Tool detection device and wafer cutting machine

Abstract

The utility model discloses a tool detection device and wafer cutting machine, this tool detection device includes base, detection subassembly, tool and protective cover. Detection subassembly sets up in base and includes light source emission end and light source receiving end, and light source emission end and light source receiving end have the gap for avoiding between, and tool mobile setting is in base, and tool can be moved to the gap for avoiding to at least be used for shielding the part light of light source emission end to the light source receiving end emission, protective cover rotation setting is in base and has the closing state of rotation to cover in detection subassembly to cover detection subassembly, and protective cover still has the opening state of rotation to avoid tool to allow tool to move to the gap for avoiding. The tool detection device and wafer cutting machine of the present application can solve the problem of the existing protective cover occupying larger space and the poor protection effect of the tool detection device.

Description

Technical Field

[0001] This utility model relates to the field of wafer dicing equipment technology, and more specifically, to a tool detection device and a wafer dicing machine. Background Technology

[0002] Wafer dicing is a core step in semiconductor manufacturing, and its precision directly affects the quality and performance of the chip. During wafer dicing, wear or replacement of the dicing tool can cause changes in its outer diameter, thus affecting the control of the dicing depth. If the changes in tool diameter are not compensated for in a timely manner, it may lead to incomplete or over-dicing of the wafer. Therefore, existing technologies employ a detection device in the wafer dicing machine to detect the tool and prevent changes in its outer diameter due to wear or positional misalignment. Furthermore, the tool detection device typically requires a protective cover to prevent debris and other impurities generated during wafer dicing from affecting its detection accuracy. However, existing tool detection devices and protective covers generally use a translational method for their connection, resulting in a large space occupied by the protective cover. Moreover, existing protective covers do not provide adequate protection for the tool detection device, and debris and other impurities can still enter the interior of the protective cover, posing a risk of affecting the tool detection device. Utility Model Content

[0003] The main objective of this invention is to provide a tool detection device and a wafer dicing machine, which at least solves the problems of existing protective covers occupying too much space and having poor protective effect on tool detection devices.

[0004] According to one aspect of the present invention, a tool detection device is provided, comprising:

[0005] Base;

[0006] A detection component is disposed on the base, and the detection component includes a light source emitting end and a light source receiving end, and there is a clearance gap between the light source emitting end and the light source receiving end. The light source emitting end is at least used to emit light, and the light source receiving end is at least used to receive the light emitted by the light source emitting end to sense the luminous flux passing through the clearance gap.

[0007] A cutting tool is movably disposed on the base, and the cutting tool can be moved to the clearance gap to at least block part of the light emitted by the light source emitting end to the light source receiving end;

[0008] A protective cover is rotatably disposed on the base, and the protective cover has a closed state in which it rotates to cover the detection component to shield the detection component, and the protective cover also has an open state in which it rotates to avoid the cutting tool to allow the cutting tool to move to the avoidance gap.

[0009] Furthermore, along the first direction of the base, the protective cover and the detection component are spaced apart on the base, and the detection component is fixedly connected to the base. The protective cover rotates along the second direction to switch between the closed state and the open state.

[0010] Furthermore, along the height direction of the tool detection device, the bottom of the clearance gap is higher than the top of the base, and when the protective cover is in the closed state, the edge of the protective cover near the base is lower than the bottom of the clearance gap.

[0011] Furthermore, the tool detection device also includes a power unit, which is disposed on the base and is drivenly connected to the protective cover to drive the protective cover to switch between the closed state and the open state.

[0012] Furthermore, the power unit includes a rotary cylinder, the housing of which is fixedly connected to the base, and the piston rod of which is fixedly connected to the protective cover. The rotary cylinder drives the piston rod to rotate, thereby causing the protective cover to switch between the closed state and the open state.

[0013] Furthermore, the tool detection device also includes a cleaning component, which is disposed on the base and located between the detection component and the protective cover to clean and dry the detection component.

[0014] Furthermore, the cleaning assembly includes a first water spray pipe and a first air blowing pipe. Both the first water spray pipe and the first air blowing pipe extend along the height direction of the tool detection device. The ends of the first water spray pipe and the first air blowing pipe near the opening are bent toward the side closer to the detection device. Along the height direction of the tool detection device, the opening of the first water spray pipe is higher than the light source emitting end, and the first water spray pipe sprays water onto the light source emitting end to clean it. The first air blowing pipe is at the same height as the light source emitting end, and the first air blowing pipe blows air onto the light source emitting end to dry it.

[0015] Furthermore, the cleaning assembly also includes a second water spray pipe and a second air blowing pipe. Both the second water spray pipe and the second air blowing pipe extend along the height direction of the tool detection device. The ends of the second water spray pipe and the second air blowing pipe near the opening are bent toward the side closer to the detection device. Along the height direction of the tool detection device, the opening of the second water spray pipe is higher than the light source receiving end, and the second water spray pipe sprays water onto the light source receiving end to clean it. The second air blowing pipe is at the same height as the light source receiving end, and the second air blowing pipe blows air onto the light source receiving end to dry it.

[0016] Furthermore, the detection component also includes a bracket, the light source emitting end and the light source receiving end are fixedly connected to the base through the bracket, and the bracket is provided with a flow guide, the flow guide is located at the bottom of the clearance gap, and the flow guide is inclined from the side away from the protective cover to the bottom of the side closer to the protective cover.

[0017] On the other hand, this application also mentions a wafer dicing machine, which includes the aforementioned tool detection device.

[0018] In this invention, the protective cover is rotatable relative to the base, allowing it to switch between a closed and an open state. Normally, the protective cover is in the closed state. When tool inspection is required, the protective cover rotates relative to the base and switches from the closed to the open state. At this time, the tool moves to a predetermined position within the clearance gap, blocking the light emitted from the light source's emitting end towards the light source's receiving end. During this process, the light source's receiving end detects the tool wear by sensing changes in the luminous flux emitted from the emitting end towards the receiving end, thus enabling tool wear compensation. After the tool leaves the clearance gap, the protective cover rotates relative to the base and switches from the open to the closed state, thereby covering the inspection components and providing protection. Furthermore, the protective cover can cooperate with the base to form a relatively sealed environment, preventing contamination of the inspection components by wafer debris and other impurities generated during the cutting process, ensuring the accuracy of the tool wear detection device.

[0019] In other words, by setting a protective cover that can rotate relative to the base, this application not only reduces the internal space occupied by the protective cover in the wafer dicing machine, but also allows the rotating protective cover covering the detection components to better cooperate with the base, forming a more enclosed space. This prevents the detection components from being contaminated by wafer debris and other impurities, effectively improving the accuracy of the tool detection device in detecting tool wear and enhancing the processing quality of the wafer dicing machine. Attached Figure Description

[0020] The accompanying drawings, which are included to provide a further understanding of the present invention and constitute a part of this invention, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings:

[0021] Figure 1 This is a structural diagram of the wafer dicing machine disclosed in an embodiment of the present utility model;

[0022] Figure 2 for Figure 1 A partial internal structure diagram of a wafer dicing machine;

[0023] Figure 3 for Figure 2 Enlarged view of section A;

[0024] Figure 4 This is a first-view structural diagram of the tool detection device (excluding the tool) disclosed in an embodiment of the present utility model;

[0025] Figure 5 This is a second-view structural diagram of the tool detection device (excluding the tool) disclosed in an embodiment of the present utility model;

[0026] Figure 6 This is a third-view structural diagram of the tool detection device (excluding the tool) disclosed in an embodiment of the present utility model;

[0027] Figure 7 This is a fourth-view structural diagram of the tool detection device (excluding the tool and with the protective cover in an open state) disclosed in an embodiment of the present utility model.

[0028] Figure 8 This is a fourth-view structural diagram of the tool detection device (excluding the tool and with the protective cover closed) disclosed in an embodiment of the present invention.

[0029] The above figures include the following reference numerals:

[0030] 1000. Wafer dicing machine; 100. Tool detection device; 11. Base; 12. Detection component; 121. Light source emitter; 122. Light source receiver; 123. Clearance gap; 124. Support; 1241. Flow guide; 13. Tool; 14. Protective cover; 15. Power unit; 151. Rotary cylinder; 1511. Housing; 1512. Piston rod; 16. Cleaning component; 161. First water spray pipe; 162. First air blowing pipe; 163. Second water spray pipe; 164. Second air blowing pipe. Detailed Implementation

[0031] It should be noted that, where there is no conflict, the embodiments and features in the embodiments of this utility model can be combined with each other. The present utility model will now be described in detail with reference to the accompanying drawings and embodiments.

[0032] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to the present invention. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0033] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0034] As described in the background section, during wafer dicing, wear or replacement of the dicing tool leads to changes in its outer diameter, affecting the control of the wafer dicing depth. If tool wear is not detected and compensated for in a timely manner, it may result in incomplete or over-dicing of the wafer. Existing wafer dicing machines employ tool detection devices to monitor the tool and prevent changes in its outer diameter due to wear or positional shifts, and these devices are protected by protective covers. However, existing protective covers typically use a translational method to cover the tool detection device, resulting in a large footprint within the wafer dicing machine. Furthermore, existing protective covers do not provide adequate protection for the tool detection device, allowing debris and other impurities generated during wafer dicing to enter the cover, leading to inaccurate data from the tool detection device and affecting wafer processing quality. Therefore, this application provides a new tool detection device whose protective cover not only occupies less internal space in the wafer dicing machine but also provides better protection for the tool detection device. The tool detection device of this application will be described in detail below with reference to the accompanying drawings.

[0035] See Figures 1 to 8 As shown, this application provides a tool detection device 100, which includes a base 11, a detection component 12, a tool 13, and a protective cover 14.

[0036] The detection component 12 is disposed on the base 11 and includes a light source emitting end 121 and a light source receiving end 122, with a clearance gap 123 between them. The light source emitting end 121 is used to emit light, and the light source receiving end 122 is used to receive light emitted by the light source emitting end 121 to sense the luminous flux passing through the clearance gap 123. A cutter 13 is movably disposed on the base 11 and is movable to the clearance gap 123 to at least block part of the light emitted by the light source emitting end 121 to the light source receiving end 122. A protective cover 14 is rotatably disposed on the base 11 and has a closed state where it rotates to cover the detection component 12, and an open state where it rotates to allow the cutter 13 to move to the clearance gap 123.

[0037] In this application, the protective cover 14 is rotatable relative to the base 11, allowing it to switch between a closed and an open state. Normally, the protective cover 14 is in the closed state. When the tool 13 needs to be inspected, the protective cover 14 rotates relative to the base 11 and switches from the closed state to the open state. At this time, the tool 13 moves to a predetermined position in the clearance gap 123 to block the light emitted from the light source emitting end 121 towards the light source receiving end 122. During this process, the light source receiving end 122 detects the wear of the tool 13 by sensing the change in the light flux emitted from the light source emitting end 121 towards the light source receiving end 122, thus enabling tool wear compensation. After the tool 13 leaves the clearance gap 123, the protective cover 14 rotates relative to the base 11 and switches from the open state to the closed state, thereby covering the detection component 12 and providing protection for it. Furthermore, the protective cover 14 can cooperate with the base 11 to form a relatively sealed environment, preventing the detection component 12 from being contaminated by impurities such as wafer debris generated during the cutting process, and ensuring the accuracy of the tool detection device 100 in detecting the wear of the tool 13.

[0038] In other words, by providing a protective cover 14 that can rotate relative to the base 11, this application not only reduces the internal space occupied by the protective cover 14 in the wafer dicing machine 1000, but also allows the protective cover 14, which rotates and covers the detection component 12, to better cooperate with the base 11, forming a more enclosed space. This prevents the detection component 12 from being contaminated by wafer debris and other impurities, effectively improving the accuracy of the tool detection device 100 in detecting the wear of the tool 13 and enhancing the processing quality of the wafer dicing machine 1000.

[0039] It should be added that when using a wafer dicing machine 1000 to process wafers, before dicing, the cutting tool 13 is generally moved to the wafer processing stage (not shown in the figure) to identify an initial position. Then, the cutting tool 13 is moved to the cutting tool detection device 100 for detection. The initial position difference between the cutting tool 13 and the wafer processing stage before dicing is obtained by the obstruction of the light flux of the detection component 12 by the cutting tool 13. After the cutting tool 13 has been dicing the wafer for a period of time, it is moved to the cutting tool detection device 100 for detection again. The second position difference between the cutting tool 13 and the wafer processing stage after dicing is obtained by the obstruction of the light flux of the detection component 12 by the cutting tool 13. The position difference of the cutting tool 13 after dicing the wafer is compared with the position difference before dicing to determine the wear of the cutting tool 13. The position of the cutting tool 13 is then adjusted or the cutting tool 13 is replaced according to the wear amount to compensate for the wear generated by the cutting tool 13 during wafer dicing, thereby ensuring the processing quality of the wafer.

[0040] Further, see Figures 4 to 8 As shown, along the first direction of the base 11, the protective cover 14 and the detection component 12 are spaced apart on the base 11, and the detection component 12 is fixedly connected to the base 11. The protective cover 14 rotates along the second direction to switch between a closed state and an open state.

[0041] Specifically, the first direction of the base 11 is... Figure 7 and Figure 8As shown in the first direction, along the base 11, the protective cover 14 and the detection component 12 are spaced apart on the base 11. This spacing ensures that the protective cover 14 and the detection component 12 have their own independent space on the base 11, preventing interference between the protective cover 14 and the detection component 12 when switching between closed and open states, thus avoiding collisions. This ensures smooth rotation of the protective cover 14 and the stability and safety of the detection component 12. Simultaneously, the spaced arrangement of the protective cover 14 and the detection component 12 provides sufficient space for operators to operate and maintain both. This facilitates inspection, adjustment, and other work on the detection component 12, and also makes it easier for operators to rotate or replace the protective cover 14 for maintenance. The fixed connection ensures the stability of the detection component 12 during operation, preventing positional errors between the tool 13 and the detection component 12 due to structural loosening between the detection component 12 and the base 11. This guarantees the accuracy of the detection component 12's position detection of the tool 13. The detection component 12 typically needs to precisely emit and receive light to detect the tool 13. If its position shifts or deviates, it will affect the path of the light emitted by the light source emitter 121 and the accuracy of the light received by the light source receiver 122, thus affecting the detection accuracy of the tool 13. Furthermore, when the protective cover 14 is closed, it can cover the detection component 12, preventing wafer debris and other impurities from entering the detection component 12. This avoids these impurities affecting the normal operation of the light source emitter 121 and the light source receiver 122, extending the service life of the detection component 12.

[0042] It is understandable that when the tool 13 is in the open state (i.e., Figure 7 The state shown) transitions to the off state (i.e. Figure 8 When the state shown is reached, the second direction is... Figure 7 and Figure 8 In the direction indicated by 'a', the cutter 13 rotates in the direction indicated by 'a' to switch to the closed state, thereby allowing the protective cover 14 to protect the detection component 12. When the cutter 13 switches from the closed state to the open state, the second direction is... Figure 7 and Figure 8 In the direction indicated by b, the tool 13 rotates in the direction indicated by b to switch to the open state, so that the protective cover 14 can avoid the tool 13, thereby allowing the tool 13 to move to the avoidance gap 123 for position detection.

[0043] Further, see Figures 6 to 8As shown, along the height direction of the tool detection device 100, the bottom of the clearance gap 123 is higher than the top of the base 11. When the protective cover 14 is in the closed state, the edge of the protective cover 14 near the base 11 is lower than the bottom of the clearance gap 123.

[0044] Specifically, the height direction of the tool detection device 100 is... Figures 6 to 8 The height direction shown is, that is Figure 1 and Figure 2 The height direction is shown. The bottom of the clearance gap 123 is higher than the top of the base 11. From a spatial layout perspective, this arrangement ensures that the tool 13 will not interfere with the base 11 when it moves to the clearance gap 123. This guarantees that the tool 13 can smoothly move to the detection position on the base 11, i.e., at the clearance gap 123, thereby realizing the detection function of the tool 13. This avoids the base 11 obstructing the movement of the tool 13, improves the operational stability and reliability of the tool detection device 100, and reduces the probability of failure caused by mechanical interference. When the protective cover 14 is in the closed state, the edge of the protective cover 14 near the base 11 is lower than the bottom of the clearance gap 123. This allows the protective cover 14 to better cooperate with the base 11, forming a relatively sealed environment. This prevents the light source emitting end 121 and the light source receiving end 122 of the detection component 12 from being contaminated by impurities such as wafer debris generated during the cutting process, thereby ensuring the accuracy of the tool detection device 100 in detecting the wear of the tool 13. Meanwhile, since the edge of the protective cover 14 is lower than the bottom of the clearance gap 123, when the protective cover 14 is closed, it can prevent dust, debris and other objects from entering the detection component 12 from below, especially the area where the light source emitting end 121 and the light source receiving end 122 are located, thus ensuring the cleanliness of the detection component 12 and improving the accuracy and stability of the detection.

[0045] Further, see Figure 4 and Figure 5 As shown, the tool detection device 100 also includes a power unit 15, which is disposed on the base 11 and is driven to connect with the protective cover 14 to drive the protective cover 14 to switch between a closed state and an open state.

[0046] Specifically, the power unit 15 automates the transition of the protective cover 14 between its closed and open states, eliminating the need for manual operation and improving the ease of use and operational efficiency of the tool detection device 100. Simultaneously, the power unit 15's drive connection to the protective cover 14 allows for more precise control of its rotation, ensuring accurate switching between closed and open states and guaranteeing the effective coverage of the detection component 12 and the avoidance of the moving tool 13. Furthermore, automated operation reduces human intervention, lowering the risk of accidental injury to operators during cover operation and enhancing the safety of the tool detection device 100. Moreover, the power unit 15 provides stable power support for the rotation of the protective cover 14, avoiding instability that may arise from manual operation, making the cover's state transitions more stable and reliable, thus contributing to the long-term stable operation of the tool detection device 100.

[0047] Further, see Figure 4 and Figure 5 As shown, the power unit 15 includes a rotary cylinder 151. The housing 1511 of the rotary cylinder 151 is fixedly connected to the base 11, and the piston rod 1512 of the rotary cylinder 151 is fixedly connected to the protective cover 14. The rotary cylinder 151 drives the piston rod 1512 to rotate so as to drive the protective cover 14 to switch between a closed state and an open state.

[0048] Specifically, the housing 1511 of the rotary cylinder 151 is fixedly connected to the base 11, ensuring the stability of the power unit 15 within the tool detection device 100. This prevents the entire power system of the tool detection device 100 from shaking or shifting during operation, providing a solid foundation for the stable rotation of the protective cover 14. The piston rod 1512 of the rotary cylinder 151 is fixedly connected to the protective cover 14. By driving the piston rod 1512 to rotate through the rotary cylinder 151, power can be directly and effectively transmitted to the protective cover 14, enabling the protective cover 14 to switch between the closed and open states. This driving method is simple and direct, improving the response speed and working efficiency of the device. Simultaneously, the rotary cylinder 151 can precisely control the rotation angle and speed of the piston rod 1512, thereby accurately controlling the transition process of the protective cover 14 between the closed and open states. This ensures that the protective cover 14 accurately reaches the required position, meeting the requirements of the tool detection device 100 for the state of the protective cover 14 at different working stages. Furthermore, the rotary cylinder 151, as a common power device, has the characteristics of relatively simple structure and easy maintenance. This application uses a rotary cylinder 151 as the power unit 15. When the power unit 15 fails, it is convenient to inspect, repair or replace the rotary cylinder 151, thereby reducing the maintenance cost and difficulty of the tool detection device 100.

[0049] Further, see Figure 2 and Figure 8 As shown, the tool detection device 100 also includes a cleaning component 16, which is disposed on the base 11 and located between the detection component 12 and the protective cover 14 to clean and dry the detection component 12.

[0050] Specifically, the cleaning component 16 cleans the detection component 12, removing dust, impurities, and other contaminants from its surface. This ensures the optical components (i.e., the light source emitter 121 and the light source receiver 122) of the detection component 12 remain clean, preventing wafer debris and other contaminants from affecting light emission and reception, thereby improving the detection accuracy and reliability of the tool inspection device 100. Simultaneously, the cleaning component 16 not only cleans the detection component 12 but also dries it. This prevents residual moisture from remaining on the detection component 12 after cleaning, avoiding adverse effects on its electrical or optical performance and extending its lifespan. Furthermore, since moisture causes light refraction and reflection, residual moisture on the light source emitter 121 and the light source receiver 122 will affect their light emission and reception performance. Therefore, the cleaning component 16 improves the performance of the detection component 12, thereby enhancing the quality of wafer processing. The cleaning component 16 is positioned between the detection component 12 and the protective cover 14. This layout makes full use of the internal space of the tool detection device 100, resulting in a more compact structure and effectively reducing the overall size of the tool detection device 100, which is beneficial for its miniaturization and integration. Furthermore, by placing the cleaning component 16 near the detection component 12, operators can perform timely cleaning and maintenance of the detection component 12. When cleaning of the detection component 12 is required, the cleaning component 16 can be activated for cleaning and drying without complicated operations, thereby improving the maintainability and ease of operation of the tool detection device 100.

[0051] Further, see Figures 4 to 6 As shown, the cleaning assembly 16 includes a first water spray pipe 161 and a first air blowing pipe 162. Both the first water spray pipe 161 and the first air blowing pipe 162 extend along the height direction of the tool detection device 100. The end of the first water spray pipe 161 near the pipe opening and the end of the first air blowing pipe 162 near the pipe opening are both bent toward the side closer to the detection device. Along the height direction of the tool detection device 100, the opening of the first water spray pipe 161 is higher than the light source emitting end 121, and the first water spray pipe 161 sprays water onto the light source emitting end 121 to clean the light source emitting end 121. The first air blowing pipe 162 is at the same height as the light source emitting end 121, and the first air blowing pipe 162 blows air onto the light source emitting end 121 to dry the light source emitting end 121.

[0052] Specifically, the first water spray pipe 161 and the first air blowing pipe 162 extend along the height direction of the tool detection device 100. This arrangement makes full use of the space of the tool detection device 100, making the structure more compact and avoiding mutual interference between components. Since the ends of the first water spray pipe 161 and the first air blowing pipe 162 near the pipe opening are bent towards the side near the detection component 12, water and gas can be accurately directed to the relevant parts of the detection component 12 (i.e., the light source emitting end 121), improving the cleaning and drying effect of the light source emitting end 121. Furthermore, along the height direction of the tool detection device 100, the opening of the first water spray pipe 161 is higher than the light source emitting end 121, and the first water spray pipe 161 sprays water onto the light source emitting end 121 to clean it. This arrangement allows water to impact the light source emitting end 121 with a certain pressure and angle, effectively removing dirt, impurities, etc. from the surface of the light source emitting end 121, ensuring the cleanliness of the light source emitting end 121, thereby improving the detection accuracy and reliability of the detection component 12. The first air-blowing pipe 162 is at the same height as the light source emitting end 121, so that the air blown out by the first air-blowing pipe 162 can be blown onto the light source emitting end 121 as quickly as possible, thereby drying the light source emitting end 121. Drying the light source emitting end 121 promptly after cleaning can prevent corrosion, short circuits, and other problems caused by moisture residue, extending the service life of the light source emitting end 121. It also ensures that the detection component 12 can operate normally in a dry environment, improving the accuracy of the detection results. Through the cleaning function of the first water spray pipe 161 and the drying function of the first air-blowing pipe 162, the cleaning component 16 can effectively maintain and care for the light source emitting end 121 of the detection component 12, reducing the impact of dirt and moisture on the performance of the detection component 12. This ensures that the tool detection device 100 can operate continuously and stably, improving its working efficiency and detection quality.

[0053] Further, see Figures 4 to 6 As shown, the cleaning assembly 16 also includes a second water spray pipe 163 and a second air blowing pipe 164. Both the second water spray pipe 163 and the second air blowing pipe 164 extend along the height direction of the tool detection device 100. The ends of the second water spray pipe 163 and the second air blowing pipe 164 near the opening are bent toward the side closer to the detection device. Along the height direction of the tool detection device 100, the opening of the second water spray pipe 163 is higher than the light source receiving end 122, and the second water spray pipe 163 sprays water onto the light source receiving end 122 to clean it. The second air blowing pipe 164 is at the same height as the light source receiving end 122, and the second air blowing pipe 164 blows air onto the light source receiving end 122 to dry it.

[0054] Specifically, the nozzle of the second water spray pipe 163 is higher than the light source receiver 122 and sprays water onto it, effectively cleaning the light source receiver 122. Because the nozzle of the second water spray pipe 163 is higher, water can rinse the light source receiver 122 from top to bottom, effectively removing wafer debris, dust, and other impurities adhering to the surface of the light source receiver 122, ensuring its cleanliness and maintaining its normal light receiving performance. The second air blowing pipe 164 is at the same height as the light source receiver 122 and blows air onto it, quickly drying the light source receiver 122 after cleaning. This avoids damage to the light source receiver 122 caused by residual moisture, preventing short circuits, corrosion, and other problems caused by moisture, extending the service life of the light source receiver 122, and ensuring stable operation of the light source receiver 122 in a dry environment, thus improving the accuracy of detection. Both the second water spray pipe 163 and the second air blowing pipe 164 extend along the height direction of the tool detection device 100, with the end near the pipe opening bent towards the side near the detection device. This structural design allows the cleaning and drying operations to be precisely applied to the light source receiver 122, effectively preventing the second water spray pipe 163 and the second air blowing pipe 164 from affecting other components of the tool detection device 100. It also makes the layout of the entire cleaning assembly 16 more compact and rational, saving space in the tool detection device 100. Furthermore, the effective cleaning and drying of the light source receiver 122 by the second water spray pipe 163 and the second air blowing pipe 164 ensures the overall performance of the detection assembly 12 in the tool detection device 100. This keeps the light source receiver 122 in good working condition, helping to improve the accuracy and reliability of the tool detection device 100, enabling it to more accurately detect the relevant data of the tool 13, and providing a more reliable basis for wafer production and processing.

[0055] Further, see Figures 4 to 8 As shown, the detection assembly 12 also includes a bracket 124. The light source emitting end 121 and the light source receiving end 122 are fixedly connected to the base 11 through the bracket 124. The bracket 124 is provided with a flow guide 1241, which is located at the bottom of the clearance gap 123. The flow guide 1241 is inclined from the side away from the protective cover 14 to the bottom of the side close to the protective cover 14.

[0056] Specifically, the light source emitter 121 and the light source receiver 122 are fixedly connected to the base 11 via a bracket 124, providing a more stable mounting structure for the detection assembly 12 within the tool detection device 100. This helps ensure the relative positional accuracy of the light source emitter 121 and the light source receiver 122, thereby improving the accuracy and reliability of the tool detection device 100 in detecting the tool 13 and avoiding detection errors caused by component shaking or positional shifts. The guide portion 1241 on the bracket 124 is located at the bottom of the clearance gap 123 and slopes from the side away from the protective cover 14 towards the bottom of the side closer to the protective cover 14. This design guides the water generated after the cleaning assembly 16 cleans the detection assembly 12, allowing it to drain along the slope of the guide portion 1241. This effectively prevents water accumulation around the detection assembly 12, reducing the risk of damage caused by water accumulation, avoiding short circuits and other problems caused by water to the electrical components of the light source emitter 121 and the light source receiver 122, and extending the service life of the detection assembly 12. Furthermore, the drainage section 1241 makes the drainage of the tool detection device 100 smoother, reducing the workload of cleaning up accumulated water and water stains when maintaining the tool detection device 100.

[0057] On the other hand, see Figure 1 and Figure 2 As shown, this application also mentions a wafer dicing machine 1000, which can be, for example, a manual wafer dicing machine, a semi-automatic wafer dicing machine, or a fully automatic wafer dicing machine, and the wafer dicing machine 1000 includes the aforementioned tool detection device 100. Therefore, the wafer dicing machine 1000 includes all the technical effects of the aforementioned tool detection device 100. Since the technical effects of the tool detection device 100 have been described in detail above, they will not be repeated here.

[0058] As can be seen from the above description, this application provides a tool detection device 100 consisting of a base 11, a detection component 12, a tool 13, a protective cover 14, a power unit 15, and a cleaning component 16, and applies the tool detection device 100 to a wafer dicing machine 1000. During the operation of the wafer dicing machine 1000, the protective cover 14 can rotate relative to the base 11. Compared with the existing tool detection device 100 (where the protective cover 14 can move relative to the base 11), the structure of the tool detection device 100 of this application (where the protective cover 14 can rotate relative to the base 11) has significant advantages. First, during the rotation of the protective cover 14, compared with the traditional protective structure, the space occupied inside the wafer dicing machine 1000 is greatly reduced, making the internal layout more compact and reasonable. When the protective cover 14 rotates and covers the detection component 12, the protective cover 14 can perfectly cooperate with the base 11, and the two (protective cover 14 and base 11) fit tightly together to form a highly sealed space. During the wafer dicing process, a large amount of wafer debris and other impurities are generated. The formation of a sealed space provides an effective protective layer for the detection component 12, effectively preventing the intrusion of wafer debris, dust, and other contaminants, thus avoiding contamination of the detection component 12. Keeping the detection component 12 clean allows for more accurate detection of the wear of the cutting tool 13. Accurate detection data helps to adjust the tool condition in a timely manner, thereby improving the processing quality of the wafer dicing machine 1000 and ensuring product quality.

[0059] As can be seen, compared with existing tool inspection devices, the tool inspection device 100 of this application can not only solve the problem of the large space occupied by the existing protective cover, but also provide better protection for the inspection component 12 of the tool inspection device 100. This can improve the wafer processing quality to a certain extent, thereby enabling the wafer dicing machine 1000 of this application to meet higher wafer processing requirements.

[0060] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0061] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.

[0062] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A tool detection device, characterized by include: Base (11); A detection component (12) is disposed on the base (11), and the detection component (12) includes a light source emitting end (121) and a light source receiving end (122), and there is a clearance gap (123) between the light source emitting end (121) and the light source receiving end (122). The light source emitting end (121) is at least used to emit light, and the light source receiving end (122) is at least used to receive the light emitted by the light source emitting end (121) to sense the luminous flux passing through the clearance gap (123). A cutting tool (13) is movably disposed on the base (11), and the cutting tool (13) can be moved to the clearance gap (123) to at least block part of the light emitted by the light source emitting end (121) to the light source receiving end (122); A protective cover (14) is rotatably disposed on the base (11), and the protective cover (14) has a closed state in which it rotates to cover the detection component (12) to shield the detection component (12), and the protective cover (14) also has an open state in which it rotates to avoid the blade (13) to allow the blade (13) to move to the avoidance gap (123).

2. The tool detection device according to claim 1, characterized in that Along the first direction of the base (11), the protective cover (14) and the detection component (12) are spaced apart on the base (11), and the detection component (12) is fixedly connected to the base (11). The protective cover (14) rotates along the second direction to switch between the closed state and the open state.

3. The tool detection device according to claim 1, characterized in that Along the height direction of the tool detection device, the bottom of the clearance gap (123) is higher than the top of the base (11). When the protective cover (14) is in the closed state, the edge of the protective cover (14) on the side near the base (11) is lower than the bottom of the clearance gap (123).

4. The tool detection apparatus according to claim 1, characterized by The tool detection device also includes a power unit (15), which is disposed on the base (11) and is driven to connect with the protective cover (14) to drive the protective cover (14) to switch between the closed state and the open state.

5. The tool detection device according to claim 4, characterized in that The power unit (15) includes a rotary cylinder (151), the housing (1511) of the rotary cylinder (151) is fixedly connected to the base (11), the piston rod (1512) of the rotary cylinder (151) is fixedly connected to the protective cover (14), and the rotary cylinder (151) drives the piston rod (1512) to rotate so as to drive the protective cover (14) to switch between the closed state and the open state.

6. The tool detection apparatus according to claim 1, characterized by The tool detection device further includes a cleaning component (16), which is disposed on the base (11) and located between the detection component (12) and the protective cover (14) to clean and dry the detection component (12).

7. The tool detection device according to claim 6, characterized in that The cleaning assembly (16) includes a first water spray pipe (161) and a first air blowing pipe (162). Both the first water spray pipe (161) and the first air blowing pipe (162) extend along the height direction of the tool detection device. The end of the first water spray pipe (161) near the pipe opening and the end of the first air blowing pipe (162) near the pipe opening are both bent toward the side closer to the detection device. Along the height direction of the tool detection device, the opening of the first water spray pipe (161) is higher than the light source emitting end (121), and the first water spray pipe (161) sprays water onto the light source emitting end (121) to clean the light source emitting end (121). The first air blowing pipe (162) is at the same height as the light source emitting end (121), and the first air blowing pipe (162) blows air onto the light source emitting end (121) to dry the light source emitting end (121).

8. The tool detection device according to claim 6, characterized in that The cleaning assembly (16) further includes a second water spray pipe (163) and a second air blowing pipe (164). Both the second water spray pipe (163) and the second air blowing pipe (164) extend along the height direction of the tool detection device. The end of the second water spray pipe (163) near the opening and the end of the second air blowing pipe (164) near the opening are both bent toward the side closer to the detection device. Along the height direction of the tool detection device, the opening of the second water spray pipe (163) is higher than the light source receiving end (122), and the second water spray pipe (163) sprays water onto the light source receiving end (122) to clean it. The second air blowing pipe (164) is at the same height as the light source receiving end (122), and the second air blowing pipe (164) blows air onto the light source receiving end (122) to dry it.

9. The tool detection device according to any one of claims 1 to 8, characterized in that, The detection component (12) also includes a bracket (124). The light source emitting end (121) and the light source receiving end (122) are fixedly connected to the base (11) through the bracket (124). The bracket (124) is provided with a flow guide (1241). The flow guide (1241) is located at the bottom of the clearance gap (123). The flow guide (1241) is inclined from the side away from the protective cover (14) to the bottom of the side close to the protective cover (14).

10. A wafer cutting machine characterized by comprising: The wafer dicing machine includes the tool detection device according to any one of claims 1 to 9.

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