A temperature pressure sensor

Abstract

This invention provides a temperature and pressure sensor, comprising a housing with an internal stepped cavity. The stepped cavity includes a coaxially connected mounting groove and a receiving through hole, the diameter of which is smaller than the diameter of the mounting groove. A circuit board is located within the mounting groove, with its lower surface abutting against the bottom of the groove. A signal conditioning chip is located within the mounting groove and fixed to the center of the upper surface of the circuit board. A MEMS pressure sensing chip is located within the receiving through hole and fixed to the lower surface of the circuit board. A first sealing body fills the mounting groove and covers the upper surface of the circuit board and the signal conditioning chip. A second sealing body fills the receiving through hole and covers the MEMS pressure sensing chip. This invention features a simple and compact structure, small overall size, and can meet the installation requirements of miniaturized devices, thus broadening the application scenarios of the sensor.

Description

Technical Field

[0001] This utility model relates to the field of sensor technology, and in particular to a temperature and pressure sensor. Background Technology

[0002] As the core sensing unit of a control system, the performance and integration level of sensors directly affect the measurement accuracy, response speed, and reliability of the entire system. Currently, in control systems for industrial automation, consumer electronics, and IoT applications, independent pressure and temperature sensors are typically configured in combination to simultaneously monitor pressure and temperature parameters. However, this approach not only increases the complexity of the system structure and occupies more circuit board area and wiring resources, but also leads to problems such as larger overall size, increased power consumption, higher cost, difficult calibration, and mutual interference between signals. Furthermore, while some existing integrated temperature and pressure sensors on the market have achieved integration to a certain extent, their internal structures often employ same-side arrangement or simple stacking, resulting in larger package sizes, low internal space utilization, and difficulties in miniaturization design. These limitations make it difficult to meet the application requirements of modern portable devices for sensor miniaturization, low power consumption, and high reliability. Utility Model Content

[0003] Based on this, the purpose of this utility model is to provide a temperature and pressure sensor, which aims to solve the technical problem that existing control systems, in order to simultaneously monitor pressure and temperature parameters, will simultaneously configure independent pressure sensors and temperature sensors, occupying a lot of circuit board space and wiring resources, resulting in a large overall size, increased power consumption, and increased cost, making it difficult to meet the application requirements of modern portable devices for miniaturization, low power consumption and high reliability.

[0004] The purpose of this utility model is to provide a temperature and pressure sensor, comprising: The housing has an internal stepped cavity, which includes a coaxially connected mounting groove and a receiving through hole, the diameter of which is smaller than the diameter of the mounting groove. A circuit board is located in the mounting groove, and the lower surface of the circuit board abuts against the bottom of the mounting groove. A signal conditioning chip is located in the mounting slot and fixed to the middle of the upper surface of the circuit board; The MEMS pressure sensing chip is located within the receiving through hole and fixed to the lower surface of the circuit board; The first sealing body fills the mounting groove and covers the upper surface of the circuit board and the signal conditioning chip; The second sealing body fills the receiving through hole and covers the MEMS pressure sensing chip.

[0005] In addition, the temperature and pressure sensor according to the present invention may also have the following additional technical features: Furthermore, the circuit board is provided with a temperature sensing element, which is electrically connected to the signal conditioning chip.

[0006] Furthermore, the MEMS pressure sensing chip is connected to the pads on the lower surface of the circuit board via a flip-chip bonding process, and the pressure-sensing surface of the MEMS pressure sensing chip opens towards the end of the receiving through hole away from the mounting groove.

[0007] Furthermore, the first sealing body is an epoxy resin potting compound or an organosilicon potting compound.

[0008] Furthermore, the second sealing body is silicone gel.

[0009] Furthermore, it also includes multiple connecting wires, one end of which is located in the mounting groove and electrically connected to the circuit board, and the other end extends out of the housing in a direction away from the receiving through hole.

[0010] Furthermore, the housing includes a mounting portion and a connecting portion integrally connected to the mounting portion. The mounting portion has a mounting groove, the connecting portion has a receiving through hole, and the outer peripheral surface of the connecting portion has a threaded structure.

[0011] Furthermore, the maximum outer diameter of the mounting part is no more than 11 mm, and the axial height is no more than 6 mm; The maximum outer diameter of the connecting part is smaller than the maximum outer diameter of the mounting part, and the axial height is not greater than 6mm.

[0012] Compared with the prior art, the advantages of the temperature and pressure sensor of this utility model are: simple and compact structure, which can meet the installation requirements of miniaturized equipment. Specifically, the housing of this application is provided with a stepped cavity and a signal conditioning chip fixed on the upper surface of the circuit board and a MEMS pressure sensing chip fixed on the lower surface, so as to realize the function of simultaneously detecting two parameters, temperature and pressure. Moreover, the overall size is small and can be embedded in the interior of equipment with limited space, thus broadening the application scenarios of the sensor. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural diagram of the temperature and pressure sensor of this utility model; Figure 2 This is a top view of the temperature and pressure sensor of this utility model; Figure 3 for Figure 2 A cross-sectional view at point AA.

[0014] The above figures include the following reference numerals: 10-housing; 11-mounting part; 12-connecting part; 101-mounting groove; 102-accommodating through hole; 21-circuit board; 22-signal conditioning chip; 23-MEMS pressure sensing chip; 24-first sealing body; 25-second sealing body; 26-connecting line.

[0015] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this utility model. Detailed Implementation

[0016] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Several embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this utility model will be more thorough and complete.

[0017] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0018] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0019] Please see Figures 1 to 3The image shows a temperature and pressure sensor according to this utility model, comprising a housing 10, a circuit board 21, a signal conditioning chip 22, a MEMS pressure sensing chip 23, a first sealing body 24, and a second sealing body 25. The housing 10 has a stepped cavity inside, comprising a mounting groove 101 and a receiving through hole 102 coaxially connected from top to bottom. The diameter of the receiving through hole 102 is smaller than the diameter of the mounting groove 101. In this embodiment, both the mounting groove 101 and the receiving through hole 102 are circular holes. More specifically, the housing 10 includes a mounting part 11 and a connecting part 12 integrally connected to the mounting part 11. The mounting part 11 has a mounting groove 101 inside. The outer surfaces of the two opposite sides of the mounting part 11 along the radial direction of the mounting groove 101 are planar. In practical applications, the planar design on both sides can serve as a reference surface during sensor assembly, effectively preventing the sensor from rotating during installation and improving assembly convenience. Simultaneously, it can also be used with auxiliary clamping tools such as wrenches to achieve stable clamping, effectively shortening assembly time. The connecting part 12 is provided with a receiving through hole 102, and the outer peripheral surface of the connecting part 12 is provided with a threaded structure, which is used to realize the stable installation of the sensor on the device under test.

[0020] Furthermore, to ensure the compact size and high adaptability of the housing 10, the maximum outer diameter of the mounting part 11 is no greater than 11 mm, and the axial height is no greater than 6 mm; the maximum outer diameter of the connecting part 12 is smaller than the maximum outer diameter of the mounting part 11, and the axial height is no greater than 6 mm. As a specific embodiment, in this embodiment, the maximum outer diameter of the mounting part 11 is 11 mm, the distance between the two planar outer surfaces of the mounting part 11 is 10 mm, the axial height of the mounting part 11 is 6 mm, and the axial height of the connecting part 12 is 6 mm, making the overall appearance of the housing 10 more regular and facilitating stable assembly within a limited installation space.

[0021] Circuit board 21 is located within mounting groove 101, with its lower surface abutting against the bottom of groove 101. Signal conditioning chip 22 is located within mounting groove 101 and fixed to the center of the upper surface of circuit board 21. Circuit board 21 has a temperature sensing element, which is electrically connected to signal conditioning chip 22. Signal conditioning chip 22 amplifies, filters, and linearly corrects the raw signals output from temperature sensing element and MEMS pressure sensing chip 23, improving signal accuracy. As a specific example, in this embodiment, the temperature sensing element can be a surface-mount negative temperature coefficient thermistor, electrically connected to signal conditioning chip 22 via gold wire bonding, ensuring that the temperature signal can be transmitted to signal conditioning chip 22 in real time without delay, achieving accurate detection of ambient or medium temperature.

[0022] The MEMS pressure sensing chip 23 is located within the receiving through-hole 102 and fixed to the lower surface of the circuit board 21. Specifically, the MEMS pressure sensing chip 23 is connected to the pads on the lower surface of the circuit board 21 via flip-chip bonding. The pressure-sensing surface of the MEMS pressure sensing chip 23 is open at the end of the receiving through-hole 102 away from the mounting groove 101, so that the measured medium can directly contact the pressure-sensing surface, reducing the pressure transmission path and improving the pressure detection response speed and accuracy. It should be noted that in practical applications, the temperature and pressure sensor of this application can simultaneously and directly output pressure and temperature digitally, meeting the functional requirements of most control systems. Moreover, both the signal conditioning chip 22 and the MEMS pressure sensing chip 23 are existing standardized products, requiring no custom development. The integrated molding design of the housing 10 can effectively reduce the overall production cost of the product, simplify the manufacturing process, avoid high-cost and difficult processes such as lead wires, effectively improve the product yield, and is suitable for automated mass production.

[0023] The first sealing element 24 fills the mounting groove 101 and covers the upper surface of the circuit board 21 and the signal conditioning chip 22. Further, the first sealing element 24 is an epoxy resin potting compound or an organosilicon potting compound.

[0024] The second sealing body 25 fills the receiving through hole 102 and covers the MEMS pressure sensing chip 23. Furthermore, the second sealing body 25 is made of silicone gel, which effectively blocks external impurities from entering the receiving through hole 102, ensuring that the pressure of the medium to be measured can be smoothly transmitted to the pressure-sensing surface of the MEMS pressure sensing chip 23.

[0025] The temperature and pressure sensor of this application also includes multiple connecting wires 26. One end of the connecting wire 26 is located in the mounting groove 101 and is electrically connected to the pad of the circuit board 21 by a soldering process. The other end extends out of the housing 10 in a direction away from the receiving through hole 102, for connection with external devices (such as controllers, data acquisition modules) to realize the output of detection signals and power supply.

[0026] In practical applications, the working principle of the temperature and pressure sensor of this application can be as follows: the pressure of the measured medium is applied to the MEMS pressure sensing chip 23 through the receiving through hole 102, causing a change in the resistance of the MEMS pressure sensing chip 23, which in turn causes a change in its output electrical signal. This electrical signal is input to the signal conditioning chip 22 through the circuit board 21. At the same time, the signal conditioning chip 22 can directly collect the resistance of the temperature sensing element on the circuit board 21 to determine the ambient temperature. After processing by the signal conditioning chip 22, the pressure and temperature are finally directly output to the application end through intuitive digital output according to the user's needs.

[0027] Compared with existing technologies, the advantages of the temperature and pressure sensor of this application are: simple and compact structure, which can meet the installation requirements of miniaturized equipment. Specifically, the housing of this application has a stepped cavity and a signal conditioning chip fixed on the upper surface of the circuit board and a MEMS pressure sensing chip fixed on the lower surface, which realizes the function of simultaneously detecting two parameters, temperature and pressure. Moreover, the overall size is small and can be embedded in the interior of equipment with limited space, thus broadening the application scenarios of the sensor.

[0028] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0029] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this utility model application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model application should be determined by the appended claims.

Claims

1. A temperature pressure sensor, characterized by, include: The housing has an internal stepped cavity, which includes a coaxially connected mounting groove and a receiving through hole, the diameter of which is smaller than the diameter of the mounting groove. A circuit board is located in the mounting groove, and the lower surface of the circuit board abuts against the bottom of the mounting groove. A signal conditioning chip is located in the mounting slot and fixed to the middle of the upper surface of the circuit board; The MEMS pressure sensing chip is located within the receiving through hole and fixed to the lower surface of the circuit board; The first sealing body fills the mounting groove and covers the upper surface of the circuit board and the signal conditioning chip; The second sealing body fills the receiving through hole and covers the MEMS pressure sensing chip.

2. The temperature pressure sensor of claim 1, wherein, The circuit board is equipped with a temperature sensing element, which is electrically connected to the signal conditioning chip.

3. The temperature pressure sensor of claim 1, wherein, The MEMS pressure sensing chip is connected to the pads on the lower surface of the circuit board via a flip-chip bonding process, and the pressure-sensing surface of the MEMS pressure sensing chip opens towards the end of the receiving through hole away from the mounting groove.

4. The temperature pressure sensor of claim 1, wherein, The first sealing body is an epoxy resin potting compound or an organosilicon potting compound.

5. The temperature pressure sensor of claim 1, wherein, The second sealing material is silicone gel.

6. The temperature and pressure sensor according to claim 1, characterized in that, It also includes multiple connecting wires, one end of which is located in the mounting groove and electrically connected to the circuit board, and the other end extends out of the housing in a direction away from the receiving through hole.

7. The temperature and pressure sensor according to claim 1, characterized in that, The housing includes a mounting part and a connecting part integrally connected to the mounting part. The mounting part has a mounting groove, the connecting part has a receiving through hole, and the outer peripheral surface of the connecting part has a threaded structure.

8. The temperature and pressure sensor according to claim 7, characterized in that, The maximum outer diameter of the mounting part is no more than 11 mm, and the axial height is no more than 6 mm. The maximum outer diameter of the connecting part is smaller than the maximum outer diameter of the mounting part, and the axial height is not greater than 6mm.

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