Optoelectronic device and electronic rearview mirror

Abstract

The application provides an optoelectronic device, comprising an upper substrate, a shielding layer, an insulating layer, an upper conductive layer, a light-adjusting material layer, a lower conductive layer and a lower substrate which are arranged in a stack; wherein the shielding layer is used for shielding a peripheral area of the optoelectronic device, the insulating layer is used for insulating between the shielding layer and the upper conductive layer, the upper conductive layer comprises a first area and other areas of the upper conductive layer which are insulated from each other; the upper conductive layer and the lower conductive layer are both guided to a side of the lower substrate which is opposite to the upper substrate through respective corresponding conductive structures; the corresponding conductive structure of the lower conductive layer comprises: the first area of the upper conductive layer; a second spaced conductive structure which is in electrical contact with one end of the first area of the upper conductive layer and in electrical contact with the other end of the lower conductive layer; and a second conductive circuit which is in electrical contact with one end of the first area of the upper conductive layer and guides an electrical connection position to the side of the lower substrate which is opposite to the upper substrate.

Description

Technical Field

[0001] This application relates to the field of optoelectronic technology, and in particular to an optoelectronic device and an electronic rearview mirror. Background Technology

[0002] Electronic anti-glare rearview mirrors are favored by users because they can turn the anti-glare mode on and off without manual mechanical flipping, and are now widely used in vehicles.

[0003] Since both conductive layers in the electronic anti-glare rearview mirror need to be connected to the electrode lead-out structure and the voltage is input to the two conductive layers through the electrode lead-out structure, the electrode lead-out structure in the prior art is large in size, or its position is unreasonable, or it is not easy to connect, resulting in a large overall device size.

[0004] The applicant's invention patent application with application number CN202511232402.9 proposes an optoelectronic device that can reduce product size. However, due to considerations of concealing circuits or components such as frame adhesive, the peripheral area of ​​the optoelectronic device is sometimes provided with a shielding layer. When the shielding layer is made of conductive material, and the upper conductive layer has multiple mutually insulated areas, in order to avoid these multiple areas being indirectly connected by the shielding layer, it is necessary to divide the shielding layer into multiple mutually insulated areas as well. However, the areas between the multiple areas of the shielding layer are often visually obvious, affecting the aesthetics of the entire optoelectronic device.

[0005] Therefore, it is necessary to propose an optoelectronic device that improves aesthetics. Utility Model Content

[0006] To address the aforementioned issues, this application provides an optoelectronic device that can improve aesthetics while reducing product size.

[0007] To achieve the above objectives, this utility model provides an optoelectronic device, comprising an upper substrate, a shielding layer, an insulating layer, an upper conductive layer, a dimming material layer, a lower conductive layer, and a lower substrate stacked together. The shielding layer is used to shield the surrounding area of ​​the optoelectronic device, and the insulating layer is used to insulate the shielding layer and the upper conductive layer. The upper conductive layer includes a first region and other regions that are mutually insulated from each other. The upper conductive layer and the lower conductive layer guide the electrical connection position to the side of the lower substrate away from the upper substrate through their respective corresponding conductive structures. The conductive structure corresponding to the lower conductive layer includes: a first region of the upper conductive layer; a second spaced conductive structure with one end electrically contacting the first region of the upper conductive layer and the other end electrically contacting the lower conductive layer; and a second conductive circuit with one end electrically contacting the first region of the upper conductive layer and the other end guiding the electrical connection position to the side of the lower substrate away from the upper substrate.

[0008] In a preferred embodiment, the second conductive circuit is a conductive sheet or a flexible circuit board.

[0009] In a preferred embodiment, the conductive structure is part of the optoelectronic device or a driving device connected to the optoelectronic device.

[0010] In a preferred embodiment, the conductive structure corresponding to the upper conductive layer includes a first conductive circuit that is in direct electrical contact with the upper conductive layer.

[0011] In a preferred embodiment, the first conductive circuit is a conductive sheet or a flexible circuit board.

[0012] In a preferred embodiment, one end of the first conductive circuit is in direct electrical contact with the upper conductive layer, and the other end extends from the edge of the lower substrate to the side of the lower substrate opposite to the upper substrate.

[0013] In a preferred embodiment, the area near the location where the edge of the lower substrate is bypassed by the first conductive circuit is not provided with a lower conductive layer, or the lower conductive layer in the area near the location where the edge of the lower substrate is bypassed by the first conductive circuit is insulated from other areas of the lower conductive layer.

[0014] In a preferred embodiment, one end of the first conductive circuit is directly electrically contacted and fixed to the upper conductive layer via conductive silver paste.

[0015] In a preferred embodiment, the conductive structure corresponding to the upper conductive layer includes: The first region of the lower conductive layer that is insulated from other regions of the lower conductive layer; A first spaced conductive structure having one end electrically contacting a first region of the lower conductive layer and the other end electrically contacting the upper conductive layer; One end of the structure is electrically contacted with the first region of the lower conductive layer, and the other end guides the electrical connection position to the side of the lower substrate facing away from the upper substrate, forming a first lead-out conductive structure.

[0016] In a preferred embodiment, the first conductive lead structure includes a first conductive lead layer that covers at least the side edge of the lower substrate portion, the first conductive lead layer being in contact with a first region of the lower conductive layer.

[0017] In a preferred embodiment, the first spacer conductive structure comprises: a frame adhesive having conductive properties.

[0018] In a preferred embodiment, the second spacer conductive structure comprises: a frame adhesive having conductive properties.

[0019] In a preferred embodiment, the upper substrate serves as a protective cover for the optoelectronic device.

[0020] In a preferred embodiment, a reflective layer is also included on the side of the dimming material layer facing away from the substrate.

[0021] In a preferred embodiment, the reflective layer is located between the dimming material layer and the lower substrate, or on the side of the lower substrate facing away from the dimming material layer.

[0022] In a preferred embodiment, the dimming material layer includes an EC layer, an SPD layer, a liquid crystal layer, or a dye liquid crystal layer.

[0023] In addition, this application also provides an electronic rearview mirror, including the aforementioned optoelectronic device.

[0024] It should be understood that the above general description of this application and the following detailed description are exemplary and illustrative and are intended to provide further explanation of the claimed application. Attached Figure Description

[0025] The accompanying drawings are included to provide a further understanding of the present application and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the present application and, together with the description, serve to explain the principles of the present application. In the drawings: Figure 1 This is a schematic diagram of the upper substrate and shielding layer of the optoelectronic device provided in Embodiment 1 of this application; Figure 2 This is a schematic diagram of the upper substrate, shielding layer, and insulating layer of the optoelectronic device provided in Embodiment 1 of this application; Figure 3 This is a schematic diagram of the upper substrate, shielding layer, insulating layer and upper conductive layer of the optoelectronic device provided in Embodiment 1 of this application; Figure 4 This is a schematic diagram of the lower substrate of the optoelectronic device provided in Embodiment 1 of this application facing the upper substrate; Figure 5 This is a schematic diagram of the projection state of the optoelectronic device provided in this embodiment 1; Figure 6 yes Figure 5 A partial cross-sectional view of the location BB of the optoelectronic device; Figure 7 yes Figure 5 A partial cross-sectional view of the location AA of the optoelectronic device; Figure 8 This is a schematic diagram of the upper substrate and shielding layer of the optoelectronic device provided in Embodiment 2 of this application; Figure 9 This is a schematic diagram of the upper substrate, shielding layer, and insulating layer of the optoelectronic device provided in Embodiment 2 of this application; Figure 10 This is a schematic diagram of the upper substrate, shielding layer, insulating layer and upper conductive layer of the optoelectronic device provided in Embodiment 2 of this application; Figure 11 This is a schematic diagram of the lower substrate of the optoelectronic device provided in Embodiment 2 of this application facing the upper substrate; Figure 12 This is a schematic diagram of the projection state of the optoelectronic device provided in Embodiment 2; Figure 13 yes Figure 12 A partial cross-sectional view of the location BB of the optoelectronic device; Figure 14 yes Figure 12 A partial cross-sectional view of the location AA of the optoelectronic device. Detailed Implementation

[0026] Now, reference will be made in detail to exemplary embodiments of this application, examples of which are illustrated in the accompanying drawings. Wherever possible, throughout the drawings, the same reference numerals will be used to denote the same or similar components.

[0027] The shapes, dimensions, ratios, angles, and quantities disclosed in the accompanying drawings used to describe embodiments of this application are merely examples, and therefore, this application is not limited to the details illustrated. Similar reference numerals always denote similar elements. In the following description, detailed descriptions will be omitted where it is determined that such detailed descriptions unnecessarily obscure the essence of this application.

[0028] Where the terms “comprising,” “having,” and “including” are used as described in this specification, additional parts may be added unless “only” is used. Singular terms may include plural forms unless otherwise stated.

[0029] When interpreting a component, it is interpreted as including a range of errors, although this is not explicitly described.

[0030] In the description of embodiments of this application, when a structure (e.g., an electrode, wire, wiring, layer, or contact) is described as being formed on top of / below the upper / lower portion of another structure or other structures, this description should be understood to include cases where these structures are in contact with each other, and further includes cases where a third structure is disposed therebetween.

[0031] In describing temporal relationships, for example, when time sequence is described as “after,” “following,” “next,” and “before,” discontinuous cases may be included unless “exactly” or “immediately following” is used.

[0032] It should be understood that although the terms "first," "second," etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are merely used to distinguish one element from another. For example, without departing from the scope of this application, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0033] The “X-axis direction,” “Y-axis direction,” and “Z-axis direction” should not be interpreted solely by their geometric relationship of being perpendicular to each other, but rather can have a broader directionality within the scope of the functionality of the components in this application.

[0034] The term "at least one" should be understood to include any and all combinations of one or more of the related listed items. For example, "at least one of the first, second, and third items" means a combination of all items proposed from the first, second, and third items, as well as two or more of the first, second, or third items.

[0035] Features of the various embodiments of this application may be connected or combined with each other in part or in whole, and may operate in various ways and be technology-driven, as will be fully understood by those skilled in the art. Embodiments of this application may be performed independently of each other, or may be performed together in an interdependent relationship.

[0036] Hereinafter, exemplary embodiments of this application will be described in detail with reference to the accompanying drawings.

[0037] Example 1 Figure 1 This is a schematic diagram of the upper substrate and shielding layer of the optoelectronic device provided in Embodiment 1 of this application. Figure 2 This is a schematic diagram of the upper substrate, shielding layer, and insulating layer of the optoelectronic device provided in Embodiment 1 of this application. Figure 3 This is a schematic diagram of the upper substrate, shielding layer, insulating layer and upper conductive layer of the optoelectronic device provided in Embodiment 1 of this application; Figure 4 This is a schematic diagram of the lower substrate of the optoelectronic device provided in Embodiment 1 of this application facing the upper substrate. Figure 5 This diagram illustrates the projection state of the optoelectronic device provided in Embodiment 1. Figure 6 It shows Figure 5 A partial cross-sectional view of the location BB of the optoelectronic device. Figure 7 It shows Figure 5 A partial cross-sectional view of the location AA of the optoelectronic device.

[0038] See also Figures 1 to 7The optoelectronic device includes an upper substrate 10, a shielding layer 8, an insulating layer 9, an upper conductive layer 11, a dimming material layer 60, a lower conductive layer 21, and a lower substrate 20, which are stacked together. The shielding layer 8 is used to shield the peripheral area of ​​the optoelectronic device, and the insulating layer 9 is used to insulate the shielding layer 8 and the upper conductive layer 11.

[0039] Both the upper conductive layer 11 and the lower conductive layer 21 guide the electrical connection positions to the side of the lower substrate 20 opposite to the upper substrate 10 through their respective corresponding conductive structures. It should be noted that guiding to the side of the lower substrate 20 opposite to the upper substrate 10 includes: extending the electrical connection positions out of the side of the lower substrate 20 opposite to the upper substrate 10, or bending them onto the surface of the lower substrate 20 opposite to the upper substrate 10.

[0040] In this embodiment, the upper conductive layer guides the electrical connection position to the side of the lower substrate opposite to the upper substrate through a first conductive circuit that is in direct electrical contact with the upper conductive layer; while the lower conductive layer indirectly guides the electrical connection position to the side of the lower substrate opposite to the upper substrate through a second conductive circuit that is in direct electrical contact with at least a portion of the upper conductive layer. This will be explained in detail below.

[0041] The upper conductive layer 11 includes other regions 11A of the upper conductive layer and a first region 11B that is insulated from the other regions 11A. The insulation between the first region 11B of the upper conductive layer 11 and the other regions 11A can be achieved by means of an etch line between the two regions. As an example, the etch line can be achieved by a chemical etching process or a physical etching process. The first region 11B of the upper conductive layer 11 is used to indirectly transmit the voltage ultimately applied to the lower conductive layer 21. The other regions 11A of the upper conductive layer 11 are used to apply the voltage to the upper conductive layer 11. The voltage difference between the voltage applied to the upper conductive layer 11 and the voltage applied to the lower conductive layer 21 controls the optical properties of the dimming material layer 60.

[0042] like Figure 6 A schematic diagram of the structure near the conductive structure corresponding to the lower conductive layer 21 is shown. The conductive structure corresponding to the lower conductive layer 21 includes: a first region 11B of the upper conductive layer 11; a second spacer conductive structure with one end electrically contacting the first region 11B of the upper conductive layer 11 and the other end electrically contacting the lower conductive layer 21; and a second conductive circuit 31 with one end electrically contacting the first region 11B of the upper conductive layer 11 and the other end guiding the electrical connection position to the side of the lower substrate 20 opposite to the upper substrate 10. In this way, by applying a voltage to the second conductive circuit 31, the voltage is ultimately applied to the lower conductive layer 21 through the first region 11B and the second spacer conductive structure of the upper conductive layer 11.

[0043] It should be noted that the second conductive circuit 31 and the first region 11B of the upper conductive layer 11 can achieve electrical contact through direct physical contact, or through conductive adhesive 32 with adhesive and conductive properties, to ensure the stability of the electrical contact. As an example, the conductive adhesive here can be cured conductive silver paste.

[0044] The second spacer conductive structure can be an independently disposed spacer conductive structure located between the first region 11B of the upper conductive layer 11 and the lower conductive layer 21, or it can be as follows: Figure 4 The reusable frame adhesive shown has a conductive section 41, thus forming a conductive frame adhesive. Specifically, this conductive section can be achieved by incorporating conductive particles into the frame adhesive section; for example, conductive particles could be conductive gold spheres.

[0045] One end of the second conductive circuit 31 can extend the electrical connection position out of the lower substrate 20 to the side opposite to the upper substrate 10, or as... Figure 6 The surface of the bent-down substrate 20 shown is on the side opposite to the upper substrate 10.

[0046] like Figure 7 The diagram shows a structural schematic near the conductive structure corresponding to the upper conductive layer. This conductive structure includes a first conductive circuit 51 that is in direct electrical contact with the upper conductive layer 11. It should be noted that since the upper conductive layer 11 is divided into a first region 11B and other regions 11A, the upper conductive layer 11 in direct electrical contact with the first conductive circuit 51 specifically refers to the other region 11A of the upper conductive layer 11. One end of the first conductive circuit 51 is in direct electrical contact with the other region 11A of the upper conductive layer 11, and the other end extends from the edge of the lower substrate 20 to the side of the lower substrate 20 facing away from the upper substrate 10.

[0047] It should be noted that, in order to meet the requirements of narrow bezels, the first conductive circuit 51 should be as close as possible to the edge of the lower substrate 20 when it passes around the edge of the lower substrate 20. However, this may easily lead to accidental electrical contact between the first conductive circuit 51 and the lower conductive layer 21. Therefore, the lower conductive layer 21 can be omitted in the region 20B near the edge of the lower substrate 20 where the first conductive circuit 51 passes around it. Figure 5 As shown. As an alternative implementation, the lower conductive layer of the region 20B near the edge of the lower substrate 20 that is bypassed by the first conductive circuit 51 is insulated from other regions of the lower conductive layer 21. For example, the two regions can be insulated by an etched line. As an example, the etched line can be implemented by a chemical etching process or a physical etching process.

[0048] It should be noted that the first conductive circuit 51 can achieve electrical contact with other areas 11A of the upper conductive layer 11 through direct physical contact, or through conductive adhesive 52 with adhesive and conductivity properties, to ensure the stability of the electrical contact. As an example, the conductive adhesive here can be cured conductive silver paste.

[0049] When the sealant is in contact with both the lower conductive layer 21 and other areas 11A of the upper conductive layer, to prevent the lower conductive layer 21 and other areas 11A of the upper conductive layer from becoming conductive, the areas of the sealant in contact with both the lower conductive layer 21 and other areas 11A of the upper conductive layer preferably do not have conductivity. For example, Figure 5 At the location shown, section 42 of the frame adhesive is non-conductive.

[0050] One end of the first conductive circuit 51 can extend the electrical connection position out of the lower substrate 20 to the side opposite to the upper substrate 10, or as... Figure 7 The surface of the bent-down substrate 20 shown is on the side opposite to the upper substrate 10.

[0051] It should be noted that, in this embodiment, at least one of the first conductive circuit 51 and the second conductive circuit 31 can be part of the optoelectronic device. Alternatively, in an alternative embodiment, at least one of the first conductive circuit 51 and the second conductive circuit 31 may not be part of the optoelectronic device, but rather part of a driving device connected to the optoelectronic device. The driving device is used to drive the optoelectronic device.

[0052] Furthermore, at least one of the first conductive circuit 51 and the second conductive circuit 31 can be replaced with a needle-shaped conductive structure, and correspondingly, an electrical contact can be provided at the position of the upper or lower conductive layer that is in electrical contact with the needle-shaped conductive structure.

[0053] In this embodiment, since both the upper and lower conductive layers guide the electrical connection positions to the side of the lower substrate away from the upper substrate through their respective conductive structures, it helps to reduce the overall size of the product.

[0054] It should be noted that, in order to meet the requirements of shielding, the shielding layer is sometimes made of a high-reflectivity material. High-reflectivity materials are sometimes made of conductive metals. When the shielding layer is made of a conductive material, without the insulating layer 9, even if the upper conductive layer is divided into a first region 11B and other regions 11A that are not in direct contact with each other, they will still be electrically connected through the shielding layer 8, which is in contact with both regions. This prevents the first region 11B and other regions 11A from achieving true insulation, thus causing the optoelectronic device in this embodiment to be unable to be driven normally. To solve this problem, one approach is to omit the insulating layer 9 and divide the shielding layer 8 into multiple mutually insulated regions. However, this would make the dividing lines of the shielding layer 8 visually visible, affecting the aesthetics of the optoelectronic device. Therefore, in Embodiment 1 of this application, an insulating layer 9 is provided between the shielding layer 8 and the upper conductive layer. This prevents the shielding layer 8 from accidentally connecting the first region 11B and other regions 11A of the upper conductive layer, thus eliminating the need for further division of the shielding layer 8 and improving the overall aesthetics of the optoelectronic device.

[0055] Furthermore, since the upper conductive layer is divided into a first region 11B and other regions 11A, the operating states of the dimming material layer 60 at the corresponding positions in the first region 11B and other regions 11A are often different. To avoid the user noticing this difference, preferably, it can be as follows: Figures 1 to 6 As shown, the dividing line between the first region 11B and other regions 11A of the upper conductive layer is set within the area shielded by the shielding layer 8.

[0056] At least one of the first conductive circuit 51 and the second conductive circuit 31 can be replaced by a flexible circuit board. When both the first conductive circuit 51 and the second conductive circuit 31 are flexible circuit boards, the first conductive circuit 51 and the second conductive circuit 31 can be two independent flexible circuit boards or the same flexible circuit board. When they are the same flexible circuit board, they need to contain at least two electrical paths.

[0057] As an alternative embodiment, at least one of the first conductive circuit 51 and the second conductive circuit 31 may be a conductive sheet.

[0058] Example 2 Figure 8 This is a schematic diagram of the upper substrate and shielding layer of the optoelectronic device provided in Embodiment 2 of this application. Figure 9 This is a schematic diagram of the upper substrate, shielding layer, and insulating layer of the optoelectronic device provided in Embodiment 2 of this application. Figure 10 This is a schematic diagram of the upper substrate, shielding layer, insulating layer and upper conductive layer of the optoelectronic device provided in Embodiment 2 of this application; Figure 11 This is a schematic diagram of the lower substrate of the optoelectronic device provided in Embodiment 2 of this application facing the upper substrate. Figure 12 This diagram illustrates the projection state of the optoelectronic device provided in Embodiment 2. Figure 13 It shows Figure 12 A partial cross-sectional view of the location BB of the optoelectronic device. Figure 14 It shows Figure 12 A partial cross-sectional view of the location AA of the optoelectronic device.

[0059] See also Figures 8 to 14 The optoelectronic device includes an upper substrate 10, a shielding layer 8, an insulating layer 9, an upper conductive layer 11, a dimming material layer 60, a lower conductive layer 21, and a lower substrate 20, which are stacked together. The shielding layer 8 is used to shield the peripheral area of ​​the optoelectronic device, and the insulating layer 9 is used to insulate the shielding layer 8 and the upper conductive layer 11.

[0060] Both the upper conductive layer 11 and the lower conductive layer 21 guide the electrical connection positions to the side of the lower substrate 20 opposite to the upper substrate 10 through their respective corresponding conductive structures. It should be noted that guiding to the side of the lower substrate 20 opposite to the upper substrate 10 includes: extending the electrical connection positions out of the side of the lower substrate 20 opposite to the upper substrate 10, or bending them onto the surface of the lower substrate 20 opposite to the upper substrate 10.

[0061] In this embodiment, the lower conductive layer indirectly guides the electrical connection position to the side of the lower substrate opposite to the upper substrate through a second conductive circuit that is in electrical contact with at least a portion of the upper conductive layer, while the upper conductive layer indirectly guides the electrical connection position to the side of the lower substrate opposite to the upper substrate through a first lead-out conductive structure that is in electrical contact with at least a portion of the lower conductive layer. This will be explained in detail below.

[0062] The upper conductive layer 11 includes other regions 11A of the upper conductive layer and a first region 11B that is insulated from the other regions 11A. The insulation between the first region 11B of the upper conductive layer 11 and the other regions 11A can be achieved by means of an etch line between the two regions. As an example, the etch line can be achieved by a chemical etching process or a physical etching process.

[0063] The lower conductive layer 21 includes other regions 21A of the lower conductive layer and a first region 21B that is insulated from the other regions 21A. The insulation between the first region 21B of the lower conductive layer 21 and the other regions 21A can be achieved by means of an etch line between the two regions. As an example, the etch line can be achieved by a chemical etching process or a physical etching process.

[0064] The first region 11B of the upper conductive layer 11 is used to indirectly transmit the voltage ultimately applied to the lower conductive layer 21 (more specifically, other regions 21A of the lower conductive layer 21). The first region 21B of the lower conductive layer 21 is used to indirectly transmit the voltage ultimately applied to the upper conductive layer 11 (more specifically, other regions 11A of the upper conductive layer 11). The voltage difference between the voltage applied to other regions 11A of the upper conductive layer and the voltage applied to other regions 21A of the lower conductive layer controls the optical properties of the dimming material layer 60.

[0065] like Figure 13 A schematic diagram of the structure near the conductive structure corresponding to the lower conductive layer 21 is shown. The conductive structure corresponding to the lower conductive layer 21 includes: a first region 11B of the upper conductive layer 11; a second spacer conductive structure with one end electrically contacting the first region 11B of the upper conductive layer 11 and the other end electrically contacting the lower conductive layer 21 (more specifically, other regions 21A of the lower conductive layer); and a second conductive circuit 31 with one end electrically contacting the first region 11B of the upper conductive layer 11 and the other end guiding the electrical connection position to the side of the lower substrate 20 opposite to the upper substrate 10. In this way, by applying a voltage to the second conductive circuit 31, the voltage is ultimately applied to the other regions 21A of the lower conductive layer 21 through the first region 11B of the upper conductive layer 11 and the second spacer conductive structure.

[0066] It should be noted that the second conductive circuit 31 and the first region 11B of the upper conductive layer 11 can achieve electrical contact through direct physical contact, or through conductive adhesive 32 with adhesive and conductive properties, to ensure the stability of the electrical contact. As an example, the conductive adhesive here can be cured conductive silver paste.

[0067] The second spacer conductive structure can be an independently disposed spacer conductive structure located between the first region 11B of the upper conductive layer 11 and other regions 21A of the lower conductive layer 21, or it can be as follows: Figure 9 The reusable frame adhesive shown has a conductive section 41, thus forming a conductive frame adhesive. Specifically, the conductive function of this section can be achieved by incorporating conductive particles into the frame adhesive section; for example, the conductive particles could be conductive gold spheres.

[0068] One end of the second conductive circuit 31 can extend the electrical connection position out of the lower substrate 20 to the side opposite to the upper substrate 10, or as... Figure 13 The surface of the bent-down substrate 20 shown is on the side opposite to the upper substrate 10.

[0069] like Figure 14The diagram shows a structural schematic near the conductive structure corresponding to the upper conductive layer. This conductive structure includes: a first region 21B of the lower conductive layer 21 that is insulated from other regions 21A of the lower conductive layer 21; a first spacer conductive structure that is electrically contacted at one end with the first region 21B of the lower conductive layer 21 and at the other end with the upper conductive layer 11 (more specifically, other regions 11A of the upper conductive layer 11); and a first lead-out conductive structure 7 that is electrically contacted at one end with the first region 21B of the lower conductive layer 21 and at the other end guides the electrical connection position to the side of the lower substrate facing away from the upper substrate. Thus, by applying a voltage to the first lead-out conductive structure 7, the voltage is ultimately applied to the other regions 11A of the upper conductive layer 11 through the first region 21B of the lower conductive layer 21 and the first spacer conductive structure.

[0070] like Figure 14 As shown, the first conductive lead-out structure 7 may include a first conductive lead-out layer 71 covering at least a portion of the edge side of the lower substrate 20, and the first conductive lead-out layer 71 is in contact with the first region 21B of the lower conductive layer 21. In practice, the first conductive lead-out layer 71 can be formed by a film deposition process. Preferably, the material of the first conductive lead-out layer 71 can be the same as the material of the first region 21B of the lower conductive layer 21, so that the first region 21B of the lower conductive layer 21 and the first conductive lead-out layer 71 can be formed in the same film deposition process stage. For example, the first region 21B of the lower conductive layer 21 and the first conductive lead-out layer 71 can be formed in adjacent or non-adjacent process steps using the same film deposition process, or they can be formed in the same process step using the same film deposition process.

[0071] The first spacer conductive structure can be an independently disposed spacer conductive structure located between the first region 21B of the lower conductive layer 21 and other regions 11A of the upper conductive layer 11, or it can be as follows: Figure 10 The reusable frame adhesive shown has a conductive section 43, thus forming a conductive frame adhesive. Specifically, the conductive function of this section can be achieved by incorporating conductive particles into the frame adhesive section; for example, the conductive particles could be conductive gold spheres.

[0072] One end of the first conductive lead 7 can extend the electrical connection position out of the lower substrate 20 to the side opposite to the upper substrate 10, or as... Figure 14 The surface of the bent-down substrate 20 shown is on the side opposite to the upper substrate 10.

[0073] It should be noted that the second conductive circuit 31 in this embodiment can be part of the optoelectronic device. Of course, in an alternative embodiment, the second conductive circuit 31 may not be part of the optoelectronic device, but rather part of the driving device connected to the optoelectronic device. The driving device is used to drive the optoelectronic device.

[0074] Furthermore, the second conductive circuit 31 can be replaced with a needle-shaped conductive structure, and correspondingly, an electrically conductive contact can be provided at the position of the upper conductive layer that is in electrical contact with the second conductive circuit 31.

[0075] In this embodiment, since both the upper and lower conductive layers guide the electrical connection positions to the side of the lower substrate away from the upper substrate through their respective conductive structures, it helps to reduce the overall size of the product.

[0076] Similar to Embodiment 1, since an insulating layer 9 is provided between the shielding layer 8 and the upper conductive layer, it is possible to prevent the shielding layer 8 from accidentally making the first region 11B of the upper conductive layer and other regions 11A conductively connected. In this way, the shielding layer 8 does not need to be divided, thereby improving the aesthetics of the entire optoelectronic device.

[0077] Furthermore, since the upper conductive layer is divided into a first region 11B and other regions 11A, the operating states of the dimming material layer 60 at the corresponding positions in the first region 11B and other regions 11A are often different. To avoid the user noticing this difference, preferably, it can be as follows: Figures 8 to 13 As shown, the dividing line between the first region 11B and other regions 11A of the upper conductive layer is set within the area shielded by the shielding layer 8. Furthermore, since the lower conductive layer in this embodiment is divided into the first region 21B and other regions 21A, the operating states of the dimming material layer 60 at the corresponding positions of the first region 21B and other regions 21A are often different. To avoid the user noticing this difference, preferably, it can be as follows... Figure 14 As shown, the dividing line between the first region 21B and other regions 21A of the lower conductive layer is set within the area shielded by the shielding layer 8.

[0078] The second conductive circuit 31 is a flexible circuit board or conductive sheet.

[0079] In the above embodiments, in order to protect the internal structure of the optoelectronic device, a protective cover plate, such as a cover glass, can be provided on the outside of the upper substrate (i.e., the side facing away from the lower substrate). In a preferred embodiment, in order to reduce the thickness and weight of the entire device, the separately provided protective cover plate can be omitted, and the upper substrate can be reused as the protective cover plate.

[0080] In the above embodiments, the dimming material layer can modulate the intensity, color, phase, polarization, and / or direction of the incident light. Therefore, as an example, the dimming material layer can be capable of adjusting light transmittance, adjusting its own haze, or adjusting both light transmittance and its own haze.

[0081] Depending on the type of dimming material, the dimming material layer may include an electrochromic (EC) dimming material layer, a liquid crystal dimming material layer, and / or an SPD dimming material layer. Among them, the electrochromic dimming material layer and the SPD dimming material layer can adjust the light transmittance, while the liquid crystal dimming material layer can adjust the light transmittance and / or adjust the haze.

[0082] Depending on the type of dimming function, the dimming material layer can include a dimming material layer capable of adjusting light transmittance, a dimming material layer capable of adjusting haze, or a dimming material layer capable of adjusting both light transmittance and haze. Furthermore, when the dimming material layer is capable of adjusting both light transmittance and haze, it can adjust light transmittance and haze independently or simultaneously and in conjunction.

[0083] When a liquid crystal dimming material layer is used to achieve a dimming material layer capable of adjusting light transmittance, the dimming material layer may include liquid crystal material and dichroic dye. Alternatively, it can be replaced by not containing dichroic dye and instead using a polarizer in the optoelectronic device. Furthermore, to improve the contrast of light transmittance adjustment, a dichroic dye can be added to the dimming material layer simultaneously with the polarizer.

[0084] When a liquid crystal dimming material layer is used to realize a dimming material layer that can adjust the haze, the dimming material layer may include PDLC (Polymer Dispersed Liquid Crystal) material or cholesteric liquid crystal material.

[0085] In addition, when the dimming material layer is a liquid crystal dimming material layer, as an example, the liquid crystal molecules in the liquid crystal dimming material layer can exist in at least one stable state that remains basically stable after the voltage is removed. At least one of the stable states is a transmission state, and the collimated transmitted light flux of the transmission state incident on the liquid crystal dimming material layer is greater than the scattered light flux.

[0086] When the dimming material layer is one that can adjust both light transmittance and haze, as an example, the dimming material layer may include liquid crystal material and dichroic dye. Preferably, it may further include chiral agent material. For example, a liquid crystal dimming device is described in Chinese invention patent application 202111232990.8 filed in 2021, which will not be described in detail here.

[0087] The dimming material in the dimming material layer can have a certain degree of fluidity, making the dimming material layer a liquid dimming layer.

[0088] The optoelectronic devices in the above embodiments can be applied to various dimming technology fields. For example, the optoelectronic devices can be applied to automotive electronic rearview mirrors with adjustable overall reflectivity and / or transmittance, smart windows with adjustable overall transmittance, etc.

[0089] In the above embodiments, the optoelectronic device may further include a reflective layer on the side of the dimming material layer facing away from the upper substrate. Specifically, the reflective layer may be located between the dimming material layer and the lower substrate, or on the side of the lower substrate facing away from the dimming material layer.

[0090] The preferred embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the specific details of the above embodiments. Within the scope of the technical concept of this application, various simple modifications can be made to the technical solution of this application, and these simple modifications all fall within the protection scope of this application.

[0091] Furthermore, various different implementations of this application can be combined in any way, as long as they do not violate the spirit of this application, they should also be regarded as the content disclosed in this application.

Claims

1. An optoelectronic device, comprising an upper substrate, a shielding layer, an insulating layer, an upper conductive layer, a dimming material layer, a lower conductive layer, and a lower substrate stacked together; wherein The shielding layer is used to shield the surrounding area of ​​the optoelectronic device, and the insulating layer is used to insulate the shielding layer and the upper conductive layer. The upper conductive layer includes a first region and other regions that are mutually insulated from each other. The upper conductive layer and the lower conductive layer guide the electrical connection position to the side of the lower substrate away from the upper substrate through their respective corresponding conductive structures. The conductive structure corresponding to the lower conductive layer includes: a first region of the upper conductive layer; a second spaced conductive structure with one end electrically contacting the first region of the upper conductive layer and the other end electrically contacting the lower conductive layer; and a second conductive circuit with one end electrically contacting the first region of the upper conductive layer and the other end guiding the electrical connection position to the side of the lower substrate away from the upper substrate.

2. The optoelectronic device as described in claim 1, wherein the second conductive circuit is a conductive sheet or a flexible circuit board.

3. The optoelectronic device of claim 1, wherein, The conductive structure is part of the optoelectronic device or a driving device connected to the optoelectronic device.

4. The optoelectronic device of claim 1, wherein, The conductive structure corresponding to the upper conductive layer includes: a first conductive circuit that is in direct electrical contact with the upper conductive layer.

5. The optoelectronic device of claim 4, wherein, The first conductive circuit is a conductive sheet or a flexible circuit board.

6. The optoelectronic device of claim 4, wherein, One end of the first conductive circuit is in direct electrical contact with the upper conductive layer, and the other end extends from the edge of the lower substrate to the side of the lower substrate opposite to the upper substrate.

7. The optoelectronic device of claim 6, wherein, The area near the position where the edge of the lower substrate is bypassed by the first conductive circuit does not have a lower conductive layer, or the lower conductive layer in the area near the position where the edge of the lower substrate is bypassed by the first conductive circuit is insulated from other areas of the lower conductive layer.

8. The optoelectronic device of claim 6, wherein, One end of the first conductive circuit is directly electrically contacted and fixed to the upper conductive layer through conductive silver paste.

9. The optoelectronic device of claim 1, wherein, The conductive structure corresponding to the upper conductive layer includes: The first region of the lower conductive layer that is insulated from other regions of the lower conductive layer; A first spaced conductive structure having one end electrically contacting a first region of the lower conductive layer and the other end electrically contacting the upper conductive layer; One end of the structure is electrically contacted with the first region of the lower conductive layer, and the other end guides the electrical connection position to the side of the lower substrate facing away from the upper substrate, forming a first lead-out conductive structure.

10. The optoelectronic device of claim 9, wherein, The first conductive lead-out structure includes a first conductive lead-out layer that covers at least the side edge of the lower substrate portion, and the first conductive lead-out layer is in contact with a first region of the lower conductive layer.

11. The optoelectronic device of claim 9, wherein, The first spacer conductive structure includes: a frame adhesive with conductive function.

12. The optoelectronic device of claim 1, wherein, The second spacer conductive structure includes: a frame adhesive with conductive function.

13. The optoelectronic device of any of claims 1 to 12, wherein, The upper substrate serves as a protective cover for the optoelectronic device.

14. The optoelectronic device of any of claims 1 to 12, wherein, It also includes a reflective layer on the side of the dimming material layer facing away from the substrate.

15. The optoelectronic device of claim 14, wherein, The reflective layer is located between the dimming material layer and the lower substrate, or on the side of the lower substrate facing away from the dimming material layer.

16. An optoelectronic device as claimed in any one of claims 1 to 12, wherein, The dimming material layer includes an EC layer, an SPD layer, a liquid crystal layer, or a dye liquid crystal layer.

17. An electronic rearview mirror, comprising the photoelectric device as described in claim 1.

Images