A high-precision thickness device for processing crystalline silicon

Abstract

This utility model relates to the field of crystalline silicon processing technology and discloses a high-precision thickness-fixing device for crystalline silicon processing, including: a device base, support legs, and a mounting frame; the support legs are welded and fixed to the lower surface of the device base, and the mounting frame is welded and fixed to the upper end of the device base. It also includes: a thickness-fixing component, an adjustment component, and a limiting component; the thickness-fixing component is disposed on the upper surface of the device base, and the adjustment component is disposed on one side of the mounting frame. This utility model utilizes a buffer pad inside the mounting housing to buffer the vibrations generated by the stepper motor during operation, thereby reducing the transmission of vibrations to the crystalline silicon and providing a certain degree of protection. When the crystalline silicon is ground to reduce its thickness, a reset spring pushes the placement plate back to its original position under its own elasticity. At this time, the upper surface of the placement plate contacts a micro switch, which sends the detected data to the controller, thereby stopping the stepper motor and achieving the effect of thickness-fixing processing of the crystalline silicon.

Description

Technical Field

[0001] This utility model relates to the field of crystalline silicon processing technology, specifically a high-precision thickness-fixing device for crystalline silicon processing. Background Technology

[0002] High-precision thickness control equipment for crystalline silicon processing is used for processing crystalline silicon materials. In the crystalline silicon industry chain, the roughly processed silicon wafers often have problems such as thickness deviation and surface unevenness. The thickness control equipment is a specialized core device used to process the cut rough silicon wafers to the target thickness, achieving micron-level precision control, and flexibly adjusting the processing thickness according to different product requirements. Its core value lies in solving the problems of poor thickness uniformity and insufficient precision of crystalline silicon materials, laying the foundation for the high efficiency and stable production of subsequent photovoltaic cells and semiconductor chips.

[0003] In the prior art, such as the polishing equipment for polycrystalline silicon surface grinding with an anti-displacement structure disclosed in CN216967379U, there are polishing fixtures, adjusting grooves, sliders, and anti-displacement units. The polishing fixtures are symmetrically provided with adjusting grooves. A slider is slidably connected in the adjusting grooves. An anti-displacement unit is provided on the slider. The anti-displacement unit includes a clamping linkage plate, a first protective tube, and a first adjusting shaft. By adjusting the height of the slider on the slide rail, the height of the polishing machine can be changed, thereby adapting to polishing polycrystalline silicon wafers of different thicknesses. It can stably and parallelly clamp the polycrystalline silicon wafers, thereby preventing the polycrystalline silicon wafers from shifting during the polishing process.

[0004] Existing devices can change the height of the polishing machine by adjusting the height of the sliding block on the slide rail, thereby adapting to polishing polycrystalline silicon wafers of different thicknesses. They can stably and parallelly clamp the polycrystalline silicon wafers, thus preventing them from shifting during the polishing process. However, they are not convenient for fixing the thickness during use. The physical strength of the silicon wafer is relatively low. If the thickness is uneven, the grinding force on the thick area is too large, which can easily cause edge chipping. Utility Model Content

[0005] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the present invention.

[0006] Given that the existing technology has the disadvantages of inconvenience in thickness determination during use, low physical strength of silicon wafers, and uneven thickness, excessive grinding force on the thicker areas can easily lead to edge chipping.

[0007] To achieve the above objectives, this utility model provides the following technical solution: A high-precision thickness-fixing device for crystalline silicon processing includes: a device base, support legs, and a mounting frame; the support legs are welded and fixed to the lower surface of the device base, and the mounting frame is welded and fixed to the upper end of the device base; the device also includes: Thickness fixing component, adjustment component and limiting component; the thickness fixing component is disposed on the upper surface of the device base, the adjustment component is disposed on one side of the mounting frame, and the limiting component is disposed above the device base.

[0008] As a further embodiment of this utility model: the thickness-fixing component includes: a fixed component, a movable component, a limiting bolt, a mounting plate, and a micro switch. The fixed component is welded to the upper surface of the device base. The movable component is telescopically connected inside the fixed component. The limiting bolt, which abuts against the movable component, is threaded on the side wall of the fixed component.

[0009] As a further improvement of this utility model: a mounting plate is welded and fixed to the upper surface of the movable part, and a micro switch is fixed to one side of the mounting plate by screws.

[0010] As a further embodiment of this utility model: the adjustment component includes: a servo motor, a lead screw, a slider, a stepper motor, a transmission rod, a mounting shell, a buffer pad, and a grinding disc. The servo motor is fixed to the upper end of the mounting bracket by screws, and the power output shaft of the servo motor is fixed with a lead screw. The outer surface of the lead screw is threaded with a slider that is slidably connected to the mounting bracket.

[0011] As a further embodiment of this utility model: one end of the slider is fixed with a stepper motor by screws, the power output shaft of the stepper motor is fixed with a transmission rod, and the lower surface of the transmission rod is telescopically connected with a mounting shell.

[0012] As a further improvement of this utility model: the interior of the mounting shell is provided with a buffer pad that is fixedly connected to the transmission rod, and a grinding disc is installed on the lower surface of the mounting shell.

[0013] As a further embodiment of this utility model: the limiting component includes: a placement plate, a reset spring, a limiting rod, a limiting tube, a connecting tube, a negative pressure pump, an exhaust pipe, and a solenoid valve. The placement plate is disposed above the device base. The lower surface of the placement plate abuts against a reset spring that is fixedly connected to the device base. The lower end of the placement plate is fixed with a limiting rod, and the lower end of the limiting rod is telescopically connected to a limiting tube.

[0014] As a further embodiment of this utility model: a connecting pipe is connected to one side of the placement plate, a negative pressure pump is connected to the end of the connecting pipe, an exhaust pipe is connected to the outer wall of the connecting pipe, and a solenoid valve is fixed to one side of the exhaust pipe.

[0015] Compared with the prior art, the beneficial effects of this utility model are: 1. The present invention uses a buffer pad inside the housing to buffer the vibration generated by the stepper motor during operation, thereby reducing the transmission of vibration to the crystalline silicon and providing a certain degree of protection. When the thickness of the crystalline silicon is reduced by grinding, the reset spring will push the placement plate to reset under its own elasticity. At this time, the upper surface of the placement plate contacts the micro switch, and the micro switch sends the detected data to the controller, thereby stopping the stepper motor and realizing the function of fixed thickness processing of crystalline silicon.

[0016] 2. This utility model loosens the limiting bolts on the fixing component to release the fixing of the moving component. At this time, the mounting plate can be pulled vertically, thereby adjusting the distance between the micro switch and the placement plate, which is convenient for processing crystalline silicon of different thicknesses. Attached Figure Description

[0017] Figure 1 A three-dimensional structural schematic diagram of a high-precision thickness-fixing device for crystalline silicon processing; Figure 2 This is a schematic cross-sectional view of the plate placed in a high-precision thickness-fixing device for crystalline silicon processing. Figure 3 This is a schematic cross-sectional view of the mounting bracket in a high-precision thickness-fixing device for crystalline silicon processing. Figure 4 This is a three-dimensional structural diagram of a plate placed in a high-precision thickness-fixing device for crystalline silicon processing. Figure 5 This is a schematic cross-sectional view of a fixing component in a high-precision thickness-fixing device for crystalline silicon processing.

[0018] In the diagram: 1. Device base; 2. Support leg; 3. Mounting bracket; 4. Fixing component; 41. Moving component; 42. Limit bolt; 43. Mounting plate; 44. Micro switch; 5. Servo motor; 51. Lead screw; 52. Slider; 53. Stepper motor; 54. Transmission rod; 55. Mounting shell; 56. Buffer pad; 57. Grinding disc; 6. Placement plate; 61. Return spring; 62. Limit rod; 63. Limit tube; 64. Connecting tube; 65. Negative pressure pump; 66. Exhaust pipe; 67. Solenoid valve. Detailed Implementation

[0019] To make the above-mentioned objectives, features and advantages of this utility model more readily understood, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0020] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0021] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single embodiment or an embodiment selectively excluded from other embodiments.

[0022] Example 1 Please see Figure 1 - Figure 5 This is the first embodiment of the present utility model. This embodiment provides a high-precision thickness-fixing device for crystalline silicon processing, including: a device base 1, support legs 2, and a mounting frame 3; the support legs 2 are welded and fixed to the lower surface of the device base 1, and the mounting frame 3 is welded and fixed to the upper end of the device base 1, and also includes: Thickness fixing component, adjustment component and limiting component; the thickness fixing component is disposed on the upper surface of the device base 1, the adjustment component is disposed on one side of the mounting frame 3, and the limiting component is disposed above the device base 1.

[0023] Specifically, the thickness-fixing component includes: a fixing part 4, a movable part 41, a limiting bolt 42, a mounting plate 43, and a micro switch 44. The fixing part 4 is welded to the upper surface of the device base 1. The movable part 41 is telescopically connected inside the fixing part 4. The limiting bolt 42, which abuts against the movable part 41, is threaded on the side wall of the fixing part 4. The mounting plate 43 is welded and fixed to the upper surface of the movable part 41. The micro switch 44 is fixed to one side of the mounting plate 43 by screws.

[0024] Furthermore, when the silicon crystal is polished to reduce its thickness, the reset spring 61 will push the placement plate 6 to reset under its own elasticity. At this time, the upper surface of the placement plate 6 contacts the micro switch 44, and the micro switch 44 sends the detected data to the controller, which in turn causes the controller to control the stepper motor 53 to stop running, thereby achieving the function of fixed thickness processing of silicon crystal.

[0025] Specifically, the adjustment components include: a servo motor 5, a lead screw 51, a slider 52, a stepper motor 53, a transmission rod 54, a mounting shell 55, a buffer pad 56, and a grinding disc 57. The servo motor 5 is fixed to the upper end of the mounting bracket 3 by screws. The power output shaft of the servo motor 5 is fixed with the lead screw 51. The outer surface of the lead screw 51 is threaded with a slider 52 that is slidably connected to the mounting bracket 3. One end of the slider 52 is fixed with a stepper motor 53 by screws. The power output shaft of the stepper motor 53 is fixed with a transmission rod 54. The lower surface of the transmission rod 54 is telescopically connected with the mounting shell 55.

[0026] Furthermore, the controller controls the servo motor 5 to run, which in turn drives the lead screw 51 to rotate, causing the threaded slider 52 to move vertically, so that the lower surface of the polishing disc 57 contacts the upper surface of the crystalline silicon.

[0027] Specifically, the interior of the mounting housing 55 is provided with a buffer pad 56 that is fixedly connected to the transmission rod 54, and a grinding disc 57 is installed on the lower surface of the mounting housing 55.

[0028] Furthermore, the stepper motor 53 is started by the controller, which in turn drives the transmission rod 54 to rotate, synchronously driving the grinding disc 57 at the lower end of the mounting housing 55 to rotate, grinding the crystalline silicon. The buffer pad 56 set inside the mounting housing 55 can play a buffering role.

[0029] In use, place the device base 1 in a suitable position. The support legs 2 ensure the stability of the device. Loosen the limit bolts 42 on the fixing parts 4 to release the fixation of the moving parts 41. At this time, the mounting plate 43 can be pulled vertically to adjust the distance between the micro switch 44 and the placement plate 6. After adjustment, tighten the limit bolts 42 to fix the moving parts 41. Then, the servo motor 5 on the mounting frame 3 is controlled by an external controller to drive the lead screw 51 to rotate, which in turn drives the threaded slider 52 to move vertically. When the lower surface of the grinding disc 57 contacts the upper surface of the crystalline silicon, it will push the placement plate 6 to move downward slightly, thereby pushing the return spring 61 to compress. The limit rod 62 and the limit... Position tube 63 acts as a guide. At this time, the stepper motor 53 on the slider 52 is started by the controller, which drives the transmission rod 54 to rotate, synchronously driving the grinding disc 57 at the lower end of the mounting shell 55 to rotate, grinding the crystalline silicon. The buffer pad 56 set in the mounting shell 55 can play a buffering role, thereby reducing the vibration generated by the stepper motor 53 during operation and transmitting it into the crystalline silicon, providing a certain degree of protection. When the thickness of the crystalline silicon is reduced by grinding, the reset spring 61 will push the placement plate 6 to reset under its own elasticity. At this time, the upper surface of the placement plate 6 contacts the micro switch 44. The micro switch 44 sends the detected data to the controller, which then controls the stepper motor 53 to stop running, realizing the function of crystalline silicon thickness determination.

[0030] In summary, when this high-precision thickness-fixing device for crystalline silicon processing is in use, the buffer pad 56 installed inside the mounting housing 55 can act as a buffer, thereby reducing the vibration generated by the stepper motor 53 during operation from being transmitted to the crystalline silicon, thus providing a certain degree of protection. When the crystalline silicon is ground to reduce its thickness, the reset spring 61 will push the placement plate 6 to reset under its own elasticity. At this time, the upper surface of the placement plate 6 contacts the micro switch 44, and the micro switch 44 sends the detected data to the controller, which in turn causes the controller to stop the stepper motor 53, thereby achieving the function of crystalline silicon thickness-fixing processing.

[0031] Example 2 Please see Figure 1 - Figure 5This is the second embodiment of the present utility model.

[0032] Specifically, the limiting components include: a placement plate 6, a return spring 61, a limiting rod 62, a limiting tube 63, a connecting tube 64, a negative pressure pump 65, an exhaust pipe 66, and a solenoid valve 67. The placement plate 6 is positioned above the device base 1. The lower surface of the placement plate 6 abuts against the return spring 61, which is fixedly connected to the device base 1. The lower end of the placement plate 6 is fixed with the limiting rod 62, and the lower end of the limiting rod 62 is telescopically connected to the limiting tube 63.

[0033] Furthermore, the negative pressure pump 65 can extract the air from the placement plate 6, and the negative pressure holes on the upper surface of the placement plate 6 can adsorb the crystalline silicon under negative pressure, thereby reducing the possibility of the crystalline silicon falling off.

[0034] Specifically, a connecting pipe 64 is connected to one side of the placement plate 6, a negative pressure pump 65 is connected to the end of the connecting pipe 64, an exhaust pipe 66 is connected to the outer wall of the connecting pipe 64, and a solenoid valve 67 is fixed to one side of the exhaust pipe 66.

[0035] Furthermore, when the solenoid valve 67 on the exhaust pipe 66 is opened, external air can enter the placement plate 6, thereby relieving the negative pressure adsorption on the crystalline silicon.

[0036] In use, the crystalline silicon to be processed is placed on the placement plate 6. Through the connecting pipe 64, the negative pressure pump 65 can extract the air from the placement plate 6. The negative pressure holes on the upper surface of the placement plate 6 perform negative pressure adsorption on the crystalline silicon, thereby reducing the possibility of the crystalline silicon falling off. When the solenoid valve 67 on the exhaust pipe 66 is opened, the outside air can enter the placement plate 6, thereby releasing the negative pressure adsorption on the crystalline silicon. When performing fixed thickness processing.

[0037] In summary, when using this high-precision thickness-fixing device for crystalline silicon processing, the buffer pad 56 inside the mounting housing 55 acts as a buffer, thereby reducing the vibration generated by the stepper motor 53 during operation from being transmitted to the crystalline silicon, providing a certain degree of protection. When the crystalline silicon is ground to reduce its thickness, the reset spring 61 will push the placement plate 6 to reset under its own elasticity. At this time, the upper surface of the placement plate 6 contacts the micro switch 44, and the micro switch 44 sends the detected data to the controller, which then controls the stepper motor 53 to stop running, thus achieving the function of crystalline silicon thickness-fixing processing. Furthermore, the limit bolt 42 on the fixing part 4 is loosened, releasing the fixation of the moving part 41. At this time, the mounting plate 43 can be pulled vertically, thereby adjusting the distance between the micro switch 44 and the placement plate 6, facilitating the processing of crystalline silicon with different thicknesses.

[0038] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape, and proportions of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of this utility model. The order or sequence of any process or method steps may be changed or rearranged according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structural equivalents but also equivalent structures. Without departing from the scope of this invention, other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments. Therefore, this invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0039] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the best mode of carrying out the present invention as currently considered, or those features that are not relevant to implementing the present invention) may be omitted.

[0040] It should be understood that numerous specific implementation decisions can be made during the development of any actual implementation method, and in any engineering or design project. Such development efforts may be complex and time-consuming, but for those of ordinary skill in the art who benefit from this disclosure, the development effort will be a routine task in design, manufacturing, and production without requiring extensive experimentation.

[0041] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A high-precision thickness-fixing device for crystalline silicon processing, characterized in that: include: The device includes a base (1), support legs (2), and a mounting bracket (3); the support legs (2) are welded and fixed to the lower surface of the device base (1), and the mounting bracket (3) is welded and fixed to the upper end of the device base (1). It also includes: Thickness fixing component, adjustment component and limiting component; the thickness fixing component is disposed on the upper surface of the device base (1), the adjustment component is disposed on one side of the mounting frame (3), and the limiting component is disposed above the device base (1).

2. The high-precision thickness-fixing device for crystalline silicon processing according to claim 1, characterized in that: The thickness-fixing component includes: a fixing part (4), a movable part (41), a limiting bolt (42), a mounting plate (43), and a micro switch (44). The fixing part (4) is welded to the upper surface of the device base (1). The movable part (41) is telescopically connected inside the fixing part (4). The limiting bolt (42) that abuts against the movable part (41) is threaded on the side wall of the fixing part (4).

3. The high-precision thickness device for processing crystalline silicon according to claim 2, characterized in that: A mounting plate (43) is welded and fixed to the upper surface of the movable part (41), and a micro switch (44) is fixed to one side of the mounting plate (43) by screws.

4. The high-precision thickness-fixing device for crystalline silicon processing according to claim 3, characterized in that: The adjustment assembly includes: a servo motor (5), a lead screw (51), a slider (52), a stepper motor (53), a transmission rod (54), a mounting shell (55), a buffer pad (56), and a grinding disc (57). The servo motor (5) is fixed to the upper end of the mounting bracket (3) by screws. The power output shaft of the servo motor (5) is fixed with a lead screw (51). The outer surface of the lead screw (51) is threaded with a slider (52) that is slidably connected to the mounting bracket (3).

5. The high-precision thickness-fixing device for crystalline silicon processing according to claim 4, characterized in that: One end of the slider (52) is fixed with a stepper motor (53) by screws. The power output shaft of the stepper motor (53) is fixed with a transmission rod (54). The lower surface of the transmission rod (54) is telescopically connected with a mounting shell (55).

6. The high-precision thickness-fixing device for crystalline silicon processing according to claim 5, characterized in that: The mounting housing (55) has a buffer pad (56) that is fixedly connected to the transmission rod (54) inside, and a grinding disc (57) is installed on the lower surface of the mounting housing (55).

7. The high-precision thickness-fixing device for crystalline silicon processing according to claim 6, characterized in that: The limiting assembly includes: a placement plate (6), a reset spring (61), a limiting rod (62), a limiting tube (63), a connecting tube (64), a negative pressure pump (65), an exhaust pipe (66), and a solenoid valve (67). The placement plate (6) is positioned above the device base (1). The lower surface of the placement plate (6) is abutted against the reset spring (61) which is fixedly connected to the device base (1). The lower end of the placement plate (6) is fixed with the limiting rod (62), and the lower end of the limiting rod (62) is telescopically connected to the limiting tube (63).

8. The high-precision thickness-fixing device for crystalline silicon processing according to claim 7, characterized in that: A connecting pipe (64) is connected to one side of the placement plate (6), a negative pressure pump (65) is connected to the end of the connecting pipe (64), an exhaust pipe (66) is connected to the outer wall of the connecting pipe (64), and a solenoid valve (67) is fixed to one side of the exhaust pipe (66).

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