Polishing droplet device

Abstract

The polishing droplet device provided by the embodiment of the present disclosure comprises: a cantilever located above a polishing disc; a rotating shaft, one end of which is fixedly connected with the cantilever; a first shell, the rotating shaft being fixedly connected with the first shell, the first shell having a first accommodating cavity, the rotating shaft being located in the first accommodating cavity; a positioning ring, the rotating shaft being rotationally connected with the positioning ring, wherein the rotating shaft passes through a through hole located at the center of the positioning ring; and a positioning part, the positioning part being fixedly connected with the first shell and abutting against the positioning ring, wherein at least two positioning notches are formed in the positioning ring, the cantilever rotates around the positioning ring, the positioning part abuts against the positioning notches in the rotating process, at least one positioning notch corresponds to a standby station of the cantilever, and at least one positioning notch corresponds to a working station of the cantilever. The embodiment of the present disclosure realizes the conversion of the station by arranging the positioning ring, and can make the positioning process more convenient while realizing accurate positioning.

Description

Technical Field

[0001] This disclosure relates to the field of polishing technology, and in particular to a polishing dripping device. Background Technology

[0002] In the wafer manufacturing process, polishing steps such as rough polishing and fine polishing are generally required. Among these, the supply of polishing slurry has a significant impact on the final morphology and quality of the wafer after polishing. Therefore, designing a reasonable and effective polishing slurry dispensing device for the wafer polishing system is of great importance.

[0003] In existing technologies, polishing slurry dripping devices on the market mainly use a center-drip method to add polishing slurry to the polishing pad. The polishing slurry is added downwards from above the center of the polishing pad, and as the polishing head rotates, it carries the polishing slurry to other positions on the polishing pad. However, since the dripping device needs to be moved away from the working position when changing the polishing pad, it is impossible to accurately find the original position when moving back, which reduces the polishing quality.

[0004] Therefore, the technical problem with the existing technology is that the position of the polishing liquid droplet is difficult to be repeatedly located. Utility Model Content

[0005] This disclosure provides a polishing liquid dripping device, which at least helps to solve the problems of complex structure and complicated positioning and switching process of existing polishing liquid dripping devices.

[0006] According to some embodiments of this disclosure, one aspect of this disclosure provides a polishing liquid dripping device for replenishing polishing liquid to a polishing disc, comprising: a cantilever, the cantilever being located above the polishing disc and used to drip polishing liquid onto the polishing disc; a rotating shaft, one end of which is fixedly connected to the cantilever; a first housing, the rotating shaft being fixedly connected to the first housing, the first housing having a first receiving cavity, the rotating shaft being located within the first receiving cavity; a positioning ring, the rotating shaft being rotatably connected to the positioning ring, wherein the rotating shaft passes through a through hole located at the center of the positioning ring; a positioning part, the positioning part being fixedly connected to the first housing and abutting against the positioning ring; wherein the positioning ring has at least two positioning notches, the cantilever rotating around the positioning ring under the drive of the positioning part, the positioning part abutting against the positioning notches during rotation, at least one positioning notch corresponding to a standby position of the cantilever, and at least one positioning notch corresponding to a working position of the cantilever.

[0007] In some embodiments, the positioning part includes: a second housing, the second housing being fixedly connected to the first housing, the second housing having a second receiving cavity, wherein the first receiving cavity communicates with the second receiving cavity; a positioning rod, one end of the positioning rod abutting against the positioning ring or the positioning notch; and an elastic element, the elastic element being disposed in the second receiving cavity, the other end of the positioning rod being connected to the elastic element, the elastic element providing a thrust toward the axis of rotation of the positioning rod during rotation.

[0008] In some embodiments, the polishing dripping device further includes a bearing, which is fixedly connected to the end of the positioning rod away from the elastic element.

[0009] In some embodiments, the polishing dripping device further includes an adjusting member that passes through the second housing, wherein one end of the adjusting member is connected to the end of the elastic member away from the positioning rod, and the adjusting member adjusts the resistance of the positioning rod during rotation.

[0010] In some embodiments, the adjusting element is a bolt.

[0011] In some embodiments, the elastic element includes a spring structure or a cylinder.

[0012] In some embodiments, the positioning notch includes a first face and a second face facing each other, wherein the included angle between the first face and the second face is greater than or equal to 90°.

[0013] In some embodiments, the cross-sectional shape of the positioning notch includes a fan shape in the direction perpendicular to the thickness of the positioning ring.

[0014] In some embodiments, the positioning notch extends through the positioning ring along the thickness direction of the positioning ring.

[0015] In some embodiments, the polishing dripping device further includes a detection component electrically connected to the cantilever for monitoring the position of the cantilever.

[0016] The technical solutions provided in this disclosure have at least the following advantages:

[0017] The technical solution provided in this disclosure includes a cantilever positioned above a polishing disc. The cantilever drips polishing liquid onto the polishing disc, allowing the polishing liquid to spread outwards towards the wafer under centrifugal force for polishing. A rotating shaft is fixedly connected at one end to the cantilever. A first housing is also fixedly connected to the rotating shaft, and the first housing has a first receiving cavity in which the rotating shaft is located. A positioning ring is rotatably connected to the rotating shaft, with the rotating shaft passing through a through hole at the center of the positioning ring. A positioning part is fixedly connected to the first housing and abuts against the positioning ring. The positioning ring has at least two positioning notches. The cantilever rotates around the positioning ring, and the positioning part abuts against the positioning notches during rotation. At least one positioning notch corresponds to a standby position of the cantilever, and at least one positioning notch corresponds to a working position of the cantilever. Therefore, in this disclosure, by setting a positioning ring and directly creating multiple notches on it, the positioning rod can fall into the notches under the push of an elastic element during rotation, achieving precise positioning while making the process of changing workstations more convenient. At the same time, it makes the overall structure of the polishing drip device simpler. Attached Figure Description

[0018] One or more embodiments are illustrated by way of example with corresponding pictures in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Unless otherwise stated, the pictures in the accompanying drawings do not constitute a limitation on scale. In order to more clearly illustrate the technical solutions in the embodiments of this disclosure or the conventional technology, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A top view of the polishing droplet device provided in an embodiment of this disclosure located at the working station;

[0020] Figure 2 A top view of the polishing liquid dripping device provided in an embodiment of this disclosure located in the standby position;

[0021] Figure 3 A cross-sectional view of a polishing droplet device provided in an embodiment of this disclosure;

[0022] Figure 4 Another cross-sectional view of a polishing droplet apparatus provided in an embodiment of this disclosure;

[0023] Figure 5 This is another cross-sectional view of a polishing droplet apparatus provided in an embodiment of the present disclosure. Detailed Implementation

[0024] As can be seen from the background technology, currently, polishing dropper devices are commonly used for chemical mechanical polishing of wafers. If the polishing dropper device needs to be positioned on the polishing pad for droppering, it is usually necessary to use fixing devices such as positioning pins or positioning screws. On the one hand, this makes the overall structure of the polishing dropper device more complex, and on the other hand, it makes the switching process between the working and standby states of the polishing dropper device more cumbersome.

[0025] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been provided in the embodiments of this disclosure to facilitate a better understanding of the disclosure. However, the technical solutions claimed in this disclosure can be implemented even without these technical details and various variations and modifications based on the following embodiments.

[0026] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0027] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0028] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists, A and B exist simultaneously, and B exists. In addition, the character " / " in this document generally indicates that the related objects before and after it have an "or" relationship.

[0029] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0030] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0031] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0032] This disclosure provides a polishing liquid dripping device, which at least helps to solve the problems of complex structure and complicated positioning and switching process of existing polishing liquid dripping devices.

[0033] Figure 1 A top view of a polishing droplet device provided in an embodiment of this disclosure located at a working station. Figure 2 A top view of a polishing liquid dripping device provided in an embodiment of this disclosure, located in a standby position. Figure 3 This is a cross-sectional view of a polishing dripping device provided in an embodiment of the present disclosure. Figure 4 Another cross-sectional view of a polishing droplet apparatus provided in an embodiment of this disclosure. Figure 5 This is another cross-sectional view of a polishing droplet apparatus provided in an embodiment of the present disclosure.

[0034] Reference Figures 1 to 5This disclosure provides a polishing liquid dripping device for replenishing polishing liquid to a polishing disk 100, comprising: a cantilever 217 located above the polishing disk 100, the cantilever 217 being used to drip polishing liquid onto the polishing disk 100; a rotating shaft, one end of which is fixedly connected to the cantilever 217; a first housing 211, the rotating shaft being fixedly connected to the first housing 211, the first housing 211 having a first receiving cavity, the rotating shaft being located within the first receiving cavity; and a positioning ring 202, the rotating shaft being rotatably connected to the positioning ring 202. 02, wherein the rotating shaft passes through the through hole located at the center of the positioning ring 202; the positioning part is fixedly connected to the first housing 211 and abuts against the positioning ring 202; wherein the positioning ring 202 is provided with at least two positioning notches 218, the cantilever 217 rotates around the positioning ring 202 under the drive of the positioning part, and the positioning part abuts against the positioning notch 218 during the rotation process, at least one positioning notch 218 corresponds to the standby position of the cantilever 217, and at least one positioning notch 218 corresponds to the working position of the cantilever 217.

[0035] Specifically, a conduit can be provided inside the cantilever 217 to deliver polishing slurry, allowing the slurry to drip from above the polishing disk 100. The polishing disk 100 is rotatable, and the polishing slurry, under centrifugal force, spreads around the polishing disk 100 onto the wafer located on the polishing disk 100, thereby achieving wafer polishing. In some other embodiments of this disclosure, a liquid storage chamber can also be provided inside the cantilever 217 to store the polishing slurry.

[0036] The rotating shaft can be set as a hollow cylindrical structure. The cantilever 217 is fixedly connected to one end of the rotating shaft, and the rotating shaft is fixedly connected to the positioning part. Thus, the cantilever 217 can rotate around the axis of the rotating shaft to realize the work position switching of the cantilever 217.

[0037] In this embodiment, by setting a positioning ring 202 and directly creating multiple notches on the positioning ring 202, the positioning rod 212 can fall into the notches under the push of the elastic member 214 when rotating. This achieves precise positioning and makes the process of changing workstations more convenient. At the same time, it simplifies the overall structure of the polishing dripping device.

[0038] In some other embodiments of this disclosure, the positioning ring 202 may further include multiple positioning notches 218. For example, the positioning ring 202 may include 3, 4, or 5 positioning notches 218. Two or more positioning notches 218 may be set to correspond to multiple working positions of the cantilever 217. For example, two, 3, or 4 positioning notches 218 may be set to correspond to two, 3, or 4 working positions of the cantilever 217. Therefore, when the area to be polished on the wafer is large or dispersed, setting multiple working positions on the cantilever 217 allows the polishing slurry to drip sufficiently onto the area to be polished on the wafer, eliminating the need to set multiple polishing slurry dripping devices above a polishing disk 100, thus achieving complete polishing of the area to be polished on the wafer.

[0039] In embodiments of this disclosure, the positioning part includes: a second outer shell 216, which is fixedly connected to a first outer shell 211, and has a second receiving cavity, wherein the first receiving cavity communicates with the second receiving cavity; a positioning rod 212, one end of which abuts against a positioning ring 202 or a positioning notch 218; and an elastic member 214, which is disposed in the second receiving cavity, and the other end of the positioning rod 212 is connected to the elastic member 214, wherein the elastic member 214 provides a thrust toward the axis of rotation of the positioning rod 212 during rotation.

[0040] Specifically, an opening is formed on the first outer shell 211 that corresponds to the cross-sectional diameter of the second outer shell 216 facing the first outer shell 211, allowing the second outer shell 216 to be fixedly connected to the first outer shell 211, and the first receiving cavity and the second receiving cavity to communicate. The first outer shell 211 and the second outer shell 216 can be fixedly connected by welding, riveting, or other methods. In some other embodiments of this disclosure, the first outer shell 211 and the second outer shell 216 can also be integrally formed, thereby making the overall structure of the polishing dripping device more robust, and improving the driving effect of the positioning part on the rotating shaft and cantilever 217 housed in the first shell.

[0041] In some embodiments, the elastic element 214 can be a spring structure. In other embodiments, the elastic element 214 can be a cylinder, which is a reciprocating structure and therefore can also serve as the elastic element 214.

[0042] Reference Figure 3 and Figure 4 In the embodiments of this disclosure, the polishing dripping device further includes a bearing 213, which is fixedly connected to the end of the positioning rod 212 away from the elastic member 214.

[0043] Specifically, one end of the bearing 213 is fixedly connected to the end of the positioning rod 212 away from the elastic element 214, and the other end of the bearing 213 abuts against the positioning ring 202 or the positioning notch 218. Thus, the bearing 213 reduces the resistance when the positioning rod 212 falls into or rotates out of the positioning notch 218, making the switching process of the cantilever 217 smoother and improving the service life of the polishing dripping device. The bearing 213 can be a deep groove ball bearing 213, an angular contact bearing 213, or a self-aligning ball bearing 213, etc., as long as it can reduce the resistance when the positioning rod 212 falls into or rotates out of the positioning notch 218; no limitation is made here.

[0044] In the embodiments of this disclosure, the polishing dripping device further includes an adjusting member 215, which is disposed through the second housing 216. One end of the adjusting member 215 is connected to the end of the elastic member 214 away from the positioning rod 212, and the adjusting member 215 adjusts the compression amount of the elastic member 214.

[0045] Specifically, by increasing the compression of the elastic element 214 through the adjusting component 215, the movement resistance of the positioning rod 212 is increased. This prevents the positioning rod 212 from easily disengaging from the positioning notch 218 and from easily rotating. Consequently, the cantilever 217 is less prone to rotation when in a working or standby position, leading to a more stable polishing dripping process and preventing the positioning rod 212 from disengaging from the positioning notch 218 and the cantilever 217 from rotating. Simultaneously, by decreasing the compression of the elastic element 214 through the adjusting component 215, the movement resistance of the positioning rod 212 is reduced, making the rotation of the positioning rod 212 easier.

[0046] In the embodiments of this disclosure, the adjusting member 215 is a bolt. Specifically, the positioning rod 212 has a threaded through hole for the screw to pass through, and the bolt is fixedly connected to the positioning rod 212 through the threaded through hole. By increasing the compression of the elastic member 214 through the adjusting member 215, the movement resistance of the positioning rod 212 is increased, so that the positioning rod 212 will not easily disengage from the positioning notch 218, and the positioning rod 212 will not easily rotate. This makes it less likely for the cantilever 217 to rotate when it is in a working position or a standby position, and thus the polishing dripping process will be more stable, avoiding the situation where the positioning rod 212 disengages from the positioning notch 218 and the cantilever 217 beam rotates. At the same time, by reducing the compression of the elastic member 214 through the adjusting member 215, the movement resistance of the positioning rod 212 is reduced, making the rotation process of the positioning rod 212 easier. In some other embodiments of this disclosure, the adjusting member 215 may also be a component that can adjust the resistance, such as a spring rod, which is not limited here.

[0047] In embodiments of this disclosure, the positioning notch 218 includes a first face and a second face facing each other, wherein the included angle between the first face and the second face is greater than or equal to 90°.

[0048] Specifically, the included angle between the first and second surfaces can be 90°, 100°, 110° or 120°. Within this angle range, on the one hand, it can ensure that the positioning rod 212 can fall into the positioning notch 218 to achieve the station positioning of the cantilever 217. On the other hand, the opening of the positioning notch 218 should not be too small to avoid the positioning rod 212 failing to fall into the positioning notch 218 or the length of the positioning rod 212 falling into the positioning notch 218 being too short, resulting in poor positioning and fixation of the positioning rod 212.

[0049] In the embodiments of this disclosure, the cross-sectional shape of the positioning notch 218 includes a fan shape in the direction perpendicular to the thickness of the positioning ring. Therefore, the positioning rod 212 will not easily detach when it falls into the positioning notch 218, thereby preventing the cantilever 217 from easily rotating when positioned at the standby or working position.

[0050] In the embodiments of this disclosure, the positioning notch 218 penetrates the positioning ring 202 along the thickness direction of the positioning ring. In some other embodiments of this disclosure, the positioning notch 218 may not penetrate the positioning ring 202 along the dripping direction of the polishing liquid. In this case, the positioning rod 212 is set flush with the positioning notch 218 in the horizontal direction to ensure that the positioning rod 212 can fall into or turn out of the positioning notch 218.

[0051] In embodiments of this disclosure, the polishing dripping device further includes a detection component electrically connected to the cantilever 217 for monitoring the position of the cantilever 217.

[0052] Specifically, the detection component can monitor whether the cantilever 217 is in the standby or working position. If the cantilever 217 is not in the preset working or standby position, an alarm can be triggered to prevent the polishing liquid from dripping until the cantilever 217 rotates to the preset working or standby position before the polishing work begins.

[0053] The polishing liquid device provided in this disclosure can not only polish wafers in the semiconductor field, but also be used for other products to be polished using polishing liquid, and is not limited thereto.

[0054] The technical solution provided in this embodiment includes a cantilever 217 located above the polishing disk 100. The cantilever 217 is used to drip polishing liquid onto the polishing disk 100, thereby allowing the polishing liquid to spread around the polishing disk 100 and onto the wafer for polishing under centrifugal force. A rotating shaft is included, with one end fixedly connected to the cantilever 217. A first housing 211 is also included, with the rotating shaft fixedly connected to it. The first housing 211 has a first receiving cavity, and the rotating shaft is located within the first receiving cavity. A positioning ring 202 is rotatably connected to a rotating shaft, which passes through a through hole located at the center of the positioning ring 202. A positioning part is fixedly connected to the first outer shell 211 and abuts against the positioning ring 202. The positioning ring 202 has at least two positioning notches 218. The cantilever 217 rotates around the positioning ring 202 under the drive of the positioning part. During rotation, the positioning part abuts against the positioning notches 218. At least one positioning notch 218 corresponds to the standby position of the cantilever 217, and at least one positioning notch 218 corresponds to the working position of the cantilever 217. Therefore, in this embodiment, by setting a positioning ring 202 and directly opening multiple notches on it, the positioning rod 212 can fall into the notch under the push of the elastic element 214 when rotating, achieving precise positioning and making the switching process more convenient. At the same time, it simplifies the overall structure of the polishing dripping device.

[0055] Those skilled in the art will understand that the above embodiments are specific examples of implementing this disclosure, and in practical applications, various changes in form and detail may be made without departing from the spirit and scope of this disclosure. Any person skilled in the art can make various alterations and modifications without departing from the spirit and scope of this disclosure; therefore, the scope of protection of this disclosure should be determined by the scope defined in the claims.

Claims

1. A polishing droplet device for replenishing a polishing liquid to a polishing pad, characterized by, include: A cantilever, located above the polishing disk, is used to drip the polishing liquid onto the polishing disk; A rotating shaft, one end of which is fixedly connected to the cantilever; A first outer shell, wherein the rotating shaft is fixedly connected to the first outer shell, the first outer shell has a first receiving cavity, and the rotating shaft is located within the first receiving cavity; A positioning ring, wherein the rotating shaft is rotatably connected to the positioning ring, and the rotating shaft passes through a through hole located at the center of the positioning ring; The positioning part is fixedly connected to the first outer shell and abuts against the positioning ring; The positioning ring has at least two positioning notches. The cantilever rotates around the positioning ring under the drive of the positioning part. The positioning part abuts against the positioning notches during the rotation. At least one positioning notch corresponds to the standby position of the cantilever and at least one positioning notch corresponds to the working position of the cantilever.

2. The polishing droplet device of claim 1, wherein, The positioning unit includes: A second outer shell is fixedly connected to the first outer shell, and the second outer shell has a second receiving cavity, wherein the first receiving cavity communicates with the second receiving cavity; A positioning rod, one end of which abuts against the positioning ring or the positioning notch; An elastic element is disposed within the second receiving cavity, and the other end of the positioning rod is connected to the elastic element. During rotation, the elastic element provides a thrust to the positioning rod toward the axis of rotation.

3. The polishing droplet device of claim 2, wherein, The polishing droplet device further includes: A bearing is fixedly connected to the end of the positioning rod away from the elastic element.

4. The polishing droplet device of claim 2, wherein, The polishing droplet device further includes: An adjusting member is provided through the second housing, wherein one end of the adjusting member is connected to the end of the elastic member away from the positioning rod, and the adjusting member adjusts the compression of the elastic member.

5. The polishing droplet device of claim 4, wherein, The adjusting component is a bolt.

6. The polishing droplet device of claim 2, wherein, The elastic element includes a spring structure or a cylinder.

7. The polishing droplet device of claim 1, wherein, The positioning notch includes a first surface and a second surface facing each other, wherein the included angle between the first surface and the second surface is greater than or equal to 90°.

8. The polishing dripping device according to claim 1, characterized in that, In the direction perpendicular to the thickness of the positioning ring, the cross-sectional shape of the positioning notch includes a fan shape.

9. The polishing droplet device of claim 1, wherein, The positioning notch penetrates the positioning ring along the thickness direction of the positioning ring.

10. The polishing droplet device of claim 1, wherein, The polishing droplet device further includes: A detection component, electrically connected to the cantilever, is used to monitor the position of the cantilever.

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