapid heat transfer and heating. Furthermore, the thermally conductive fixing components can be effectively positioned and quickly installed with the battery cell.

Description

Technical Field

[0001] This utility model relates to the technical field of battery cells and related technologies, and in particular to a highly integrated thermal management bus assembly and a battery cell structure. Background Technology

[0002] Currently, new energy electric vehicles use battery modules assembled from cylindrical cells. During module assembly, many different types and quantities of busbars are needed to connect the cells in series and parallel. The thermal management design of cylindrical cell modules uses a "serpentine" process where flat tubes are attached to the sides of the cells. Thermally conductive adhesive or pads are used as the heat transfer medium between the cell sides and the flat tubes. Coolant flows through the liquid-cooled flat tubes, and the flow of coolant cools or heats the module cells.

[0003] However, due to the large capacity of passenger vehicle battery packs and the high demand for battery cells, the number of cells and the module size are both relatively large after the cells are assembled into modules. Depending on the project requirements, the series and parallel bus designs used in the modules will result in various types and quantities of busbars, making it easy to install incorrectly, which is time-consuming and labor-intensive. Furthermore, the manufacturing process also results in significant waste of busbar raw materials, keeping costs high. In addition, a "serpentine" liquid-cooled flat tube is placed between each row of cells in the module. Considering the large number of cells and the insufficient manufacturing precision of the liquid-cooled flat tube, the assembly tolerance between the liquid-cooled flat tube and the cells is unstable, easily leading to uneven gaps between the cells and the liquid-cooled flat tube. Although thermally conductive adhesive is used as a filler, it affects the insulation and thermal management performance of the assembled module. Moreover, with a large number of cells in the module, there are also relatively many liquid-cooled flat tubes. The axial pushing and pressing connection of the flat tubes places high demands on the process, tooling, and equipment, resulting in low assembly efficiency. Utility Model Content

[0004] In view of this, and to solve the above problems, the purpose of this utility model is to provide a highly integrated thermal management bus assembly, comprising: Liquid cooling plate, thermally conductive fastener, membrane structure, busbar, module positive output terminal, module negative output terminal; The busbar is installed inside the membrane structure; The surface of the liquid cooling plate is equipped with several thermally conductive fasteners, and several of the thermally conductive fasteners pass through the membrane structure; The positive output terminal and the negative output terminal of the module are respectively installed at both ends of the liquid cooling plate, and the connecting piece of the positive output terminal and the connecting piece of the negative output terminal are connected in series with the busbar.

[0005] The aforementioned highly integrated thermal management bus assembly includes a liquid cooling plate comprising an upper liquid cooling plate and a lower liquid cooling plate; the upper liquid cooling plate and a plurality of the thermally conductive fasteners are respectively mounted on the two surfaces of the lower liquid cooling plate.

[0006] The aforementioned highly integrated thermal management bus assembly includes a membrane structure comprising an upper membrane and a lower membrane; the bus is installed between the upper membrane and the lower membrane, and the upper membrane and the lower membrane encapsulate the bus.

[0007] In the aforementioned highly integrated thermal management bus assembly, the interior of the thermally conductive fixing member is filled with a heat transfer medium, the outer wall of the thermally conductive fixing member is wound with metal wire, and the metal wire is provided with an insulating layer on the outside.

[0008] In the aforementioned highly integrated thermal management bus assembly, the transverse cross-section of the thermally conductive fixing member is any one of a circle, rectangle, or ellipse.

[0009] In the aforementioned highly integrated thermal management bus assembly, the upper membrane can be bonded to the liquid-cooled lower plate by thermally conductive adhesive or hot pressing.

[0010] In the aforementioned highly integrated thermal management bus assembly, the thermally conductive fastener is mounted to the liquid-cooled lower plate by riveting or welding.

[0011] A battery cell structure, comprising the aforementioned highly integrated thermal management bus assembly, further comprising: Battery cells, module trays, and module support plates; The module tray is mounted on the module support plate, and a plurality of the battery cells are mounted on the module tray; Several of the aforementioned thermally conductive fasteners are mounted on the battery cell.

[0012] In the aforementioned battery cell structure, thermally conductive structural adhesive is filled between each battery cell and each thermally conductive fixing member.

[0013] In the aforementioned battery cell structure, a first mounting portion extends outward from the positive output terminal of the highly integrated thermal management bus assembly, and a second mounting portion extends outward from the negative output terminal of the highly integrated thermal management bus assembly. The first mounting portion and the second mounting portion are mounted on the module tray.

[0014] The positive effects of the above technical solution compared with the existing technology are: By applying this utility model, a highly integrated thermal management bus assembly and a battery cell structure are provided. This device integrates the bus and the liquid cooling plate into one unit, reducing the number of module parts and improving production efficiency. It also adds a thermally conductive fixing component, which has good strength, can quickly transfer heat and heat up, and can be effectively positioned and quickly installed with the battery cell. Attached Figure Description

[0015] Figures 1a to 1bThis is an assembly diagram of a highly integrated thermal management bus assembly according to the present invention.

[0016] Figures 2a to 2d This is an assembly diagram of a battery cell structure according to the present invention.

[0017] Figure 3 for Figure 2c A magnified view of a portion of the image.

[0018] 1. Thermally conductive fastener; 2. Upper film; 3. Lower film; 4. Busbar; 5. Positive output terminal of the module; 6. Negative output terminal of the module; 7. Liquid cooling upper plate; 8. Liquid cooling lower plate; 9. First mounting part; 10. Second mounting part; 11. Battery cell; 12. Module tray; 13. Module support plate. Detailed Implementation

[0019] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention.

[0020] The structures, proportions, and sizes illustrated in the accompanying drawings are merely for illustrative purposes and to aid those skilled in the art. They are not intended to limit the scope of this invention and therefore have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, provided they do not affect the effectiveness or purpose of this invention, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms "upper," "lower," "left," "right," "middle," and "one" used in this specification are merely for clarity and not intended to limit the scope of this invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this invention.

[0021] like Figures 1a to 1b As shown, a highly integrated thermal management bus assembly according to a preferred embodiment is illustrated, comprising: a liquid cooling plate, a thermally conductive fixing member 1, a membrane structure, a bus 4, a module positive output electrode 5, and a module negative output electrode 6.

[0022] Busbar 4 is installed inside the membrane structure; several thermally conductive fasteners 1 are installed on the surface of the liquid cooling plate, and several thermally conductive fasteners 1 pass through the membrane structure; the module positive output electrode 5 and the module negative output electrode 6 are respectively installed at both ends of the liquid cooling plate, and the connecting piece of the module positive output electrode 5 and the connecting piece of the module negative output electrode 6 are connected in series with busbar 4.

[0023] In practical use, this device uses a single sheet of aluminum to be stamped and cut into all the series busbars 4, module negative output poles 6, and module positive output poles 5 in one go. Then, the whole device is encapsulated using an upper film 2 and a lower film 3. Finally, according to design requirements, laser cleaning is used to process the areas of the busbars 4 that need to be welded. This results in significant improvements to the device in terms of raw materials, finished products, and manufacturing processes.

[0024] This device integrates the busbar 4 and the liquid cooling plate into one unit, reducing the number of module parts and improving production efficiency. It also adds a heat-conducting fixing component 1, which allows heat to be quickly transferred to the outside.

[0025] In this device, the liquid cooling plate adopts common structures such as flow channel plate and flat plate, and is made using mature brazing technology. The epoxy spray coating on the surface of the liquid cooling plate is eliminated, and the liquid cooling plate and the busbar 4 are bonded together by their membrane structure, which is both reliable and meets the insulation requirements.

[0026] In this device, the connecting piece of the positive output terminal 5 and the connecting piece of the negative output terminal 6 of the module are connected to the busbar 4 by laser spot welding.

[0027] This device adds a heat-conducting fixing component 1, which not only plays a role in heat conduction, quickly transferring heat to the outside, but also serves as a guide for rapid assembly of the entire component.

[0028] Based on the above, this utility model also has the following embodiments: Furthermore, a highly integrated thermal management bus assembly includes a liquid cooling plate comprising an upper liquid cooling plate 7 and a lower liquid cooling plate 8. The upper liquid cooling plate 7 and several thermally conductive fasteners 1 are respectively mounted on the two surfaces of the lower liquid cooling plate 8. Specifically, the upper liquid cooling plate 7 and the lower liquid cooling plate 8 are made from flat plates using integral stamping and brazing processes, or they can be made from other materials and forming processes. The upper liquid cooling plate 7 is provided with heating contacts, which are mainly used to heat the coolant when needed to prevent the coolant from freezing in low-temperature environments, thereby ensuring the normal operation of the liquid cooling system.

[0029] Furthermore, a highly integrated thermal management bus assembly is provided, wherein the membrane structure includes an upper membrane 2 and a lower membrane 3; a bus 4 is located between the upper membrane 2 and the lower membrane 3, and the upper membrane 2 and the lower membrane 3 encapsulate the bus 4. Specifically, a one-piece punched bus 4 is used, maximizing the utilization of raw materials and allowing for a one-time installation during module assembly, avoiding the error-prone situation of installing multiple bus 4s.

[0030] Furthermore, a highly integrated thermal management bus assembly is provided, wherein the interior of the thermally conductive fixing member 1 is filled with a heat transfer medium, the outer wall of the thermally conductive fixing member 1 is wound with metal wire, and the metal wire is provided with an insulating layer. Specifically, the thermally conductive fixing member 1 is encapsulated by an internal heat transfer medium, a surface wound metal wire, and an outer surface insulating layer. The heat transfer medium can be made of a phase change material or other materials with rapid thermal conductivity.

[0031] Furthermore, a highly integrated thermal management bus assembly is provided, wherein the transverse cross-section of the thermally conductive fixing component 1 can be any shape, such as circular, rectangular, or elliptical. Specifically, the shape of the thermally conductive fixing component 1 can be set according to actual usage. The thermally conductive fixing component 1 is externally wound with metal wire and externally connected to a PTC. When energized, it utilizes the principle of electromagnetic induction, resulting in a rapid heating rate, allowing the battery cell temperature to quickly rise to the operating temperature at low temperatures.

[0032] Furthermore, a highly integrated thermal management bus assembly is provided, wherein the upper membrane 2 can be bonded to the liquid-cooled lower plate 8 by thermally conductive adhesive or hot pressing. Specifically, the upper membrane 2 and the liquid-cooled lower plate 8 can be bonded by the adhesive of the upper membrane 2 itself, or by other methods such as thermally conductive adhesive or hot pressing.

[0033] Furthermore, a highly integrated thermal management bus assembly is provided, wherein the thermally conductive fastener 1 is mounted to the liquid-cooled lower plate 8 by riveting or welding.

[0034] Furthermore, a highly integrated thermal management bus assembly is provided, wherein an array of thermally conductive fasteners 1 are mounted on the liquid-cooled lower plate 8. Specifically, the thermally conductive fasteners 1 are arranged in an array on the lower surface of the liquid-cooled lower plate 8 according to actual usage requirements.

[0035] For a cell structure, please refer to [link / reference]. Figures 2a to 2d and Figure 3 As shown, the assembly includes the aforementioned highly integrated thermal management bus assembly, and further includes: a battery cell 11, a module tray 12, and a module support plate 13. The module tray 12 is mounted on the module support plate 13, and several battery cells 11 are mounted on the module tray 12; several thermally conductive fasteners 1 are mounted on the battery cells 11.

[0036] Specifically, the module tray 12 and the module support plate 13 can be fixed together by applying adhesive to the large surface and using edge rivets, or the module support plate 13 can be placed in the injection mold during the injection molding of the module tray 12. Then, the battery cell 11 is installed into the module tray 12.

[0037] The components in this device are positioned and assembled into the interior of the battery cell 11 using a heat-conducting fixing component 1. The heat-conducting fixing component 1 itself has excellent strength and can quickly transfer and heat the battery. During battery cell 11 module discharge, low-temperature charging, and cold start, the busbar 4 can respond quickly, shortening pre-processing time and eliminating waiting time for vehicle owners. Furthermore, the variety and quantity of incoming parts are significantly reduced compared to before, making overall assembly simpler and more efficient, lowering manufacturing costs, reducing investment in production line equipment, avoiding the risk of incorrect busbar 4 installation, improving component quality control, and enhancing module assembly efficiency and quality.

[0038] This device adds a heat-conducting fixing component 1, which improves the efficiency of module thermal management (such as heat dissipation). In low-temperature conditions, the PTC energized heat-conducting fixing component 1 has its own coil, which generates heat quickly through electromagnetic induction, raising the temperature of the battery cell 11. This greatly shortens the time for car owners to use the car in extremely cold weather (low-temperature charging and starting), eliminating the need for waiting.

[0039] Furthermore, in a battery cell structure, thermally conductive structural adhesive is filled between each battery cell 11 and each thermally conductive fixing member 1. Specifically, each thermally conductive fixing member 1 is bonded and fixed to each battery cell 12 with thermally conductive structural adhesive, thereby significantly improving the overall rigidity.

[0040] Furthermore, in a battery cell structure, a first mounting portion 9 extends outward from the positive output terminal 5 of the highly integrated thermal management bus assembly module, and a second mounting portion 10 extends outward from the negative output terminal 6 of the highly integrated thermal management bus assembly module. The first mounting portion 9 and the second mounting portion 10 are mounted on a module tray 12. Specifically, the assembly can be mounted entirely on the module tray 12 via the first mounting portion 9 and the second mounting portion 10. Specifically, both the first mounting portion 9 and the second mounting portion 19 are L-shaped.

[0041] The above description is only a preferred embodiment of the present utility model and does not limit the implementation method and protection scope of the present utility model. Those skilled in the art should realize that all solutions obtained by equivalent substitutions and obvious changes made based on the description and illustrations of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A highly integrated thermal management bus assembly, characterized in that, include: Liquid cooling plate, thermally conductive fastener, membrane structure, busbar, module positive output terminal, module negative output terminal; The busbar is installed inside the membrane structure; The surface of the liquid cooling plate is equipped with several thermally conductive fasteners, and several of the thermally conductive fasteners pass through the membrane structure; The positive output terminal and the negative output terminal of the module are respectively installed at both ends of the liquid cooling plate, and the connecting piece of the positive output terminal and the connecting piece of the negative output terminal are connected in series with the busbar.

2. The highly integrated thermal management bus assembly according to claim 1, characterized in that, The liquid cooling plate includes a liquid cooling upper plate and a liquid cooling lower plate; the liquid cooling upper plate and a plurality of the heat-conducting fixing components are respectively installed on the two surfaces of the liquid cooling lower plate.

3. The highly integrated thermal management bus assembly according to claim 2, characterized in that, The membrane structure includes an upper membrane and a lower membrane; the busbar is installed between the upper membrane and the lower membrane, and the upper membrane and the lower membrane encapsulate the busbar.

4. The highly integrated thermal management bus assembly according to claim 1, characterized in that, The interior of the heat-conducting fastener is filled with a heat transfer medium, the outer wall of the heat-conducting fastener is wrapped with metal wire, and the metal wire is provided with an insulating layer.

5. A highly integrated thermal management bus assembly according to claim 1, characterized in that, The transverse cross-section of the heat-conducting fastener can be any one of a circle, rectangle, or ellipse.

6. A highly integrated thermal management bus assembly according to claim 3, characterized in that, The upper film can be bonded to the liquid-cooled lower plate by thermally conductive adhesive or hot pressing.

7. A highly integrated thermal management bus assembly according to claim 2, characterized in that, The heat-conducting fastener is installed on the liquid-cooled lower plate by riveting or welding.

8. A battery cell structure, characterized in that, The highly integrated thermal management bus assembly according to any one of claims 1-7 further includes: Battery cells, module trays, and module support plates; The module tray is mounted on the module support plate, and a plurality of the battery cells are mounted on the module tray; Several of the aforementioned thermally conductive fasteners are mounted on the battery cell.

9. A cell structure according to claim 8, characterized in that, Thermally conductive structural adhesive is filled between each of the battery cells and each of the thermally conductive fasteners.

10. A cell structure according to claim 8, characterized in that, The highly integrated thermal management bus assembly has a first mounting portion extending outward from the positive output terminal of the module, and a second mounting portion extending outward from the negative output terminal of the module. The first mounting portion and the second mounting portion are mounted on the module tray.

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