Splash guard for polishing liquid and debris
Patent Information
- Application Number
- CN202521975060.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-12
- Publication Date
- 2026-09-11
- Estimated Expiration
- 2035-09-12
AI Technical Summary
目前的抛光液防溅射装置多为防止抛光液溅射，并无针对碎片的清理措施
[0015]本公开实施例提供的技术方案至少具有以下优点：
Smart Images
Figure CN224738030U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of polishing technology, and in particular to a splash-proof device for polishing fluid and debris. Background Technology
[0002] Chemical mechanical polishing (CMP) is an ultra-precision surface finishing technique that achieves global planarization. In CMP, the wafer is typically held in place by the bottom surface of a support head, with the side of the wafer containing the deposited layer pressed against the upper surface of a polishing pad. The support head, driven by a drive assembly, rotates in the same direction as the polishing pad, applying a downward load to the wafer. Simultaneously, polishing fluid is supplied to the upper surface of the polishing pad and distributed between the wafer and the polishing pad, allowing the wafer to undergo chemical and mechanical polishing through a combination of chemical and mechanical processes.
[0003] During chemical mechanical polishing (CMP), the centrifugal force generated by the rotation of moving parts such as the bearing head and polishing disc throws the polishing slurry off the disc. If the wafer breaks during operation, fragments will also be thrown out with the rotation. To prevent the polishing slurry and silicon carbide fragments from splashing outwards under centrifugal force, baffles need to be installed on the outside of the polishing disc, and the fragments need to be cleaned regularly. Current polishing slurry anti-splash devices are mostly designed to prevent polishing slurry splashing, but do not have measures for cleaning fragments. Utility Model Content
[0004] This disclosure provides a splash-proof device for polishing slurry and debris, which at least helps to solve the problem that most current polishing slurry splash-proof devices only prevent polishing slurry from splashing and do not have cleaning measures for debris.
[0005] According to some embodiments of this disclosure, one aspect of this disclosure provides a splash-proof device for polishing fluid and debris, used to prevent the splashing of polishing fluid and debris that do not drip onto the polishing pad during the polishing process. The device includes: a flow guide channel, which is disposed around the outer periphery of the polishing pad; the flow guide channel includes a first side plate, a second side plate, and a bottom plate, wherein the first side plate and the second side plate are disposed opposite to each other, and the height of the first side plate is adapted to the height of the polishing pad, and the height of the second side plate is greater than the height of the first side plate; the flow guide channel is used to collect polishing fluid during the polishing process; and a receiving groove, which is formed on the bottom plate facing the dripping direction of the polishing fluid, used to collect debris during the polishing process.
[0006] The base plate includes a slope facing the flow channel. The slope includes a first end and a second end opposite to each other. The first end is fixedly connected to the first side plate, and the second end is fixedly connected to the second side plate. Both the first end and the second end are inclined downward toward the receiving channel.
[0007] At least one water inlet is provided on the side of the second side plate facing the guide channel.
[0008] In some embodiments, the device further includes a baffle, which is disposed around the outer periphery of the polishing disk and is movably connected to one end of the second side plate away from the polishing disk.
[0009] In some embodiments, the system further includes a lifting assembly disposed on the side of the second side plate or the baffle away from the guide channel, so that the baffle and the second side plate can move relative to each other in the height direction of the second side plate.
[0010] In some embodiments, the cross-sectional shape of the guide channel perpendicular to the dripping direction of the polishing liquid is an n-sided polygon, where n is greater than or equal to 4 and n is a positive integer.
[0011] In some embodiments, the device further includes: a movable groove disposed within the receiving groove, the movable groove having a filter hole, the diameter of the filter hole being smaller than the minimum diameter of the fragment.
[0012] In some embodiments, the device further includes a cover plate, which is detachably connected to the second side plate near the receiving groove, and the second side plate has a through hole at a position corresponding to the cover plate for removing the movable groove.
[0013] In some embodiments, the receiving groove has an opening on the side facing the second side plate for retrieving the movable groove.
[0014] In some embodiments, the receiving tank has a drain outlet on the side away from the inside of the receiving tank.
[0015] The technical solutions provided in this disclosure have at least the following advantages:
[0016] The technical solution provided in this disclosure includes a flow guide channel, which is arranged around the outer periphery of the polishing disk. The flow guide channel includes a first side plate, a second side plate, and a bottom plate. The first side plate and the second side plate are arranged opposite to each other. The first side plate abuts against the polishing disk, and the height of the first side plate is adapted to the height of the polishing disk. The height of the second side plate is greater than the height of the first side plate. The flow guide channel is used to collect polishing fluid during the polishing process. Thus, during the polishing process, the second side plate can block the polishing fluid that is splashed out. A receiving tank is provided on the bottom plate facing the direction of polishing fluid dripping, which is used to collect debris during the polishing process. By setting a flow guide structure around and at the bottom of the polishing disk, if the wafer breaks during chemical mechanical polishing, and the debris is thrown out with the rotation, the flow guide structure in this solution has a receiving tank that can collect the debris splashed out during the polishing process, further ensuring the safety of the polishing process. Attached Figure Description
[0017] One or more embodiments are illustrated by way of example with corresponding pictures in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Unless otherwise stated, the pictures in the accompanying drawings do not constitute a limitation on scale. In order to more clearly illustrate the technical solutions in the embodiments of this disclosure or the conventional technology, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 A perspective view of a splash-proof device for polishing fluid and debris provided in an embodiment of this disclosure;
[0019] Figure 2 A top view of a splash-proof device for polishing fluid and debris provided in an embodiment of this disclosure;
[0020] Figure 3 A top view of a splash-proof device for polishing fluid and debris provided in another embodiment of this disclosure;
[0021] Figure 4 A cross-sectional view of a splash-proof device for polishing fluid and debris provided in an embodiment of this disclosure;
[0022] Figure 5 Another cross-sectional view of a splash-proof device for polishing fluid and debris provided in an embodiment of this disclosure. Detailed Implementation
[0023] As the background technology indicates, during chemical mechanical polishing (CMP), the centrifugal force generated by the rotation of moving parts such as the bearing head and polishing disc throws the polishing slurry off the disc. If the wafer breaks during operation, fragments will also be thrown out with the rotation. To prevent the polishing slurry and silicon carbide fragments from splashing outwards under centrifugal force, baffles need to be installed on the outside of the polishing disc, and the fragments need to be cleaned regularly. Current polishing slurry anti-splash devices are mostly designed to prevent polishing slurry splashing, and do not have measures for cleaning fragments.
[0024] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been provided in the embodiments of this disclosure to facilitate a better understanding of the disclosure. However, the technical solutions claimed in this disclosure can be implemented even without these technical details and various variations and modifications based on the following embodiments.
[0025] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.
[0026] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.
[0027] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists, A and B exist simultaneously, and B exists. In addition, the character " / " in this document generally indicates that the related objects before and after it have an "or" relationship.
[0028] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).
[0029] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.
[0030] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.
[0031] Figure 1A perspective view of a splash-proof device for polishing fluid and debris provided in an embodiment of this disclosure; Figure 2 A top view of a splash-proof device for polishing fluid and debris provided in an embodiment of this disclosure; Figure 3 A top view of a splash-proof device for polishing fluid and debris provided in another embodiment of this disclosure; Figure 4 A cross-sectional view of a splash-proof device for polishing fluid and debris provided in an embodiment of this disclosure; Figure 5 Another cross-sectional view of a splash-proof device for polishing fluid and debris provided in an embodiment of this disclosure.
[0032] This disclosure provides a splash-proof device for polishing slurry and debris, which at least helps to solve the problem that most current polishing slurry splash-proof devices only prevent polishing slurry from splashing and do not have cleaning measures for debris.
[0033] Reference Figures 1 to 5 This disclosure provides a splash-proof device for polishing slurry and debris, used to prevent the splashing of polishing slurry and debris that do not drip onto the polishing disk 10 during the polishing process. The device includes: a guide channel 30, which surrounds the outer periphery of the polishing disk 10 and includes a first side plate 35, a second side plate 36, and a bottom plate 31. The first side plate 35 and the second side plate 36 are arranged opposite to each other, with the height of the first side plate 35 adapted to the height of the polishing disk 10, and the height of the second side plate 36 greater than the height of the first side plate 35. The guide channel 30 is used to collect polishing slurry during the polishing process; and a receiving groove 32, which is formed on the bottom plate 31 facing the direction of polishing slurry dripping, used to collect debris during the polishing process. The advantage of having a guide channel 30 around and at the bottom of the polishing disk 10 is that if the wafer breaks during chemical mechanical polishing, and debris is thrown out with the rotation, the guide structure in this solution has a receiving groove 32, which can collect the debris splashed out during the polishing process, further ensuring the safety of the polishing process.
[0034] Reference Figure 1 and Figure 4 In this embodiment of the disclosure, the base plate 31 includes a slope facing into the guide channel 30. The slope includes a first end and a second end opposite to each other. The first end is fixedly connected to the first side plate 35, and the second end is fixedly connected to the second side plate 36. Both the first end and the second end are inclined downward toward the receiving channel 32.
[0035] Specifically, the receiving tank 32 can be located at one end of the base plate 31 near the first side plate 35, or at one end of the base plate 31 near the second side plate 36. The receiving tank 32 can also be located at any position on the base plate 31. As long as the first and second ends of the slope are both inclined downwards towards the receiving tank 32, the polishing liquid and the debris will splash outwards under the action of centrifugal force. When they are blocked by the second side plate 36 and fall into the base plate 31, the debris can fall into the receiving tank 32 along the slope of the slope. Thus, the silicon carbide debris can be collected by the receiving tank 32, which facilitates the cleaning of the debris.
[0036] The depth of the receiving tank 32 along the dripping direction of the polishing liquid can be set to be less than or equal to the height of the first side plate 35. Thus, on the one hand, the depth of the receiving tank 32 is not too shallow, so that the fragments will not be easily carried out after falling into the receiving tank 32 along the slope of the slope. On the other hand, the depth of the receiving tank 32 is not too deep, so as to avoid the overall space occupied by the anti-splash device for polishing liquid and fragments being too large, and at the same time, it can avoid the manufacturing cost of the anti-splash device for polishing liquid and fragments being too high.
[0037] Meanwhile, the cross-sectional shape of the receiving tank 32 perpendicular to the dripping direction of the polishing liquid can be square, circular, trapezoidal, or irregular, as long as the maximum diameter of the cross-section is less than the minimum width of the base plate 31 and greater than the maximum width of any cross-section of the fragment. This ensures that the receiving tank 32 has sufficient space to accommodate the splashed fragments, and that the receiving tank 32 is not directly connected to the first side plate 35, preventing a decrease in the splash-proof effect of the polishing liquid and fragment anti-splash device. It should be noted that when the cross-sectional shape of the receiving tank 32 is circular, the maximum diameter refers to the diameter of the circle; when the cross-sectional shape of the receiving tank 32 is square, the maximum diameter refers to the length of the longest side of the square; when the cross-sectional shape of the receiving tank 32 is trapezoidal, the maximum diameter refers to the length of the lower base of the trapezoid; and when the cross-sectional shape of the receiving tank 32 is irregular, the maximum diameter refers to the length of the longest diameter of the irregular shape, i.e., the longest line segment between any two vertices of the irregular shape.
[0038] In this embodiment, the position furthest from the slope to the receiving groove 32 is the highest point of the base plate 31, and the slope of the base plate 31 is inclined from the highest point to the receiving groove 32, thereby ensuring that the polishing liquid and debris falling into the base plate 31 can all flow into the receiving groove 32.
[0039] In this disclosure embodiment, in conjunction with reference to Figure 1 and Figure 3 At least one water inlet 37 is provided on the side of the second side plate 36 facing the guide channel 30.
[0040] Specifically, refer to Figure 3Five water inlets 37 are provided on the side of the second side plate 36 facing the guide channel 30. Water can be supplied to the guide channel through the water inlets 37, thereby washing the fragments that fall into the guide channel 30 during the polishing process into the receiving tank 32, thus realizing the collection of fragments during the polishing process.
[0041] In this embodiment, it further includes: a baffle 20, which is disposed around the outer periphery of the polishing disk 10, and the baffle 20 is movably connected to the end of the second side plate 36 away from the polishing disk 10.
[0042] Specifically, the baffle 20 can be slidably connected to the second side plate 36. When not polishing, the baffle 20 can slide to a position flush with the polishing disc 10, thereby reducing the space occupied by the anti-splash device for polishing liquid and debris when not polishing. During polishing, the baffle 20 can slide away from the polishing disc 10, thereby improving the anti-splash effect of the anti-splash device for polishing liquid and debris.
[0043] Meanwhile, the baffle 20 can also be configured as a flap that is rotatably connected to the second side plate 36. When the polishing process is not in progress, the flap can be flipped to the inner wall or outer periphery of the second side plate 36. During the polishing process, the flap can be flipped and fixed to the end of the second side plate 36 away from the polishing disc 10, which can also make the anti-splashing effect of the anti-splashing device for polishing liquid and debris better.
[0044] The baffle 20 can also be detachably connected to the second side plate 36. After the polishing process, if there is splashed polishing liquid left on the surface of the baffle 20, the baffle 20 and the second side plate 36 can be disassembled for cleaning.
[0045] The side of the baffle 20 facing the polishing disk 10 and the side of the second side plate 36 facing the polishing disk 10 may be coated with a hydrophilic coating to absorb the polishing liquid splashed onto the baffle 20 or the second side plate 36, preventing the polishing liquid from splashing back onto the component to be polished.
[0046] In this embodiment, a lifting assembly 40 is also included. The lifting assembly 40 is disposed on the side of the second side plate 36 or the baffle 20 away from the groove of the guide channel 30, so that the baffle 20 and the second side plate 36 can move relative to each other in the height direction of the second side plate 36.
[0047] The baffle 20 can be slidably connected to the second side plate 36 via the lifting assembly 40. The baffle 20 can be arranged around the outer periphery of the second side plate 36, or the baffle 20 can be arranged around the inner wall of the second side plate 36, as long as the baffle 20 and the second side plate 36 can move relative to each other along the height direction of the second side plate 36, and there is no limitation here.
[0048] In this embodiment, the lifting assembly 40 may be a cylinder. In some other embodiments of this disclosure, the lifting assembly 40 includes a slide rail and a slider, the slide rail or slider being disposed on the side of the second side plate 36 away from the groove of the guide channel 30, and the slider or slide rail being disposed on the side of the baffle 20 facing the second side plate 36. Specifically, the slide rail and slider may be made of plastic or metal, which on the one hand ensures the connection stability between the second side plate 36 and the baffle 20, and on the other hand reduces the overall manufacturing cost of the anti-splash device for polishing liquid and debris. In addition, the lifting assembly 40 may also include a linear motor or guide rod, etc., that can slidably connect the baffle 20 and the second side plate 36.
[0049] See Figure 2 In this embodiment of the present disclosure, the cross-sectional shape of the guide groove 30 perpendicular to the dripping direction of the polishing liquid is an n-sided polygon, where n is greater than or equal to 4 and n is a positive integer.
[0050] Specifically, the cross-sectional shape of the guide channel 30 perpendicular to the dripping direction of the polishing liquid can be quadrilateral, pentagonal, hexagonal, heptagonal, or octagonal. That is, the cross-sectional shapes of the first side plate 35 and the second side plate 36 perpendicular to the dripping direction of the polishing liquid can be arranged to form quadrilaterals, pentagons, hexagons, heptagons, or octagons. Therefore, the overall structure of the guide channel 30 has higher stability and is less prone to damage.
[0051] See Figure 1 In this embodiment, the device further includes a movable groove 33, which is disposed within the receiving groove 32. The movable groove 33 has filter holes with a diameter smaller than the minimum diameter of the fragments. The shape of the movable groove 33 is adapted to the shape of the receiving groove 32, thereby facilitating the collection of fragments by the movable groove 33.
[0052] Reference Figure 3 and Figure 5 In this embodiment, it further includes: a cover plate 34, which is detachably connected to the second side plate 36 near the receiving groove 32. The second side plate 36 has a through hole at the position corresponding to the cover plate 34 for taking out the movable groove 33.
[0053] In some other embodiments of this disclosure, the receiving groove 32 has an opening on the side facing the second side plate 36 for retrieving the movable groove 33. Specifically, the movable groove 33 can be configured as a pull-out movable groove 33, so that the movable groove 33 can be pulled out from the receiving groove 32 to clean the collected debris in the movable groove 33.
[0054] In some other embodiments of this disclosure, a drain outlet is provided on the side of the receiving tank 32 away from the inside of the tank. Specifically, the polishing liquid and debris collected in the receiving tank 32 can be discharged through the drain outlet, and a flushing pipe can be connected to the drain outlet to flush the receiving tank 32 and the bottom plate 31, thereby cleaning the polishing liquid and debris.
[0055] In this embodiment, both the polishing disc 10 and the guide channel 30 are mounted on the installation platform. This facilitates polishing operations and the collection or cleaning of polishing fluid and debris by the operator.
[0056] The technical solution provided in this embodiment includes a flow guide trough 30, which is disposed around the outer periphery of the polishing disk 10. The flow guide trough 30 includes a first side plate 35, a second side plate 36, and a bottom plate 31. The first side plate 35 and the second side plate 36 are disposed opposite to each other, and the height of the first side plate 35 is adapted to the height of the polishing disk 10, while the height of the second side plate 36 is greater than the height of the first side plate 35. Thus, during the polishing process, the second side plate 36 can block the polishing liquid that is thrown out. A receiving trough 32 is provided on the bottom plate 31 facing the dripping direction of the polishing liquid to collect debris during the polishing process. The bottom plate 31 includes a slope facing into the flow guide trough 30, and the slope includes a first end and a second end facing each other. The first end is fixedly connected to the first side plate 35, and the second end is fixedly connected to the second side plate 36. Both the first end and the second end are inclined downward toward the receiving trough 32. The present invention provides a flow guiding structure around and at the bottom of the polishing pad 10. If the wafer breaks during the chemical mechanical polishing process and the fragments are thrown out with the rotation, the flow guiding structure in this solution has a receiving groove 32, which can collect the fragments splashed out during the polishing process, thereby further ensuring the safety of the polishing process.
[0057] Those skilled in the art will understand that the above embodiments are specific examples of implementing this disclosure, and in practical applications, various changes in form and detail may be made without departing from the spirit and scope of this disclosure. Any person skilled in the art can make various alterations and modifications without departing from the spirit and scope of this disclosure; therefore, the scope of protection of this disclosure should be determined by the scope defined in the claims.
Claims
1. A splash-proof device for polishing fluid and debris, used to prevent the splashing of polishing fluid and debris that have not dripped onto the polishing pad during the polishing process, characterized in that, include: A flow guide channel is provided around the outer periphery of the polishing disk. The flow guide channel includes a first side plate, a second side plate, and a bottom plate. The first side plate and the second side plate are arranged opposite to each other. The height of the first side plate is adapted to the height of the polishing disk, and the height of the second side plate is greater than the height of the first side plate. The flow guide channel is used to collect polishing liquid during the polishing process. The base plate has a receiving groove facing the dripping direction of the polishing liquid to collect debris during the polishing process.
2. The anti-splash device for polishing fluid and debris according to claim 1, characterized in that, The base plate includes a slope facing the flow channel. The slope includes a first end and a second end opposite to each other. The first end is fixedly connected to the first side plate, and the second end is fixedly connected to the second side plate. Both the first end and the second end are inclined downward toward the receiving channel.
3. The anti-splash device for polishing fluid and debris according to claim 1, characterized in that, At least one water inlet is provided on the side of the second side plate facing the guide channel.
4. The anti-splash device for polishing fluid and debris according to claim 1, characterized in that, Also includes: A baffle is disposed around the outer periphery of the polishing disc, and the baffle is movably connected to the end of the second side plate away from the polishing disc.
5. The anti-splash device for polishing fluid and debris according to claim 4, characterized in that, Also includes: A lifting assembly is disposed on the side of the second side plate or the baffle away from the guide channel, so that the baffle and the second side plate can move relative to each other in the height direction of the second side plate.
6. The anti-splash device for polishing fluid and debris according to claim 1, characterized in that, The cross-sectional shape of the guide channel perpendicular to the dripping direction of the polishing liquid is an n-sided polygon, where n is greater than or equal to 4 and n is a positive integer.
7. The anti-splash device for polishing fluid and debris according to claim 1, characterized in that, Also includes: An active slot is placed inside the receiving slot, and the active slot is provided with filter holes, the diameter of which is smaller than the minimum diameter of the fragment.
8. The anti-splash device for polishing fluid and debris according to claim 7, characterized in that, Also includes: A cover plate is detachably connected to the second side plate near the receiving groove. The second side plate has a through hole at a position corresponding to the cover plate for removing the movable groove.
9. The anti-splash device for polishing fluid and debris according to claim 7, characterized in that, The receiving groove has an opening on the side facing the second side plate for retrieving the movable groove.
10. The anti-splash device for polishing fluid and debris according to claim 1, characterized in that, The side of the receiving tank away from the inside of the receiving tank has a drain outlet.