Wafer epitaxial measurement device

Abstract

The utility model provides a kind of wafer epitaxy measuring device, it is related to precision machinery contact protection technical field.Wafer epitaxy measuring device includes support, drive arrangement, connecting rod and mercury-containing capillary, drive arrangement is fixedly installed on support;One end of connecting rod is fixedly connected with the moving end of drive arrangement, and the other end extends along horizontal direction;Mercury-containing capillary is fixedly arranged at the end of connecting rod away from drive arrangement, mercury-containing capillary is arranged at the underside of connecting rod, mercury-containing capillary extends towards the side away from connecting rod, the measuring end of mercury-containing capillary is provided with recess, recess is embedded with elastic washer, and elastic washer protrudes to the measuring end surface of mercury-containing capillary outside.The test device of the application can not only effectively reduce the indentation left by quartz mercury-containing capillary on wafer surface, improve yield, but also can alleviate the damage caused by foreign matter on wafer surface to mercury-containing capillary, save a lot of mercury-containing capillary replacement cost and maintenance cost.

Description

Technical Field

[0001] This utility model relates to the field of precision mechanical contact protection technology, and in particular to a wafer epitaxial measurement device. Background Technology

[0002] The epitaxial layer of a wafer refers to a single-crystal thin film deposited on the surface of a wafer using epitaxial growth technology. The carrier concentration of the epitaxial layer is one of the core parameters affecting the performance of semiconductor devices. Its level and distribution directly alter the electrical properties of the material, the operating state of the device, and the circuit function. Carrier concentration is typically measured using contact-type concentration testing equipment. The testing principle of contact-type concentration testing equipment is as follows: a probe filled with mercury in the testing device contacts the surface of the epitaxial layer of the wafer under test. The mercury in the probe forms a capacitance structure with the surface of the sample. By measuring the capacitance change of the sample under different voltages, the carrier concentration of the epitaxial layer is analyzed. In existing technologies, the probe, as a crucial component of contact-type concentration testing equipment, directly contacts the epitaxial layer during measurement, easily leaving indentations on the wafer surface. Utility Model Content

[0003] This invention provides a wafer epitaxial measurement device to alleviate the problem of indentation that easily occurs during wafer epitaxial testing.

[0004] This utility model provides a wafer epitaxial measurement device, which includes a support, a driving device, a connecting rod, and a mercury-containing capillary. The driving device is fixedly mounted on the support. One end of the connecting rod is fixedly connected to the moving end of the driving device, and the other end extends horizontally. The mercury-containing capillary is fixedly disposed at the end of the connecting rod opposite to the driving device. The mercury-containing capillary is disposed on the lower side of the connecting rod and extends towards the side opposite to the connecting rod. The measuring end of the mercury-containing capillary is provided with a groove, and an elastic washer is embedded in the groove. The elastic washer protrudes beyond the surface of the measuring end of the mercury-containing capillary.

[0005] In one embodiment of the present invention, the bracket includes a base plate and a fixing plate fixedly connected to the base plate, and the fixed end of the driving device is fixedly mounted on the fixing plate.

[0006] In one embodiment of this utility model, the driving device is an electric cylinder.

[0007] In one embodiment of this utility model, the elastic washer is made of hydrogenated nitrile rubber.

[0008] In one embodiment of the present invention, the elastic washer includes a support body and a rubber material covering the support body.

[0009] In one embodiment of the present invention, the surface of the elastic washer is coated with a polytetrafluoroethylene coating, the thickness of the polytetrafluoroethylene coating is 10-20 μm, and the coefficient of friction of the elastic washer is 0.05-0.1.

[0010] In one embodiment of this utility model, the mercury-containing capillary is fixedly connected to the connecting rod by a clamp.

[0011] In one embodiment of this utility model, a pressure sensor is provided between the clamp and the connecting rod.

[0012] In one embodiment of the present invention, the measuring device further includes a controller, which is electrically connected to the driving device and the pressure sensor respectively.

[0013] In one embodiment of the present invention, the edge of the groove is provided with a chamfer, and the radius of the chamfer is 0.1mm.

[0014] The beneficial effects of this utility model are as follows: This utility model proposes a wafer epitaxial measurement device. A driving device is fixedly mounted on a support. The moving end of the driving device is fixedly connected to a connecting rod, allowing the connecting rod to move on the support. A mercury-containing capillary is fixedly mounted at the end of the connecting rod opposite to the driving device. The connecting rod can move the mercury-containing capillary to apply pressure to the wafer epitaxy, thereby achieving wafer epitaxy measurement. The addition of an elastic washer at the test end of the mercury-containing capillary not only effectively reduces the indentation left by the quartz mercury-containing capillary on the wafer surface, improving yield, but also mitigates damage to the mercury-containing capillary caused by foreign matter on the wafer surface, saving significant replacement and maintenance costs for the mercury-containing capillary. Attached Figure Description

[0015] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0016] In the attached diagram:

[0017] Figure 1 This is a schematic diagram of the structure of a wafer epitaxial measurement device provided in an embodiment of the present invention;

[0018] Figure 2 This is a schematic diagram of the mercury-containing capillary in a wafer epitaxial measurement device provided in one embodiment of the present invention;

[0019] Figure 3 This is a schematic diagram of the structure of the mercury-containing capillary and elastic gasket in a wafer epitaxial measurement device provided in one embodiment of the present invention.

[0020] The attached figures are labeled as follows:

[0021] 100, bracket; 110, base plate; 120, fixing plate; 200, drive device; 210, fixed end; 220, moving end; 300, connecting rod; 400, mercury-containing capillary tube; 410, groove; 500, elastic washer; 600, clamp; 700, pressure sensor. Detailed Implementation

[0022] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0023] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. The drawings only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0024] In the following description, numerous details are explored to provide a more thorough explanation of embodiments of the present invention. However, it will be apparent to those skilled in the art that embodiments of the present invention may be practiced without these specific details. In other embodiments, well-known structures and devices are shown in block diagram form rather than in detail to avoid obscuring embodiments of the present invention.

[0025] Please see Figures 1 to 3This application provides a wafer epitaxial measurement device, which includes a support 100, a driving device 200, a connecting rod 300, and a mercury-containing capillary 400. The driving device 200 is fixedly mounted on the support 100. One end of the connecting rod 300 is fixedly connected to the moving end 220 of the driving device 200, and the other end of the connecting rod 300 extends horizontally. The mercury-containing capillary 400 is fixedly disposed at the end of the connecting rod 300 away from the driving device 200. The mercury-containing capillary 400 is disposed on the lower side of the connecting rod 300 and extends towards the side away from the connecting rod 300. The measuring end of the mercury-containing capillary 400 is provided with a groove 410, and an elastic washer 500 is embedded in the groove 410. The elastic washer 500 protrudes beyond the surface of the measuring end of the mercury-containing capillary 400. During wafer epitaxial layer testing, the mercury column in the mercury-containing capillary 400 forms a capacitance structure with silicon carbide (SiC) or other semiconductor materials, which can be used to measure the electrical properties of the material. During testing, it is sufficient to ensure that the mercury column in the mercury-containing capillary 400 is in contact with the material under test. Therefore, placing an elastic washer 500 at the test end of the mercury-containing capillary 400 does not affect the measurement accuracy. In this application, placing an elastic washer 500 at the test end of the mercury-containing capillary 400 not only reduces the indentation left by the quartz mercury-containing capillary 400 on the wafer surface and alleviates damage caused by foreign matter on the wafer surface to the mercury-containing capillary 400, thus improving the yield, but also saves a significant amount of replacement and maintenance costs for the mercury-containing capillary 400.

[0026] Please see Figure 1 The bracket 100 serves as a fixed support, ensuring the stability of the entire testing device. In one embodiment, the bracket 100 includes a base plate 110 and a fixing plate 120 fixedly connected to the base plate 110, with the fixed end 210 of the drive device 200 fixedly mounted on the fixing plate 120. This structural design allows the drive device 200 to be stably fixed, effectively avoiding shaking caused by unstable installation during measurement and ensuring measurement accuracy.

[0027] Please see Figure 1 In one embodiment, the driving device 200 can be any device capable of driving the connecting rod 300 to slide on the support 100, and can meet the accuracy requirements. In this embodiment, the driving device 200 is an electric cylinder, which has advantages such as high precision, high stability, and good controllability. It can accurately achieve linear motion, meeting the stringent requirements for driving precision in wafer epitaxial measurement. It can precisely control the distance and speed of movement according to measurement needs, thereby ensuring the smooth progress of the measurement work. In other embodiments, the driving device 200 can also be other devices in the art, as long as they meet the usage requirements.

[0028] Please see Figures 1 to 3In one embodiment, the elastic washer 500 can be made of any elastic material. In this embodiment, the elastic washer 500 is made of hydrogenated nitrile butadiene rubber. Hydrogenated nitrile butadiene rubber has excellent oil resistance, heat resistance, and aging resistance, and can adapt to various complex environments that may be encountered during wafer epitaxial measurement, ensuring that the elastic washer 500 maintains good elasticity during long-term use, further improving the reliability of the device.

[0029] Please see Figures 1 to 3 In one embodiment, the elastic washer 500 includes a support body and a rubber material covering the support body. The support body provides good structural support for the elastic washer 500, preventing excessive deformation of the elastic washer 500 under pressure, while the external rubber material reduces wear on the wafer surface. The combination of the support body and the rubber material can maintain the elastic buffering performance of the elastic washer 500 and provide sufficient support force to prevent uneven pressure on the wafer epitaxy due to excessive deformation.

[0030] Please see Figure 3 This application does not limit the dimensions of the groove 410 and the elastic washer 500, which can be adjusted according to actual needs. To ensure the stability of the elastic washer 500, the width of the elastic washer 500 is greater than the width of the groove 410. In one embodiment, the height of the elastic washer 500 protruding to the measuring end surface of the mercury-containing capillary 400 is 0.04 to 0.06 mm. For example, the depth of the groove 410 is 0.35 mm, the width of the groove 410 is 0.35 mm, and the cross-sectional diameter of the elastic washer 500 is 0.4 mm. This ensures that the elastic washer 500 is stably embedded in the groove 410, preventing it from falling out during use, and also increases the contact area between the elastic washer 500 and the wafer and disperses pressure.

[0031] Please see Figures 1 to 3In one embodiment, the surface of the elastic washer 500 is coated with a polytetrafluoroethylene (PTFE) coating, the thickness of which is 10–20 μm. Exemplarily, a hydrogenated nitrile rubber O-ring is placed in a PTFE suspension and sintered at 300°C to form the PTFE coating. PTFE has an extremely low coefficient of friction; coating it on the surface of the elastic washer 500 significantly reduces the friction between the elastic washer 500 and other components, making the relative movement between related components smoother during operation, reducing energy loss, and improving the operating efficiency of the device. Simultaneously, the PTFE coating also has good chemical stability, further enhancing the chemical corrosion resistance of the elastic washer 500 and preventing it from being corroded and damaged in harsh chemical environments. Controlling the coating thickness to 10–20 μm ensures sufficient thickness to exert its friction-reducing and corrosion-resistant properties without compromising the elasticity or other properties of the elastic washer 500 due to excessive thickness. For example, the coefficient of friction of the elastic washer 500 is 0.05 to 0.1. This low coefficient of friction effectively reduces friction when the elastic washer 500 comes into contact with other components and undergoes relative movement. During the operation of the measuring device, excessive friction between the elastic washer 500 and the test piece may cause uneven movement of the components, affecting the accuracy and stability of the measuring device.

[0032] Please see Figure 2 and Figure 3 In one embodiment, the edge of the groove 410 is chamfered with a radius of 0.1 mm. The chamfer at the groove 410 prevents stress concentration that could cause the quartz tube to crack, and also prevents the edge of the groove 410 from being too sharp, thus preventing scratches on the wafer surface during wafer placement or handling, protecting the wafer's integrity and ensuring that measurement results are not affected by wafer surface damage.

[0033] Please see Figure 1 In one embodiment, the mercury-containing capillary 400 is fixedly connected to the connecting rod 300 via a clamp 600. The clamp 600 can be any device capable of firmly holding the mercury-containing capillary 400, preventing it from shaking or displacing during operation of the measuring device and affecting the measurement results. The clamp 600 and the mercury-containing capillary 400 can be connected by clamping, nesting, or other methods to ensure a tight and stable connection. The clamp 600 and the connecting rod 300 are also fixedly connected, such as by bolts or welding, to ensure that no relative displacement occurs between the clamp 600 and the connecting rod 300 during device operation. This allows the mercury-containing capillary 400 to be stably held in the required position, accurately performing its function in the wafer epitaxial measurement device.

[0034] Please see Figure 1In one embodiment, a pressure sensor 700 is disposed between the clamp 600 and the connecting rod 300. The pressure sensor 700 plays a crucial monitoring role in this device. During the measurement process, a certain pressure is generated when the mercury-containing capillary 400 comes into contact with the object being measured. This pressure is transmitted to the pressure sensor 700 through the clamp 600. The pressure sensor 700 can monitor the pressure magnitude in real time and convert the pressure signal into an electrical signal output. By analyzing the output signal of the pressure sensor 700, the operator can understand the contact pressure between the mercury-containing capillary 400 and the wafer epitaxial layer in real time, and thus adjust the relevant parameters of the measuring device according to actual needs to ensure that the pressure is moderate during the measurement process, which can ensure the accuracy of the measurement without damaging the wafer epitaxial layer due to excessive pressure. In one embodiment, the measuring device also includes a controller (not shown in the figure). The controller is electrically connected to the drive device 200 and the pressure sensor 700 respectively. The pressure monitoring range of the pressure sensor 700 and the pressure adjustment parameters of the controller are set to determine a reasonable pressure threshold. During the measurement process, the pressure sensor 700 monitors the pressure in real time and transmits the signal to the controller. The controller can control the extension length of the moving end 220 of the drive device 200 according to the pressure of the pressure sensor 700, so as to achieve the pressure between the elastic washer 500 and the wafer epitaxial layer. This ensures that the pressure between the elastic washer 500 and the wafer epitaxial layer is always within a reasonable range during the test, effectively avoiding the formation of indentations and improving the wafer yield. The control method of the controller can refer to the existing technology, and will not be described in detail here. In this embodiment, the pressure sensor 700 is fixedly installed on the side of the connecting rod 300 facing the material to be tested. The clamp 600 and the mercury-containing capillary 400 are nested together. The mercury-containing capillary 400 extends into the clamp 600 from the end facing the pressure sensor 700 and extends out from the end of the clamp 600 away from the pressure sensor 700, and is fixed by fasteners. The clamp 600 has an internal thread at the end facing the pressure sensor 700, and the pressure sensor 700 has an external thread on the side facing away from the connecting rod 300 that matches the internal thread. During installation, the mercury-containing capillary 400 is mounted on the clamp 600, and the clamp 600 and the pressure sensor 700 are fixedly connected by threads, thereby fixing the mercury-containing capillary 400 and facilitating its replacement.

[0035] This invention relates to a wafer epitaxial measurement device. A drive unit is fixedly mounted on a support. The moving end of the drive unit is fixedly connected to a connecting rod, allowing the connecting rod to move on the support. A mercury-containing capillary is fixedly mounted at the end of the connecting rod opposite to the drive unit. The connecting rod can move the mercury-containing capillary to apply pressure to the wafer epitaxy, thereby achieving wafer epitaxy measurement. The addition of an elastic washer at the test end of the mercury-containing capillary not only effectively reduces the indentation left by the quartz mercury-containing capillary on the wafer surface, improving yield, but also mitigates damage to the mercury-containing capillary caused by foreign matter on the wafer surface, saving significant replacement and maintenance costs for the mercury-containing capillary.

[0036] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A wafer epitaxial measurement device, characterized in that, include: Support (100); A drive unit (200) is fixedly mounted on the bracket (100); A connecting rod (300) has one end fixedly connected to the moving end (220) of the driving device (200), and the other end extends out in the horizontal direction; A mercury-containing capillary (400) is fixedly disposed at one end of the connecting rod (300) away from the driving device (200). The mercury-containing capillary (400) is disposed on the lower side of the connecting rod (300) and extends toward the side away from the connecting rod (300). A groove (410) is provided at the measuring end of the mercury-containing capillary (400), and an elastic washer (500) is embedded in the groove (410). The elastic washer (500) protrudes to the outside of the measuring end surface of the mercury-containing capillary (400).

2. The wafer epitaxial measurement apparatus according to claim 1, characterized in that, The bracket (100) includes a base plate (110) and a fixing plate (120) fixedly connected to the base plate (110), and the fixed end (210) of the drive device (200) is fixedly installed on the fixing plate (120).

3. The wafer epitaxial measurement apparatus according to claim 1, characterized in that, The drive device (200) is an electric cylinder.

4. The wafer epitaxial measurement apparatus according to claim 1, characterized in that, The elastic washer (500) is made of hydrogenated nitrile rubber.

5. The wafer epitaxial measurement apparatus according to claim 1, characterized in that, The elastic washer (500) includes a support body and a rubber material covering the support body.

6. The wafer epitaxial measurement apparatus according to claim 1, characterized in that, The surface of the elastic washer (500) is coated with a polytetrafluoroethylene coating, the thickness of which is 10-20 μm, and the coefficient of friction of the elastic washer (500) is 0.05-0.

1.

7. The wafer epitaxial measurement apparatus according to claim 1, characterized in that, The mercury-containing capillary (400) is fixedly connected to the connecting rod (300) by a clamp (600).

8. The wafer epitaxial measurement apparatus according to claim 7, characterized in that, A pressure sensor (700) is provided between the clamp (600) and the connecting rod (300).

9. The wafer epitaxial measurement apparatus according to claim 8, characterized in that, The measuring device also includes a controller, which is electrically connected to the drive device (200) and the pressure sensor (700) respectively.

10. The wafer epitaxial measurement apparatus according to claim 1, characterized in that, The groove (410) has a chamfered edge with a radius of 0.1 mm.

Images