Chip aggregation light detection system

Abstract

The utility model provides a kind of chip aggregation light's detection system, it include: optical chip, focusing device and detection device, the coupling module of dense arrangement in optical chip receives the optical signal transmitted by waveguide module and exports optical signal to focusing device, focusing device focuses the output optical signal of optical chip to detection device, wherein the one-to-one connection between each waveguide of waveguide module and each coupler of coupling module can also be carried out multiple-to-one connection.The utility model is by using focusing device, and / or improve the structure of optical chip itself, so that the intensity of the output optical signal of optical chip is promoted and all output to detection device, to further improve the signal-to-noise ratio of detection system and detection task.

Description

Technical Field

[0001] This utility model relates to the field of optoelectronic chip design, and in particular to a detection system for chip-generated light. Background Technology

[0002] In the field of optical signal sensing, photonic integrated chips can perform various functions such as signal collection, modulation, splitting, interference, and emission. However, in some applications using photonic chips for biomarker detection, the signal from a single optically coupled I / O port of the photonic chip is often quite weak. When this weak signal output from the I / O port is received by a photodetector, such as a CCD, APD, SPAD, PMT, or photodiode, the low intensity of the optical signal output from the I / O port significantly impacts the signal-to-noise ratio of the entire photoelectric detection system due to the low noise level.

[0003] To reduce the impact of thermal noise from photodetectors on the system's signal-to-noise ratio (SNR), detection systems typically employ deep cooling to reduce thermal noise. However, cooling increases product complexity and cost, making it less than ideal. Therefore, designing a photodetector system that can improve the SNR while reducing energy consumption and cost has become a pressing technical challenge for those skilled in the art.

[0004] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this utility model and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background section of this utility model. Utility Model Content

[0005] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a detection system for chip-based light aggregation, which solves the problem of unsatisfactory signal-to-noise ratio in weak light detection of existing photoelectric detection systems.

[0006] To achieve the above and other related objectives, this utility model provides a chip-based light aggregation detection system, which includes at least: an optical chip, a focusing device, and a detection device; the optical chip includes a waveguide module and a coupling module; the waveguide module includes A waveguides, and the coupling module includes B couplers, wherein A and B are both natural numbers greater than or equal to 1, and A equals B; one waveguide corresponds to one coupler; the B couplers output B optical signals, which serve as the output optical signals of the optical chip; the focusing device is disposed between the optical chip and the detection device; the focusing device focuses the output optical signals of the optical chip onto the detection device.

[0007] Optionally, couplers located on the same process plane are arranged in groups. When the coupler is a grating coupler, the arrangement density of each coupler group is greater than or equal to 80 groups / When the coupler is an end-face coupler, the arrangement density of each coupler group is greater than or equal to 30 groups / .

[0008] Optionally, the coupler is a grating coupler, and B couplers are stacked in layers in the optical chip, with the vertical projections of each coupler layer overlapping.

[0009] To achieve the above and other related objectives, this utility model also provides a chip-based light aggregation detection system, which includes at least: an optical chip, a focusing device, and a detection device; the optical chip includes a waveguide module and a coupling module; the waveguide module includes A waveguides, and the coupling module includes B couplers, wherein A and B are both natural numbers greater than or equal to 1, and A is greater than B; multiple waveguides are connected to a coupler based on a beam combiner, and / or multiple waveguides are connected to a multi-waveguide coupler, wherein there are C beam combiners and D multi-waveguide couplers, where C and D are both integers greater than or equal to 0, and C + D = B; the B couplers output B optical signals, which serve as the output optical signals of the optical chip; the focusing device is disposed between the optical chip and the detection device; the focusing device focuses the output optical signals of the optical chip onto the detection device.

[0010] Optionally, when the coupler is a grating coupler, the arrangement density of each coupler on the same process plane is greater than or equal to 80 / 100. When the coupler is an end-face coupler, the arrangement density of each coupler on any edge of the optical chip is greater than or equal to 30 / 100. .

[0011] Optionally, the beam combiner includes a beam combiner structure and a multimode waveguide; the multi-branch input terminals of the beam combiner structure are connected one-to-one with multiple waveguides, and the output terminal is connected to one end of the multimode waveguide; the other end of the multimode waveguide is connected to the input terminal of the coupler.

[0012] Optionally, the multi-waveguide coupler includes a coupling structure and a grating structure; the first end of the coupling structure is connected to multiple waveguides, and the second end is connected to the input end of the grating structure.

[0013] Optionally, all B couplers are located on the same process plane.

[0014] Alternatively, the coupler is a grating coupler, which outputs an optical signal from the upper or lower surface of the optical chip.

[0015] Alternatively, each coupler can focus its corresponding optical signal onto the focusing device.

[0016] Alternatively, the coupler is an end-face coupler, which outputs optical signals from the side of the optical chip.

[0017] Optionally, the focusing device includes N lenses, and when N is greater than or equal to 2, the optical axes of the N lenses coincide; where N is a natural number greater than or equal to 1.

[0018] As described above, the chip-based light-gathering detection system of this invention has the following beneficial effects:

[0019] 1. This utility model overcomes the shortcomings of the small light flux transmitted by the optical coupler by setting a focusing device between the optical chip and the detection device, and inputs all the output light signal into the detection device, thereby achieving light flux matching between the optical chip and the detection device, and improving the intensity of the output light signal, thus achieving the purpose of improving the signal-to-noise ratio of the detection system.

[0020] 2. This utility model improves the structure of the optical chip by setting a beam combiner, which not only increases the intensity of the output optical signal but also improves the collection efficiency of the focusing device, which is beneficial to reducing the size of the focusing device and the entire detection system.

[0021] 3. This utility model improves the structure of the optical chip by modifying the coupler, which not only increases the intensity of the optical signal and the collection efficiency of the focusing device and reduces the size of the device, but also simplifies the structure of the optical chip.

[0022] 4. By stacking multiple couplers, this utility model improves the intensity of the output optical signal and the collection efficiency of the focusing device without using a beam combiner or multi-waveguide coupler, thus achieving the utility model objective of improving the signal-to-noise ratio.

[0023] 5. This utility model can significantly improve the collection efficiency of the focusing device and the signal-to-noise ratio of the detection system by focusing the optical signals output by each coupler onto the focusing device and setting the focusing device as a microlens. Attached Figure Description

[0024] Figure 1 The diagram shown is a simplified structural schematic of the chip-based light-gathering detection system of this invention.

[0025] Figure 2 This diagram shows a dense arrangement of couplers on the same process surface in the optical chip of this invention.

[0026] Figure 3 The diagram shown is a schematic diagram of the first spatial structure of the chip-based light-gathering detection system of this utility model.

[0027] Figure 4 The diagram shown is a second spatial structure schematic of the chip-based light-gathering detection system of this invention.

[0028] Figure 5 The diagram shown is a third spatial structure schematic of the chip-based light-gathering detection system of this utility model.

[0029] Figure 6 The diagram shown is a fourth spatial structure schematic of the chip-based light-gathering detection system of this utility model.

[0030] Figure 7 This diagram shows the fifth spatial structure of the chip-based light-gathering detection system of this invention.

[0031] Figure 8 The diagram shown is a structural schematic of the bundle combiner of this utility model.

[0032] Figure 9 The diagram shown is a schematic diagram of the first structure of the multi-waveguide coupler of this utility model.

[0033] Figure 10 The diagram shown is a second structural schematic of the multi-waveguide coupler of this utility model.

[0034] Figure 11 The diagram shown is a third structural schematic of the multi-waveguide coupler of this utility model.

[0035] Figure 12 The diagram shown is a flowchart of the chip polymerization light extraction method of this utility model.

[0036] Component designation explanation

[0037] 1 optical chip

[0038] 11 Waveguide Module

[0039] 12 Coupling Modules

[0040] 2. Focusing device

[0041] 3. Detection device

[0042] 1a waveguide

[0043] 1b Coupler

[0044] 1c combiner

[0045] 1d multi-waveguide coupler

[0046] 1e Bundle combiner structure

[0047] 1f multimode waveguide of the beam combiner

[0048] Coupling structure of 1g multi-waveguide coupler

[0049] Grating structure of 1h multi-waveguide coupler Detailed Implementation

[0050] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0051] Please see Figures 1-12 It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the illustrations only show the components related to this utility model and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0052] Due to design and manufacturing limitations, optical waveguides are typically small in size and have low luminous flux (also known as optical extension). The luminous flux of optically coupled I / O ports is also relatively small. On the other hand, since photodetectors are not limited by the light propagation mode of optical waveguides, they typically have a large light reception angle NA. In particular, photodetectors can further increase the light reception angle by integrating microlenses. Therefore, the luminous flux of the detector often far exceeds that of the optically coupled I / O port.

[0053] In photoelectric detection for weak light, the optical signal output from the optical chip is affected by environmental noise when it enters the detector, resulting in an unsatisfactory signal-to-noise ratio (SNR) of the photoelectric detection system. Based on this, considering the technical background that the optical flux of the detector is much greater than that of the optical coupling port, if the optical flux between the optical chip and the detector can be matched and the energy of the signal light received by the detector can be significantly increased, the SNR of the entire detection system will be greatly improved.

[0054] Therefore, by focusing the output light from all the optically coupled I / O ports in the chip and inputting it into the photodetector, this invention can not only significantly improve the signal-to-noise ratio of the photodetector system by matching the light flux and increasing the energy of the signal light, but also reduce the dependence of the detection system on cooling components, as well as reduce the energy consumption and component costs of the detection system. The specific technical solution of this invention is as follows:

[0055] Example 1

[0056] like Figure 1As shown, this embodiment provides a detection system for chip-generated light, including: an optical chip 1, a focusing device 2, and a detection device 3.

[0057] like Figure 1 As shown, the optical chip 1 includes a waveguide module 11 and a coupling module 12; the waveguide module 11 includes A waveguides 1a, and the coupling module 12 includes B couplers 1b, where A and B are natural numbers greater than or equal to 1, and A equals B; one waveguide 1a is connected to one coupler 1b; the B couplers 1b correspond to the output B optical signals and serve as the output optical signals of the optical chip 1.

[0058] Specifically, in this embodiment, in the optical chip 1, B couplers 1b are used to receive optical signals transmitted in A waveguides 1a, and the B couplers 1b will output B optical signals in a one-to-one correspondence as the output optical signals of the optical chip 1. Further, the waveguides 1a and couplers 1b are connected in a one-to-one correspondence, so the number of waveguides 1a is equal to the number of couplers 1b. Even further, the couplers 1b are densely arranged, that is, the couplers 1b located on the same process plane are grouped, and the couplers in each group and the coupler groups are arranged as closely as possible; wherein, when the coupler 1b is a grating coupler, all coupler groups on the same process plane output optical signals concentrated in a predetermined light-emitting area, and the arrangement density of each coupler group on the same process plane is greater than or equal to 80 groups / year. , including but not limited to 90 or more groups / 100 sets / 110 groups / 120 sets / When coupler 1b is an end-face coupler, each coupler group is arranged in an interlaced pattern along the two edges of the optical chip on the same process surface, and the arrangement density of each coupler group on any edge of the optical chip is greater than or equal to 30 groups / , including but not limited to 40 or more groups / 50 sets / 60 sets / 70 sets / As an example, such as Figure 2 As shown, coupler 1b is a grating coupler. Couplers 1b on the same process plane are arranged in groups, and each group of couplers includes 4 closely adjacent couplers (in practical applications, each group of couplers can include more than 2 couplers 1b, or 6, 8, 10, etc.). The number of upper coupler groups is greater than or equal to 100; among them, to facilitate the dense arrangement of coupler 1b, similar to Figure 3Each waveguide 1a is located to the left of the corresponding coupler 1b and connected to the corresponding coupler 1b. In practical applications, the area of ​​the light-emitting region, the number of couplers in each coupler group, and the number of coupler groups on the same process surface are set as needed, and the corresponding arrangement density of the coupler groups is calculated, which is not limited to this embodiment.

[0059] Specifically, in this embodiment, coupler 1b is a grating coupler, and B couplers 1b are stacked layer by layer in the optical chip 1, such as... Figure 3 As shown, the vertical projections of each coupler 1b layer coincide, meaning the arrangement of each coupler 1b layer is consistent with the arrangement of the top coupler 1b layer. Further, the waveguide layers in the optical chip 1 are stacked layer by layer, and each waveguide layer is processed to obtain the coupler layer. The waveguide layer containing the top coupler is closest to the optical chip surface, and as the number of coupler layers increases, the waveguide layer containing the coupler is farther from the optical chip surface. Each waveguide layer has a corresponding process surface, and couplers in the same layer are located on the same process surface. As an example, such as... Figure 3 As shown, the B couplers 1b are divided into three layers in the optical chip 1. These three layers of couplers are stacked sequentially in a direction perpendicular to the upper surface of the optical chip. Correspondingly, the A waveguides 1a are also divided into three layers. Each waveguide 1a in the bottom layer is connected to each coupler 1b in a one-to-one manner. The connection method of each waveguide 1a and coupler 1b in the middle layer is the same as that in the top layer. The couplers 1b in each layer are densely arranged, and the light output areas of each layer overlap in a direction perpendicular to the upper surface of the optical chip, thus reducing the light spot area output by the B couplers 1b. In practical applications, the specific number of layers and arrangement of waveguides 1a and couplers 1b can be set as needed, and are not limited to this embodiment.

[0060] Specifically, in this embodiment, the waveguide layer corresponding to a single process surface is processed to obtain B couplers 1b, that is, all B couplers 1b are formed on the same process surface. Further, as... Figure 4 As shown, coupler 1b is a grating coupler, and each coupler 1b outputs an optical signal from either the upper or lower surface of the optical chip. Furthermore, as... Figure 5 As shown, by designing the grating period of each grating coupler 1b, each optical signal is emitted from the surface of the optical chip at a designed angle, thereby focusing itself to a point in the off-chip space. In practical applications, the specific arrangement of waveguide 1a and coupler 1b can be set as needed, and is not limited to this embodiment.

[0061] Specifically, in this embodiment, such as Figure 6 As shown, B couplers 1b are still formed on the same process plane, and couplers 1b are end-face couplers, with each coupler 1b outputting optical signals from the same side of the optical chip. As an example, such as... Figure 6 As shown, when coupler 1b is an end-face coupler, A waveguides 1a are formed inside the optical chip 1 and are connected one-to-one with each coupler 1b. Each optical signal is emitted from the side of the optical chip into the off-chip space. In practical applications, the specific arrangement of waveguides 1a and couplers 1b can be set as needed, and is not limited to this embodiment.

[0062] like Figure 1 As shown, the focusing device 2 is disposed between the optical chip 1 and the detection device 3; the focusing device 2 focuses the output optical signal of the optical chip 1 onto the detection device 3.

[0063] Specifically, in this embodiment, the focusing device 2 receives B optical signals output from the B couplers 1b in the optical chip 1 and inputs them all to the detection device 3. By focusing each optical signal, the light intensity received by the detection device 3 increases, and the signal-to-noise ratio of the detection system is improved. One end of the focusing device 2 needs to match the numerical aperture (NA) of the B couplers 1b, and the other end needs to match the numerical aperture of the detection device 3. Further, the focusing device 2 includes N lenses. When N is greater than or equal to 2, the optical axes of the N lenses coincide, where N is a natural number greater than or equal to 1.

[0064] Specifically, in this embodiment, the size of the focusing device 2 should be sufficient to receive all the output optical signals from the optical chip. For example, such as... Figure 3 As shown, B grating couplers 1b are stacked in layers. The initial output light signal spot area of ​​the optical chip 1 is relatively small, therefore a small spatial optical lens or a patch microlens can be selected to focus all the light signals; wherein, the patch microlens can be directly attached to the optical chip 1. As another example, such as Figure 4 and Figure 6 As shown, since each coupler 1b is arranged in a single layer within the optical chip, and the B optical signals do not naturally focus, the initial spot area of ​​the optical signal output from the optical chip is relatively large. Therefore, a large spatial optical lens is required to focus all the optical signals and transmit them to the detection device 3. As another example, such as... Figure 5 As shown, each grating coupler 1b is still arranged in a single layer. However, since the optical signals output by each grating coupler 1b naturally focus to a single point, microlenses can be placed at the focal point of each optical signal on the surface of the detection device 3. The microlenses further focus the output optical signals and transmit them to the detection device 3, greatly improving the collection efficiency of the focusing device 2 and significantly reducing the size of the detection system. In practical applications, the specific type of focusing device 2 can be set according to needs, and is not limited to this embodiment.

[0065] Specifically, in this embodiment, by adding a focusing device 2 and by improving the optical chip 1 itself, the detection device 3 can receive all the optical signals output by the optical chip 1 and perform photoelectric conversion. In this process: firstly, the intensity of the output optical signal is improved, the thermal noise effect in the detection system is reduced, and thus the signal-to-noise ratio of the detection system is improved; secondly, since the detection system reduces its dependence on cooling components, the energy consumption and component cost of the system are further reduced.

[0066] Example 2

[0067] like Figure 7 As shown, this embodiment provides a detection system for chip-generated light aggregation, which differs from Embodiment 1 in that:

[0068] like Figure 7 As shown, the optical chip includes a waveguide module 11 and a coupling module 12. The waveguide module 11 includes A waveguides 1a, and the coupling module 12 includes B couplers 1b, where A and B are natural numbers greater than or equal to 1, and A is greater than B. Multiple waveguides 1a are connected to a coupler 1b based on a beam combiner 1c, and / or multiple waveguides 1a are connected to a multi-waveguide coupler 1b, where there are C beam combiners 1c and D multi-waveguide couplers 1d, where C and D are integers greater than or equal to 0, and C+D=B. The B couplers 1b output B optical signals, which serve as the output optical signals of the optical chip.

[0069] Specifically, in this embodiment, the couplers 1b are still densely arranged. Since each coupler 1b is connected to multiple waveguides 1a, the couplers 1b on the same process surface do not need to be grouped. When the coupler 1b is a grating coupler, all couplers on the same process surface output optical signals in a predefined light-emitting area. The arrangement density of each coupler 1b on the same process surface is greater than or equal to 80. , including but not limited to 90 or more 100 pieces / 110 / 120 pieces / When coupler 1b is an end-face coupler, each coupler 1b is arranged in an interlaced pattern along the two edges of the optical chip on the same process surface, and the arrangement density of each coupler 1b on any edge of the optical chip is greater than or equal to 30 / 100. , including but not limited to 40 or more 50 pieces / 60 pieces / 70 pieces / Furthermore, such as Figure 8As shown, waveguide 1a and coupler 1b are connected in a many-to-one manner through beam combiner 1c. The number of optical waveguides 1a beamed by each beam combiner 1c in optical chip 1 can be the same or different. Furthermore, beam combiner 1c includes beam combining structure 1e and multimode waveguide 1f. The multi-branch input ends of beam combining structure 1e are connected one-to-one to multiple waveguides 1a, the output end of beam combining structure 1e is connected to one end of multimode waveguide 1f, and the other end of multimode waveguide 1f is connected to the input end of coupler 1b. As an example, a Y-branch beamsplitter or a multimode interference (MMI) coupler can be selected as the beam combining structure 1f. In practical applications, the specific type of beam combining structure 1f is set according to needs and is not limited to this embodiment.

[0070] Specifically, in this embodiment, such as Figure 9 , Figure 10 and Figure 11 As shown, a many-to-one connection is established between waveguide 1a and multi-waveguide coupler 1d, that is, the structure of coupler 1b is directly improved into multi-waveguide coupler 1d to simplify the structure of the optical chip; wherein, the number of optical waveguides 1a bundled by each multi-waveguide coupler 1d in the optical chip can be the same or different. Further, the multi-waveguide coupler 1d includes a coupling structure 1g and a grating structure 1h, the first end of the coupling structure 1g is connected to multiple waveguides 1a, and the second end is connected to the input end of the grating structure 1h. As an example, such as... Figure 9 and Figure 10 As shown, the width of the first end of the coupling structure 1g can be less than or equal to the width of the second end; as Figure 11 As shown, the width of the first end of the coupling structure 1g can also be greater than the width of the second end (star coupling structure), where, Figure 9 , Figure 10 and Figure 11 Both can ensure that coupler 1b couples multiple optical signals corresponding to multiple waveguides 1a.

[0071] It should be noted that the C value of the number of beam combiners 1c and the D value of the number of multi-waveguide couplers 1d are both integers greater than or equal to 0 and less than or equal to B: when the many-to-one connection between waveguide 1a and coupler 1b is achieved by beam combiners 1c, the C value is equal to the B value; when the many-to-one connection between waveguide 1a and multi-waveguide coupler 1d is achieved, the D value is equal to the B value; when both beam combiners 1c and multi-waveguide couplers 1d exist in optical chip 1, the C value and the D value are added together to equal the B value.

[0072] Specifically, in this embodiment, Figure 4 The one-to-one connection between waveguide 1a and coupler 1b in the optical chip shown is changed to a many-to-one connection: coupler 1b remains a densely arranged grating coupler, such as... Figure 7As shown, the B couplers 1b are still located on the same process surface and output optical signals from the upper surface of the optical chip 1. However, the connection between the waveguide 1a and the coupler 1b is changed to a many-to-one connection to reduce the number of couplers in the optical chip 1, and can even reduce the number of couplers to one. Therefore, the size of the focusing device 2 in the detection system can be reduced. The focusing device 2 can be a patch microlens and directly attached to the light inlet of the detection device 3, and the collection efficiency of the focusing device 2 can also be improved. Furthermore, the size of the focusing device 2 can be further reduced. Figure 5 and Figure 6 The one-to-one connection between waveguide 1a and coupler 1b shown is changed to a many-to-one connection. With corresponding adjustments to various parts of the detection system, the improved detection system can reduce the number of couplers 1b, further improving the collection efficiency of the focusing device 2. Figure 5 and Figure 6 The adjustments made will be set according to the actual situation, and will not be explained in detail here.

[0073] Example 3

[0074] like Figure 12 As shown, this embodiment provides a chip-based light aggregation method, including the following steps:

[0075] like Figure 12 As shown, in step S1, the optical signals of each waveguide in the waveguide module 11 are transmitted to the corresponding couplers in the coupling module 12, and the B optical signals output by the B couplers are used as the output optical signals of the optical chip 1.

[0076] Specifically, in this embodiment, the connection between waveguide 1a and coupler 1b can be a one-to-one connection or a many-to-one connection, as long as it ensures that A waveguides 1a input their respective optical signals to B couplers 1b. Furthermore, the densely arranged B couplers 1b output their respective optical signals one-to-one as the output optical signals of the optical chip 1; wherein, all B couplers 1b can be located on the same process plane, or the B couplers 1b can be stacked in layers. Further still, the detection system for the chip-converged light used in this embodiment can be configured according to actual needs, which will not be described in detail here.

[0077] Specifically, in this embodiment, when coupler 1b is a grating coupler, and B couplers 1b are located on the same process surface and emit light from the upper or lower surface of the optical chip, the emission direction of the corresponding optical signal of each coupler 1b is adjusted so that the B optical signals are focused to a single point. A focusing device 2 is then set at the focal point of the B optical signals. The collection efficiency of the focusing device 2 is greatly improved, and the signal-to-noise ratio is enhanced. Further, the grating period of each coupler 1b is adjusted, and the emission direction of each coupler 1b is adjusted. The formula for calculating the grating period, based on the grating Bragg condition, is as follows: , Indicates the diffraction order. Indicates the operating wavelength. This indicates the effective refractive index of the waveguide used in the grating structure of the grating coupler. This indicates the refractive index of the protective layer on the surface of optical chip 1. This indicates the target emission angle of the grating coupler. In actual use, the grating period of each coupler 1b can be set according to the target emission angle required when each coupler 1b focuses to a point. This will not be explained in detail here.

[0078] like Figure 12 As shown, in step S2, the focusing device 2 receives the output optical signal of the optical chip 1 and transmits it to the detection device 3.

[0079] Specifically, in this embodiment, the focusing device 2 receives B optical signals output from the optical chip 1, enhances the intensity of the B optical signals, and transmits them all to the detection device 3, thus improving the signal-to-noise ratio of the entire photoelectric detection task. The focusing device 2 must match the numerical aperture of the B couplers 1b of the optical chip and the total spot size of the B optical signals, and also match the numerical aperture and photosensitive area of ​​the detection device 3. In practical applications, the specific structure and dimensions of the focusing device 2 can be set as needed, and no specific limitations are imposed here.

[0080] It should be noted that the chip light emission method of this embodiment can be implemented based on the chip aggregation light emission detection system of Embodiment 1 and Embodiment 2, or it can be implemented based on other detection systems that are the same as or substantially the same as the protection scope of this utility model.

[0081] In summary, the chip-based light-gathering detection system of this invention includes: an optical chip, a focusing device, and a detection device. The densely arranged coupling modules in the optical chip receive the optical signal transmitted by the waveguide module and output the optical signal to the focusing device. The focusing device focuses the output optical signal of the optical chip onto the detection device. The waveguides of the waveguide module and the couplers of the coupling modules can be connected one-to-one or many-to-one. By employing a focusing device and / or improving the structure of the optical chip itself, this invention enhances the intensity of the output optical signal and ensures that all of it is output to the detection device, thereby improving the signal-to-noise ratio of the detection system and the detection task. Therefore, this invention effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0082] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A detection system for chip-based light aggregation, characterized in that, The detection system for light aggregation from the chip includes at least: an optical chip, a focusing device, and a detection device; The optical chip includes a waveguide module and a coupling module; the waveguide module includes A waveguides, and the coupling module includes B couplers, wherein A and B are both natural numbers greater than or equal to 1, and A equals B; one waveguide corresponds to one coupler; the B couplers correspond to output B optical signals, which are used as the output optical signals of the optical chip; The focusing device is disposed between the optical chip and the detection device; the focusing device focuses the output optical signal of the optical chip onto the detection device.

2. The system of claim 1, wherein: The couplers on the same process surface are arranged in groups, when the coupler is a grating coupler, the arrangement density of each coupler group is greater than or equal to 80 groups , when the coupler is an end surface coupler, the arrangement density of each coupler group is greater than or equal to 30 groups .

3. The system of claim 1, wherein: The coupler is a grating coupler, and B couplers are stacked in layers in the optical chip, with the vertical projections of each coupler layer overlapping.

4. A system for detecting chip aggregation light output, characterized by The detection system for light aggregation from the chip includes at least: an optical chip, a focusing device, and a detection device; The optical chip includes a waveguide module and a coupling module; the waveguide module includes A waveguides, and the coupling module includes B couplers, where A and B are both natural numbers greater than or equal to 1, and A is greater than B; multiple waveguides are connected to a coupler based on a beam combiner, and / or multiple waveguides are connected to a multi-waveguide coupler, where there are C beam combiners and D multi-waveguide couplers, where C and D are both integers greater than or equal to 0, and C + D = B; the B couplers output B optical signals, which serve as the output optical signals of the optical chip; The focusing device is disposed between the optical chip and the detection device; the focusing device focuses the output optical signal of the optical chip onto the detection device.

5. The system of claim 4, wherein: When the coupler is a grating coupler, the arrangement density of each coupler on the same process surface is greater than or equal to 80 When the coupler is an end face coupler, the arrangement density of each coupler on any edge of the optical chip is greater than or equal to 30 .

6. The system of claim 4, wherein: The beam combiner includes a beam combiner structure and a multimode waveguide; the multi-branch input terminals of the beam combiner structure are connected to multiple waveguides in a one-to-one correspondence, and the output terminal is connected to one end of the multimode waveguide; the other end of the multimode waveguide is connected to the input terminal of the coupler.

7. The system of claim 4, wherein the chip aggregates the light. The multi-waveguide coupler includes a coupling structure and a grating structure; the first end of the coupling structure is connected to multiple waveguides, and the second end is connected to the input end of the grating structure.

8. The detection system for chip-converged light according to any one of claims 1 or 4-7, characterized in that: All B couplers are located on the same process plane.

9. The system of claim 8, wherein the chip aggregates the light. The coupler is a grating coupler, which outputs optical signals from the upper or lower surface of the optical chip.

10. The system of claim 9, wherein the chip aggregates the light. Each coupler focuses its corresponding optical signal onto the focusing device.

11. The system of claim 8, wherein the chip aggregates the light. The coupler is an end-face coupler, which outputs optical signals from the side of the optical chip.

12. The system of claim 1 or any one of claims 4-7, wherein: The focusing device includes N lenses, and when N is greater than or equal to 2, the optical axes of the N lenses coincide; where N is a natural number greater than or equal to 1.

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