Micro-channel evaporator and vapor chamber heat exchange device
Patent Information
- Application Number
- CN202521975960.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-14
- Publication Date
- 2026-09-04
- Estimated Expiration
- 2035-09-14
AI Technical Summary
[0005]现有的微通道蒸发器在使用时，多制作为板状，直接与热源接触换热，即蒸发器将热源包裹换热，微通道蒸发器的体积需大于或等于热源，造成体积庞大、成本上涨，同时，微通道蒸发器内的微通道均为平行布置，热量仅能沿微通道的长度方向进行扩散，不能垂直于微通道长度方向扩散，对于点状发热的热源，无法利用其边缘位置的微通道进行换热，不利于局部高热源区域的热扩散，即无法满足高功率密度模块的点状均温需求
[0033] 1. By using slots within the heat exchange plate assembly, a heat spreader plate, which acts as a thermal bridge, can be inserted. The heat spreader plate then transfers heat from the heat source to the heat exchange plate assembly for heat exchange. This reduces the size of the heat exchange plate assembly, eliminating the need for it to be the same size as or larger than the heat source, thereby lowering operating costs.
Smart Images
Figure CN224718996U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of evaporator technology, and more specifically, to a microchannel evaporator. Furthermore, this utility model also relates to a heat exchange device with a heat spreader including the aforementioned microchannel evaporator. Background Technology
[0002] With the significant increase in power density of equipment such as new energy vehicles, energy storage systems, and 5G base stations, thermal management systems are placing higher demands on the heat exchange efficiency, compact size, and temperature uniformity of evaporators. Microchannel evaporators, due to their high heat exchange performance and compact structure, have become one of the mainstream solutions.
[0003] Existing microchannel evaporators typically employ a horizontal tube arrangement structure, with multiple horizontal microchannel tubes arranged vertically and manifolds (liquid distribution tubes and gas collection tubes) on both sides; the refrigerant enters from one side of the liquid distribution tube, flows through the horizontal microchannels to the other side of the gas collection tube, and is discharged.
[0004] However, during the implementation of this solution, the applicant discovered the following problems with the existing technology:
[0005] Existing microchannel evaporators are mostly made in plate form, directly contacting the heat source for heat exchange. In other words, the evaporator wraps the heat source for heat exchange. The volume of the microchannel evaporator needs to be greater than or equal to that of the heat source, resulting in a large size and increased cost. At the same time, the microchannels in the microchannel evaporator are arranged in parallel, and heat can only diffuse along the length of the microchannel, not perpendicular to the length of the microchannel. For point-heating heat sources, it is not possible to use the microchannels at their edges for heat exchange, which is not conducive to heat diffusion in local high heat source areas. In other words, it cannot meet the point-temperature uniformity requirements of high power density modules.
[0006] In summary, how to solve the problem of the large size of existing microchannel evaporators and their unfavorable heat diffusion in local high heat source areas is a problem that urgently needs to be solved by those skilled in the art. Utility Model Content
[0007] In view of this, the purpose of this utility model is to provide a microchannel evaporator that can homogenize and export the temperature of the heat source by using a heat spreader as a heat bridge, and then contact the heat exchange plate component for heat exchange in the form of an insertion slot, thereby effectively reducing the volume of the evaporator. Furthermore, by homogenizing the heat at the heat source end and the evaporator through the heat spreader, the heat diffusion in the local high heat source area is accelerated, thus meeting the point-like temperature uniformity requirements.
[0008] Another objective of this invention is to provide a heat exchanger device with a heat spreader including the microchannel evaporator described above, which has the same technical features and can solve the same technical problems.
[0009] To achieve the above objectives, this utility model provides the following technical solution:
[0010] A microchannel evaporator, comprising:
[0011] Low-temperature medium channel;
[0012] A high-temperature medium channel is arranged parallel to the low-temperature medium channel;
[0013] Several heat exchange plate assemblies are spaced apart between the low-temperature medium channel and the high-temperature medium channel, and several capillary channels are provided in the heat exchange plate assemblies, with the two ends of the capillary channels respectively connected to the low-temperature medium channel and the high-temperature medium channel;
[0014] The heat exchange plate assembly is provided with a slot for inserting a heat spreader plate, and the capillary channels are arranged around the inner wall of the slot.
[0015] Preferably, the end of the low-temperature medium channel is connected to a low-temperature medium filling port, and the end of the high-temperature medium channel is connected to a high-temperature medium outlet;
[0016] The low-temperature medium filling port and the high-temperature medium outlet are located at different ends of the microchannel evaporator.
[0017] Preferably, the cryogenic medium channel includes a first cavity, a cryogenic medium distribution pipe, and a cryogenic medium filling port;
[0018] The first cavity is used to communicate with the capillary channel, the cryogenic medium distribution tube is built into the first cavity, and the cryogenic medium filling port is communicated with the cryogenic medium distribution tube;
[0019] The wall of the cryogenic medium distribution pipe is provided with several sets of through holes along its length. The through holes are arranged at equal intervals, or the spacing of the through holes near the cryogenic medium filling port is smaller than that at the other end.
[0020] Preferably, the high-temperature medium channel includes a second cavity, a high-temperature medium manifold, and a high-temperature medium outlet;
[0021] The second cavity is used to communicate with the capillary channel, the high-temperature medium manifold is built into the second cavity, and the high-temperature medium outlet is communicated with the high-temperature medium manifold;
[0022] The high-temperature medium manifold has several sets of through holes arranged along its length, with the spacing between the through holes near the outlet of the high-temperature medium being greater than that at the other end.
[0023] Preferably, the arrangement height of the high-temperature medium channel is higher than that of the low-temperature medium channel;
[0024] A reflux channel is provided between the high-temperature medium channel and the low-temperature medium channel to allow the liquid medium in the high-temperature medium channel to flow back to the low-temperature medium channel.
[0025] Preferably, the inlet end of the reflux channel is connected at a low position to the outlet end of the high-temperature medium channel;
[0026] The outlet end of the reflux channel is connected to the end of the cryogenic medium channel furthest from the inlet end.
[0027] Preferably, the return channel is connected in series with a U-shaped bend structure to form a liquid seal at the U-shaped bend structure.
[0028] Preferably, the planes of two adjacent heat exchange plate assemblies are parallel, and the two ends of the heat exchange plate assemblies are detachably connected to the low-temperature medium channel and the high-temperature medium channel, respectively.
[0029] Preferably, the opening directions of two adjacent sets of slots are the same or opposite.
[0030] A heat exchanger with a heat spreader, comprising a heat spreader and a microchannel evaporator as described in any one of the above-mentioned embodiments;
[0031] One end of the heat spreader is fixedly inserted into the slot.
[0032] The microchannel evaporator provided by this invention has at least the following advantages compared with the prior art:
[0033] 1. By using slots within the heat exchange plate assembly, a heat spreader plate, which acts as a thermal bridge, can be inserted. The heat spreader plate then transfers heat from the heat source to the heat exchange plate assembly for heat exchange. This reduces the size of the heat exchange plate assembly, eliminating the need for it to be the same size as or larger than the heat source, thereby lowering operating costs.
[0034] 2. The reduced volume of the heat exchange plate assembly can shorten the length of the capillary channel, that is, the refrigerant has a shorter path in the capillary channel. This avoids the refrigerant being affected by gravity and lateral pressure drop, which can cause the inlet end to be too cold and the outlet end to be too hot, resulting in insufficient phase change and local "dry point" problems.
[0035] 3. By utilizing the heat dissipation characteristics of the heat exchange plate, the heat from the high heat source area can be automatically diffused to the surrounding area, solving the problem of heat diffusion in the local high heat source area. After the heat exchange plate is inserted into the slot, it can simultaneously contact and exchange heat with multiple capillary channels in the heat exchange plate component. The heat from the high heat source area of the heat exchange plate can diffuse to the surrounding area and be exchanged by the other capillary channels, thus improving the heat exchange effect of the heat exchange plate component.
[0036] 4. The design of setting up several heat exchange plate components between the low temperature medium channel and the high temperature medium channel can accommodate the insertion of multiple heat exchange plates, thereby meeting the heat exchange needs of multi-point non-uniform heat exchange systems such as battery modules, distributed power electronics or data center cooling units.
[0037] The heat exchange device provided by this utility model, including the microchannel evaporator mentioned above, has the same beneficial effects. Attached Figure Description
[0038] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.
[0039] Figure 1 This is a schematic diagram of the structure of the specific microchannel evaporator provided by this utility model;
[0040] Figure 2 Provided by this utility model Figure 1 Enlarged view of point A in the middle;
[0041] Figure 3 A cross-sectional view of the specific microchannel evaporator provided by this utility model;
[0042] Figure 4 Provided by this utility model Figure 3 Enlarged view of point B in the middle;
[0043] Figure 5 Provided by this utility model Figure 3 Sectional view at CC;
[0044] Figure 6 This is a schematic diagram of the structure of a specific embodiment of the heat exchanger with a heat spreader provided by this utility model;
[0045] Figure 7 This is a schematic diagram of the structure of a second embodiment of the heat exchanger device provided by this utility model;
[0046] Figure 8 This is a schematic diagram of another embodiment of the microchannel evaporator provided by this utility model;
[0047] Figure 9 This is a schematic diagram of the bottom structure of another embodiment of the microchannel evaporator provided by this utility model.
[0048] In the picture:
[0049] 1. Cryogenic medium channel; 11. Cryogenic medium filling port; 12. Cryogenic medium distribution pipe;
[0050] 2. High-temperature medium channel; 21. High-temperature medium outlet; 22. High-temperature medium manifold;
[0051] 3. Heat exchanger plate assembly; 31. Capillary channel; 32. Slot;
[0052] 4. Return channel; 41. U-shaped bend structure;
[0053] 5. Heat spreader. Detailed Implementation
[0054] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0055] The core of this invention is to provide a microchannel evaporator that can homogenize and export the temperature of the heat source through a heat spreader plate as a heat bridge, and then exchange heat with the heat exchange plate component in the form of an insertion slot. This can effectively reduce the volume of the evaporator, and accelerate the heat diffusion of local high heat source areas through the heat spreader plate at the heat source end and the evaporator, thus meeting the point-like temperature uniformity requirements.
[0056] Another core aspect of this invention is to provide a heat exchanger device with a heat spreader including the aforementioned microchannel evaporator, which has the same technical features and can solve the same technical problems.
[0057] Please refer to Figures 1-5 A microchannel evaporator, comprising:
[0058] Low-temperature medium channel 1;
[0059] High-temperature medium channel 2 is arranged in parallel with low-temperature medium channel 1;
[0060] Several heat exchange plate components 3 are spaced apart between the low temperature medium channel 1 and the high temperature medium channel 2, and several capillary channels 31 are provided in the heat exchange plate components 3, with the two ends of the capillary channels 31 connected to the low temperature medium channel 1 and the high temperature medium channel 2 respectively.
[0061] The heat exchange plate assembly 3 is provided with a slot 32 for inserting the heat spreader 5, and the capillary channel 31 is arranged around the inner wall of the slot 32.
[0062] like Figure 1As shown, several heat exchange plate assemblies 3 are arranged between the parallel low-temperature medium channel 1 and high-temperature medium channel 2. Each heat exchange plate assembly 3 is provided with a capillary channel 31. When the low-temperature heat exchange medium flows from the low-temperature medium channel 1 to the high-temperature medium channel 2 through the capillary channel 31, it can exchange heat with the heat exchange plate assembly 3. Therefore, each heat exchange plate assembly 3 is provided with a slot 32, which allows the heat exchange plate 5 to be inserted into the heat exchange plate assembly 3 for contact heat exchange, increasing the contact area for heat exchange in the microchannel evaporator and helping to miniaturize the microchannel evaporator.
[0063] Meanwhile, by using the heat exchange plate 5 as a heat bridge to transfer heat, the microchannel evaporator is separated from the heat source. The heat source does not need to be wrapped in the microchannel evaporator, which can reduce the volume of the microchannel evaporator and shorten the length of the capillary channel 31. This ensures that there is always a heat exchange medium with heat absorption capacity in the capillary channel 31, avoiding the problem of local dry spots in the capillary channel 31.
[0064] Moreover, when the heat spreader plate 5 is inserted into the slot 32, the heat spreader plate 5 can contact and exchange heat with multiple capillary channels 31 inside the slot 32. At the same time, by utilizing the heat spreader plate 5's heat spreader characteristics, the heat diffusion rate in the high heat source area can be effectively improved, thereby improving the heat exchange efficiency of the microchannel evaporator.
[0065] Moreover, by utilizing the thermal conductivity of the heat spreader 5, the heat flow field of the heat source and the heat exchange medium flow field in the microchannel evaporator are physically decoupled, improving the convenience of equipment maintenance.
[0066] Meanwhile, the heat spreader 5 and the microchannel evaporator adopt a detachable plug-in design, which helps to improve the on-site adaptability of the equipment and the flexibility of thermal control zoning.
[0067] In some embodiments, a low-temperature medium channel 1 is connected to a low-temperature medium filling port 11 at one end, and a high-temperature medium channel 2 is connected to a high-temperature medium outlet 21 at one end.
[0068] The low-temperature medium filling port 11 and the high-temperature medium outlet 21 are located at different ends of the microchannel evaporator.
[0069] like Figure 1 and Figure 3 As shown, the end of the cryogenic medium channel 1 closest to the cryogenic medium filling port 11 is the proximal end, and the other end is the distal end;
[0070] The end of the high-temperature medium channel 2 closest to the high-temperature medium outlet 21 is designated as the proximal end, and the other end as the distal end;
[0071] The near end of the cryogenic medium channel 1 is the high-pressure end, and the far end is the low-pressure end;
[0072] The near end of the high-temperature medium channel 2 is the low-pressure end, and the far end is the high-pressure end;
[0073] Therefore, the high-pressure end of the low-temperature medium channel 1 can be connected to the high-pressure end of the high-temperature medium channel 2 through the capillary channel 31, and the low-pressure end of the low-temperature medium channel 1 can be connected to the low-pressure end of the high-temperature medium channel 2. That is, the pressure drop at both ends of the capillary channel 31 at different positions is relatively close, thereby making the flow rate of the heat exchange medium in the capillary channel 31 at different positions similar, and thus making the heat exchange effect of the capillary channel 31 at different positions similar, that is, the heat exchange effect at different positions of the microchannel evaporator is similar.
[0074] In some embodiments, the cryogenic medium channel 1 includes a first cavity, a cryogenic medium distribution pipe 12, and a cryogenic medium filling port 11;
[0075] The first cavity is used to communicate with the capillary channel 31, the cryogenic medium distribution pipe 12 is built into the first cavity, and the cryogenic medium filling port 11 is connected to the cryogenic medium distribution pipe 12.
[0076] The wall of the cryogenic medium distribution pipe 12 has several sets of through holes arranged along its length. The through holes are arranged at equal intervals, or the spacing of the through holes near the cryogenic medium filling port 11 is smaller than that of the through holes at the other end.
[0077] like Figure 3 As shown, the low-temperature medium channel 1 adopts the method of wrapping the low-temperature medium distribution pipe 12 with the first cavity, so that the low-temperature heat exchange medium, that is, the low-temperature gas-liquid mixture refrigerant, can be distributed to different length positions of the low-temperature medium channel 1, ensuring that the low-temperature refrigerant can pass through the capillary channels 31 of the heat exchange plate assembly 3 at different positions.
[0078] Furthermore, by expanding the capacity of the first cavity, the capillary channels 31 located in the same position, i.e., within the same heat exchange plate assembly 3, can obtain cryogenic refrigerant with the same initial pressure and initial flow rate.
[0079] The low-temperature medium in the low-temperature medium distribution pipe 12 enters the first cavity through the through holes in the pipe wall. Therefore, when arranging the through holes, they can be selected to correspond one-to-one with the arrangement position of the heat exchange plate assembly 3, that is, to arrange them evenly at equal intervals, so as to reduce the residence time of the low-temperature heat exchange medium in the first cavity and quickly enter the capillary channel 31 for heat exchange.
[0080] In some embodiments, such as Figure 3As shown, the low-temperature medium filling port 11 and the high-temperature medium outlet 21 are located at different ends of the microchannel evaporator. At this time, the distance between the far end of the low-temperature medium channel 1 and the near end of the high-temperature medium channel 2 is relatively close. Therefore, the negative pressure suction at the far end of the low-temperature medium channel 1 is greater than that at the near end. By making the through holes at the near end of the low-temperature medium distribution pipe 12 dense and the through holes at the far end sparse, the refrigerant supply at the near end of the first cavity is increased and the refrigerant supply at the far end of the first cavity is reduced, thereby balancing the heat exchange medium flow rate of the capillary channel 31 in the heat exchange plate assembly 3 located at different positions.
[0081] In some embodiments, the high-temperature medium channel 2 includes a second cavity, a high-temperature medium manifold 22, and a high-temperature medium outlet 21;
[0082] The second cavity is used to communicate with the capillary channel 31. The high-temperature medium manifold 22 is built into the second cavity, and the high-temperature medium outlet 21 is connected to the high-temperature medium manifold 22.
[0083] The pipe wall of the high-temperature medium manifold 22 has several sets of through holes arranged along its length. The spacing of the through holes near the high-temperature medium outlet 21 is greater than that at the other end.
[0084] like Figure 3 , Figure 4 and Figure 5 As shown, the high-temperature medium channel 2 is constructed by enclosing the high-temperature medium manifold 22 within a second cavity, allowing the high-temperature heat exchange medium after heat exchange through the capillary channel 31 to preferentially enter the second cavity. The medium then enters the high-temperature medium manifold 22 through the through-hole in its wall, where it is collected. In some embodiments, the high-temperature medium manifold 22 is coaxially arranged with the second cavity, and the height of the through-hole in the high-temperature medium manifold 22 is higher than the outlet of the capillary channel 31. Therefore, the liquid portion of the heat exchange medium passing through the capillary channel 31 remains in the second cavity, while the gas portion enters the high-temperature medium manifold 22, achieving gas-liquid separation.
[0085] In some embodiments, the spacing of the through holes at the near end of the high-temperature medium manifold 22 is greater than that at the far end, in order to solve the problem of different negative pressure suction at different positions of the high-temperature medium manifold 22, so that the far end and the near end can obtain a relatively close gaseous heat exchange medium collection speed.
[0086] like Figure 4 As shown, since the high-temperature medium manifold 22 is mainly used to collect gaseous heat exchange medium, in order to increase the collection speed, the through holes are arranged in a ring array on the pipe wall of the high-temperature medium manifold 22 to increase the speed at which the gaseous heat exchange medium enters the high-temperature medium manifold 22.
[0087] In some embodiments, the arrangement height of the high-temperature medium channel 2 is higher than that of the low-temperature medium channel 1;
[0088] A reflux channel 4 is provided between the high-temperature medium channel 2 and the low-temperature medium channel 1 to allow the liquid medium in the high-temperature medium channel 2 to flow back to the low-temperature medium channel 1.
[0089] When the low-temperature heat exchange medium passes through the capillary channel 31 in a gas-liquid mixed form, there is a situation of incomplete vaporization, that is, liquid heat exchange medium enters the high-temperature medium channel 2. When the amount of liquid heat exchange medium exceeds a certain amount, it will enter the compressor of the subsequent equipment, causing damage to the compressor. Moreover, the cold energy in the liquid heat exchange medium is not fully utilized, resulting in low overall cold energy utilization rate of the microchannel evaporator.
[0090] like Figure 1 , Figure 3 and Figure 4 As shown, a reflux channel 4 is provided to allow the liquid heat exchange medium in the high-temperature medium channel 2 to flow back into the low-temperature medium channel 1, and then exchange heat again through the capillary channel 31, thereby improving the utilization rate of the cold energy in the heat exchange medium.
[0091] In some embodiments, the inlet end of the reflux channel 4 is connected at a low position to the outlet end of the high-temperature medium channel 2;
[0092] The outlet end of the reflux channel 4 is connected to the end of the cryogenic medium channel 1 furthest from the inlet end.
[0093] Setting the inlet of the reflux channel 4 at the outlet of the high-temperature medium channel 2 helps the liquid heat exchange medium in the high-temperature medium channel 2 to converge with the gaseous heat exchange medium at the inlet of the reflux channel 4, thereby facilitating the reflux of the liquid heat exchange medium.
[0094] The outlet of the reflux channel 4 is set at the end of the low-temperature medium channel 1 away from the inlet section, so that the inlet and outlet of the reflux channel 4 are both in the low-pressure zone of the corresponding cavity, avoiding the reverse flow of gaseous heat exchange medium caused by the pressure difference between the two ends.
[0095] In some embodiments, the return channel 4 is connected in series with a U-shaped bend structure 41 to form a liquid seal at the U-shaped bend structure 41.
[0096] like Figure 2 As shown, a U-shaped bend structure 41 is provided in the return channel 4. When the liquid passes through, part of it remains in the U-shaped bend structure 41, forming a liquid seal. This can also prevent gas from passing through, thus avoiding the gaseous heat exchange medium from passing through the return channel 4.
[0097] In some embodiments, the planes on which two adjacent heat exchange plate assemblies 3 are located are parallel, and the two ends of the heat exchange plate assemblies 3 are detachably connected to the low-temperature medium channel 1 and the high-temperature medium channel 2, respectively.
[0098] like Figure 1 As shown, the planes of adjacent heat exchange plate components 3 are parallel, so the planes of the inserted heat spreader 5 are also parallel, which facilitates the heat source of the steam arrangement to contact the heat spreader 5 for heat exchange.
[0099] In addition, the heat exchange plate assembly 3 is detachably assembled with the low-temperature medium channel 1 and the high-temperature medium channel 2, which allows for disassembly and maintenance of a single heat exchange plate assembly 3, thus improving maintenance convenience.
[0100] In some embodiments, the opening directions of two adjacent sets of slots 32 are the same or opposite.
[0101] like Figure 6 and Figure 7 As shown, slot 32 can be designed to be open at both ends, or open at one end and closed at the other. When it is open at one end, the opening directions can be consistent, such as... Figure 6 As shown, the inserted heat spreaders 5 are neatly arranged on one side of the microchannel evaporator; when the opening directions are opposite, as... Figure 7 As shown, the inserted heat spreader 5 is arranged in a fishbone pattern on both sides of the microchannel evaporator.
[0102] In some embodiments, such as Figure 8 and Figure 9 As shown, the heat exchange plate structure 3 is a flat plate design, eliminating the slot 32, and the width direction of the heat exchange plate structure is consistent with the length direction of the low temperature medium channel 1 and the high temperature medium channel 2, so that multiple heat exchange plate structures 3 can be combined to form a large plane for direct contact with the heat source for heat dissipation.
[0103] Meanwhile, multiple microchannel evaporators can be connected in parallel, so that the heat exchange plate structure 3 of multiple microchannel evaporators can be combined to form a large plane, and the heat source can directly contact the heat exchanger.
[0104] Specifically, in the application of power battery heat dissipation, after multiple microchannel evaporators are connected in parallel, all the heat exchange plate structures 3, as well as the high-temperature medium channels 2 and low-temperature medium channels 1 at both ends of the heat exchange plate structures 3, together form a large plane. The power battery can be directly laid flat on the above-mentioned large plane and directly contact the heat exchange plate structures 3 for heat exchange.
[0105] In addition to the microchannel evaporators disclosed in the above embodiments, this utility model also provides a heat exchanger with a heat spreader plate, including a heat spreader plate 5 and the microchannel evaporator of any one of the above embodiments.
[0106] One end of the heat spreader 5 is fixedly inserted into the slot 32, and the other end is used to contact the heat source for heat exchange.
[0107] The structure of the other parts of this heat exchanger is described in reference to existing technologies and will not be repeated here.
[0108] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.
[0109] The microchannel evaporator and heat exchanger with a vapor chamber provided by this utility model have been described in detail above. Specific examples have been used to illustrate the principle and implementation of this utility model. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core idea of this utility model. It should be noted that those skilled in the art can make several improvements and modifications to this utility model without departing from the principle of this utility model, and these improvements and modifications also fall within the protection scope of the claims of this utility model.
Claims
1. A microchannel evaporator, characterized in that, include: Low-temperature medium channel (1); A high-temperature medium channel (2) is arranged in parallel with the low-temperature medium channel (1); Several heat exchange plate components (3) are spaced apart between the low temperature medium channel (1) and the high temperature medium channel (2), and several capillary channels (31) are provided in the heat exchange plate components (3), with the two ends of the capillary channels (31) respectively connected to the low temperature medium channel (1) and the high temperature medium channel (2). The heat exchange plate assembly (3) is provided with a slot (32) for inserting a heat spreader plate (5), and the capillary channel (31) is arranged around the inner wall of the slot (32).
2. The microchannel evaporator according to claim 1, characterized in that, The end of the low-temperature medium channel (1) is connected to a low-temperature medium filling port (11), and the end of the high-temperature medium channel (2) is connected to a high-temperature medium outlet (21). The low-temperature medium filling port (11) and the high-temperature medium outlet (21) are located at different ends of the microchannel evaporator.
3. The microchannel evaporator according to claim 1, characterized in that, The cryogenic medium channel (1) includes a first cavity, a cryogenic medium distribution pipe (12), and a cryogenic medium filling port (11). The first cavity is used to communicate with the capillary channel (31), the cryogenic medium distribution pipe (12) is built into the first cavity, and the cryogenic medium filling port (11) is communicated with the cryogenic medium distribution pipe (12); The wall of the cryogenic medium distribution pipe (12) is provided with several sets of through holes along its length. The through holes are arranged at equal intervals, or the spacing of the through holes near the cryogenic medium filling port (11) is smaller than that of the through holes at the other end.
4. The microchannel evaporator according to claim 1, characterized in that, The high-temperature medium channel (2) includes a second cavity, a high-temperature medium manifold (22), and a high-temperature medium outlet (21). The second cavity is used to communicate with the capillary channel (31), the high temperature medium manifold (22) is built into the second cavity, and the high temperature medium outlet (21) is communicated with the high temperature medium manifold (22); The pipe wall of the high-temperature medium manifold (22) is provided with several sets of through holes along the length direction. The spacing of the through holes at the end near the high-temperature medium outlet (21) is greater than that at the other end.
5. The microchannel evaporator according to claim 1, characterized in that, The arrangement height of the high temperature medium channel (2) is higher than that of the low temperature medium channel (1); A reflux channel (4) is provided between the high-temperature medium channel (2) and the low-temperature medium channel (1) to allow the liquid medium in the high-temperature medium channel (2) to flow back to the low-temperature medium channel (1).
6. The microchannel evaporator according to claim 5, characterized in that, The inlet end of the reflux channel (4) is connected to the low end of the outlet end of the high temperature medium channel (2); The outlet end of the reflux channel (4) is connected to the end of the cryogenic medium channel (1) away from the inlet end.
7. The microchannel evaporator according to claim 5, characterized in that, The return channel (4) is connected in series with a U-shaped bend structure (41) to form a liquid seal at the U-shaped bend structure (41).
8. The microchannel evaporator according to any one of claims 1-7, characterized in that, The planes of two adjacent heat exchange plate assemblies (3) are parallel, and the two ends of the heat exchange plate assemblies (3) are detachably connected to the low temperature medium channel (1) and the high temperature medium channel (2), respectively.
9. The microchannel evaporator according to any one of claims 1-7, characterized in that, The opening directions of two adjacent sets of slots (32) are the same or opposite.
10. A heat exchanger with a heat spreader plate, characterized in that, Includes a heat spreader (5) and a microchannel evaporator as described in any one of claims 1-9; One end of the heat spreader (5) is fixedly inserted into the slot (32).